Silicone Thermal Compounds and Thermal Interface Materials
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SE Series two-component Thermal Gel are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, available in options ranging from 2.0 to 8.0 W/m ·K. ◆ Soft and elastic after curing, maintaining the required thickness and providing... [See More]
- Chemical System: Silicone
- Industry: Electronics
- Form / Shape: Gel
- Use Temperature: -58 to 302
from CHT USA Inc.
CHT's AS1707 is a 1-part, alkoxy cured, thermally conductive, low volatile, RTV silicone adhesive paste. AS1707 is formulated to meet the requirements for use as a space grade adhesive. AS1707 has low thermal outgassing properties and a wide operational temperature range. In addition to meeting... [See More]
- Chemical System: Silicone
- Industry: Automotive; Electronics
- Cure / Technology: Single Component; Alkoxy
- Features: Flame Retardant; UL Rating
from Hernon Manufacturing, Inc.
Hernon Dissipator 746D is a thermally conductive adhesive formulated for bonding electrical components to heat sinks or printed circuit boards. Fast room temperature cure combined with excellent heat dissipation for thermally sensitive components and controlled strength for service repair provide... [See More]
- Chemical System: Silicone
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Room Temperature Vulcanizing or Curing
from Fujipoly® America Corp.
Fujipoly ® introduces Sarcon ® PG45A its newest high-performance, putty-like thermal interface material. This extremely low modulus gap filler exhibits a thermal resistance as low as 0.02 °C •in2/W at 43.5 PSI with a thermal conductivity of 4.5 W/m °K. Sarcon ® PG45A... [See More]
- Chemical System: Silicone
- Gap Fill: 0.0591 to 0.0984
- Form / Shape: Putty; Gap Filler, Foam in Place Gasket
- Industry: Electronics; Semiconductors, IC's
from MacDermid Alpha Electronics Solutions
Heat transfer compound for efficient and reliable thermal coupling of electrical and electronic components. Product Overview. HTC Heat Transfer Compound is a non-silicone thermal interface material recommended for efficient and reliable thermal coupling of electrical and electronic components, or... [See More]
- Chemical System: Silicone
- Industry: Electronics; Semiconductors, IC's
- Form / Shape: Grease, Paste
- Use Temperature: 266
from Master Bond, Inc.
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]
- Chemical System: Silicone
- Composition: Unfilled
- Type: High Dielectric; Optical
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing; Addition Cure
from RS Components, Ltd.
Thermal Putty with EMI, 2.0 W/m K, 55ml [See More]
- Chemical System: Silicone
- Thermal Conductivity: 2
- Use Temperature: -58 to 392
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's TIV800 Series RTV Thermal Conductive Adhesive are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, available in options ranging from 1.0 to 2.0 W/m ·K. ◆ High bonding performance. ◆ Good stability, long-term high... [See More]
- Chemical System: Silicone
- Use Temperature: -58 to 392
- Industry: Electronics
- Thermal Conductivity: 1.5
from Fujipoly® America Corp.
Fujipoly ® America announces the release of its new SARCON ® SPG-70A. It is a high flow rate, high heat transferring compound that exhibits a thermal conductivity of 7.0 W/m °K and has the lowest thermal resistance among our dispensable SPG products. When applied between heat-generating... [See More]
- Chemical System: Silicone
- Industry: Electronics
- Form / Shape: Grease, Paste; Gap Filler, Foam in Place Gasket
- Thermal Conductivity: 7
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component ; Addition Cure
- Composition: Filled
- Form / Shape: Grease, Paste; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
from RS Components, Ltd.
Thermal Putty, 2.0 W/m K, 55ml [See More]
- Chemical System: Silicone
- Thermal Conductivity: 2
- Use Temperature: -58 to 392
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SC Series Thermal Films are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 0.8 to 5.0 W/m ·K. ◆ Optional fiberglass or polyimide film can be used as the reinforcement carrier. ◆ High mechanical... [See More]
- Chemical System: Silicone
- Use Temperature: -58 to 392
- Industry: Electronics
- Thermal Conductivity: 3.5
from Fujipoly® America Corp.
