Electronics Thermal Compounds and Thermal Interface Materials
from Dongguan Sheen Electronic Technology Co., Ltd.
CSF series Carbon Fiber Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Exceptional thermal conductivity options ranging from 15 to 45 W/mK. ◆ Available in various thicknesses from 0.3 to 12.0 mm. ◆ Features natural tackiness for easy application... [See More]
- Industry: Electronics
- Use Temperature: ? to 320
- Form / Shape: Pad
- Thermal Conductivity: 25
from CHT USA Inc.
CHT's AS1707 is a 1-part, alkoxy cured, thermally conductive, low volatile, RTV silicone adhesive paste. AS1707 is formulated to meet the requirements for use as a space grade adhesive. AS1707 has low thermal outgassing properties and a wide operational temperature range. In addition to meeting... [See More]
- Industry: Automotive; Electronics
- Cure / Technology: Single Component; Alkoxy
- Chemical System: Silicone
- Features: Flame Retardant; UL Rating
from Hernon Manufacturing, Inc.
Dissipator ® 745 is a thermally conductive room temperature cure adhesive that is designed for bonding electrical components to heat sink with a controlled gap. Dissipator ® 745, through a special shimming property, insulates the component electrically while allowing thermal conductivity. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Room Temperature Vulcanizing or Curing
from Fujipoly® America Corp.
bull; CF210A is the newest Fujipoly thermal gap filler. • CF210A incorporates carbon fibers along with traditional fillers found in thermal gap filler materials. • CF210A is rated at 21 W/m •K. • Compliance is closer to a much lower conductivity gap filler (Fujipoly- Sarcon... [See More]
- Industry: Electronics; Semiconductors, IC's
- Use Temperature: -40 to 302
- Form / Shape: Gap Filler, Foam in Place Gasket
- Thermal Conductivity: 21
from Quantaflex Printed Electronics Inc.
A high level of custom engineering and problem solving. Designing electrical shielding components requires a high level of custom engineering and problem solving. Nothing should be left to chance because the goal is to create a part that protects the electronic device (and your customers) from the... [See More]
- Industry: Electronics; Semiconductors, IC's
- Features: EMI/RFI Shielding
- Form / Shape: Liquid; Foam; Gap Filler, Foam in Place Gasket
from MacDermid Alpha Electronics Solutions
A silver sinter paste, providing high thermal and electrical conductivity. Product Overview. The ALPHA ® Argomax ® 2020 Paste is a high-performance silver sinter paste used in applications that require excellent thermal and electrical conductivity. This paste is particularly suited for... [See More]
- Industry: Automotive; Electronics; Semiconductors, IC's
- Form / Shape: Die Bonding Adhesives; Grease, Paste
from Master Bond, Inc.
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Silicone
- Type: High Dielectric; Optical
- Composition: Unfilled
from Dongguan Sheen Electronic Technology Co., Ltd.
CSF series Carbon Fiber Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Exceptional thermal conductivity options ranging from 15 to 45 W/mK. ◆ Available in various thicknesses from 0.3 to 12.0 mm. ◆ Features natural tackiness for easy application... [See More]
- Industry: Electronics
- Use Temperature: ? to 320
- Form / Shape: Pad
- Thermal Conductivity: 15
from CHT USA Inc.
CHT's QSil 563 is a 2-part, platinum cure, 100% silicone solids elastomer designed for electronic potting and encapsulation applications. QSil 562 offers a hard, low modulus material that is readily repairable. QSil 563 is thermally conductive to aid in efficient heat dissipation. This silicone... [See More]
- Industry: Automotive; Electronics
- Features: Flame Retardant; UL Rating
- Cure / Technology: Two Component ; Addition
- Use Temperature: -67 to 399
from Hernon Manufacturing, Inc.
Hernon Dissipator 745D is a thermally conductive room temperature cure adhesive that is designed for bonding electrical components to heat sink with a controlled gap. Dissipator 745D, through a special shimming property, insulates the component electrically while allowing thermal... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Room Temperature Vulcanizing or Curing
from Fujipoly® America Corp.
Fujipoly ® introduces Sarcon ® PG45A its newest high-performance, putty-like thermal interface material. This extremely low modulus gap filler exhibits a thermal resistance as low as 0.02 °C •in2/W at 43.5 PSI with a thermal conductivity of 4.5 W/m °K. Sarcon ® PG45A... [See More]
- Industry: Electronics; Semiconductors, IC's
- Form / Shape: Putty; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Gap Fill: 0.0591 to 0.0984
from Master Bond, Inc.
EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's; Aerospace
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from Dongguan Sheen Electronic Technology Co., Ltd.
CSF series Carbon Fiber Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Exceptional thermal conductivity options ranging from 15 to 45 W/mK. ◆ Available in various thicknesses from 0.3 to 12.0 mm. ◆ Features natural tackiness for easy application... [See More]
- Industry: Electronics
- Use Temperature: ? to 320
- Form / Shape: Pad
- Thermal Conductivity: 35
from CHT USA Inc.
CHT's SE3000 is a 2-part, platinum cure silicone elastomer designed for electronic potting and encapsulation applications. It offers good prtection against chemicals, environmental contamination, mechanical shock, vibration and impact damage. SE3000 can be used in applications where low flammability... [See More]
- Industry: Electronics
- Features: Flame Retardant; UL Rating
- Cure / Technology: Two Component ; Addition
- Use Temperature: -94 to 482
from Hernon Manufacturing, Inc.
Hernon Dissipator 746D is a thermally conductive adhesive formulated for bonding electrical components to heat sinks or printed circuit boards. Fast room temperature cure combined with excellent heat dissipation for thermally sensitive components and controlled strength for service repair provide... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Chemical System: Silicone
from Fujipoly® America Corp.
Fujipoly ® America announces the release of its new SARCON ® SPG-70A. It is a high flow rate, high heat transferring compound that exhibits a thermal conductivity of 7.0 W/m °K and has the lowest thermal resistance among our dispensable SPG products. When applied between heat-generating... [See More]
- Industry: Electronics
- Form / Shape: Grease, Paste; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Thermal Conductivity: 7
from Master Bond, Inc.
