Optical Grade / Material Thermal Compounds and Thermal Interface Materials Datasheets

from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Type: High Dielectric; Optical
  • Cure / Technology: Thermoplastic / Hot Melt
  • Chemical System: Polyamide
  • Form / Shape: Pellets
Epoxy Adhesive with Ultra Low Thermal Resistance -- EP48TC
from Master Bond, Inc.

For advanced PCB assembly and heat sink bonding applications, Master Bond offers EP48TC, a specially formulated adhesive that features ultra low thermal resistance of 5-7 x 10-6 K •m2/W. This system uses high thermal conductive fillers and is capable of being applied in bond lines as thin as... [See More]

  • Type: High Dielectric; Optical
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing