Pad Thermal Compounds and Thermal Interface Materials
from Fujipoly® America Corp.
Silicone Gap Filler Pad for Absorption of Electromagnetic Wave. Features. Effective to absorb and damp a wide range of electromagnetic waves. Also effective as a high performance thermal interface material. Easily filling small gaps of IC chip surface with soft gel texture. Good workability to... [See More]
- Form / Shape: Pad; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Type: High Dielectric
- Gap Fill: 0.0197 to 0.0984
from Dongguan Sheen Electronic Technology Co., Ltd.
CSF series Carbon Fiber Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Exceptional thermal conductivity options ranging from 15 to 45 W/mK. ◆ Available in various thicknesses from 0.3 to 12.0 mm. ◆ Features natural tackiness for easy application... [See More]
- Form / Shape: Pad
- Use Temperature: ? to 320
- Industry: Electronics
- Thermal Conductivity: 25
from Fujipoly® America Corp.
Fujipoly ® recently released Sarcon ® GR130A, its newest high-performance, thermal gap filler pad. The highly conformable, gel-like sheets exhibit a thermal resistance as low as 0.02 °C •in2/W at 43.5 PSI with a thermal conductivity of 13 W/m °K. Sarcon ® GR130A is available... [See More]
- Form / Shape: Pad; Gap Filler, Foam in Place Gasket
- Gap Fill: 0.0118 to 0.0787
- Chemical System: Silicone
- Industry: Electronics; Semiconductors, IC's
from Dongguan Sheen Electronic Technology Co., Ltd.
CSF series Carbon Fiber Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Exceptional thermal conductivity options ranging from 15 to 45 W/mK. ◆ Available in various thicknesses from 0.3 to 12.0 mm. ◆ Features natural tackiness for easy application... [See More]
- Form / Shape: Pad
- Use Temperature: ? to 320
- Industry: Electronics
- Thermal Conductivity: 15
from Fujipoly® America Corp.
Sarcon ® XR-e is highly conformable/thermally conductive gel materials, 11watt/m-K (No electricity conductive) in a versatile sheet form that easily fit and adhere e to most all shapes and sizes of components, and makes reliable and complete physical contact. The surface consistency of the pads... [See More]
- Form / Shape: Gel; Pad; Gap Filler, Foam in Place Gasket
- Gap Fill: 0.0394 to 0.0787
- Chemical System: Silicone
- Industry: Electronics; Semiconductors, IC's
from Dongguan Sheen Electronic Technology Co., Ltd.
CSF series Carbon Fiber Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Exceptional thermal conductivity options ranging from 15 to 45 W/mK. ◆ Available in various thicknesses from 0.3 to 12.0 mm. ◆ Features natural tackiness for easy application... [See More]
- Form / Shape: Pad
- Use Temperature: ? to 320
- Industry: Electronics
- Thermal Conductivity: 35
from Fujipoly® America Corp.
SARCON ® PG65A from Fujipoly ® is one of the industry ’s newest high-performance thermal interface materials that is extremely compressible. This double-sticky surface TIM is a great choice for applications that have delicate or wide-variation component heights and require extremely... [See More]
- Form / Shape: Pad; Putty; Gap Filler, Foam in Place Gasket
- Industry: Aerospace; Automotive; Electronics; OEM or Industrial
- Chemical System: Silicone
- Use Temperature: -40 to 302
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SP Series Phase Change Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.8 to 6.0 W/m ·K. ◆ Low thermal impedance, reaching as low as 0.015 ℃*in ²/W at 50psi, ensuring... [See More]
- Form / Shape: Pad
- Use Temperature: -40 to 257
- Industry: Electronics
- Thermal Conductivity: 6
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SF Series Silicone Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.5 to 15.0 W/m ·K. ◆ Available in various thicknesses from 0.3 to 10.0 mm. ◆ Highly compressible, soft,... [See More]
- Form / Shape: Pad
- Use Temperature: -58 to 392
- Industry: Electronics
- Thermal Conductivity: 4
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SF Series Silicone Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.5 to 15.0 W/m ·K. ◆ Available in various thicknesses from 0.3 to 10.0 mm. ◆ Highly compressible, soft,... [See More]