EP3HTND-2Med Black is a one part system that combines easy processing with excellent bonding properties. It cures in 20-30 minutes at 250°F or 5-10 minutes at 300°F and adheres well to a wide variety of substrates including glass, metals, ceramics and most plastics. This paste compound meets USP... [See More]
- Industry: Aerospace; Electronics; Electric Power; Photonics; Semiconductors, IC's
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SP Series Phase Change Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.8 to 6.0 W/m ·K. ◆ Low thermal impedance, reaching as low as 0.015 ℃*in ²/W at 50psi, ensuring... [See More]
- Industry: Electronics
- Use Temperature: -40 to 257
- Form / Shape: Pad
- Thermal Conductivity: 6
from CHT USA Inc.
CHT's QSil 553 is a 2-part, platinum cure, silicone potting compound and encapsulant designed to protect electronic components from harsh environmental conditions and shock and vibration. It features a low viscosity for convenient dispensing and will easily flow throughout components. Because of its... [See More]
- Industry: Automotive; Electronics; OEM or Industrial
- Features: Flame Retardant; UL Rating
- Cure / Technology: Two Component ; Addition
- Use Temperature: -67 to 464
from Fujipoly® America Corp.
Silicone Gap Filler Pad for Absorption of Electromagnetic Wave. Features. Effective to absorb and damp a wide range of electromagnetic waves. Also effective as a high performance thermal interface material. Easily filling small gaps of IC chip surface with soft gel texture. Good workability to... [See More]
- Industry: Electronics; Semiconductors, IC's
- Chemical System: Silicone
- Type: High Dielectric
- Form / Shape: Pad; Gap Filler, Foam in Place Gasket
from Master Bond, Inc.
One part, nano silica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
- Composition: Filled
- Type: High Dielectric
- Cure / Technology: UV or Radiation Cured; Single Component; Dual Curing
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SF Series Silicone Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.5 to 15.0 W/m ·K. ◆ Available in various thicknesses from 0.3 to 10.0 mm. ◆ Highly compressible, soft,... [See More]
- Industry: Electronics
- Use Temperature: -58 to 392
- Form / Shape: Pad
- Thermal Conductivity: 4
from Fujipoly® America Corp.
FEATURES: • Highly Conformable and High Heat Conducting Gel materials. • SARCON Thermal Gap Filler Pads are highly conformable and high heat conducting gel materials in a versatile sheet form. • Easily fit and adhere to most all shapes and sizes of components, including protrusions... [See More]
- Industry: Electronics
- Chemical System: Silicone
- Type: High Dielectric
- Form / Shape: Gap Filler, Foam in Place Gasket
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Composition: Filled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component ; Addition Cure
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SE Series two-component Thermal Gel are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, available in options ranging from 2.0 to 8.0 W/m ·K. ◆ Soft and elastic after curing, maintaining the required thickness and providing... [See More]
- Industry: Electronics
- Form / Shape: Gel
- Chemical System: Silicone
- Use Temperature: -58 to 302
from Fujipoly® America Corp.
Highly Conformable and High Heat Conducting gel materials. SARCON ® Thermal Gap Filler Pads are highly conformable and high heat conducting gel materials in a versatile sheet form. They easily fit and adhere to most all shapes and sizes of components, including protrusions and recessed areas. [See More]
- Industry: Electronics; Semiconductors, IC's
- Form / Shape: Gel; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Gap Fill: 0.0394 to 0.1181
from Master Bond, Inc.
EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's TIV800 Series RTV Thermal Conductive Adhesive are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, available in options ranging from 1.0 to 2.0 W/m ·K. ◆ High bonding performance. ◆ Good stability, long-term high... [See More]
- Industry: Electronics
- Use Temperature: -58 to 392
- Chemical System: Silicone
- Thermal Conductivity: 1.5
from Fujipoly® America Corp.
Fujipoly ® recently released Sarcon ® GR130A, its newest high-performance, thermal gap filler pad. The highly conformable, gel-like sheets exhibit a thermal resistance as low as 0.02 °C •in2/W at 43.5 PSI with a thermal conductivity of 13 W/m °K. Sarcon ® GR130A is available... [See More]
- Industry: Electronics; Semiconductors, IC's
- Form / Shape: Pad; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Gap Fill: 0.0118 to 0.0787
from Master Bond, Inc.
Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
- Composition: Filled
- Chemical System: Polyphenylene Sulfide; Epoxy
- Cure / Technology: Thermoset; Single Component
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SC Series Thermal Films are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 0.8 to 5.0 W/m ·K. ◆ Optional fiberglass or polyimide film can be used as the reinforcement carrier. ◆ High mechanical... [See More]
- Industry: Electronics
- Use Temperature: -58 to 392
- Chemical System: Silicone
- Thermal Conductivity: 3.5
from Fujipoly® America Corp.
Fujipoly ® USA introduces new 5 and 6W/m-K SARCON ® thermally conductive greases to the North American market. SARCON ® SG-50NS and SG-60NS greases offer excellent stability over wide temperature ranges with low thermal resistance. They feature exceptionally low bleed and evaporation as... [See More]
- Industry: Electronics
- Thermal Conductivity: 5 to 6
- Form / Shape: Grease, Paste
from Master Bond, Inc.
EP35SP is a two component epoxy system specially formulated to resist high temperatures and aggressive chemicals. It has a paste viscosity with little to no flow when curing. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's; Downhole
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SC Series Thermal Films are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 0.8 to 5.0 W/m ·K. ◆ Optional fiberglass or polyimide film can be used as the reinforcement carrier. ◆ High mechanical... [See More]
- Industry: Electronics
- Use Temperature: -58 to 392
- Chemical System: Silicone
- Thermal Conductivity: 0.9000
from Fujipoly® America Corp.
SARCON ® PG130A from Fujipoly ® is one of the industry ’s newest high-performance thermal interface materials that is extremely compressible. This double-sticky surface TIM is a great choice for applications that have delicate or wide-variation component heights and require extremely... [See More]
- Industry: Electronics; Semiconductors, IC's
- Form / Shape: Putty; Gap Filler, Foam in Place Gasket
- Type: High Dielectric
- Gap Fill: 0.0118 to 0.0787
from Master Bond, Inc.
EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SF Series Silicone Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.5 to 15.0 W/m ·K. ◆ Available in various thicknesses from 0.3 to 10.0 mm. ◆ Highly compressible, soft,... [See More]
- Industry: Electronics
- Use Temperature: -40 to 248
- Form / Shape: Pad
- Thermal Conductivity: 15
from Fujipoly® America Corp.
SARCON® Extremely Compressible Gap Filler Type (Putty Type) is a highly conformable, thermally conductive, non-flammable interface materials. The surface consistency is excellent for filling small air gaps and uneven mating surface, making reliable contact with various shapes and sizes of... [See More]
- Industry: Electronics; Semiconductors, IC's
- Form / Shape: Putty; Gap Filler, Foam in Place Gasket
- Type: High Dielectric
- Use Temperature: -40 to 302
from Master Bond, Inc.
EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]
- Industry: Electronics; OEM or Industrial
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SG560 Series Thermal Grease are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, available in options ranging from 1.0 to 5.0 W/m ·K. ◆ Low thermal impedance, with a minimum of 0.015 ℃*in ²/W at 30psi. ◆ Minimum... [See More]
- Industry: Electronics
- Use Temperature: ? to 302
- Form / Shape: Grease, Paste
- Thermal Conductivity: 4
from Fujipoly® America Corp.
SARCON ® SPG-25B-NS from Fujipoly ® is an easy to dispense, low- viscosity, silicone free compound that exhibits a thermal conductivity of 2.5 W/m °K and a thermal resistance of only 2.1 °K •cm2/W. When applied between heat-generating components and a nearby heat sink or... [See More]
- Industry: Electronics
- Use Temperature: -40 to 248
- Form / Shape: Grease, Paste; Gap Filler, Foam in Place Gasket
- Thermal Conductivity: 2.5 to 25
from Master Bond, Inc.
MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]
- Industry: Aerospace; Electronics; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Silicone
- Type: High Dielectric; Optical
- Composition: Unfilled
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's AF Series Silicone-free Thermal Pads (Non-silicone Thermal Pads) are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.0 to 8.0 W/m ·K. ◆ Available in various thicknesses from 0.5 to 5.0 mm. ◆... [See More]
- Industry: Electronics
- Form / Shape: Pad
- Chemical System: Silicone
- Use Temperature: -40 to 248
from Fujipoly® America Corp.
Fujipoly ® recently introduced a comprehensive engineering kit that includes free samples of (20) different Sarcon ® Thermal Interface Materials. The sample kit gives engineers the flexibility to test the performance properties of multiple Sarcon ® materials in order to find the perfect... [See More]
- Industry: Electronics; Semiconductors, IC's
from Master Bond, Inc.
MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Silicone
- Type: High Dielectric
- Composition: Filled
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SF Series Silicone Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.5 to 15.0 W/m ·K. ◆ Available in various thicknesses from 0.3 to 10.0 mm. ◆ Highly compressible, soft,... [See More]
- Industry: Electronics
- Use Temperature: -58 to 302
- Form / Shape: Pad
- Thermal Conductivity: 7
from Fujipoly® America Corp.
SARCON ® PG65A from Fujipoly ® is one of the industry ’s newest high-performance thermal interface materials that is extremely compressible. This double-sticky surface TIM is a great choice for applications that have delicate or wide-variation component heights and require extremely... [See More]
- Industry: Aerospace; Automotive; Electronics; OEM or Industrial
- Form / Shape: Pad; Putty; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Use Temperature: -40 to 302
from Master Bond, Inc.
Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Epoxy
- Type: High Dielectric; Optical
- Composition: Unfilled
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SF Series Silicone Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.5 to 15.0 W/m ·K. ◆ Available in various thicknesses from 0.3 to 10.0 mm. ◆ Highly compressible, soft,... [See More]
- Industry: Electronics
- Use Temperature: -58 to 392
- Form / Shape: Pad
- Thermal Conductivity: 5
from Fujipoly® America Corp.
The SARCON® LG Series is the perfect solution for filling large, complex and uneven gaps between heat generating components that depend on reliable contact with a heat spreader to maintain optimal performance. SARCON® LG23A and LG30A easily dispense in a liquid form that will cure at room... [See More]
- Industry: Electronics; Semiconductors, IC's
- Chemical System: Silicone
- Type: High Dielectric
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Master Bond EP30NS is a nano silica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Epoxy
- Type: High Dielectric; Optical
- Composition: Filled
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SP Series Phase Change Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.8 to 6.0 W/m ·K. ◆ Low thermal impedance, reaching as low as 0.015 ℃*in ²/W at 50psi, ensuring... [See More]
- Industry: Electronics
- Use Temperature: -40 to 257
- Form / Shape: Pad
- Thermal Conductivity: 4
from Master Bond, Inc.
EP42-2LV Black is a two component, room temperature curing epoxy compound featuring low viscosity and superior chemical resistance. It meets NASA low outgassing specifications, is black in color and optically opaque. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SE Series one-component Thermal Gel are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, available in options ranging from 2.0 to 10.0 W/m ·K. ◆ High softness and compressibility, providing low assembly stress, ideal for... [See More]
- Industry: Electronics
- Form / Shape: Gel
- Chemical System: Silicone
- Use Temperature: -58 to 302
from Master Bond, Inc.
Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part nickel conductive systems, EP76M... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SF Series Silicone Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.5 to 15.0 W/m ·K. ◆ Available in various thicknesses from 0.3 to 10.0 mm. ◆ Highly compressible, soft,... [See More]
- Industry: Electronics
- Use Temperature: -58 to 257
- Form / Shape: Pad
- Thermal Conductivity: 10
from Master Bond, Inc.
Master Bond X21Med is a toughened one part system that can be used for bonding and priming polyolefinic surfaces. This exceptionally low viscosity ( <250 cps) solvent based system is easy to apply and process. It cures at room temperature or more rapidly with the addition of heat. X21Med passes... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
- Composition: Unfilled
- Type: High Dielectric
- Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
from Dongguan Sheen Electronic Technology Co., Ltd.
CSF series Carbon Fiber Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Exceptional thermal conductivity options ranging from 15 to 45 W/mK. ◆ Available in various thicknesses from 0.3 to 12.0 mm. ◆ Features natural tackiness for easy application... [See More]
- Industry: Electronics
- Use Temperature: ? to 320
- Form / Shape: Pad
- Thermal Conductivity: 30
from Master Bond, Inc.
Master Bond Polymer System FL901AO is a one component high performance, thermally conductive, electrically insulative epoxy resin based adhesive film with outstanding performance characteristics. Unlike many other such epoxy film products, it does not require refrigerated storage although this is... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SP Series Phase Change Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.8 to 6.0 W/m ·K. ◆ Low thermal impedance, reaching as low as 0.015 ℃*in ²/W at 50psi, ensuring... [See More]
- Industry: Electronics
- Use Temperature: -40 to 257
- Form / Shape: Pad
- Thermal Conductivity: 3
from Master Bond, Inc.
Master Bond Supreme 17HT is a one component toughened epoxy for bonding and sealing. It has a moderate viscosity system with good flow properties. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from Dongguan Sheen Electronic Technology Co., Ltd.
CSF series Carbon Fiber Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Exceptional thermal conductivity options ranging from 15 to 45 W/mK. ◆ Available in various thicknesses from 0.3 to 12.0 mm. ◆ Features natural tackiness for easy application... [See More]
- Industry: Electronics
- Use Temperature: ? to 320
- Form / Shape: Pad
- Thermal Conductivity: 20
from Master Bond, Inc.
Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for conventional bonding and sealing. This system features an excellent die shear strength of 24-27 kg-f and can be used in a typical die size ranging from 4-400 mm2. EP17HTDA-1 can also be... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from Bluestar Silicones USA Corp.
Metal Oxide Thickened Dimethyl Silicone Compound. Description. Bluesil V-740 is a metal oxide thickened dimethyl silicone compound. It is a white, heavy paste used for heat dissipation applications where high thermal conductivity is required. [See More]
- Industry: Electronics; Electric Power; Semiconductors, IC's
- Cure / Technology: Two Component
- Chemical System: Silicone
- Form / Shape: Grease, Paste
from Nordson EFD
Our innovative, non-silicone thermal compounds provide an ideal thermal solution by ensuring reliable heat transfer over a longer time than most industrial thermal interface materials. Conventional, silicone-based heat sink compounds and thermal greases tend to spread after a number of heating and... [See More]
- Industry: Electronics; Semiconductors, IC's
- Cure / Technology: Single Component
- Composition: Unfilled
- Form / Shape: Grease, Paste
from Aremco Products, Inc.
Aremco offers an expansive range of ceramic-based materials used for the assembly of high temperature, high power electrical devices, and high temperature fixtures, molds and tooling. These materials, based on aluminum oxide, aluminum nitride, magnesium oxide, silicon dioxide, silicon carbide,... [See More]
- Industry: Electronics
- Features: Dissimilar Substrates
- Form / Shape: Liquid; Encapsulant or Conformal Coating
- Use Temperature: 1150
from Protavic America, Inc.
PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]
- Industry: Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Composition: Unfilled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component
from Hi-Tech Seals, Inc.
HERNON ® offers a complete line of structural acrylic adhesives. These systems are two-part, no mix, and reactive adhesives. Each acrylic adhesive has two components: the adhesive base or resin, and the Activator. Structural acrylic adhesives are termed “reactive ” cure systems. The... [See More]
- Industry: Electronics
- Cure / Technology: Two Component
- Chemical System: Acrylic
- Form / Shape: Grease, Paste
from Ohmite Manufacturing Co.
Ohmite thermal interface materials (TIMs) are designed for use in applications requiring reliable performance, low contact resistance, long life, low maintenance and high thermal conductivity. The flexible graphite materials are die-cut to ensure exact fit and reduce module-to-module variation... [See More]
- Industry: Electronics; Electric Power; OEM or Industrial
- Thermal Conductivity: 800
- Use Temperature: -40 to 752
- CTE: 15
from Shiu Li Technology Co., Ltd
LiPOLY DTT44 is a soft thermally conductive gel pad specifically designed for networking applications. DTT44 is designed to focus on Dk and Df to reduce interference in RF modules. DTT44 has a thermal conductivity of 3.0 W/m*K. This product can be supplied as standard sheets, custom die-cuts or... [See More]
- Industry: Electronics
- Form / Shape: Pad; Sheet Form, Die-cut Parts
- Chemical System: Silicone
- Gap Fill: 0.0197 to 0.1969
from Epoxy Technology
EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]
- Industry: Electronics; Photonics
- Chemical System: Epoxy
- Type: High Dielectric; Optical
- Cure / Technology: Thermoset; Two Component
from Sauereisen, Inc.
Sauereisen Cement No. 31 is a white, porcelain-like cement that is widely used throughout industry in a variety of applications. including assembling, sealing, insulating and cementing of ceramics, porcelain, metal, and glass. [See More]
- Industry: Electronics; Electric Power
- Chemical System: Ceramic
- Type: High Dielectric
- Composition: Unfilled
from Henkel Corporation - Electronics
Gap Pad ® 1000HD was designed to with-stand applications requiring high durability. The coated polyimide carrier on one side of the material allows easy rework, excellent handling characteristics and puncture resistance. The conformable and elastic nature of Gap Pad ® 1000HD allows excellent... [See More]
- Industry: Electronics
from Techsil Limited
Elecolit ® 6603 is a thermally conductive epoxy with very good metal adhesion and slight flexibility. This grade has very good flow behavior and can easily be processed using a dispenser, spreading knife or spatula. Although designed for bonding applications, 6603 can also be used as a potting... [See More]
- Industry: Electronics
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Features: Electrically Conductive
from Wacker Chemical Corp.
