Non-corrosive Cure Thermal Compounds and Thermal Interface Materials
from Master Bond, Inc.
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]
- Features: Phase Change; Non-corrosive; Flexible; Dissimilar Substrates
- Chemical System: Silicone
- Type: High Dielectric; Optical
- Composition: Unfilled
from Master Bond, Inc.
EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]
- Features: Flame Retardant; Non-corrosive; Flexible; Dissimilar Substrates
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from Master Bond, Inc.
EP3HTND-2Med Black is a one part system that combines easy processing with excellent bonding properties. It cures in 20-30 minutes at 250°F or 5-10 minutes at 300°F and adheres well to a wide variety of substrates including glass, metals, ceramics and most plastics. This paste compound meets USP... [See More]
- Features: Non-corrosive; Dissimilar Substrates
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from Master Bond, Inc.
One part, nano silica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]
- Features: Phase Change; Non-corrosive; Dissimilar Substrates
- Composition: Filled
- Type: High Dielectric
- Cure / Technology: UV or Radiation Cured; Single Component; Dual Curing
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Features: Electrically Conductive; Phase Change; Non-corrosive; Flexible; Dissimilar Substrates
- Composition: Filled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component ; Addition Cure
from Master Bond, Inc.
EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]
- Features: Non-corrosive; Dissimilar Substrates
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from Master Bond, Inc.
Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]
- Features: Electrically Conductive; Non-corrosive; Dissimilar Substrates
- Composition: Filled
- Chemical System: Polyphenylene Sulfide; Epoxy
- Cure / Technology: Thermoset; Single Component
from Master Bond, Inc.
EP35SP is a two component epoxy system specially formulated to resist high temperatures and aggressive chemicals. It has a paste viscosity with little to no flow when curing. [See More]
- Features: Non-corrosive; Dissimilar Substrates
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from Master Bond, Inc.
EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]
- Features: Flame Retardant; Non-corrosive; Dissimilar Substrates
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from Master Bond, Inc.
EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]
- Features: Non-corrosive; Flexible; Dissimilar Substrates
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from Master Bond, Inc.
MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]
- Features: Phase Change; Non-corrosive; Flexible; Dissimilar Substrates
- Chemical System: Silicone
- Type: High Dielectric; Optical
- Composition: Unfilled
from Master Bond, Inc.
MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]
- Features: Non-corrosive; Flexible; Dissimilar Substrates
- Chemical System: Silicone
- Type: High Dielectric
- Composition: Filled
from Master Bond, Inc.
Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]
- Features: Non-corrosive; Dissimilar Substrates
- Chemical System: Epoxy
- Type: High Dielectric; Optical
- Composition: Unfilled
from Master Bond, Inc.
Master Bond EP30NS is a nano silica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]
- Features: Non-corrosive; Dissimilar Substrates
- Chemical System: Epoxy
- Type: High Dielectric; Optical
- Composition: Filled
from Master Bond, Inc.
EP42-2LV Black is a two component, room temperature curing epoxy compound featuring low viscosity and superior chemical resistance. It meets NASA low outgassing specifications, is black in color and optically opaque. [See More]
- Features: Non-corrosive; Dissimilar Substrates
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from Master Bond, Inc.
Master Bond X21Med is a toughened one part system that can be used for bonding and priming polyolefinic surfaces. This exceptionally low viscosity ( <250 cps) solvent based system is easy to apply and process. It cures at room temperature or more rapidly with the addition of heat. X21Med passes... [See More]
- Features: Non-corrosive; Dissimilar Substrates
- Composition: Unfilled
- Type: High Dielectric
- Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Master Bond Supreme 17HT is a one component toughened epoxy for bonding and sealing. It has a moderate viscosity system with good flow properties. [See More]
- Features: Non-corrosive; Flexible; Dissimilar Substrates
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from Master Bond, Inc.
Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for conventional bonding and sealing. This system features an excellent die shear strength of 24-27 kg-f and can be used in a typical die size ranging from 4-400 mm2. EP17HTDA-1 can also be... [See More]
- Features: Non-corrosive; Dissimilar Substrates
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from Master Bond, Inc.
Master Bond UV10TK40M is a higher viscosity, one part UV system for bonding, sealing and coating with good optical clarity, excellent physical properties and a high glass transition temperature. [See More]
- Features: Non-corrosive; Dissimilar Substrates
- Composition: Unfilled
- Type: High Dielectric; Optical
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; UV curing system
from Master Bond, Inc.
Supreme 3HTND-2DM is a rapid curing, toughened, one part epoxy system used for the dam-and-fill method for chip-on-board encapsulation. It passes ASTM E595 specifications for NASA low outgassing allowing it to be used in vacuum, aerospace, electro-optic and other related applications. Supreme... [See More]
- Features: Non-corrosive; Dissimilar Substrates
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from Master Bond, Inc.
Formulated to have special optical transmission properties, EP30-2LB is an optically clear epoxy that does not permit UV light transmission, but transmits well from 450-900 nm and above. It is a user friendly compound that has a non-critical ten to one mix ratio by weight. This system cures readily... [See More]
- Features: Non-corrosive; Dissimilar Substrates
- Chemical System: Epoxy
- Type: High Dielectric; Optical
- Composition: Unfilled
from Master Bond, Inc.
Formulated for thermal management applications, EP30TC is a two component epoxy that contains robust thermally conductive fillers with very fine particle sizes. It has thermal conductivity of 18-20 BTU •in/ft2 •hr • °F [2.60-2.88 W/(m •K)] and can be applied in sections as... [See More]
- Features: Non-corrosive; Dissimilar Substrates
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Filled
from Master Bond, Inc.
EP41S-5 is chemically resistant and withstands acids, bases, alcohols, fuels and many solvents. This two part epoxy is widely used for bonding, sealing, coating, and encapsulating. It provides high physical strength properties and electrical insulation values. EP41S-5 offers convenient handling with... [See More]
- Features: Non-corrosive; Dissimilar Substrates
- Chemical System: Epoxy
- Type: High Dielectric
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Master Bond EP42HT-3AO is thermally conductive, electrically insulating epoxy for bonding, sealing, coating and encapsulation applications. Among its many favorable attributes, this system has a high glass transition temperature and a low coefficient of thermal expansion. [See More]
- Features: Non-corrosive; Dissimilar Substrates
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from Master Bond, Inc.
Master Bond EP121AO is a two component, high performance epoxy resin system featuring high thermal stability, high thermal conductivity, superior electrical insulation properties and outstanding dimensional stability for coating, sealing, potting and encapsulation for service up to 450-500 °F. [See More]
- Features: Non-corrosive; Dissimilar Substrates
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Filled