Polyamide Thermal Compounds and Thermal Interface Materials
from RS Components, Ltd.
Thermal interface material 32mm polyimid [See More]
- Chemical System: Polyamide
- Thermal Conductivity: 0.3700
- Use Temperature: -22 to 257
from RS Components, Ltd.
Thermal interface material 23mm polyimid [See More]
- Chemical System: Polyamide
- Thermal Conductivity: 0.3700
- Use Temperature: -22 to 257
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Chemical System: Polyamide
- Cure / Technology: Thermoplastic / Hot Melt; Single Component
- Type: High Dielectric
- Form / Shape: Pellets
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Chemical System: Polyamide
- Cure / Technology: Thermoplastic / Hot Melt
- Type: High Dielectric
- Form / Shape: Pellets
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Chemical System: Polyamide
- Cure / Technology: Thermoplastic / Hot Melt
- Type: High Dielectric
- Form / Shape: Pellets
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Chemical System: Polyamide
- Cure / Technology: Thermoplastic / Hot Melt; Single Component
- Type: High Dielectric
- Form / Shape: Pellets
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Chemical System: Polyamide
- Cure / Technology: Thermoplastic / Hot Melt
- Type: High Dielectric
- Form / Shape: Pellets
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Chemical System: Polyamide
- Cure / Technology: Thermoplastic / Hot Melt
- Type: High Dielectric; Optical
- Form / Shape: Pellets