Silicone Gap Filler Pad for Absorption of Electromagnetic Wave. Features. Effective to absorb and damp a wide range of electromagnetic waves. Also effective as a high performance thermal interface material. Easily filling small gaps of IC chip surface with soft gel texture. Good workability to... [See More]
- Chemical System: Silicone
- Form / Shape: Pad; Gap Filler, Foam in Place Gasket
- Type: High Dielectric
- Gap Fill: 0.0197 to 0.0984
from Master Bond, Inc.
MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]
- Chemical System: Silicone
- Composition: Unfilled
- Type: High Dielectric; Optical
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from RS Components, Ltd.
Thermal Putty [See More]
- Chemical System: Silicone
- Thermal Conductivity: 2
- Use Temperature: -40 to 392
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SC Series Thermal Films are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 0.8 to 5.0 W/m ·K. ◆ Optional fiberglass or polyimide film can be used as the reinforcement carrier. ◆ High mechanical... [See More]
- Chemical System: Silicone
- Use Temperature: -58 to 392
- Industry: Electronics
- Thermal Conductivity: 0.9000
from Fujipoly® America Corp.
FEATURES: • Highly Conformable and High Heat Conducting Gel materials. • SARCON Thermal Gap Filler Pads are highly conformable and high heat conducting gel materials in a versatile sheet form. • Easily fit and adhere to most all shapes and sizes of components, including protrusions... [See More]
- Chemical System: Silicone
- Form / Shape: Gap Filler, Foam in Place Gasket
- Type: High Dielectric
- Gap Fill: 0.0118 to 0.0787
from Master Bond, Inc.
MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]
- Chemical System: Silicone
- Composition: Filled
- Type: High Dielectric
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from RS Components, Ltd.
Thermal Putty [See More]
- Chemical System: Silicone
- Use Temperature: -40 to 392
- Form / Shape: Cartridge
- Thermal Conductivity: 3
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's AF Series Silicone-free Thermal Pads (Non-silicone Thermal Pads) are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.0 to 8.0 W/m ·K. ◆ Available in various thicknesses from 0.5 to 5.0 mm. ◆... [See More]
- Chemical System: Silicone
- Industry: Electronics
- Form / Shape: Pad
- Use Temperature: -40 to 248
from Fujipoly® America Corp.
Highly Conformable and High Heat Conducting gel materials. SARCON ® Thermal Gap Filler Pads are highly conformable and high heat conducting gel materials in a versatile sheet form. They easily fit and adhere to most all shapes and sizes of components, including protrusions and recessed areas. [See More]
- Chemical System: Silicone
- Gap Fill: 0.0394 to 0.1181
- Form / Shape: Gel; Gap Filler, Foam in Place Gasket
- Industry: Electronics; Semiconductors, IC's
from Master Bond, Inc.
MasterSil 972TC-LO is capable of transferring heat with a thermal conductivity of 7-9 BTU •in/ft ² •hr • °F [1.01-1.30 W/(m •K)], while retaining superior dielectric properties. It bonds well to a wide variety of substrates, including metals, composites, glass, ceramics... [See More]
- Chemical System: Silicone
- Composition: Unfilled
- Type: High Dielectric
- Cure / Technology: Thermoset; Two Component
from RS Components, Ltd.
Thermal Putty [See More]
- Chemical System: Silicone
- Use Temperature: -40 to 392
- Form / Shape: Cartridge
- Thermal Conductivity: 5
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SE Series one-component Thermal Gel are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, available in options ranging from 2.0 to 10.0 W/m ·K. ◆ High softness and compressibility, providing low assembly stress, ideal for... [See More]
- Chemical System: Silicone
- Industry: Electronics
- Form / Shape: Gel
- Use Temperature: -58 to 302
from Fujipoly® America Corp.
Fujipoly ® recently released Sarcon ® GR130A, its newest high-performance, thermal gap filler pad. The highly conformable, gel-like sheets exhibit a thermal resistance as low as 0.02 °C •in2/W at 43.5 PSI with a thermal conductivity of 13 W/m °K. Sarcon ® GR130A is available... [See More]
- Chemical System: Silicone
- Gap Fill: 0.0118 to 0.0787
- Form / Shape: Pad; Gap Filler, Foam in Place Gasket
- Industry: Electronics; Semiconductors, IC's
from Master Bond, Inc.
