Gap Filling Compound Thermal Compounds and Thermal Interface Materials
from Master Bond, Inc.
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]
- Form / Shape: Liquid; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Type: High Dielectric; Optical
- Composition: Unfilled
from Fujipoly® America Corp.
bull; CF210A is the newest Fujipoly thermal gap filler. • CF210A incorporates carbon fibers along with traditional fillers found in thermal gap filler materials. • CF210A is rated at 21 W/m •K. • Compliance is closer to a much lower conductivity gap filler (Fujipoly- Sarcon... [See More]
- Form / Shape: Gap Filler, Foam in Place Gasket
- Use Temperature: -40 to 302
- Industry: Electronics; Semiconductors, IC's
- Thermal Conductivity: 21
from Thermon, Inc
NH nonhardening heat transfer compound is used where thermal expansion and contraction could break the bond of a hardened compound. Typically installed between plate-type heating coils or with systems that require periodic disassembly, NH remains pliable indefinitely, allowing the compound to expand... [See More]
- Form / Shape: Liquid; Gap Filler, Foam in Place Gasket
- Use Temperature: 32 to 410
- Cure / Technology: Single Component
- Thermal Conductivity: 34.61 to 69.23
from Quantaflex Printed Electronics Inc.
A high level of custom engineering and problem solving. Designing electrical shielding components requires a high level of custom engineering and problem solving. Nothing should be left to chance because the goal is to create a part that protects the electronic device (and your customers) from the... [See More]
- Form / Shape: Liquid; Foam; Gap Filler, Foam in Place Gasket
- Features: EMI/RFI Shielding
- Industry: Electronics; Semiconductors, IC's
from Master Bond, Inc.
EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]
- Form / Shape: Liquid; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from Fujipoly® America Corp.
Fujipoly ® introduces Sarcon ® PG45A its newest high-performance, putty-like thermal interface material. This extremely low modulus gap filler exhibits a thermal resistance as low as 0.02 °C •in2/W at 43.5 PSI with a thermal conductivity of 4.5 W/m °K. Sarcon ® PG45A... [See More]
- Form / Shape: Putty; Gap Filler, Foam in Place Gasket
- Gap Fill: 0.0591 to 0.0984
- Chemical System: Silicone
- Industry: Electronics; Semiconductors, IC's
from Thermon, Inc
SnapTrace is a preformed flexible heat transfer compound designed for rapid, consistent installation over steam trace tubing on straight piping. SnapTrace also includes TFK channel, providing mechanical and weather protection to the installation. Thermon's heat transfer compounds provide an... [See More]
- Form / Shape: 4ft Lengths; Gap Filler, Foam in Place Gasket
- Thermal Conductivity: 34.61 to 69.23
- Use Temperature: 14 to 450
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Form / Shape: Grease, Paste; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
- Composition: Filled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component ; Addition Cure
from Fujipoly® America Corp.
Fujipoly ® America announces the release of its new SARCON ® SPG-70A. It is a high flow rate, high heat transferring compound that exhibits a thermal conductivity of 7.0 W/m °K and has the lowest thermal resistance among our dispensable SPG products. When applied between heat-generating... [See More]
- Form / Shape: Grease, Paste; Gap Filler, Foam in Place Gasket
- Industry: Electronics
- Chemical System: Silicone
- Thermal Conductivity: 7
from Thermon, Inc
T-3 heat transfer compound now has higher temperature ratings than ever before while still creating an efficient thermal bond between a steam or electric heater and process pipes or equipment. A single "Thermonized ™"steam tracer utilizing Thermon's heat transfer compound is more cost... [See More]
- Form / Shape: Grease, Paste; Gap Filler, Foam in Place Gasket
- Use Temperature: 32 to 850
- Cure / Technology: Single Component
- Thermal Conductivity: 34.61 to 69.23
from Master Bond, Inc.
EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]
- Form / Shape: Liquid; Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from Fujipoly® America Corp.
Silicone Gap Filler Pad for Absorption of Electromagnetic Wave. Features. Effective to absorb and damp a wide range of electromagnetic waves. Also effective as a high performance thermal interface material. Easily filling small gaps of IC chip surface with soft gel texture. Good workability to... [See More]
- Form / Shape: Pad; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Type: High Dielectric
- Gap Fill: 0.0197 to 0.0984
from Master Bond, Inc.
Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]
- Form / Shape: Liquid; Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
- Composition: Filled
- Chemical System: Polyphenylene Sulfide; Epoxy
- Cure / Technology: Thermoset; Single Component
from Fujipoly® America Corp.
FEATURES: • Highly Conformable and High Heat Conducting Gel materials. • SARCON Thermal Gap Filler Pads are highly conformable and high heat conducting gel materials in a versatile sheet form. • Easily fit and adhere to most all shapes and sizes of components, including protrusions... [See More]
- Form / Shape: Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Type: High Dielectric
- Gap Fill: 0.0118 to 0.0787
from Master Bond, Inc.
EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]
- Form / Shape: Liquid; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from Fujipoly® America Corp.
Highly Conformable and High Heat Conducting gel materials. SARCON ® Thermal Gap Filler Pads are highly conformable and high heat conducting gel materials in a versatile sheet form. They easily fit and adhere to most all shapes and sizes of components, including protrusions and recessed areas. [See More]
- Form / Shape: Gel; Gap Filler, Foam in Place Gasket
- Gap Fill: 0.0394 to 0.1181
- Chemical System: Silicone
- Industry: Electronics; Semiconductors, IC's
from Master Bond, Inc.
EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]
- Form / Shape: Liquid; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from Fujipoly® America Corp.
Fujipoly ® recently released Sarcon ® GR130A, its newest high-performance, thermal gap filler pad. The highly conformable, gel-like sheets exhibit a thermal resistance as low as 0.02 °C •in2/W at 43.5 PSI with a thermal conductivity of 13 W/m °K. Sarcon ® GR130A is available... [See More]
- Form / Shape: Pad; Gap Filler, Foam in Place Gasket
- Gap Fill: 0.0118 to 0.0787
- Chemical System: Silicone
- Industry: Electronics; Semiconductors, IC's
from Master Bond, Inc.
MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]
- Form / Shape: Liquid; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Type: High Dielectric
- Composition: Filled
from Fujipoly® America Corp.
SARCON ® PG130A from Fujipoly ® is one of the industry ’s newest high-performance thermal interface materials that is extremely compressible. This double-sticky surface TIM is a great choice for applications that have delicate or wide-variation component heights and require extremely... [See More]
- Form / Shape: Putty; Gap Filler, Foam in Place Gasket
- Gap Fill: 0.0118 to 0.0787
- Type: High Dielectric
- Industry: Electronics; Semiconductors, IC's
from Master Bond, Inc.
Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]
- Form / Shape: Liquid; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
- Type: High Dielectric; Optical
- Composition: Unfilled
from Fujipoly® America Corp.
SARCON® Extremely Compressible Gap Filler Type (Putty Type) is a highly conformable, thermally conductive, non-flammable interface materials. The surface consistency is excellent for filling small air gaps and uneven mating surface, making reliable contact with various shapes and sizes of... [See More]
- Form / Shape: Putty; Gap Filler, Foam in Place Gasket
- Industry: Electronics; Semiconductors, IC's
- Type: High Dielectric
- Use Temperature: -40 to 302
from Master Bond, Inc.
Master Bond EP30NS is a nano silica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]
- Form / Shape: Liquid; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
- Type: High Dielectric; Optical
- Composition: Filled
from Fujipoly® America Corp.
SARCON ® SPG-25B-NS from Fujipoly ® is an easy to dispense, low- viscosity, silicone free compound that exhibits a thermal conductivity of 2.5 W/m °K and a thermal resistance of only 2.1 °K •cm2/W. When applied between heat-generating components and a nearby heat sink or... [See More]
- Form / Shape: Grease, Paste; Gap Filler, Foam in Place Gasket
- Use Temperature: -40 to 248
- Industry: Electronics
- Thermal Conductivity: 2.5 to 25
from Master Bond, Inc.
EP42-2LV Black is a two component, room temperature curing epoxy compound featuring low viscosity and superior chemical resistance. It meets NASA low outgassing specifications, is black in color and optically opaque. [See More]
- Form / Shape: Liquid; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from Fujipoly® America Corp.
SARCON ® PG65A from Fujipoly ® is one of the industry ’s newest high-performance thermal interface materials that is extremely compressible. This double-sticky surface TIM is a great choice for applications that have delicate or wide-variation component heights and require extremely... [See More]
- Form / Shape: Pad; Putty; Gap Filler, Foam in Place Gasket
- Industry: Aerospace; Automotive; Electronics; OEM or Industrial
- Chemical System: Silicone
- Use Temperature: -40 to 302
from Master Bond, Inc.
Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part nickel conductive systems, EP76M... [See More]
- Form / Shape: Die Bonding Adhesives; Grease, Paste; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Fujipoly® America Corp.
The SARCON® LG Series is the perfect solution for filling large, complex and uneven gaps between heat generating components that depend on reliable contact with a heat spreader to maintain optimal performance. SARCON® LG23A and LG30A easily dispense in a liquid form that will cure at room... [See More]
- Form / Shape: Gel; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Type: High Dielectric
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for conventional bonding and sealing. This system features an excellent die shear strength of 24-27 kg-f and can be used in a typical die size ranging from 4-400 mm2. EP17HTDA-1 can also be... [See More]
- Form / Shape: Liquid; Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from Techsil Limited
Momentive TIA241GF is a 2 part, thermally conductive silicone that is dispensed as a liquid and cured in place to create a heat path for efficient heat transfer. After being applied, the non-slumping paste consistency of TIA214GF provides physical stability to prevent run-off after dispense. [See More]
- Form / Shape: Grease, Paste; Gap Filler, Foam in Place Gasket
- Industry: Electronics
- Chemical System: Silicone
- Features: Flame Retardant
from Protavic America, Inc.
PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ is heat stable up to 150 °C. [See More]
- Form / Shape: Gel; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Filled
from Shiu Li Technology Co., Ltd
LiPOLY BS75K is a soft thermally conductive gap filler. With a thermal conductivity of 3.0 W/m*K and a low thermal impedance, BS75K is suitable for a wide range of applications. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for a wide... [See More]
- Form / Shape: Pad; Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
- Gap Fill: 0.0197 to 0.1969
- Chemical System: Silicone
- Industry: Electronics
from Boyd
Thermal Interface Materials - Gap Fillers and Pads, Films, Tapes, Hardware. Electronic devices continue to become faster, smaller, and more powerful every day, enabling technological advancements across all industries. The Internet of Things, powered by embedded electronics and its complex... [See More]
- Form / Shape: Pad; Gap Filler, Foam in Place Gasket
from Aremco Products, Inc.
High fired strength, dense ceramics [See More]
- Form / Shape: Liquid; Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
- Chemical System: Ceramic
- Type: High Dielectric
- Composition: Filled
from Henkel Corporation - Electronics
GAP PAD ™ HC 5.0 is a soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique filler package and low-modulus resin formulation. The enhanced material is ideal for applications... [See More]
- Form / Shape: Pad; Gap Filler, Foam in Place Gasket
- Industry: Electronics
from Henkel Corporation - Industrial
BERGQUIST GAP PAD TGP 1350, Highly Conformable, Thermally Conductive, Reworkable Gap Filling Material. BERGQUIST ® GAP PAD TGP 1350 is a highly compliant Gap Pad material that is ideal for fragile component leads. The material includes a PEN film, which facilitates rework and improves puncture... [See More]
- Form / Shape: Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
from Henkel Adhesive Technologies - Aviation, Space and Rail
BERGQUIST ® GAP FILLER TGF 3500LVO is a silicone, two-component, high thermal conductivity, liquid gap filler. This product offers the mechanical property benefits of a silicone material with the additional feature of low outgassing. It can be used in industries ranging from automotive to... [See More]
- Form / Shape: Liquid; Gap Filler, Foam in Place Gasket
- Cure / Technology: Thermoset
- Chemical System: Silicone
- Industry: OEM or Industrial
from Sauereisen, Inc.
Sauereisen Cement No. 31 is a white, porcelain-like cement that is widely used throughout industry in a variety of applications. including assembling, sealing, insulating and cementing of ceramics, porcelain, metal, and glass. [See More]
- Form / Shape: Liquid; Powder; Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
- Chemical System: Ceramic
- Type: High Dielectric
- Composition: Unfilled
from Techsil Limited
Techsil ® TIM11123 (GB) Grey is a 200 micron, self-gapping, non-corrosive, 1-part room temperature vulcanizing (RTV) silicone rubber. It is one of a new family of products called acetone cure sealants. These products are cured rapidly in contact with atmospheric moisture to a tough rubber that... [See More]
- Form / Shape: Gap Filler, Foam in Place Gasket
- Features: Electrically Conductive
from Shiu Li Technology Co., Ltd
LiPOLY ’s S282 is a thermally conductive pad designed for gap filling. The thermal conductivity is 1.7 W/m*K. It uses fiberglass cloth as the reinforcement material with great self-adhesive that can fit closely with non-flat heat sinks to increase the contact area. The low stress damped... [See More]
- Form / Shape: Pad; Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
- Gap Fill: 0.0197 to 0.1969
- Chemical System: Silicone
- Industry: Electronics
from Aremco Products, Inc.
