Filled Thermal Compounds and Thermal Interface Materials
from Master Bond, Inc.
Master Bond LED405Med is a one part, nano filled system that cures quickly upon exposure to a 405 nm LED light. It does not require a UV light source. It meets ISO 10993-5 for cytotoxicity and resists sterilization. It can cure up to 1/8 think and has low shrinkage upon cure. It also features... [See More]
- Composition: Filled
- Cure / Technology: Thermoset; Single Component; LED Cure
- Type: High Dielectric; Optical
- Form / Shape: Liquid
from ELANTAS North America LLC
Mineral-filled VPI resin - semi-flexible for transformers with improved heat dissipation [See More]
- Composition: Filled
- Chemical System: Alkyd
- Type: High Dielectric
- Cure / Technology: Thermoset; Single Component
from MacDermid Alpha Electronics Solutions
Low-stress, thermally conductive die attach adhesive for high-power and exposed pad semiconductor packages. Product Overview. ATROX ® 590-4HT1: Silver-filled conductive adhesive offering excellent adhesion and electrical performance with controlled bleed-out. [See More]
- Composition: Filled
- Industry: Electronics; Semiconductors, IC's
- Form / Shape: Die Bonding Adhesives
- Features: Electrically Conductive
from Master Bond, Inc.
One part, nano silica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]
- Composition: Filled
- Cure / Technology: UV or Radiation Cured; Single Component; Dual Curing
- Type: High Dielectric
- Form / Shape: Glob Top, Daub, Doming or Overfill; Liquid; Encapsulant or Conformal Coating
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Composition: Filled
- Cure / Technology: Thermoset; Two Component ; Addition Cure
- Chemical System: Silicone
- Form / Shape: Grease, Paste; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
from Master Bond, Inc.
Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]
- Composition: Filled
- Cure / Technology: Thermoset; Single Component
- Chemical System: Polyphenylene Sulfide; Epoxy
- Form / Shape: Liquid; Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
from Master Bond, Inc.
EP5TC-80 is a one part, NASA low outgassing rated epoxy that achieves a thermal conductivity of 3.3-3.7 W/(m·K), while also retaining its electrical non-conductivity. [See More]
- Composition: Filled
- Chemical System: Epoxy
- Type: High Dielectric
- Cure / Technology: Thermoset; Single Component
from Master Bond, Inc.
For advanced PCB assembly and heat sink bonding applications, Master Bond offers EP48TC, a specially formulated adhesive that features ultra low thermal resistance of 5-7 x 10-6 K •m2/W. This system uses high thermal conductive fillers and is capable of being applied in bond lines as thin as... [See More]
- Composition: Filled
- Chemical System: Epoxy
- Type: High Dielectric; Optical
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
EP79FL is a silver coated nickel filled polymer system that forms high strength bonds that are resistant to extreme cryogenic temperatures. It is electrically conductive and has a volume resistivity of <0.005 ohm-cm. As a silver coated nickel filled system, it is much more cost effective than... [See More]
- Composition: Filled
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Epoxy
- Form / Shape: Liquid; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
from Master Bond, Inc.
MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]
- Composition: Filled
- Chemical System: Silicone
- Type: High Dielectric
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Master Bond EP30NS is a nano silica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]
- Composition: Filled
- Chemical System: Epoxy
- Type: High Dielectric; Optical
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part nickel conductive systems, EP76M... [See More]
- Composition: Filled
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Form / Shape: Die Bonding Adhesives; Grease, Paste; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
from Master Bond, Inc.
