Single Component System Thermal Compounds and Thermal Interface Materials
from CHT USA Inc.
CHT's AS1707 is a 1-part, alkoxy cured, thermally conductive, low volatile, RTV silicone adhesive paste. AS1707 is formulated to meet the requirements for use as a space grade adhesive. AS1707 has low thermal outgassing properties and a wide operational temperature range. In addition to meeting... [See More]
- Cure / Technology: Single Component; Alkoxy
- Industry: Automotive; Electronics
- Chemical System: Silicone
- Features: Flame Retardant; UL Rating
from Master Bond, Inc.
EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]
- Cure / Technology: Thermoset; Single Component
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from MacDermid Alpha Electronics Solutions
A single-component epoxy cures at low temperatures, offering water resistance and bonding FPCB to various plastic materials. Product Overview. A high-performance, one-component epoxy adhesive designed for bonding applications in electronics manufacturing. It provides excellent adhesion to a variety... [See More]
- Cure / Technology: Single Component
- Industry: Electronics; Semiconductors, IC's
from ELANTAS North America LLC
Mineral-filled VPI resin - semi-flexible for transformers with improved heat dissipation [See More]
- Cure / Technology: Thermoset; Single Component
- Chemical System: Alkyd
- Type: High Dielectric
- Composition: Filled
from Thermon, Inc
NH nonhardening heat transfer compound is used where thermal expansion and contraction could break the bond of a hardened compound. Typically installed between plate-type heating coils or with systems that require periodic disassembly, NH remains pliable indefinitely, allowing the compound to expand... [See More]
- Cure / Technology: Single Component
- Use Temperature: 32 to 410
- Form / Shape: Liquid; Gap Filler, Foam in Place Gasket
- Thermal Conductivity: 34.61 to 69.23
from Master Bond, Inc.
EP3HTND-2Med Black is a one part system that combines easy processing with excellent bonding properties. It cures in 20-30 minutes at 250°F or 5-10 minutes at 300°F and adheres well to a wide variety of substrates including glass, metals, ceramics and most plastics. This paste compound meets USP... [See More]
- Cure / Technology: Thermoset; Single Component
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from Thermon, Inc
T-3 heat transfer compound now has higher temperature ratings than ever before while still creating an efficient thermal bond between a steam or electric heater and process pipes or equipment. A single "Thermonized ™"steam tracer utilizing Thermon's heat transfer compound is more cost... [See More]
- Cure / Technology: Single Component
- Use Temperature: 32 to 850
- Form / Shape: Grease, Paste; Gap Filler, Foam in Place Gasket
- Thermal Conductivity: 34.61 to 69.23
from Master Bond, Inc.
One part, nano silica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]
- Cure / Technology: UV or Radiation Cured; Single Component; Dual Curing
- Composition: Filled
- Type: High Dielectric
- Form / Shape: Glob Top, Daub, Doming or Overfill; Liquid; Encapsulant or Conformal Coating
from Thermon, Inc
The New & Improved T-85 is a pre-mixed epoxy-based heat transfer compound with higher temperature ratings and the highest possible bond strength for use in moist and corrosive environments. T-85 is typically utilized on pumps, valves and equipment where maximum bond strength for tracing installation... [See More]
- Cure / Technology: Single Component
- Use Temperature: 32 to 450
- Form / Shape: Die Bonding Adhesives; Grease, Paste
- Thermal Conductivity: 34.61 to 69.23
from Master Bond, Inc.
EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]
- Cure / Technology: Thermoset; Single Component
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from Thermon, Inc
T-99 is a specialty high temperature heat transfer compound formulated to provide high thermal stability and bond strength up to 1204°C (2200°F). Unlike other grades of heat transfer compounds, it is also electrically non-conductive (when cured). It is supplied ready to use and may be applied by... [See More]
- Cure / Technology: Single Component
- Use Temperature: 32 to 2200
- Form / Shape: Die Bonding Adhesives; Grease, Paste
- Thermal Conductivity: 25.96 to 51.92
from Master Bond, Inc.
Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]
- Cure / Technology: Thermoset; Single Component
- Composition: Filled
- Chemical System: Polyphenylene Sulfide; Epoxy
- Form / Shape: Liquid; Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
from Master Bond, Inc.
Master Bond X21Med is a toughened one part system that can be used for bonding and priming polyolefinic surfaces. This exceptionally low viscosity ( <250 cps) solvent based system is easy to apply and process. It cures at room temperature or more rapidly with the addition of heat. X21Med passes... [See More]
- Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
- Composition: Unfilled
- Type: High Dielectric
- Form / Shape: Liquid; Primer
from Master Bond, Inc.
Master Bond Polymer System FL901AO is a one component high performance, thermally conductive, electrically insulative epoxy resin based adhesive film with outstanding performance characteristics. Unlike many other such epoxy film products, it does not require refrigerated storage although this is... [See More]
- Cure / Technology: Thermoset; Single Component
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from Master Bond, Inc.
Master Bond Supreme 17HT is a one component toughened epoxy for bonding and sealing. It has a moderate viscosity system with good flow properties. [See More]
- Cure / Technology: Thermoset; Single Component
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from Master Bond, Inc.
Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for conventional bonding and sealing. This system features an excellent die shear strength of 24-27 kg-f and can be used in a typical die size ranging from 4-400 mm2. EP17HTDA-1 can also be... [See More]
- Cure / Technology: Thermoset; Single Component
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from Master Bond, Inc.
Master Bond UV10TK40M is a higher viscosity, one part UV system for bonding, sealing and coating with good optical clarity, excellent physical properties and a high glass transition temperature. [See More]
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; UV curing system
- Composition: Unfilled
- Type: High Dielectric; Optical
- Form / Shape: Liquid; Encapsulant or Conformal Coating
from Nordson EFD
Our innovative, non-silicone thermal compounds provide an ideal thermal solution by ensuring reliable heat transfer over a longer time than most industrial thermal interface materials. Conventional, silicone-based heat sink compounds and thermal greases tend to spread after a number of heating and... [See More]
- Cure / Technology: Single Component
- Form / Shape: Grease, Paste
- Composition: Unfilled
- Industry: Electronics; Semiconductors, IC's
from Protavic America, Inc.
Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for production needs. One... [See More]
- Cure / Technology: Thermoset; Single Component
- Composition: Filled
- Chemical System: Epoxy
- Form / Shape: Die Bonding Adhesives; Grease, Paste
from Epoxy Technology
EPO-TEK ® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical, and... [See More]
- Cure / Technology: Thermoset; Single Component
- Composition: Filled
- Chemical System: Epoxy
- Form / Shape: Die Bonding Adhesives; Grease, Paste
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 84-1LMIT, Epoxy, Component assembly, Electrically Conductive Adhesive. LOCTITE ® ABLESTIK 84-1LMIT adhesive is designed for medium die attach applications. This adhesive is ideal for application by syringe dispensing or screen printing. Electrically conductive. High thermal... [See More]
- Cure / Technology: Single Component
- Form / Shape: Paste
- Chemical System: Epoxy
from Epoxies Etc...
70-3800 is a low viscosity, aluminum filled, epoxy tooling resin. This system is used for making heat resistant cast tools or parts that require very good thermal conductivity. 70-3800 is easily machined, drilled, tapped, or polished, and is ideal for vacuum form molds, dies, drill jigs, injection... [See More]
- Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
- Composition: Filled
- Chemical System: Epoxy
- Form / Shape: Liquid; Die Bonding Adhesives
from Henkel Corporation - Electronics
One component, low temperature curing thermally conductive epoxy adhesive. [See More]
- Cure / Technology: Single Component
- Industry: Electronics
- Chemical System: Epoxy
- Thermal Conductivity: 2.3
from OMEGA Engineering, Inc.
OMEGATHERM thermal conducting paste is a high temperature and high thermally conductive paste product. They are specially formulated for permanent and temporary bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics,... [See More]
- Cure / Technology: Single Component
- Chemical System: Silicone
- Type: High Dielectric
- Form / Shape: Grease, Paste
from Shiu Li Technology Co., Ltd
LiPOLY ’s TIM12/TIM14 is a one-part silicon-based thermally conductive adhesive that can be cured at room temperature or high temperature. It not only produces low stress, low thermal resistance, low viscosity, and good adhesion to components, but also maintains insulating properties. It... [See More]
- Cure / Technology: Single Component; Room Temperature Vulcanizing or Curing (optional feature); High Heat
- Form / Shape: Gel; Die Bonding Adhesives; Grease, Paste
- Chemical System: Silicone
- Industry: Electronics
from Sauereisen, Inc.
Sauereisen Adhesive Paste No. 19 is an inorganic, odorless, nontoxic cement used for bonding glass, porcelain, wood, felt, cork, metals and ceramic fiber. Some typical applications include protection of exposed metal surfaces during heat treating, bonding wallboard to brick or concrete and cementing... [See More]
- Cure / Technology: Single Component
- Chemical System: Ceramic
- Type: High Dielectric
- Composition: Unfilled
from Protavic America, Inc.
Epoxy system designed for underfill applications. This material is fast flowing and provides excellent properties for common device packaging. [See More]
- Cure / Technology: Thermoset; Single Component
- Chemical System: Epoxy
- Type: High Dielectric
- Form / Shape: Liquid; Die Bonding Adhesives
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 12-2, Silicone, General Assembly LOCTITE ® ABLESTIK 12-2 adhesive is the lower viscosity version of ABLETHERM 12-1 adhesive. It is designed for bonding applications which require high thermal conductivity and reworkability. Thermally conductive. Reworkable. Unfilled [See More]
- Cure / Technology: Single Component
- Chemical System: Silicone
from Epoxies Etc...
50-3122 is a one component (no mixing is necessary) epoxy adhesive with a unique combination of physical properties. This adhesive provides both high shear and high peel strengths. It is also able to maintain exceptionally strong bonds over a wide temperature range of -60 to +205 °C. 50-3122 is... [See More]
- Cure / Technology: Thermoset; Single Component
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Filled
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Cure / Technology: Thermoplastic / Hot Melt; Single Component
- Chemical System: Polyamide
- Type: High Dielectric
- Form / Shape: Pellets
from OMEGA Engineering, Inc.
OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper products. [See More]
- Cure / Technology: Single Component
- Chemical System: Silicone
- Type: High Dielectric
- Form / Shape: Grease, Paste
from Protavic America, Inc.
A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals. [See More]
- Cure / Technology: Thermoset; Single Component
- Composition: Filled
- Chemical System: Epoxy
- Form / Shape: Glob Top, Daub, Doming or Overfill; Liquid; Die Bonding Adhesives
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 8-2, Epoxy, Non-conductive Die Attach Adhesive LOCTITE ® ABLESTIK 8-2 non-conductive die attach adhesive is designed for MEMs package applications. Designed as an instrument adhesive, LOCTITE ABLESTIK 8-2 adhesive offers eight times the thermal conductivity of unfilled epoxies. [See More]
- Cure / Technology: Single Component
- Chemical System: Epoxy
- Type: High Dielectric
from Epoxies Etc...
50-3115 is a one part thermally conductive electrically insulating epoxy. This epoxy system is designed and engineered for demanding electronic bonding applications. It is formulated with low ionic high performance polymers and new proprietary thermally conductive fillers. [See More]
- Cure / Technology: Thermoset; Single Component
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Cure / Technology: Thermoplastic / Hot Melt; Single Component
- Form / Shape: Pellets
- Type: High Dielectric
- Industry: Electronics
from OMEGA Engineering, Inc.
OMEGA's THERMCOAT KIT is used for cementing fine-gage thermocouples in place on metal, plastic and ceramic surfaces and for assembling and installing thermopiles, temperature probes and thermocouple bolometers. THERMCOAT CO and THERMCOAT COL This is a fast-setting two-part cement which should be... [See More]
- Cure / Technology: Thermoset (optional feature); Single Component
- Form / Shape: Liquid (optional feature); Powder (optional feature)
- Chemical System: Ceramic
- Use Temperature: -229 to 446
from Protavic America, Inc.
Single component resin with very low linear expansion of 10 ppm per degree and high ionic purity for protecting semi-conductor silicon crystals, in particularly BGA. [See More]
- Cure / Technology: Thermoset; Single Component
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Filled
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 813J01 BIPAX, Silicone, Non-corrosive, Encapsulant LOCTITE ® ABLESTIK 813J01 BIPAX exhibits very low stress upon cure thus preventing component cracking and other stress-related problems. This adhesive can be cured at room temperature in thick or thin sections. It is... [See More]
- Cure / Technology: Single Component
- Viscosity: 40000
- Chemical System: Silicone
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Cure / Technology: Thermoplastic / Hot Melt; Single Component
- Chemical System: Polyamide
- Type: High Dielectric
- Form / Shape: Pellets
from Henkel Corporation - Industrial
LOCTITE STYCAST 2851FT, Epoxy, Encapsulant LOCTITE ® STYCAST 2851FT is recommended for encapsulation of components that require heat dissipation and thermal shock properties . It has a low coefficient of thermal expansion and exhibits excellent resistance to a wide variety of industrial... [See More]
- Cure / Technology: Single Component
- Thermal Conductivity: 1.36
- Chemical System: Epoxy
- Tensile (Break): 7250
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Cure / Technology: Thermoplastic / Hot Melt; Single Component
- Chemical System: Polyamide
- Type: High Dielectric
- Form / Shape: Pellets
from Henkel Corporation - Industrial
LOCTITE ABLESTIK ABP 8037TI, Acrylate, Die Attach, Silver Filled Conductive Adhesive LOCTITE ® ABLESTIK ABP 8037TI silver filled conductive adhesive is recommended for use in the attachment of integrated circuits and components onto metal leadframes and advanced substrates. Excellent electrical... [See More]
- Cure / Technology: Single Component
- CTE: 34
- Form / Shape: Paste