Acrylic / Polyacrylate Thermal Compounds and Thermal Interface Materials
4 Results
Highly Thermal Conductive and Non-Flammable Non-Silicone Gel Sheet -- SARCON ® NR-c
from Fujipoly® America Corp.
from Fujipoly® America Corp.
SARCON ® NR-c is a highly conformable, thermally conductive, non-flammable acrylate resin (non-silicone) sheet with thermally conductive fillers. Available in sheets and die-cut forms for formal interface uses wherever gap filler pads are traditionally used. No silicone extractions. Lower... [See More]
- Chemical System: Acrylic
- Gap Fill: 0.0197
- Form / Shape: Gel; Gap Filler, Foam in Place Gasket
- Industry: Electronics; Semiconductors, IC's
Adhesives -- 2349594
from RS Components, Ltd.
from RS Components, Ltd.
Loctite 3875 pt A [See More]
- Chemical System: Acrylic
- Industry: Thermal Management
Thermal Pads -- 1777717 [CPUPAD40.64X40.64 from Bergquist Company (The)]
from RS Components, Ltd.
from RS Components, Ltd.
CPU Pad 40.64x40.64x0.127mm 0.9K/mW 6kV [See More]
- Chemical System: Acrylic
- Thermal Conductivity: 0.6000
Dissipator® Adhesive -- Grade 745
from Hi-Tech Seals, Inc.
from Hi-Tech Seals, Inc.
HERNON ® offers a complete line of structural acrylic adhesives. These systems are two-part, no mix, and reactive adhesives. Each acrylic adhesive has two components: the adhesive base or resin, and the Activator. Structural acrylic adhesives are termed “reactive ” cure systems. The... [See More]
- Chemical System: Acrylic
- Form / Shape: Grease, Paste
- Cure / Technology: Two Component
- Industry: Electronics