Filled Thermal Compounds and Thermal Interface Materials

Pedigree® -- 40 VTC-40F
from ELANTAS PDG, Inc.

Mineral-filled VPI resin - semi-flexible for transformers with improved heat dissipation [See More]

  • Composition: Filled
  • Chemical System: Alkyd
  • Type: High Dielectric
  • Cure / Technology: Thermoset; Single Component
Biocompatible, Thermally Conductive Epoxy -- EPO-TEK® MED-T7110
from Epoxy Technology

EPO-TEK ® MED-T7110 is a thermally conductive, electrically insulating, low temperature curing epoxy; ideal for temperature sensitive devices. It is often used encapsulating copper coils in various medical imaging systems. (X-ray, Nuclear and MRI). [See More]

  • Composition: Filled
  • Chemical System: Epoxy
  • Type: High Dielectric
  • Cure / Technology: Thermoset; Two Component  
Highly Thermal Conductive and Non-Flammable Silicone Putty Sheet -- SARCON ® XR-Um-AL
from Fujipoly® America Corp.

Sarcon ® XR-Um-Al has one surface with aluminum film, which enable to remove eve n after application ( before operation) and there is no-pull-out effect. Putty nature enables low contact thermal resistance. Low Molecular Siloxane content is very low. Has a flame retardancy of UL specification 94... [See More]

  • Composition: Filled
  • Form / Shape: Putty; Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
  • Gap Fill: 0.0087 to 0.0197
Biocompatible, Nanosilica Filled LED Curable Adhesive -- LED405Med
from Master Bond, Inc.

Master Bond LED405Med is a one part, nanofilled system that cures quickly upon exposure to a 405 nm LED light. It does not require a UV light source. It meets ISO 10993-5 for cytotoxicity and resists sterilization. It can cure up to 1/8 think and has low shrinkage upon cure. It also features... [See More]

  • Composition: Filled
  • Cure / Technology: Thermoset; Single Component; LED Cure
  • Type: High Dielectric; Optical
  • Form / Shape: Liquid
Ceramabond -- 503
from Aremco Products, Inc.

High fired strength, dense ceramics [See More]

  • Composition: Filled
  • Chemical System: Ceramic
  • Type: High Dielectric
  • Cure / Technology: Thermoset
Aluminum filled epoxy system -- 70-3800R
from Epoxies Etc...

70-3800 is a low viscosity, aluminum filled, epoxy tooling resin. This system is used for making heat resistant cast tools or parts that require very good thermal conductivity. 70-3800 is easily machined, drilled, tapped, or polished, and is ideal for vacuum form molds, dies, drill jigs, injection... [See More]

  • Composition: Filled
  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
  • Chemical System: Epoxy
  • Form / Shape: Liquid; Die Bonding Adhesives
Adhesive -- GSP 1345
from GS Polymers, Inc.

Two part, 1:1, thermal conductive compound, available in cartridges [See More]

  • Composition: Filled
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Epoxy
  • Industry: OEM or Industrial
Electro-Conductive Epoxy Adhesive -- ACE-10131
from Protavic America, Inc.

Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for production needs. One... [See More]

  • Composition: Filled
  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Epoxy
  • Form / Shape: Die Bonding Adhesives; Grease, Paste