Master Bond MasterSil 705TC is a one component, thermally conductive, electrically isolating silicone for bonding, sealing and coating applications. It features outstanding thermal conductivity and is well suited for applications that require flexibility and high temperature resistance. It cures... [See More]
- Chemical System: Silicone
- Composition: Unfilled
- Type: High Dielectric
- Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
from RS Components, Ltd.
Thermal Putty [See More]
- Chemical System: Silicone
- Thermal Conductivity: 7
- Use Temperature: -58 to 392
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SE Series one-component Thermal Gel are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, available in options ranging from 2.0 to 10.0 W/m ·K. ◆ High softness and compressibility, providing low assembly stress, ideal for... [See More]
- Chemical System: Silicone
- Industry: Electronics
- Form / Shape: Gel
- Use Temperature: -58 to 302
from Fujipoly® America Corp.
SARCON ® PG65A from Fujipoly ® is one of the industry ’s newest high-performance thermal interface materials that is extremely compressible. This double-sticky surface TIM is a great choice for applications that have delicate or wide-variation component heights and require extremely... [See More]
- Chemical System: Silicone
- Industry: Aerospace; Automotive; Electronics; OEM or Industrial
- Form / Shape: Pad; Putty; Gap Filler, Foam in Place Gasket
- Use Temperature: -40 to 302
from Master Bond, Inc.
Master Bond MasterSil 153AO is an addition cured two part silicone with a high tensile lap shear strength, thermal conductivity and electrical insulation. [See More]
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Type: High Dielectric
- Form / Shape: Liquid
from RS Components, Ltd.
860 60G Tub of Heat Trans Comp Silicone [See More]
- Chemical System: Silicone
- Use Temperature: -40 to 392
- Form / Shape: Grease, Paste
- Thermal Conductivity: 0.7000
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's AF Series Silicone-free Thermal Pads (Non-silicone Thermal Pads) are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.0 to 8.0 W/m ·K. ◆ Available in various thicknesses from 0.5 to 5.0 mm. ◆... [See More]
- Chemical System: Silicone
- Industry: Electronics
- Form / Shape: Pad
- Use Temperature: -40 to 248
from Fujipoly® America Corp.
The SARCON® LG Series is the perfect solution for filling large, complex and uneven gaps between heat generating components that depend on reliable contact with a heat spreader to maintain optimal performance. SARCON® LG23A and LG30A easily dispense in a liquid form that will cure at room... [See More]
- Chemical System: Silicone
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Type: High Dielectric
- Form / Shape: Gel; Gap Filler, Foam in Place Gasket
from Master Bond, Inc.
Featuring superb electrical insulation properties, MasterSil 156 is a two component, moderate viscosity silicone system for high performance potting, encapsulation and sealing. It combines high temperature resistance, flexibility, low shrinkage upon cure and thermal conductivity exceeding 8-9 BTU... [See More]
- Chemical System: Silicone
- Composition: Unfilled
- Type: High Dielectric
- Cure / Technology: Thermoset; Two Component
from RS Components, Ltd.
860 150G Tube Silicone Heat Trans Compd [See More]
- Chemical System: Silicone
- Use Temperature: -40 to 392
- Form / Shape: Grease, Paste
- Thermal Conductivity: 0.7000
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's AF Series Silicone-free Thermal Pads (Non-silicone Thermal Pads) are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.0 to 8.0 W/m ·K. ◆ Available in various thicknesses from 0.5 to 5.0 mm. ◆... [See More]
- Chemical System: Silicone
- Industry: Electronics
- Form / Shape: Pad
- Use Temperature: -40 to 257
from Master Bond, Inc.
MasterSil 323AO-LO is a two component silicone elastomer with a self-priming feature, designed for bonding, sealing and gap filling applications. This electrically insulating and thermally conductive compound meets NASA low outgassing specifications and can be used in the aerospace, electronic,... [See More]
- Chemical System: Silicone
- Composition: Unfilled
- Type: High Dielectric
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from RS Components, Ltd.
SILICON COMPOUND [See More]
- Chemical System: Silicone
- Use Temperature: -58 to 482
- Form / Shape: Grease, Paste
- Thermal Conductivity: 0.4100
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SC Series Thermal Films are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 0.8 to 5.0 W/m ·K. ◆ Optional fiberglass or polyimide film can be used as the reinforcement carrier. ◆ High mechanical... [See More]
- Chemical System: Silicone
- Industry: Electronics
from RS Components, Ltd.
