UL Approved Thermal Compounds and Thermal Interface Materials
from Master Bond, Inc.
Featuring superb electrical insulation properties, MasterSil 156 is a two component, moderate viscosity silicone system for high performance potting, encapsulation and sealing. It combines high temperature resistance, flexibility, low shrinkage upon cure and thermal conductivity exceeding 8-9 BTU... [See More]
- Features: Flame Retardant; Non-corrosive; UL Rating; Dissimilar Substrates
- Chemical System: Silicone
- Type: High Dielectric
- Composition: Unfilled
from CHT USA Inc.
CHT's AS1707 is a 1-part, alkoxy cured, thermally conductive, low volatile, RTV silicone adhesive paste. AS1707 is formulated to meet the requirements for use as a space grade adhesive. AS1707 has low thermal outgassing properties and a wide operational temperature range. In addition to meeting... [See More]
- Features: Flame Retardant; UL Rating
- Cure / Technology: Single Component; Alkoxy
- Chemical System: Silicone
- Industry: Automotive; Electronics
from ELANTAS North America LLC
Mineral-filled VPI resin - semi-flexible for transformers with improved heat dissipation [See More]
- Features: Flexible; UL Rating; Dissimilar Substrates
- Chemical System: Alkyd
- Type: High Dielectric
- Composition: Filled
from Fujipoly® America Corp.
Sarcon ® XR-e is highly conformable/thermally conductive gel materials, 11watt/m-K (No electricity conductive) in a versatile sheet form that easily fit and adhere e to most all shapes and sizes of components, and makes reliable and complete physical contact. The surface consistency of the pads... [See More]
- Features: UL Rating
- Form / Shape: Gel; Pad; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Gap Fill: 0.0394 to 0.0787
from Master Bond, Inc.
Master Bond EP41S-6 is a two part epoxy system that meets UL 1203. Meeting this standard allows EP41S-6 to be used in conjunction with electrical equipment that needs to be labeled as explosion proof and or dust ignition proof. [See More]
- Features: Flame Retardant; Non-corrosive; UL Rating; Dissimilar Substrates
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from CHT USA Inc.
CHT's QSil 563 is a 2-part, platinum cure, 100% silicone solids elastomer designed for electronic potting and encapsulation applications. QSil 562 offers a hard, low modulus material that is readily repairable. QSil 563 is thermally conductive to aid in efficient heat dissipation. This silicone... [See More]
- Features: Flame Retardant; UL Rating
- Industry: Automotive; Electronics
- Cure / Technology: Two Component ; Addition
- Use Temperature: -67 to 399
from CHT USA Inc.
CHT's SE3000 is a 2-part, platinum cure silicone elastomer designed for electronic potting and encapsulation applications. It offers good prtection against chemicals, environmental contamination, mechanical shock, vibration and impact damage. SE3000 can be used in applications where low flammability... [See More]
- Features: Flame Retardant; UL Rating
- Industry: Electronics
- Cure / Technology: Two Component ; Addition
- Use Temperature: -94 to 482
from CHT USA Inc.
CHT's QSil 553 is a 2-part, platinum cure, silicone potting compound and encapsulant designed to protect electronic components from harsh environmental conditions and shock and vibration. It features a low viscosity for convenient dispensing and will easily flow throughout components. Because of its... [See More]
- Features: Flame Retardant; UL Rating
- Industry: Automotive; Electronics; OEM or Industrial
- Cure / Technology: Two Component ; Addition
- Use Temperature: -67 to 464
from Shiu Li Technology Co., Ltd
LiPOLY DTT44 is a soft thermally conductive gel pad specifically designed for networking applications. DTT44 is designed to focus on Dk and Df to reduce interference in RF modules. DTT44 has a thermal conductivity of 3.0 W/m*K. This product can be supplied as standard sheets, custom die-cuts or... [See More]
- Features: UL Rating
- Form / Shape: Pad; Sheet Form, Die-cut Parts
- Chemical System: Silicone
- Gap Fill: 0.0197 to 0.1969
from Hapco, Inc.
Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame... [See More]
- Features: Flame Retardant; UL Rating
- Cure / Technology: Thermoset; Two Component
- Type: High Dielectric
- Form / Shape: Liquid
from Epoxies Etc...
The 50-2369FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-2369 FR Urethane is listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low exotherm, and excellent electrical... [See More]
- Features: Flame Retardant; UL Rating
- Composition: Filled
- Chemical System: Polyurethane
- Cure / Technology: Thermoset; Two Component
from Protavic America, Inc.
PTS-46303 A/B ™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include... [See More]
- Features: Electrically Conductive; Flame Retardant; Flexible; UL Rating
- Composition: Filled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Features: UL Rating
- Chemical System: Polyamide
- Type: High Dielectric
- Cure / Technology: Thermoplastic / Hot Melt; Single Component
from ACCRAbond, Inc.