- Form / Shape: Pad
- Use Temperature: -40 to 248
- Industry: Electronics
- Thermal Conductivity: 15
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's AF Series Silicone-free Thermal Pads (Non-silicone Thermal Pads) are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.0 to 8.0 W/m ·K. ◆ Available in various thicknesses from 0.5 to 5.0 mm. ◆... [See More]
- Form / Shape: Pad
- Industry: Electronics
- Chemical System: Silicone
- Use Temperature: -40 to 248
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SF Series Silicone Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.5 to 15.0 W/m ·K. ◆ Available in various thicknesses from 0.3 to 10.0 mm. ◆ Highly compressible, soft,... [See More]
- Form / Shape: Pad
- Use Temperature: -58 to 302
- Industry: Electronics
- Thermal Conductivity: 7
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SF Series Silicone Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.5 to 15.0 W/m ·K. ◆ Available in various thicknesses from 0.3 to 10.0 mm. ◆ Highly compressible, soft,... [See More]
- Form / Shape: Pad
- Use Temperature: -58 to 392
- Industry: Electronics
- Thermal Conductivity: 5
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SP Series Phase Change Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.8 to 6.0 W/m ·K. ◆ Low thermal impedance, reaching as low as 0.015 ℃*in ²/W at 50psi, ensuring... [See More]
- Form / Shape: Pad
- Use Temperature: -40 to 257
- Industry: Electronics
- Thermal Conductivity: 4
from Shiu Li Technology Co., Ltd
LiPOLY DTT44 is a soft thermally conductive gel pad specifically designed for networking applications. DTT44 is designed to focus on Dk and Df to reduce interference in RF modules. DTT44 has a thermal conductivity of 3.0 W/m*K. This product can be supplied as standard sheets, custom die-cuts or... [See More]
- Form / Shape: Pad; Sheet Form, Die-cut Parts
- Gap Fill: 0.0197 to 0.1969
- Chemical System: Silicone
- Industry: Electronics
from Ohmite Manufacturing Co.
Ohmite thermal interface materials (TIMs) are designed for use in applications requiring reliable performance, low contact resistance, long life, low maintenance and high thermal conductivity. The flexible graphite materials are die-cut to ensure exact fit and reduce module-to-module variation... [See More]
- Form / Shape: Pad
- Use Temperature: -40 to 752
- Industry: Electronics; Electric Power; OEM or Industrial
- Thermal Conductivity: 800
from Boyd
Thermal Interface Materials - Gap Fillers and Pads, Films, Tapes, Hardware. Electronic devices continue to become faster, smaller, and more powerful every day, enabling technological advancements across all industries. The Internet of Things, powered by embedded electronics and its complex... [See More]
- Form / Shape: Pad; Gap Filler, Foam in Place Gasket
from Henkel Adhesive Technologies - Aviation, Space and Rail
BERGQUIST ® GAP PAD TGP 10000ULM is an extremely soft gap filling material rated at a thermal conductivity of 10.0 W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the... [See More]
- Form / Shape: Pad
- Industry: OEM or Industrial
- Chemical System: Silicone
- Use Temperature: -76 to 392
from Henkel Corporation - Electronics
GAP PAD ™ HC 5.0 is a soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique filler package and low-modulus resin formulation. The enhanced material is ideal for applications... [See More]
- Form / Shape: Pad; Gap Filler, Foam in Place Gasket
- Industry: Electronics
from Shiu Li Technology Co., Ltd
LiPOLY DTT65 is a soft thermally conductive gel pad specifically designed for networking applications. DTT65 is designed to focus on Dk and Df to reduce interference in RF modules. DTT65 has a thermal conductivity of 5.0 W/m*K. This product can be supplied as standard sheets, custom die-cuts or... [See More]
- Form / Shape: Pad; Sheet Form, Die-cut Parts
- Gap Fill: 0.0197 to 0.1969
- Chemical System: Silicone
- Industry: Electronics
from Henkel Adhesive Technologies - Aviation, Space and Rail
BERGQUIST ® GAP PAD TGP 5000 is a silicone based, thermally conductive, fiberglass reinforced and S-class soft gap pad. Its highly conformable nature and S-class softness ensures that it conforms to demanding contours and maintains structural integrity. Fiberglass reinforcement provides... [See More]