Formulated for thermal management applications, EP30TC is a two component epoxy that contains robust thermally conductive fillers with very fine particle sizes. It has thermal conductivity of 18-20 BTU •in/ft2 •hr • °F [2.60-2.88 W/(m •K)] and can be applied in sections as... [See More]
- Composition: Filled
- Chemical System: Epoxy
- Type: High Dielectric
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Master Bond EP121AO is a two component, high performance epoxy resin system featuring high thermal stability, high thermal conductivity, superior electrical insulation properties and outstanding dimensional stability for coating, sealing, potting and encapsulation for service up to 450-500 °F. [See More]
- Composition: Filled
- Chemical System: Epoxy
- Type: High Dielectric
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System EP77M-1 is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. It readily develops a high bonding strength of more than 2000 psi tensile... [See More]
- Composition: Filled
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Form / Shape: Grease, Paste; Gap Filler, Foam in Place Gasket
from Master Bond, Inc.
Master Bond Polymer System EP79 is a two component, silver coated nickel filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. EP79 offers a convenient one-to-one mix ratio by weight or... [See More]
- Composition: Filled
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Form / Shape: Die Bonding Adhesives; Grease, Paste; Gap Filler, Foam in Place Gasket
from Master Bond, Inc.
Featuring a low volume resistivity of 5-10 ohm-cm, EP21TDCN-LO is a nickel conductive system for high performance bonding and sealing applications. This smooth paste formulation is easy to handle and has a one to one mix ratio by weight or volume. It is a toughened system, formulated to withstand... [See More]
- Composition: Filled
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
from Protavic America, Inc.
Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for production needs. One... [See More]
- Composition: Filled
- Cure / Technology: Thermoset; Single Component
- Chemical System: Epoxy
- Form / Shape: Die Bonding Adhesives; Grease, Paste
from Epoxy Technology
EPO-TEK ® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical, and... [See More]
- Composition: Filled
- Cure / Technology: Thermoset; Single Component
- Chemical System: Epoxy
- Form / Shape: Die Bonding Adhesives; Grease, Paste
from Epoxies Etc...
70-3800 is a low viscosity, aluminum filled, epoxy tooling resin. This system is used for making heat resistant cast tools or parts that require very good thermal conductivity. 70-3800 is easily machined, drilled, tapped, or polished, and is ideal for vacuum form molds, dies, drill jigs, injection... [See More]
- Composition: Filled
- Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
- Chemical System: Epoxy
- Form / Shape: Liquid; Die Bonding Adhesives
from Aremco Products, Inc.
High fired strength, dense ceramics [See More]
- Composition: Filled
- Chemical System: Ceramic
- Type: High Dielectric
- Cure / Technology: Thermoset
from Protavic America, Inc.
A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals. [See More]
- Composition: Filled
- Cure / Technology: Thermoset; Single Component
- Chemical System: Epoxy
- Form / Shape: Glob Top, Daub, Doming or Overfill; Liquid; Die Bonding Adhesives
from Epoxies Etc...
50-3120 is a filled, single component, thermally conductive, electrically insulating epoxy system. This material is thixotropic and designed for the placement of SMD's on printed circuit boards or other substrates prior to wave soldering. It may also be used in heat sink applications. [See More]
- Composition: Filled
- Cure / Technology: Thermoset; Single Component
- Chemical System: Epoxy
- Form / Shape: Die Bonding Adhesives; Grease, Paste
from Aremco Products, Inc.
Used for repairing metal components, pinholes, cracks, and filling seams. [See More]
- Composition: Filled
- Cure / Technology: Thermoset
- Chemical System: Ceramic
- Form / Shape: Grease, Paste; Gap Filler, Foam in Place Gasket
from Protavic America, Inc.
PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ is heat stable up to 150 °C. [See More]
- Composition: Filled
- Chemical System: Epoxy
- Type: High Dielectric
- Cure / Technology: Thermoset; Two Component
from Protavic America, Inc.
Filled epoxy system for high thermal applications such as heat-sink bonding. This material has 2.2 Wm °K thermal performance with supporting laser flash data. Room temperature cure. [See More]
- Composition: Filled
- Chemical System: Epoxy
- Type: High Dielectric
- Cure / Technology: Thermoset; Two Component