Thermosetting / Crosslinking Thermal Compounds and Thermal Interface Materials

Isopaste Thermally Conductive Paste
from Acrolab Ltd.

Isopaste is a high-temperature thermal bridging compound used in Acrolab's Isoplatens and Heat Transfer Tools to act as a heat conductor in the Isobar ® Heat Pipe channels. It comes in three stock sizes: 4oz., 8oz., and 16oz. cans. [See More]

  • Cure / Technology: Thermoset; Single Component
  • Form / Shape: Grease, Paste
  • Composition: Unfilled
  • Industry: Electronics; OEM or Industrial; Heat Transfer Systems
Pedigree® -- 40 VTC-40F
from ELANTAS PDG, Inc.

Mineral-filled VPI resin - semi-flexible for transformers with improved heat dissipation [See More]

  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Alkyd
  • Type: High Dielectric
  • Composition: Filled
Biocompatible, Thermally Conductive Epoxy -- EPO-TEK® MED-T7110
from Epoxy Technology

EPO-TEK ® MED-T7110 is a thermally conductive, electrically insulating, low temperature curing epoxy; ideal for temperature sensitive devices. It is often used encapsulating copper coils in various medical imaging systems. (X-ray, Nuclear and MRI). [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Type: High Dielectric
  • Composition: Filled
Addition Cured Silicone is Optically Clear with Enhanced Low Temperature Serviceability -- MasterSil 157
from Master Bond, Inc.

MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing; Addition Cure
  • Chemical System: Silicone
  • Type: High Dielectric; Optical
  • Composition: Unfilled
MG Chemicals 8331 Silver Conductive Epoxy 115gm -- MGEP00007
from Techsil Limited

MG Chemicals 8331 is a Silver Conductive Epoxy with a moderate cure time and high conductivity. This is an economical electronic epoxy with good electrical and thermal conductivities. The adhesive bonds very well to a variety of surfaces, it resists thermal and mechanical shocks and provides the low... [See More]

  • Cure / Technology: Thermoset
  • Industry: Electronics
  • Chemical System: Epoxy
  • Features: Electrically Conductive
Ceramabond -- 503
from Aremco Products, Inc.

High fired strength, dense ceramics [See More]

  • Cure / Technology: Thermoset
  • Chemical System: Ceramic
  • Type: High Dielectric
  • Composition: Filled
Aluminum filled epoxy system -- 70-3800R
from Epoxies Etc...

70-3800 is a low viscosity, aluminum filled, epoxy tooling resin. This system is used for making heat resistant cast tools or parts that require very good thermal conductivity. 70-3800 is easily machined, drilled, tapped, or polished, and is ideal for vacuum form molds, dies, drill jigs, injection... [See More]

  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
  • Composition: Filled
  • Chemical System: Epoxy
  • Form / Shape: Liquid; Die Bonding Adhesives
Adhesive -- GSP 1345
from GS Polymers, Inc.

Two part, 1:1, thermal conductive compound, available in cartridges [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Composition: Filled
  • Chemical System: Epoxy
  • Industry: OEM or Industrial
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4501
from Hapco, Inc.

Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Form / Shape: Liquid
  • Type: High Dielectric
  • Industry: Electronics
Clear Non-Yellowing Silicone Encapsulant -- PNS-56225
from Protavic America, Inc.

PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Composition: Unfilled
  • Chemical System: Silicone
  • Form / Shape: Liquid; Die Bonding Adhesives; Encapsulant or Conformal Coating
Pourable, Addition-Curing RTV-2 Silicone Rubber -- ELASTOSIL® RT675 A/B
from Wacker Chemical Corp.

ELASTOSIL ® RT 675 A/B is a pourable, addition-curing RTV-2 silicone rubber. [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Form / Shape: Liquid
  • Chemical System: Silicone; Elastomeric
  • Industry: Electronics