Two Component System Thermal Compounds and Thermal Interface Materials
from Master Bond, Inc.
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing; Addition Cure
- Chemical System: Silicone
- Type: High Dielectric; Optical
- Composition: Unfilled
from CHT USA Inc.
CHT's QSil 563 is a 2-part, platinum cure, 100% silicone solids elastomer designed for electronic potting and encapsulation applications. QSil 562 offers a hard, low modulus material that is readily repairable. QSil 563 is thermally conductive to aid in efficient heat dissipation. This silicone... [See More]
- Cure / Technology: Two Component ; Addition
- Features: Flame Retardant; UL Rating
- Industry: Automotive; Electronics
- Use Temperature: -67 to 399
from Fujipoly® America Corp.
The SARCON® LG Series is the perfect solution for filling large, complex and uneven gaps between heat generating components that depend on reliable contact with a heat spreader to maintain optimal performance. SARCON® LG23A and LG30A easily dispense in a liquid form that will cure at room... [See More]
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Silicone
- Type: High Dielectric
- Form / Shape: Gel; Gap Filler, Foam in Place Gasket
from MacDermid Alpha Electronics Solutions
High-reliability, two-component polyurethane conformal coating for demanding applications. Product Overview. Electrolube ® 2K301P is a high-performance, two-component conformal coating specifically formulated for selective coating processes. It features increased coating thickness, enhanced... [See More]
- Cure / Technology: Two Component
- Industry: Automotive; Electronics; Semiconductors, IC's
- Form / Shape: Encapsulant or Conformal Coating
- Use Temperature: -85 to 302
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Cure / Technology: Thermoset; Two Component ; Addition Cure
- Composition: Filled
- Chemical System: Silicone
- Form / Shape: Grease, Paste; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
from CHT USA Inc.
CHT's SE3000 is a 2-part, platinum cure silicone elastomer designed for electronic potting and encapsulation applications. It offers good prtection against chemicals, environmental contamination, mechanical shock, vibration and impact damage. SE3000 can be used in applications where low flammability... [See More]
- Cure / Technology: Two Component ; Addition
- Features: Flame Retardant; UL Rating
- Industry: Electronics
- Use Temperature: -94 to 482
from Master Bond, Inc.
EP35SP is a two component epoxy system specially formulated to resist high temperatures and aggressive chemicals. It has a paste viscosity with little to no flow when curing. [See More]
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from CHT USA Inc.
CHT's QSil 553 is a 2-part, platinum cure, silicone potting compound and encapsulant designed to protect electronic components from harsh environmental conditions and shock and vibration. It features a low viscosity for convenient dispensing and will easily flow throughout components. Because of its... [See More]
- Cure / Technology: Two Component ; Addition
- Features: Flame Retardant; UL Rating
- Industry: Automotive; Electronics; OEM or Industrial
- Use Temperature: -67 to 464
from Master Bond, Inc.
EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from Master Bond, Inc.
EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from Master Bond, Inc.
MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Silicone
- Type: High Dielectric; Optical
- Composition: Unfilled
from Master Bond, Inc.
MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Silicone
- Type: High Dielectric
- Composition: Filled
from Master Bond, Inc.
Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Epoxy
- Type: High Dielectric; Optical
- Composition: Unfilled
from Master Bond, Inc.
Master Bond EP30NS is a nano silica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Epoxy
- Type: High Dielectric; Optical
- Composition: Filled
from Master Bond, Inc.
EP42-2LV Black is a two component, room temperature curing epoxy compound featuring low viscosity and superior chemical resistance. It meets NASA low outgassing specifications, is black in color and optically opaque. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from Master Bond, Inc.
Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part nickel conductive systems, EP76M... [See More]
- Cure / Technology: Thermoset; Two Component
- Composition: Filled
- Chemical System: Epoxy
- Form / Shape: Die Bonding Adhesives; Grease, Paste; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
from Master Bond, Inc.
Formulated to have special optical transmission properties, EP30-2LB is an optically clear epoxy that does not permit UV light transmission, but transmits well from 450-900 nm and above. It is a user friendly compound that has a non-critical ten to one mix ratio by weight. This system cures readily... [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Epoxy
- Type: High Dielectric; Optical
- Composition: Unfilled
from Protavic America, Inc.
PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]
- Cure / Technology: Thermoset; Two Component
- Composition: Unfilled
- Chemical System: Silicone
- Form / Shape: Liquid; Die Bonding Adhesives; Encapsulant or Conformal Coating
from Epoxies Etc...