INSTAbond ® 809FR. INSTAbond ® 809 FR exhibits good thermal conductivity, excellent flow properties, and low exotherm characteristics in large masses. INSTAbond ® 809 FR meets the requirements for UL-94 V-0 rating for flame retardancy. [See More]
- Features: Flame Retardant; UL Rating
- Cure / Technology: Two Component
- Chemical System: Epoxy
from Shiu Li Technology Co., Ltd
LiPOLY DTT65 is a soft thermally conductive gel pad specifically designed for networking applications. DTT65 is designed to focus on Dk and Df to reduce interference in RF modules. DTT65 has a thermal conductivity of 5.0 W/m*K. This product can be supplied as standard sheets, custom die-cuts or... [See More]
- Features: UL Rating
- Form / Shape: Pad; Sheet Form, Die-cut Parts
- Chemical System: Silicone
- Gap Fill: 0.0197 to 0.1969
from Hapco, Inc.
DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity). Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI-COAT R-4721 is easy to... [See More]
- Features: Flame Retardant; UL Rating
- Cure / Technology: Thermoset; Two Component
- Type: High Dielectric
- Form / Shape: Liquid
from Epoxies Etc...
50-3150 FR has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-3150 FR Black Epoxy with Catalyst 190 and Catalyst 105 are listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low shrinkage, and outstanding insulation... [See More]
- Features: Flame Retardant; UL Rating
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Protavic America, Inc.
PTS-46303 A/B ™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include... [See More]
- Features: Flame Retardant; Flexible; UL Rating
- Chemical System: Silicone
- Type: High Dielectric
- Composition: Filled
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Features: UL Rating
- Chemical System: Polyamide
- Type: High Dielectric
- Cure / Technology: Thermoplastic / Hot Melt
from Shiu Li Technology Co., Ltd
LiPOLY BS75K is a soft thermally conductive gap filler. With a thermal conductivity of 3.0 W/m*K and a low thermal impedance, BS75K is suitable for a wide range of applications. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for a wide... [See More]
- Features: UL Rating
- Form / Shape: Pad; Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Gap Fill: 0.0197 to 0.1969
from Epoxies Etc...
20-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 20-2366 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical... [See More]
- Features: Flame Retardant; Flexible; UL Rating
- Chemical System: Elastomeric; Polyurethane
- Type: High Dielectric
- Composition: Unfilled
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Features: UL Rating
- Chemical System: Polyamide
- Type: High Dielectric
- Cure / Technology: Thermoplastic / Hot Melt
from Shiu Li Technology Co., Ltd
LiPOLY BS87 is an ultra-soft thermally conductive gel pad with a thermal conductivity of 3.0 W/m*K. BS87 offers excellent compression under minimal force with high recovery characteristics. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for... [See More]
- Features: UL Rating
- Form / Shape: Pad; Sheet Form, Die-cut Parts
- Chemical System: Silicone
- Gap Fill: 0.0197 to 0.1969
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Features: UL Rating
- Cure / Technology: Thermoplastic / Hot Melt; Single Component
- Type: High Dielectric
- Form / Shape: Pellets
from Shiu Li Technology Co., Ltd
LiPOLY ’s S282 is a thermally conductive pad designed for gap filling. The thermal conductivity is 1.7 W/m*K. It uses fiberglass cloth as the reinforcement material with great self-adhesive that can fit closely with non-flat heat sinks to increase the contact area. The low stress damped... [See More]
- Features: UL Rating
- Form / Shape: Pad; Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Gap Fill: 0.0197 to 0.1969
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Features: UL Rating
- Chemical System: Polyamide
- Type: High Dielectric
- Cure / Technology: Thermoplastic / Hot Melt; Single Component
from Shiu Li Technology Co., Ltd
LiPOLY S393 is a product with high ductile thermal conductivity. Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material. It won't easy to break and deformwhether stamped, punched, strip type, or custom cutting. Your best choice... [See More]
- Features: UL Rating
- Chemical System: Silicone
- Type: High Dielectric
- Form / Shape: Pad; Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Features: UL Rating
- Chemical System: Polyamide
- Type: High Dielectric; Optical
- Cure / Technology: Thermoplastic / Hot Melt
from Shiu Li Technology Co., Ltd
LiPOLY S818 is a product with high ductile thermal conductivity.Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material.It won't easy to break and deform whether stamped, punched, strip type, or custom cutting. Your best choice... [See More]
- Features: UL Rating
- Chemical System: Silicone
- Type: High Dielectric
- Form / Shape: Pad; Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
from Shiu Li Technology Co., Ltd
LiPOLY DCTP140-s is a thermal insulator uses fiberglass cloth as a reinforcement material, combined with thermal conductive silicon, giving it high thermal conduction and great compression strength. The thermal conductivity is 4.5 W/m*K, the thickness is 0.25~0.45mm. Its high insulation and... [See More]
- Features: UL Rating
- Chemical System: Silicone
- Type: High Dielectric
- Form / Shape: Pad; Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket