Flexible / Dampening Thermal Compounds and Thermal Interface Materials
from ELANTAS North America LLC
Mineral-filled VPI resin - semi-flexible for transformers with improved heat dissipation [See More]
- Features: Flexible; UL Rating; Dissimilar Substrates
- Chemical System: Alkyd
- Type: High Dielectric
- Composition: Filled
from Master Bond, Inc.
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]
- Features: Phase Change; Non-corrosive; Flexible; Dissimilar Substrates
- Chemical System: Silicone
- Type: High Dielectric; Optical
- Composition: Unfilled
from Master Bond, Inc.
EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]
- Features: Flame Retardant; Non-corrosive; Flexible; Dissimilar Substrates
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Features: Electrically Conductive; Phase Change; Non-corrosive; Flexible; Dissimilar Substrates
- Composition: Filled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component ; Addition Cure
from Master Bond, Inc.
EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]
- Features: Non-corrosive; Flexible; Dissimilar Substrates
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from Master Bond, Inc.
MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]
- Features: Phase Change; Non-corrosive; Flexible; Dissimilar Substrates
- Chemical System: Silicone
- Type: High Dielectric; Optical
- Composition: Unfilled
from Master Bond, Inc.
MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]
- Features: Non-corrosive; Flexible; Dissimilar Substrates
- Chemical System: Silicone
- Type: High Dielectric
- Composition: Filled
from Master Bond, Inc.
Master Bond Supreme 17HT is a one component toughened epoxy for bonding and sealing. It has a moderate viscosity system with good flow properties. [See More]
- Features: Non-corrosive; Flexible; Dissimilar Substrates
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from Master Bond, Inc.
Master Bond EP21TPHT is an epoxy polysulfide compound that withstands temperatures up to 350°F which gives it a higher resistance to elevated temperatures than most polysulfide systems. [See More]
- Features: Non-corrosive; Flexible; Dissimilar Substrates
- Chemical System: Polyphenylene Sulfide; Epoxy
- Type: High Dielectric
- Composition: Unfilled
from Master Bond, Inc.
Chemically resistant to acids, bases and solvents, Master Bond epoxy Supreme 62-1 features excellent flow properties and a long working life. With a wide service temperature range of -60 °F to 450 °F, it offers an outstanding physical strength profile. [See More]
- Features: Non-corrosive; Flexible; Dissimilar Substrates
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from Master Bond, Inc.
Master Bond EP88FL is a low viscosity, optically clear, two component epoxy system featuring good flexibility for high performance bonding, coating, sealing and potting. [See More]
- Features: Non-corrosive; Flexible; Dissimilar Substrates
- Chemical System: Epoxy
- Type: High Dielectric; Optical
- Composition: Unfilled
from Master Bond, Inc.
Featuring a low volume resistivity of 5-10 ohm-cm, EP21TDCN-LO is a nickel conductive system for high performance bonding and sealing applications. This smooth paste formulation is easy to handle and has a one to one mix ratio by weight or volume. It is a toughened system, formulated to withstand... [See More]
- Features: Electrically Conductive; EMI/RFI Shielding; Non-corrosive; Flexible; Dissimilar Substrates
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Protavic America, Inc.
PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]
- Features: Electrically Conductive; Flexible
- Composition: Unfilled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component
from Epoxies Etc...
The 10-2055 and 10-2055 HV were developed to produce a general purpose, semi flexible polyurethane adhesive for bonding a wide variety of plastic and metal substrates. The flexibility of these adhesives allows bonding to substrates with high coefficients of thermal expansion (CTE) and substrates... [See More]
- Features: Flexible
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Polyurethane
- Form / Shape: Die Bonding Adhesives; Grease, Paste
from Sauereisen, Inc.
Sauereisen Aluseal Adhesive Cement No. 2 is a ceramic cement paste offering good bond strength and thermal shock. resistant properties for assembling, sealing and cementing porcelain, glass, metal and other materials. Its fine particle size. and excellent flow characteristics make No. 2 a good... [See More]
- Features: Flexible
- Chemical System: Ceramic
- Type: High Dielectric
- Composition: Unfilled
from Protavic America, Inc.
Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for production needs. One... [See More]
- Features: Electrically Conductive; Flexible
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Epoxies Etc...
The 50-2150FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL94 V-O. This system offers excellent heat transfer, low exotherm, and excellent electrical properties. 50-2150 is a two part, non-mercury, flexible polyurethane potting system. [See More]
- Features: Flame Retardant; Flexible
- Chemical System: Polyurethane
- Type: High Dielectric
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Protavic America, Inc.
PTS-46303 A/B ™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include... [See More]
- Features: Flame Retardant; Flexible; UL Rating
- Chemical System: Silicone
- Type: High Dielectric
- Composition: Filled
from Epoxies Etc...
20-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 20-2366 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical... [See More]
- Features: Flame Retardant; Flexible; UL Rating
- Chemical System: Elastomeric; Polyurethane
- Type: High Dielectric
- Composition: Unfilled