- Form / Shape: Pad
- Industry: OEM or Industrial
- Chemical System: Silicone
- Use Temperature: -76 to 392
from Shiu Li Technology Co., Ltd
LiPOLY BS75K is a soft thermally conductive gap filler. With a thermal conductivity of 3.0 W/m*K and a low thermal impedance, BS75K is suitable for a wide range of applications. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for a wide... [See More]
- Form / Shape: Pad; Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
- Gap Fill: 0.0197 to 0.1969
- Chemical System: Silicone
- Industry: Electronics
from Henkel Adhesive Technologies - Aviation, Space and Rail
BERGQUIST GAP PAD TGP 7000ULM is an extremely soft gap filling material rated at a thermal conductivity of 7.0 W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique... [See More]
- Form / Shape: Pad; Gap Filler, Foam in Place Gasket
- Industry: OEM or Industrial
- Chemical System: Silicone
- Use Temperature: -76 to 392
from Shiu Li Technology Co., Ltd
LiPOLY BS87 is an ultra-soft thermally conductive gel pad with a thermal conductivity of 3.0 W/m*K. BS87 offers excellent compression under minimal force with high recovery characteristics. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for... [See More]
- Form / Shape: Pad; Sheet Form, Die-cut Parts
- Gap Fill: 0.0197 to 0.1969
- Chemical System: Silicone
- Industry: Electronics
from Shiu Li Technology Co., Ltd
LiPOLY ’s S282 is a thermally conductive pad designed for gap filling. The thermal conductivity is 1.7 W/m*K. It uses fiberglass cloth as the reinforcement material with great self-adhesive that can fit closely with non-flat heat sinks to increase the contact area. The low stress damped... [See More]
- Form / Shape: Pad; Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
- Gap Fill: 0.0197 to 0.1969
- Chemical System: Silicone
- Industry: Electronics
from Shiu Li Technology Co., Ltd
LiPOLY S393 is a product with high ductile thermal conductivity. Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material. It won't easy to break and deformwhether stamped, punched, strip type, or custom cutting. Your best choice... [See More]
- Form / Shape: Pad; Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Type: High Dielectric
- Gap Fill: 0.0197 to 0.3937
from Shiu Li Technology Co., Ltd
LiPOLY S818 is a product with high ductile thermal conductivity.Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material.It won't easy to break and deform whether stamped, punched, strip type, or custom cutting. Your best choice... [See More]
- Form / Shape: Pad; Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Type: High Dielectric
- Gap Fill: 0.0197 to 0.3937
from Shiu Li Technology Co., Ltd
LiPOLY DCTP140-s is a thermal insulator uses fiberglass cloth as a reinforcement material, combined with thermal conductive silicon, giving it high thermal conduction and great compression strength. The thermal conductivity is 4.5 W/m*K, the thickness is 0.25~0.45mm. Its high insulation and... [See More]
- Form / Shape: Pad; Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Type: High Dielectric
- Gap Fill: 0.0098 to 0.0177
from Shiu Li Technology Co., Ltd
LiPOLY PR27 is a very thin high insulator with a thickness of 0.15mm. It uses Polyimide Film as the reinforcement material, which can increase the tensile strength. It has great dielectric strength and can withstand 12K voltages. It ’s suitable for high power transistors, electrical equipment,... [See More]
- Form / Shape: Pad; Sheet Form, Die-cut Parts
- Gap Fill: 0.0059
- Chemical System: Silicone
- Industry: Electronics
from Shiu Li Technology Co., Ltd
LiPOLY ’s thermal insulator SH1500/2000/3000 uses fiberglass cloth as a reinforcement material, combined with thermal conductive silicon, giving it high thermal conduction and great compression strength. The thermal conductivity is 1.5/2.0/3.0 W/m*K, the thickness is 0.23~0.35mm. Its high... [See More]
- Form / Shape: Pad; Sheet Form, Die-cut Parts
- Gap Fill: 0.0091 to 0.0138
- Chemical System: Silicone
- Industry: Electronics