Used for repairing metal components, pinholes, cracks, and filling seams. [See More]
- Form / Shape: Grease, Paste; Gap Filler, Foam in Place Gasket
- Composition: Filled
- Chemical System: Ceramic
- Cure / Technology: Thermoset
from Henkel Adhesive Technologies - Aviation, Space and Rail
BERGQUIST GAP PAD TGP 7000ULM is an extremely soft gap filling material rated at a thermal conductivity of 7.0 W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique... [See More]
- Form / Shape: Pad; Gap Filler, Foam in Place Gasket
- Industry: OEM or Industrial
- Chemical System: Silicone
- Use Temperature: -76 to 392
from Shiu Li Technology Co., Ltd
LiPOLY S393 is a product with high ductile thermal conductivity. Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material. It won't easy to break and deformwhether stamped, punched, strip type, or custom cutting. Your best choice... [See More]
- Form / Shape: Pad; Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Type: High Dielectric
- Gap Fill: 0.0197 to 0.3937
from Shiu Li Technology Co., Ltd
LiPOLY S818 is a product with high ductile thermal conductivity.Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material.It won't easy to break and deform whether stamped, punched, strip type, or custom cutting. Your best choice... [See More]
- Form / Shape: Pad; Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Type: High Dielectric
- Gap Fill: 0.0197 to 0.3937
from Shiu Li Technology Co., Ltd
LiPOLY DCTP140-s is a thermal insulator uses fiberglass cloth as a reinforcement material, combined with thermal conductive silicon, giving it high thermal conduction and great compression strength. The thermal conductivity is 4.5 W/m*K, the thickness is 0.25~0.45mm. Its high insulation and... [See More]
- Form / Shape: Pad; Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Type: High Dielectric
- Gap Fill: 0.0098 to 0.0177
from Shiu Li Technology Co., Ltd
Our high thermally conductive gap filler T-work 7000 provides excellent compression and extremely low thermal resistance in form shape with high thermal conductivity for gap filling between electrical component and heatsink. [See More]
- Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
- Gap Fill: 0.0197 to 0.1969
- Chemical System: Silicone
- Industry: Electronics
from Shiu Li Technology Co., Ltd
LiPOLY T-top99-s offers outstanding thermal conductivity at 24.0 W/m*K and extremely low thermal resistance under minimal force.T-top99-s offers excellent compression, filling small air gaps on uneven surfaces, ensuring an efficient and consistent transfer of heat. [See More]
- Form / Shape: Pad; Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Type: High Dielectric
- Gap Fill: 0.0197 to 0.3937
from Shiu Li Technology Co., Ltd
LiPOLY's TPS series is a low-density, potting material. Its low density and lightweight properties enhance product performance, reduce production costs. The product has a thermal conductivity of 0.55-1.50 W/m*K and can cure at room temperature or high temperatures. [See More]
- Form / Shape: Liquid; Grease, Paste; Gap Filler, Foam in Place Gasket
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Chemical System: Silicone
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
from Shiu Li Technology Co., Ltd
LiPOLY EP770 is a two-part epoxy material for gap filling. Extremely low viscosity and flowability. Good dispersion and no delamination. The high deformation material, which filling the gap closely, cover the tolerance, and has outstanding conductivity, makes is suitable for filling the peculiar... [See More]
- Form / Shape: Syringe/Cartridge; Gap Filler, Foam in Place Gasket
- Industry: Electronics
- Chemical System: Epoxy
- Use Temperature: -76 to 302
from Shiu Li Technology Co., Ltd
LiPOLY's NL-putty series is a silicone free, low-density gel filling material. Its low density and lightweight characteristics enhance product performance, reduce production costs. Commonly used in electronic products and automotive electronic devices, this series has a thermal conductivity of... [See More]
- Form / Shape: Gel; Liquid; Syringe/Cartridge/Pale; Gap Filler, Foam in Place Gasket
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Gap Fill: 0.0039 to 0.0591
- Use Temperature: -76 to 257
from Shiu Li Technology Co., Ltd
LiPOLY ’s PK223 is a material designed for gap filling. The thermal conductivity is 2.0W/m*K. The hardness is Shore 00/30 with high flexibility, high compressibility, highly insulating, great self-adhesive, which can cover the tolerance of design making it very stable. It also offers... [See More]
- Form / Shape: Pad; Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
- Gap Fill: 0.0197 to 0.3937
- Chemical System: Silicone
- Industry: Electronics
from Shiu Li Technology Co., Ltd
LiPOLY ’s PK404 is a material designed for gap filling. The thermal conductivity is 4.0W/m*K. The hardness is Shore 00/40 with high flexibility, high compressibility, highly insulating, great self-adhesive, which can cover the tolerance of design making it very stable. It also offers... [See More]
- Form / Shape: Pad; Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
- Gap Fill: 0.0197 to 0.3937
- Chemical System: Silicone
- Industry: Electronics
from Shiu Li Technology Co., Ltd
LiPOLY ’s PK605 is a material designed for gap filling. The thermal conductivity is 6.0 W/m*K. The hardness is Shore 00/60 with high flexibility, high compressibility, highly insulating, great self-adhesive, which can cover the tolerance of design making it very stable. It also offers... [See More]
- Form / Shape: Pad; Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
- Gap Fill: 0.0197 to 0.1969
- Chemical System: Silicone
- Industry: Electronics