SMT silicone heat sink compound,20ml [See More]
- Chemical System: Silicone
- Use Temperature: -40 to 392
- Form / Shape: Grease, Paste
- Thermal Conductivity: 2.9
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's AE Series one-component Silicone-free Thermal Gel are renowned for their distinctive characteristics, which include: ◆ Free from siloxane and the risk of silicone oil bleed. ◆ Good thermal conductivity, available in options ranging from 1.0 to 3.0 W/m ·K. ◆... [See More]
- Chemical System: Silicone
- Industry: Electronics
- Form / Shape: Gel
- Use Temperature: -58 to 248
from RS Components, Ltd.
Loctite TG 100 [See More]
- Chemical System: Silicone
- Use Temperature: -40 to 302
- Form / Shape: Grease, Paste
- Thermal Conductivity: 3.4
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's AF Series Silicone-free Thermal Pads (Non-silicone Thermal Pads) are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.0 to 8.0 W/m ·K. ◆ Available in various thicknesses from 0.5 to 5.0 mm. ◆... [See More]
- Chemical System: Silicone
- Industry: Electronics
- Form / Shape: Pad
- Use Temperature: -40 to 248
from RS Components, Ltd.
Heat sink grease,142gm tube [See More]
- Chemical System: Silicone
- Use Temperature: -40 to 392
- Form / Shape: Grease, Paste
- Thermal Conductivity: 0.6300
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's AF Series Silicone-free Thermal Pads (Non-silicone Thermal Pads) are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.0 to 8.0 W/m ·K. ◆ Available in various thicknesses from 0.5 to 5.0 mm. ◆... [See More]
- Chemical System: Silicone
- Industry: Electronics
- Form / Shape: Pad
- Use Temperature: -40 to 257
from RS Components, Ltd.
Silicone heat transfer compound,35ml [See More]
- Chemical System: Silicone
- Use Temperature: -58 to 392
- Form / Shape: Grease, Paste
- Thermal Conductivity: 0.9000
from Techsil Limited
TSE3281-G is a thermally conductive silicone adhesive from Momentive Performance Materials. This one component material is non-corrosive and has excellent adhesion properties to a wide variety of substrates. Potential applications for TSE3281-G include sealing and bonding for thermally conductive... [See More]
- Chemical System: Silicone; Elastomeric
- Industry: Electronics
from Protavic America, Inc.
PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component
- Composition: Unfilled
- Form / Shape: Liquid; Die Bonding Adhesives; Encapsulant or Conformal Coating
from OMEGA Engineering, Inc.
OMEGATHERM thermal conducting paste is a high temperature and high thermally conductive paste product. They are specially formulated for permanent and temporary bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics,... [See More]
- Chemical System: Silicone
- Cure / Technology: Single Component
- Type: High Dielectric
- Form / Shape: Grease, Paste
from Shiu Li Technology Co., Ltd
LiPOLY DTT44 is a soft thermally conductive gel pad specifically designed for networking applications. DTT44 is designed to focus on Dk and Df to reduce interference in RF modules. DTT44 has a thermal conductivity of 3.0 W/m*K. This product can be supplied as standard sheets, custom die-cuts or... [See More]
- Chemical System: Silicone
- Gap Fill: 0.0197 to 0.1969
- Form / Shape: Pad; Sheet Form, Die-cut Parts
- Industry: Electronics
from Henkel Corporation - Industrial
BERGQUIST GAP PAD TGP 1350, Highly Conformable, Thermally Conductive, Reworkable Gap Filling Material. BERGQUIST ® GAP PAD TGP 1350 is a highly compliant Gap Pad material that is ideal for fragile component leads. The material includes a PEN film, which facilitates rework and improves puncture... [See More]
- Chemical System: Silicone
- Form / Shape: Gap Filler, Foam in Place Gasket
from Henkel Adhesive Technologies - Aviation, Space and Rail
BERGQUIST ® GAP FILLER TGF 3500LVO is a silicone, two-component, high thermal conductivity, liquid gap filler. This product offers the mechanical property benefits of a silicone material with the additional feature of low outgassing. It can be used in industries ranging from automotive to... [See More]
- Chemical System: Silicone
- Form / Shape: Liquid; Gap Filler, Foam in Place Gasket
- Cure / Technology: Thermoset
- Industry: OEM or Industrial
from Tooling Technology
Designed to bond together structural materials such as Metapor, aluminum, ceramics and a wide variety of metals and substrates. Used to manufacture molds larger than stock sizes by joining plates of Metapor or aluminum together. Handles higher than normal temperature (250 °F) and... [See More]
- Chemical System: Silicone
from Wacker Chemical Corp.
