Polyamide Thermal Compounds and Thermal Interface Materials Datasheets

Thermal - Pads, Sheets -- 43-77-9G-ND [43-77-9G from Aavid Thermalloy, LLC]
from Digi-Key Electronics


  • Chemical System: Polyamide
  • Form / Shape: Pad
TECHNOMELT PA 2384 -- 8807299842049
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Chemical System: Polyamide
  • Cure / Technology: Thermoplastic / Hot Melt; Single Component
  • Type: High Dielectric
  • Form / Shape: Pellets
7226830 [WLFT 404 D 32 from Fischer Electronik]
from RS Components, Ltd.

Thermally conductive foil discs. Double-sided adhesive layers. Replaces mechanical fastenings. Thickness = 0.127mm. Diameter = 32mm. Thermal Conductivity = 0.37W/m ·K. Material = Polyamide. Self-Adhesive = Yes. Minimum Operating Temperature = -30 °C. Maximum Operating Temperature = +125... [See More]

  • Chemical System: Polyamide
  • Use Temperature: -22 to 257
  • Form / Shape: Pad
  • Thermal Conductivity: 0.3700