WACKER ’s silicone adhesives and sealants are based on many years of experience, innovative research and comprehensive technological expertise. In a wide variety of industries, especially in lighting technology, flowable or non-sag silicone products offer decisive advantages in performance and... [See More]
- Industry: Electronics
- Chemical System: Silicone; Elastomeric
from Hapco, Inc.
Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame... [See More]
- Industry: Electronics
- Cure / Technology: Thermoset; Two Component
- Type: High Dielectric
- Form / Shape: Liquid
from Epoxies Etc...
50-3150 FR has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-3150 FR Black Epoxy with Catalyst 190 and Catalyst 105 are listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low shrinkage, and outstanding insulation... [See More]
- Industry: Electronics; Electric Power
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Aremco Products, Inc.
High fired strength, dense ceramics [See More]
- Industry: Electronics; OEM or Industrial; Gas Ignitors, Sagger Plates, Temp Probes
- Chemical System: Ceramic
- Type: High Dielectric
- Composition: Filled
from Protavic America, Inc.
Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for production needs. One... [See More]
- Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Shiu Li Technology Co., Ltd
LiPOLY DTT65 is a soft thermally conductive gel pad specifically designed for networking applications. DTT65 is designed to focus on Dk and Df to reduce interference in RF modules. DTT65 has a thermal conductivity of 5.0 W/m*K. This product can be supplied as standard sheets, custom die-cuts or... [See More]
- Industry: Electronics
- Form / Shape: Pad; Sheet Form, Die-cut Parts
- Chemical System: Silicone
- Gap Fill: 0.0197 to 0.1969
from Henkel Corporation - Electronics
The new Gap Pad 1000SF is a thermally conductive, electrically insulating, silicone-free polymer specially designed for silicone-sensative applications. The material is ideal for applications with high standoff and flatness tolerances. Gap Pad 1000SF is reinforced for easy material handling and... [See More]
- Industry: Electronics
from Techsil Limited
MG Chemicals 8331 is a Silver Conductive Epoxy with a moderate cure time and high conductivity. This is an economical electronic epoxy with good electrical and thermal conductivities. The adhesive bonds very well to a variety of surfaces, it resists thermal and mechanical shocks and provides the low... [See More]
- Industry: Electronics
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Features: Electrically Conductive
from Wacker Chemical Corp.
ELASTOSIL ® RT 675 A/B is a pourable, addition-curing RTV-2 silicone rubber. [See More]
- Industry: Electronics
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Silicone; Elastomeric
- Form / Shape: Liquid
from Hapco, Inc.
DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity). Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI-COAT R-4721 is easy to... [See More]
- Industry: Electronics
- Cure / Technology: Thermoset; Two Component
- Type: High Dielectric
- Form / Shape: Liquid
from Epoxies Etc...
20-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 20-2366 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical... [See More]
- Industry: Electronics
- Chemical System: Elastomeric; Polyurethane
- Type: High Dielectric
- Composition: Unfilled
from Aremco Products, Inc.
Aremco ’s high temperature ceramic adhesives are unique inorganic formulations for bonding and sealing ceramics, metals, quartz, graphites, textiles, and composite materials used in design, process and maintenance applications to 3200 °F. These advanced materials, which exhibit high... [See More]
- Industry: Electronics
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Type: High Dielectric
- Form / Shape: Grease, Paste
from Protavic America, Inc.
Epoxy system designed for underfill applications. This material is fast flowing and provides excellent properties for common device packaging. [See More]
- Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Chemical System: Epoxy
- Type: High Dielectric
- Cure / Technology: Thermoset; Single Component
from Shiu Li Technology Co., Ltd
LiPOLY G566 Graphite Sheet has great thermal conductivity on the X and Y axis. The thermal conductivity is 1700W/m*K. It is flexible, which is suitable for thin products and high capability mobile devices. [See More]
- Industry: Electronics
- Gap Fill: 8.27E-4
- Form / Shape: Sheet Form, Die-cut Parts
- Thermal Conductivity: 1700
from Henkel Corporation - Electronics
Gap Pad ® 1450 is a highly compliant Gap Pad material that is ideal for fragile component leads. The material includes a permanent liner, which facilitates rework and improves puncture resistance and handling characteristics. The un-lined side of Gap Pad ® 1450 maintains a conformable, yet... [See More]
- Industry: Electronics
from Techsil Limited
MG Chemicals 8329TCM is a medium cure thermally conductive epoxy adhesive which has a convenient 1:1 mix ratio and a 45 minute work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to mechanical shocks and... [See More]
- Industry: Electronics
- Cure / Technology: Thermoset
- Chemical System: Epoxy
from Protavic America, Inc.
PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ is heat stable up to 150 °C. [See More]
- Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Filled
from Shiu Li Technology Co., Ltd
LiPOLY TR332CU has outstanding parallel thermal conduction and has high flexibility, which is suitable for thin products like mobile devices. [See More]
- Industry: Electronics
- Gap Fill: 0.0039 to 0.0059
- Form / Shape: Sheet Form, Die-cut Parts
- Use Temperature: -76 to 248
from Henkel Corporation - Electronics
Gap Pad 1500 has an ideal filler blend that gives it a low modulus characteristic that maintains optimal thermal performance yet still allows for easy handling. The natural tack on both sides of the material allows for good compliance to adjacent surfaces of components, minimizing interfacial... [See More]
- Industry: Electronics
from Techsil Limited
MG Chemicals 8331 is a Silver Conductive Epoxy with a moderate cure time and high conductivity. This is an economical electronic epoxy with good electrical and thermal conductivities. The adhesive bonds very well to a variety of surfaces, it resists thermal and mechanical shocks and provides the low... [See More]
- Industry: Electronics
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Features: Electrically Conductive
from Shiu Li Technology Co., Ltd
LiPOLY BS75K is a soft thermally conductive gap filler. With a thermal conductivity of 3.0 W/m*K and a low thermal impedance, BS75K is suitable for a wide range of applications. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for a wide... [See More]
- Industry: Electronics
- Form / Shape: Pad; Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Gap Fill: 0.0197 to 0.1969
from Henkel Corporation - Electronics
Gap Pad 1500R has the same highly conformable, low modulus polymer as the standard Gap Pad 1500. The fiberglass reinforcement allows for easy material handling and enhances puncture, shear and tear resistance. The natural tack on both sides of the material allows for good compliance to mating... [See More]
- Industry: Electronics
from Techsil Limited
MG Chemicals 8330 Silver Conductive Epoxy is a higher conductivity version of the 8331 Silver Conductive Epoxy. It is an electronic grade epoxy which combines a moderate curing rate and a high conductivity. It bonds very well to most substrates used in electronic assemblies; resists thermal and... [See More]
- Industry: Electronics
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Features: Electrically Conductive
from Shiu Li Technology Co., Ltd
LiPOLY BS87 is an ultra-soft thermally conductive gel pad with a thermal conductivity of 3.0 W/m*K. BS87 offers excellent compression under minimal force with high recovery characteristics. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for... [See More]
- Industry: Electronics
- Form / Shape: Pad; Sheet Form, Die-cut Parts
- Chemical System: Silicone
- Gap Fill: 0.0197 to 0.1969
from Henkel Corporation - Electronics
Gap Pad 1500S30 is a highly compliant Gap Pad material that is ideal for fragile component leads.The material is fiberglass reinforced for improved puncture resistance and handling characteristics. Gap Pad 1500S30 maintains a conformable, yet elastic nature that provides excellent interfacing and... [See More]
- Industry: Electronics
from Techsil Limited
MG Chemicals 8330S is a Silver Conductive Epoxy with a slow cure time and extreme conductivity. This electronic grade epoxy combines a long working time and high conductivity. The cured conductive adhesive bonds very well to most substrates used in electronic assemblies, resists thermal and... [See More]
- Industry: Electronics
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Features: Electrically Conductive
from Shiu Li Technology Co., Ltd
LiPOLY ’s S282 is a thermally conductive pad designed for gap filling. The thermal conductivity is 1.7 W/m*K. It uses fiberglass cloth as the reinforcement material with great self-adhesive that can fit closely with non-flat heat sinks to increase the contact area. The low stress damped... [See More]
- Industry: Electronics
- Form / Shape: Pad; Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Gap Fill: 0.0197 to 0.1969
from Henkel Corporation - Electronics
Gap Pad 2000S40 is recommended for low-stress applications that require a mid to high thermally conductive interface material. The highly conformable nature of the material allows the pad to fill in air voids and air gaps between PC boards and heat sinks or metal chassis with stepped topography,... [See More]
- Industry: Electronics
from Techsil Limited
MG Chemicals 8330S is a Silver Conductive Epoxy with a slow cure time and extreme conductivity. This electronic grade epoxy combines a long working time and high conductivity. The cured conductive adhesive bonds very well to most substrates used in electronic assemblies, resists thermal and... [See More]
- Industry: Electronics
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Features: Electrically Conductive
from Shiu Li Technology Co., Ltd
LiPOLY S393 is a product with high ductile thermal conductivity. Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material. It won't easy to break and deformwhether stamped, punched, strip type, or custom cutting. Your best choice... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Silicone
- Type: High Dielectric
- Form / Shape: Pad; Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
from Henkel Corporation - Electronics
Gap Pad 2200SF is a thermally conductive, electrically isolating, silicone-free polymer specially designed for silicone-sensitive applications. The material is ideal for applications with uneven topologies and high stackup tolerances. Gap Pad 2200SF is reinforced for easy material handling and added... [See More]
- Industry: Electronics
from Techsil Limited
MG Chemicals 8329TCS is a slow cure electrically insulating epoxy adhesive. Combines a long working 1:1 mix ratio and a 4 hour work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to mechanical shocks and... [See More]
- Industry: Electronics
- Cure / Technology: Thermoset
- Chemical System: Epoxy
from Shiu Li Technology Co., Ltd
LiPOLY S818 is a product with high ductile thermal conductivity.Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material.It won't easy to break and deform whether stamped, punched, strip type, or custom cutting. Your best choice... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Silicone
- Type: High Dielectric
- Form / Shape: Pad; Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
from Henkel Corporation - Electronics
Gap Pad ® 2202SF is a high performance, 2.0 W/m-K, thermally conductive gap filling material. The Gap Pad ® 2202SF compound is silicone-free by design and offers exceptionally low interfacial resistances to adjacent surfaces. Gap Pad ® 2202SF is specifically designed for... [See More]
- Industry: Electronics
from Techsil Limited
MG Chemicals 8329TCM is a medium cure thermally conductive epoxy adhesive which has a convenient 1:1 mix ratio and a 45 minute work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to mechanical shocks and... [See More]
- Industry: Electronics
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Features: Electrically Conductive
from Shiu Li Technology Co., Ltd
LiPOLY DCTP140-s is a thermal insulator uses fiberglass cloth as a reinforcement material, combined with thermal conductive silicon, giving it high thermal conduction and great compression strength. The thermal conductivity is 4.5 W/m*K, the thickness is 0.25~0.45mm. Its high insulation and... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Silicone
- Type: High Dielectric
- Form / Shape: Pad; Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
from Henkel Corporation - Electronics
Gap Pad ® 3004SF is high performance, 3.0 W/m-K, thermally conductive gap filling material. Gap Pad ® 3004SF is silicone-free by design and offers exceptionally low interfacial resistances to adjacent surfaces. Gap Pad ® 3004SF is designed for applications that are silicone-sensitive. [See More]
- Industry: Electronics
from Techsil Limited
TSE3281-G is a thermally conductive silicone adhesive from Momentive Performance Materials. This one component material is non-corrosive and has excellent adhesion properties to a wide variety of substrates. Potential applications for TSE3281-G include sealing and bonding for thermally conductive... [See More]
- Industry: Electronics
- Chemical System: Silicone; Elastomeric
from Shiu Li Technology Co., Ltd
LiPOLY PR27 is a very thin high insulator with a thickness of 0.15mm. It uses Polyimide Film as the reinforcement material, which can increase the tensile strength. It has great dielectric strength and can withstand 12K voltages. It ’s suitable for high power transistors, electrical equipment,... [See More]
- Industry: Electronics
- Form / Shape: Pad; Sheet Form, Die-cut Parts
- Chemical System: Silicone
- Gap Fill: 0.0059
from Henkel Corporation - Electronics
Gap Pad ® 3500ULM (ultra low-modulus) is an extremely soft gap filling material rated at a thermal conductivity of 3.5 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique 3.5 W/m-K filler package and ultra-low modulus resin formulation. The enhanced... [See More]
- Industry: Electronics
from Techsil Limited
Momentive SnapSIL TN3005 is a low volatile siloxane, silicone adhesive sealant that cures at room temperature. It offers primerless adhesion to many substrates and high elongation once cured. Ideal for use as an insulating adhesive seal and fixing for electrical and electronic parts. Can also be... [See More]
- Industry: Electronics
- Chemical System: Silicone; Elastomeric
from Shiu Li Technology Co., Ltd
LiPOLY ’s thermal insulator SH1500/2000/3000 uses fiberglass cloth as a reinforcement material, combined with thermal conductive silicon, giving it high thermal conduction and great compression strength. The thermal conductivity is 1.5/2.0/3.0 W/m*K, the thickness is 0.23~0.35mm. Its high... [See More]
- Industry: Electronics
- Form / Shape: Pad; Sheet Form, Die-cut Parts
- Chemical System: Silicone
- Gap Fill: 0.0091 to 0.0138
from Henkel Corporation - Electronics
Gap Pad 5000S35 is a fiberglass-reinforced filler and polymer featuring a high thermal conductivity. The material yields extremely soft characteristics while maintaining elasticity and conformability.The fiberglass reinforcement provides easy handling and converting, added electrical isolation and... [See More]
- Industry: Electronics
from Techsil Limited
Momentive SnapSIL TN3005 is a low volatile siloxane, silicone adhesive sealant that cures at room temperature. It offers primerless adhesion to many substrates and high elongation once cured. Ideal for use as an insulating adhesive seal and fixing for electrical and electronic parts. Can also be... [See More]
- Industry: Electronics
- Chemical System: Silicone; Elastomeric
from Shiu Li Technology Co., Ltd
LiPOLY T-top81 is an ultra-soft, highly conformable, non-flammable interface material. T-top81 is a high deflection material, designed to allow minimal stress on components while offering excellent thermal conductivity and low thermal resistance. With a thermal conductivity of 8.0 W/m*K, T-top81... [See More]
- Industry: Electronics
- Form / Shape: Sheet Form, Die-cut Parts
- Chemical System: Silicone
- Gap Fill: 0.0197 to 0.1969
from Henkel Corporation - Electronics
Gap Pad A2000 acts as a thermal interface and electrical insulator between electrical components and heat sinks. In the thickness range of 10 to 40 mil, Gap Pad A2000 is supplied with natural tack on both sides, allowing for excellent compliance to the adjacent surfaces of components. The 40 mil... [See More]
- Industry: Electronics
from Techsil Limited
Momentive SnapSIL TN3085 is a thermally conductive, low volatile siloxane, silicone adhesive that cures at room temperature to form an elastic, flame retardant silicone rubber. It offers primerless adhesion to many substrates. Designed for bonding applications in power supplies, securing PCB's to... [See More]
- Industry: Electronics
- Chemical System: Silicone; Elastomeric
from Shiu Li Technology Co., Ltd
Our high thermally conductive gap filler T-work 7000 provides excellent compression and extremely low thermal resistance in form shape with high thermal conductivity for gap filling between electrical component and heatsink. [See More]
- Industry: Electronics
- Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Gap Fill: 0.0197 to 0.1969
from Henkel Corporation - Electronics
Gap Pad A3000 is a thermally conductive, filled-polymer laminate, supplied on a reinforcing mesh for added electrical isolation, easy material handling and enhanced puncture, shear and tear resistance. Gap Pad A3000 has a reinforcement layer on the dark gold side of the material that assists in... [See More]
- Industry: Electronics
from Techsil Limited
Momentive SnapSIL TN3305 is a low volatile siloxane, silicone adhesive sealant that cures at room temperature. It offers primerless adhesion to many substrates and high elongation once cured. Ideal for use as an insulating adhesive seal and fixing for electrical and electronic parts. Can also be... [See More]
- Industry: Electronics
- Chemical System: Silicone; Elastomeric
from Shiu Li Technology Co., Ltd
LiPOLY T-work 8000 is a high performance thermally conductive interface pad. T-work 8000 offers outstanding thermal conductivity at 15.0 W/m*K and extremely low thermal resistance under minimal force. T-work 8000 offers excellent compression, filling small air gaps and uneven surfaces, ensuring an... [See More]
- Industry: Electronics
- Form / Shape: Sheet Form, Die-cut Parts
- Chemical System: Silicone
- Gap Fill: 0.0197 to 0.1969
from Henkel Corporation - Electronics
Gap Pad EMI 1.0 is a highly conformable, combination gap filling material offering both thermal conductivity performance and Electromagnetic Energy absorption (cavity resonances and/or cross-talk causing Electromagnetic Interference) at frequencies of 1GHz and higher. The material offers EMI... [See More]
- Industry: Electronics
from Techsil Limited
Momentive SnapSIL TN3305 is a low volatile siloxane, silicone adhesive sealant that cures at room temperature. It offers primerless adhesion to many substrates and high elongation once cured. Ideal for use as an insulating adhesive seal and fixing for electrical and electronic parts. Can also be... [See More]
- Industry: Electronics
- Chemical System: Silicone; Elastomeric
from Shiu Li Technology Co., Ltd
LiPOLY T-work 9000 offers outstanding thermal conductivity at 20.0 W/m*K and extremely low thermal resistance under minimal force. T-work 9000 offers excellent compression, filling small air gaps on uneven surfaces, ensuring an efficient and consistent transfer of heat. [See More]
- Industry: Electronics
- Form / Shape: Sheet Form, Die-cut Parts
- Chemical System: Silicone
- Gap Fill: 0.0197 to 0.1969
from Henkel Corporation - Electronics
Gap Pad HC 1000 is an extremely conformable, low modulus polymer that acts as a thermal interface and electrical insulator between electronic components and heat sinks. The “gel-like ” modulus allows this material to fill air gaps to enhance the thermal performance of electronic systems. [See More]
- Industry: Electronics
from Techsil Limited
Momentive SnapSIL TN3075 is a low volatile siloxane, silicone adhesive sealant that cures at room temperature. It offers primerless adhesion to many substrates. Ideal for use as an insulating adhesive seal and fixing for electrical and electronic parts. Can also be used as a waterproof sealant for... [See More]
- Industry: Electronics
- Chemical System: Silicone; Elastomeric
from Shiu Li Technology Co., Ltd
LiPOLY T-top99-s offers outstanding thermal conductivity at 24.0 W/m*K and extremely low thermal resistance under minimal force.T-top99-s offers excellent compression, filling small air gaps on uneven surfaces, ensuring an efficient and consistent transfer of heat. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Silicone
- Type: High Dielectric
- Form / Shape: Pad; Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
from Henkel Corporation - Electronics
Gap Pad ® HC 3.0 is a soft gap filling material rated at a thermal conductivity of 3.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique 3.0 W/m-K filler package and low-modulus resin formulation. The enhanced material is well suited for high performance... [See More]
- Industry: Electronics
from Techsil Limited
Momentive SnapSIL TN3075 is a low volatile siloxane, silicone adhesive sealant that cures at room temperature. It offers primerless adhesion to many substrates. Ideal for use as an insulating adhesive seal and fixing for electrical and electronic parts. Can also be used as a waterproof sealant for... [See More]
- Industry: Electronics
- Chemical System: Silicone; Elastomeric
from Shiu Li Technology Co., Ltd
LiPOLY's TPS series is a low-density, potting material. Its low density and lightweight properties enhance product performance, reduce production costs. The product has a thermal conductivity of 0.55-1.50 W/m*K and can cure at room temperature or high temperatures. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Chemical System: Silicone
- Form / Shape: Liquid; Grease, Paste; Gap Filler, Foam in Place Gasket
from Henkel Corporation - Electronics
Gap Pad VO is a cost effective thermally conductive interface. The material is a filled thermally conductive polymer supplied on a rubber coated fiberglass carrier allowing for easy material handling. The conformable nature of Gap Pad VO allows the pad to fill in air gaps between PC boards and heat... [See More]
- Industry: Electronics
from Techsil Limited
Momentive TIA241GF is a 2 part, thermally conductive silicone that is dispensed as a liquid and cured in place to create a heat path for efficient heat transfer. After being applied, the non-slumping paste consistency of TIA214GF provides physical stability to prevent run-off after dispense. [See More]
- Industry: Electronics
- Form / Shape: Grease, Paste; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Features: Flame Retardant
from Shiu Li Technology Co., Ltd
LiPOLY Non-Silicone Thermal Compound N700A/B is made of non-silicon resin material and none low-molecular-weight siloxane. N700A/B helps avoid electrical contact problems. N700 is flexible and has great thermal conduction, making the thermal resistance as low as possible. The thermal conductivity is... [See More]
- Industry: Electronics
- Gap Fill: 0.0197 to 0.1969
- Form / Shape: Pad; Sheet Form, Die-cut Parts
- Features: UL Rating
from Henkel Corporation - Electronics
Gap Pad VO Soft is recommended for applications that require a minimum amount of pressure on components. Gap Pad VO Soft is a highly conformable, low modulus, filled-silicone polymer on a rubber-coated fiberglass carrier. The material can be used as an interface where one side is in contact with a... [See More]
- Industry: Electronics
from Techsil Limited
Momentive TIA350R is a one-component, heat curable silicone adhesive designed for thermally conductive applications. This grade cures quickly upon exposure to heat and adheres well to a wide variety of substrates. Recommended for use as a thermal interface material between dies and heat spreaders,... [See More]
- Industry: Electronics
- Use Temperature: -40 to 200
- Chemical System: Silicone; Elastomeric
from Shiu Li Technology Co., Ltd
Non-Silicone Thermal Compound N700C is made of non-silicon resin material and none low-molecular-weight siloxane. N700C helps avoid electrical contact problems. N700 is flexible and has great thermal conduction, making the thermal resistance as low as possible. The thermal conductivity is 5.0W/m*K. [See More]
- Industry: Electronics
- Gap Fill: 0.0197 to 0.1969
- Form / Shape: Pad; Sheet Form, Die-cut Parts
- Use Temperature: -76 to 257
from Henkel Corporation - Electronics
GAP PAD ™ HC 5.0 is a soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique filler package and low-modulus resin formulation. The enhanced material is ideal for applications... [See More]
- Industry: Electronics
- Form / Shape: Pad; Gap Filler, Foam in Place Gasket
from Techsil Limited
Momentive TSE322 is a heat curable silicone adhesive sealant which will bond to many substrates without the need for a primer and cures rapidly at elevated temperatures. Product Benefits. Easy to use, one-component material. Fast cure at elevated temperature. Offers self-adhesion properties. [See More]
- Industry: Electronics
- Chemical System: Silicone; Elastomeric
- Type: High Dielectric