Two Component System Thermal Compounds and Thermal Interface Materials

Biocompatible, Thermally Conductive Epoxy -- EPO-TEK® MED-T7110
from Epoxy Technology

EPO-TEK ® MED-T7110 is a thermally conductive, electrically insulating, low temperature curing epoxy; ideal for temperature sensitive devices. It is often used encapsulating copper coils in various medical imaging systems. (X-ray, Nuclear and MRI). [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Type: High Dielectric
  • Composition: Filled
Electrically Non-Conductive Adhesives -- LOCTITE ABLESTIK 872-7TN1
from Henkel Corporation - Industrial

LOCTITE ABLESTIK 872-7TN1, Epoxy, Non-conductive adhesive LOCTITE ® ABLESTIK 872-7TN1 is ideal for electronic applications requiring stress relief. Flexible. Thixotropic. High viscosity. Long work life. Easy handling. High thermal conductivity. Reduced stress [See More]

  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Type: High Dielectric
  • Form / Shape: Paste
Addition Cured Silicone is Optically Clear with Enhanced Low Temperature Serviceability -- MasterSil 157
from Master Bond, Inc.

MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing; Addition Cure
  • Chemical System: Silicone
  • Type: High Dielectric; Optical
  • Composition: Unfilled
Thermally Conductive Epoxy -- OB-100 / OB-200 Series
from OMEGA Engineering, Inc.

OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper products. [See More]

  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Type: High Dielectric
  • Form / Shape: Liquid
Potting/Encapsulation Compound -- INSTAbond® 809FR
from ACCRAbond, Inc.

INSTAbond ® 809FR. INSTAbond ® 809 FR exhibits good thermal conductivity, excellent flow properties, and low exotherm characteristics in large masses. INSTAbond ® 809 FR meets the requirements for UL-94 V-0 rating for flame retardancy. [See More]

  • Cure / Technology: Two Component  
  • Features: Flame Retardant; UL Rating
  • Chemical System: Epoxy
Ceramabond -- 890
from Aremco Products, Inc.

Aremco ’s high temperature ceramic adhesives are unique inorganic formulations for bonding and sealing ceramics, metals, quartz, graphites, textiles, and composite materials used in design, process and maintenance applications to 3200 °F. These advanced materials, which exhibit high... [See More]

  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Form / Shape: Grease, Paste
  • Type: High Dielectric
  • Industry: Electronics
Metal Oxide Thickened Dimethyl Silicone Compound -- Bluesil™ V-740
from Bluestar Silicones USA Corp.

Metal Oxide Thickened Dimethyl Silicone Compound. Description. Bluesil V-740 is a metal oxide thickened dimethyl silicone compound. It is a white, heavy paste used for heat dissipation applications where high thermal conductivity is required. [See More]

  • Cure / Technology: Two Component  
  • Form / Shape: Grease, Paste
  • Chemical System: Silicone
  • Industry: Electronics; Electric Power; Semiconductors, IC's
Flame Retardant Thermally Conductive -- 50-3150 FR
from Epoxies Etc...

50-3150 FR has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-3150 FR Black Epoxy with Catalyst 190 and Catalyst 105 are listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low shrinkage, and outstanding insulation... [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Form / Shape: Liquid
Adhesive -- GSP 1345
from GS Polymers, Inc.

Two part, 1:1, thermal conductive compound, available in cartridges [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Composition: Filled
  • Chemical System: Epoxy
  • Industry: OEM or Industrial
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4501
from Hapco, Inc.

Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Form / Shape: Liquid
  • Type: High Dielectric
  • Industry: Electronics
Dissipator® Adhesive -- Grade 745
from Hi-Tech Seals, Inc.

HERNON ® offers a complete line of structural acrylic adhesives. These systems are two-part, no mix, and reactive adhesives. Each acrylic adhesive has two components: the adhesive base or resin, and the Activator. Structural acrylic adhesives are termed “reactive ” cure systems. The... [See More]

  • Cure / Technology: Two Component  
  • Form / Shape: Grease, Paste
  • Chemical System: Acrylic
  • Industry: Electronics
Clear Non-Yellowing Silicone Encapsulant -- PNS-56225
from Protavic America, Inc.

PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Composition: Unfilled
  • Chemical System: Silicone
  • Form / Shape: Liquid; Die Bonding Adhesives; Encapsulant or Conformal Coating
Cement -- No. 31
from Sauereisen, Inc.

Sauereisen Cement No. 31 is a white, porcelain-like cement that is widely used throughout industry in a variety of applications. including assembling, sealing, insulating and cementing of ceramics, porcelain, metal, and glass. [See More]

  • Cure / Technology: Two Component  ; Chemically Set
  • Chemical System: Ceramic
  • Type: High Dielectric
  • Composition: Unfilled
Heat Transfer Compound -- T-802-G
from Thermon Manufacturing Co.

T-802 is a two-part low to medium temperature resin-based heat transfer compound for use in moist and corrosive environments. Thermon ’s heat transfer compounds provide an efficient thermal connection between the tracer and the process equipment. By eliminating the air voids that would... [See More]

  • Cure / Technology: Two Component  
  • Industry: Corrosive / Moist Environments
  • Form / Shape: Grease, Paste
  • Use Temperature: 275
Pourable, Addition-Curing RTV-2 Silicone Rubber -- ELASTOSIL® RT675 A/B
from Wacker Chemical Corp.

ELASTOSIL ® RT 675 A/B is a pourable, addition-curing RTV-2 silicone rubber. [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Form / Shape: Liquid
  • Chemical System: Silicone; Elastomeric
  • Industry: Electronics