The 10-2055 and 10-2055 HV were developed to produce a general purpose, semi flexible polyurethane adhesive for bonding a wide variety of plastic and metal substrates. The flexibility of these adhesives allows bonding to substrates with high coefficients of thermal expansion (CTE) and substrates... [See More]
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Form / Shape: Die Bonding Adhesives; Grease, Paste
- Chemical System: Polyurethane
- Industry: OEM or Industrial
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 872-7TN1, Epoxy, Non-conductive adhesive LOCTITE ® ABLESTIK 872-7TN1 is ideal for electronic applications requiring stress relief. Flexible. Thixotropic. High viscosity. Long work life. Easy handling. High thermal conductivity. Reduced stress [See More]
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Type: High Dielectric
- Form / Shape: Paste
from Techsil Limited
Techsil ® EP25485 is a low viscosity, thermally conductive flame retardant potting and encapsulating compound. The mixed system has a long usable life and may be hot or cold cured. The system exhibits a good surface finish, high electrical strength, high thermal conductivity and low cure... [See More]
- Cure / Technology: Two Component
- Form / Shape: Liquid
- Chemical System: Epoxy
- Industry: Electronics
from ACCRAbond, Inc.
INSTAbond ® 809FR. INSTAbond ® 809 FR exhibits good thermal conductivity, excellent flow properties, and low exotherm characteristics in large masses. INSTAbond ® 809 FR meets the requirements for UL-94 V-0 rating for flame retardancy. [See More]
- Cure / Technology: Two Component
- Features: Flame Retardant; UL Rating
- Chemical System: Epoxy
from Hapco, Inc.
Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame... [See More]
- Cure / Technology: Thermoset; Two Component
- Form / Shape: Liquid
- Type: High Dielectric
- Industry: Electronics
from Epoxy Technology
EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Type: High Dielectric; Optical
- Form / Shape: Grease, Paste
from Hi-Tech Seals, Inc.
HERNON ® offers a complete line of structural acrylic adhesives. These systems are two-part, no mix, and reactive adhesives. Each acrylic adhesive has two components: the adhesive base or resin, and the Activator. Structural acrylic adhesives are termed “reactive ” cure systems. The... [See More]
- Cure / Technology: Two Component
- Form / Shape: Grease, Paste
- Chemical System: Acrylic
- Industry: Electronics
from OMEGA Engineering, Inc.
OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper products. [See More]
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Type: High Dielectric
- Form / Shape: Liquid
from Wacker Chemical Corp.
ELASTOSIL ® RT 675 A/B is a pourable, addition-curing RTV-2 silicone rubber. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Form / Shape: Liquid
- Chemical System: Silicone; Elastomeric
- Industry: Electronics
from Bluestar Silicones USA Corp.
Metal Oxide Thickened Dimethyl Silicone Compound. Description. Bluesil V-740 is a metal oxide thickened dimethyl silicone compound. It is a white, heavy paste used for heat dissipation applications where high thermal conductivity is required. [See More]
- Cure / Technology: Two Component
- Form / Shape: Grease, Paste
- Chemical System: Silicone
- Industry: Electronics; Electric Power; Semiconductors, IC's
from Sauereisen, Inc.
Sauereisen Cement No. 31 is a white, porcelain-like cement that is widely used throughout industry in a variety of applications. including assembling, sealing, insulating and cementing of ceramics, porcelain, metal, and glass. [See More]
- Cure / Technology: Two Component ; Chemically Set
- Chemical System: Ceramic
- Type: High Dielectric
- Composition: Unfilled
from Aremco Products, Inc.
Aremco ’s high temperature ceramic adhesives are unique inorganic formulations for bonding and sealing ceramics, metals, quartz, graphites, textiles, and composite materials used in design, process and maintenance applications to 3200 °F. These advanced materials, which exhibit high... [See More]
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Form / Shape: Grease, Paste
- Type: High Dielectric
- Industry: Electronics
from Protavic America, Inc.
Two part Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the assembly ofnon heat cure products and can be used for repair work in the field. It also has a convenient 1:1 mix ratio. [See More]
- Cure / Technology: Thermoset; Two Component
- Composition: Filled
- Chemical System: Epoxy
- Form / Shape: Gel; Die Bonding Adhesives
from Epoxies Etc...
The 50-2369FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-2369 FR Urethane is listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low exotherm, and excellent electrical... [See More]
- Cure / Technology: Thermoset; Two Component
- Composition: Filled
- Chemical System: Polyurethane
- Form / Shape: Gel
from Henkel Corporation - Industrial
LOCTITE STYCAST 2762FT, Epoxy, High Temperature Resistance, High Thermal Conductivity, Potting, Encapsulant LOCTITE ® STYCAST 2762FT epoxy encapsulant is designed for potting electronic components exposed to harsh environments. This material is also ideal for large and complex castings that... [See More]
- Cure / Technology: Two Component
- Viscosity: 25000
- Chemical System: Epoxy
from Hapco, Inc.
DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity). Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI-COAT R-4721 is easy to... [See More]
- Cure / Technology: Thermoset; Two Component
- Form / Shape: Liquid
- Type: High Dielectric
- Industry: Electronics
from Protavic America, Inc.
PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ is heat stable up to 150 °C. [See More]
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Filled
from Epoxies Etc...
50-3150 FR has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-3150 FR Black Epoxy with Catalyst 190 and Catalyst 105 are listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low shrinkage, and outstanding insulation... [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Composition: Unfilled
- Chemical System: Epoxy
- Form / Shape: Liquid
from Henkel Corporation - Industrial
LOCTITE STYCAST 2850FTJ, Epoxy, Encapsulant. LOCTITE ® STYCAST 2850FTJ epoxy encapsulant is designed for use in high voltage applications where surface arcing or tracking is a concern. LOCTITE STYCAST 2850FTJ is recommended for encapsulation of components that require heat dissipation and... [See More]
- Cure / Technology: Two Component
- Viscosity: 225000
- Chemical System: Epoxy
from Protavic America, Inc.
Filled epoxy system for high thermal applications such as heat-sink bonding. This material has 2.2 Wm °K thermal performance with supporting laser flash data. Room temperature cure. [See More]
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Filled
from Epoxies Etc...
20-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 20-2366 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical... [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Elastomeric; Polyurethane
- Type: High Dielectric
- Composition: Unfilled
from Henkel Corporation - Industrial
LOCTITE STYCAST 2850KT CAT 24LV, Epoxy, Encapsulant LOCTITE ® STYCAST 2850KT CAT 24LV epoxy encapsulant is designed for heat sink replacement in non-integrated electrical components and assemblies. It is also recommended for use in high voltage applications where surface arching or tracking is a... [See More]
- Cure / Technology: Two Component
- Use Temperature: 85 to 221
- Chemical System: Epoxy
- Thermal Conductivity: 2.29
from Henkel Corporation - Industrial
LOCTITE STYCAST 5952-1, Silicone, Potting or Encapsulant. LOCTITE ® STYCAST 5952-1 is designed for encapsulation of heat generating devices. It is also recommended for applications requiring a non-corrosive casting and coating. Electrically non-conductive. Good elongation strength. Moderate tear... [See More]
- Cure / Technology: Two Component
- Chemical System: Silicone
- Type: High Dielectric
- Thermal Conductivity: 0.8000
from Henkel Corporation - Industrial
LOCTITE STYCAST E 2534 FR CAT 9, Epoxy, Potting LOCTITE ® STYCAST E 2534 FR CAT 9 epoxy potting compound complies with recent demands on environmentally friendly products and does not contain brominated flame retardants. LOCTITE STYCAST E 2534 FR CAT 9 can be used with a variety of catalysts. [See More]
- Cure / Technology: Two Component
- Use Temperature: 40 to 302
- Chemical System: Epoxy
- Thermal Conductivity: 1.5
from Henkel Corporation - Industrial
LOCTITE STYCAST EE 4215/HD 3561, Epoxy, Potting and Encapsulating. LOCTITE ® STYCAST EE 4215/HD 3561 is a filled system recommended for potting applications where rigid or flexible wire leads protrude directly from the encapsulation and where high impact strength is required. This system... [See More]
- Cure / Technology: Two Component
- Chemical System: Epoxy
from Henkel Corporation - Industrial
LOCTITE STYCAST US 0155, Urethane, Potting and Encapsulating. LOCTITE ® STYCAST US 0155 is a low viscosity, flexible, flame retardant, castor oil/MDI based urethane potting/encapsulating compound. This material was designed for potting indoor and outdoor telephone connector blocks. It is... [See More]
- Cure / Technology: Two Component
- Form / Shape: Liquid
- Chemical System: Polyurethane
- Thermal Conductivity: 0.4700
from Henkel Corporation - Industrial
2-part, room temperature-cure, pourable epoxy system heavily reinforced with aluminum powder. LOCTITE ® PC 3466 (known as LOCTITE FIXMASTER ALUMINUM LIQUID) is a gray, 2-part, room temperature-cure, pourable epoxy system heavily reinforced with aluminum powder. It is used for filling or leveling... [See More]
- Cure / Technology: Two Component
- Chemical System: Epoxy
from Henkel Corporation - Industrial
LOCTITE STYCAST 2850FT BL, Epoxy, Encapsulant. LOCTITE ® STYCAST 2850FT BL epoxy is designed for applications where electrical insulation and mechanical protection must be maintained while coping with heat transfer considerations. LOCTITE STYCAST 2850FT BL can be used with a variety of... [See More]
- Cure / Technology: Two Component
- Thermal Conductivity: 1.38
- Chemical System: Epoxy
- Viscosity: 250000