Military / Government (MIL-SPEC / GG) Thermal Compounds and Thermal Interface Materials
from Hernon Manufacturing, Inc.
Dissipator ® 745 is a thermally conductive room temperature cure adhesive that is designed for bonding electrical components to heat sink with a controlled gap. Dissipator ® 745, through a special shimming property, insulates the component electrically while allowing thermal conductivity. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Composition: Filled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component ; Addition Cure
from Hernon Manufacturing, Inc.
Hernon Dissipator 745D is a thermally conductive room temperature cure adhesive that is designed for bonding electrical components to heat sink with a controlled gap. Dissipator 745D, through a special shimming property, insulates the component electrically while allowing thermal... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Master Bond Polymer Adhesive EP21TPND is a two component polysulfide/epoxy based adhesive/ sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100 mix ratio (A/B) by weight. It readily develops a high bonding strength of more than 1000 psi at room... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Semiconductors, IC's
- Chemical System: Polyphenylene Sulfide; Epoxy; Polyurethane
- Type: High Dielectric
- Composition: Filled
from Hernon Manufacturing, Inc.
Hernon Dissipator 746D is a thermally conductive adhesive formulated for bonding electrical components to heat sinks or printed circuit boards. Fast room temperature cure combined with excellent heat dissipation for thermally sensitive components and controlled strength for service repair provide... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Chemical System: Silicone
from Master Bond, Inc.
Two component EP46HT-2AO Black is ideal for demanding bonding, sealing and encapsulation applications where thermal conductivity, electrical insulation and high temperature resistance are required. It has a service temperature range of -100 °F to +500 °F with a glass transition temperature... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from Master Bond, Inc.
Master Bond EP39MAOHT is a two component, thermally conductive, electrically insulative epoxy for bonding, sealing, coating, potting and encapsulation. Its low exotherm makes it well suited for large castings and potting applications. It withstands rigorous thermal cycling, vibration and shock. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from Master Bond, Inc.
Key Features. Free flowing viscosity. High temperature resistance. Exceptionally long open time. Passes NASA low outgassing. Product Description. Master Bond Supreme 121AO is a thermally conductive epoxy for bonding, sealing and encapsulation. The mix ratio is 100:80 by weight. This system has a... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Epoxy
- Type: High Dielectric; Optical
- Cure / Technology: Thermoset; Two Component
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 5025E, Epoxy Film, Die attach LOCTITE ® ABLESTIK 5025E unsupported epoxy adhesive film is ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not required. Thin, uniform bondline control. Provides RF/EMI shielding. Electrically... [See More]
- Industry: Military
- Thermal Conductivity: 6.5
- Chemical System: Epoxy
from Henkel Corporation - Electronics
(Known as Ablestik ABLEFILM 5020K ). LOCTITE ABLESTIK 5020K is a high purity adhesive with excellent adhesion to gold-plated surfaces, particularly suited for use in hermetic packages. It is certified to MIL-STD-883, Method 5011. [See More]
- Industry: Electronics; Military
- Thermal Conductivity: 0.7000
from Shiu Li Technology Co., Ltd
LiPOLY S393 is a product with high ductile thermal conductivity. Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material. It won't easy to break and deformwhether stamped, punched, strip type, or custom cutting. Your best choice... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Silicone
- Type: High Dielectric
- Form / Shape: Pad; Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
from Epoxies Etc...
50-3100 is designed for the fastest and most continuous high heat transfer. 50-3100 measures several times faster heat dissipation than other commercially available types. The most important breakthrough is the handling of 50-3100. This system can be easily mixed and poured to form a dimensionally... [See More]
- Industry: Electronics; Electric Power; Military
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Epoxy Technology
EPO-TEK ® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical, and... [See More]
- Industry: Electronics; Military; Photonics; Semiconductors, IC's
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Shiu Li Technology Co., Ltd
LiPOLY S818 is a product with high ductile thermal conductivity.Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material.It won't easy to break and deform whether stamped, punched, strip type, or custom cutting. Your best choice... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Silicone
- Type: High Dielectric
- Form / Shape: Pad; Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
from Shiu Li Technology Co., Ltd
LiPOLY DCTP140-s is a thermal insulator uses fiberglass cloth as a reinforcement material, combined with thermal conductive silicon, giving it high thermal conduction and great compression strength. The thermal conductivity is 4.5 W/m*K, the thickness is 0.25~0.45mm. Its high insulation and... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Silicone
- Type: High Dielectric
- Form / Shape: Pad; Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
from Shiu Li Technology Co., Ltd
LiPOLY T-top99-s offers outstanding thermal conductivity at 24.0 W/m*K and extremely low thermal resistance under minimal force.T-top99-s offers excellent compression, filling small air gaps on uneven surfaces, ensuring an efficient and consistent transfer of heat. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Silicone
- Type: High Dielectric
- Form / Shape: Pad; Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
from Shiu Li Technology Co., Ltd
LiPOLY's TPS series is a low-density, potting material. Its low density and lightweight properties enhance product performance, reduce production costs. The product has a thermal conductivity of 0.55-1.50 W/m*K and can cure at room temperature or high temperatures. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Chemical System: Silicone
- Form / Shape: Liquid; Grease, Paste; Gap Filler, Foam in Place Gasket