Non-corrosive Cure Thermal Compounds and Thermal Interface Materials Datasheets

B-Staged Film Adhesive/Sealant Featuring Toughness, High Temperature Resistance, Thermal Conductivity and Electrical Isolation -- FLM36
from Master Bond, Inc.

Master Bond FLM36 is a very special film adhesive featuring incomparable strength properties, high temperature resistance and first class thermal conductivity and electrical insulation properties. It differs from other heat resistant epoxies due to its toughness. FLM36 retains very high physical... [See More]

  • Features: Non-corrosive; Flexible; Dissimilar Substrates
  • Composition: Unfilled
  • Type: High Dielectric
  • Cure / Technology: Thermoset
Dissipator® -- 745
from Hernon Manufacturing, Inc.

Dissipator ® structural acrylics provide specific adhesion for bonding electrical heat sink components with high thermal conductivity. Heat trapped and not dissipated by the components can lead to premature component failure and costly repair and replacement. Thermal conductivity is assured and... [See More]

  • Features: Phase Change; Non-corrosive; Dissimilar Substrates
  • Chemical System: Acrylic
  • Type: High Dielectric
  • Composition: Unfilled