WACKER ’s silicone adhesives and sealants are based on many years of experience, innovative research and comprehensive technological expertise. In a wide variety of industries, especially in lighting technology, flowable or non-sag silicone products offer decisive advantages in performance and... [See More]
- Chemical System: Silicone; Elastomeric
- Industry: Electronics
from Epoxies Etc...
50-1225 is a low viscosity, room temperature curing, RTV silicone potting and encapsulating compound. When cured, this material forms a soft, highly flexible, flame retardant, and thermally conductive package. [See More]
- Chemical System: Silicone; Elastomeric
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Composition: Unfilled
- Form / Shape: Liquid
from Bluestar Silicones USA Corp.
Metal Oxide Thickened Dimethyl Silicone Compound. Description. Bluesil V-740 is a metal oxide thickened dimethyl silicone compound. It is a white, heavy paste used for heat dissipation applications where high thermal conductivity is required. [See More]
- Chemical System: Silicone
- Form / Shape: Grease, Paste
- Cure / Technology: Two Component
- Industry: Electronics; Electric Power; Semiconductors, IC's
from Techsil Limited
Momentive SnapSIL TN3005 is a low volatile siloxane, silicone adhesive sealant that cures at room temperature. It offers primerless adhesion to many substrates and high elongation once cured. Ideal for use as an insulating adhesive seal and fixing for electrical and electronic parts. Can also be... [See More]
- Chemical System: Silicone; Elastomeric
- Industry: Electronics
from Protavic America, Inc.
PTS-46303 A/B ™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include... [See More]
- Chemical System: Silicone
- Composition: Filled
- Type: High Dielectric
- Cure / Technology: Thermoset; Two Component
from OMEGA Engineering, Inc.
OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper products. [See More]
- Chemical System: Silicone
- Cure / Technology: Single Component
- Type: High Dielectric
- Form / Shape: Grease, Paste
from Shiu Li Technology Co., Ltd
LiPOLY DTT65 is a soft thermally conductive gel pad specifically designed for networking applications. DTT65 is designed to focus on Dk and Df to reduce interference in RF modules. DTT65 has a thermal conductivity of 5.0 W/m*K. This product can be supplied as standard sheets, custom die-cuts or... [See More]
- Chemical System: Silicone
- Gap Fill: 0.0197 to 0.1969
- Form / Shape: Pad; Sheet Form, Die-cut Parts
- Industry: Electronics
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 12-2, Silicone, General Assembly LOCTITE ® ABLESTIK 12-2 adhesive is the lower viscosity version of ABLETHERM 12-1 adhesive. It is designed for bonding applications which require high thermal conductivity and reworkability. Thermally conductive. Reworkable. Unfilled [See More]
- Chemical System: Silicone
- Cure / Technology: Single Component
from Henkel Adhesive Technologies - Aviation, Space and Rail
BERGQUIST ® GAP PAD TGP 10000ULM is an extremely soft gap filling material rated at a thermal conductivity of 10.0 W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the... [See More]
- Chemical System: Silicone
- Industry: OEM or Industrial
- Form / Shape: Pad
- Use Temperature: -76 to 392
from Tooling Technology
Thermoforming is about heat-the primary objective is heating and cooling the plastic as fast as possible. Available in convenient 14.5 oz. tubes and applicator gun, Segen's special thermoforming compound is a silicon-based zinc oxide that dramatically increases thermal transfer rates when applied... [See More]
- Chemical System: Silicone
from Wacker Chemical Corp.
ELASTOSIL ® RT 675 A/B is a pourable, addition-curing RTV-2 silicone rubber. [See More]
- Chemical System: Silicone; Elastomeric
- Form / Shape: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Industry: Electronics
from Techsil Limited
Momentive SnapSIL TN3005 is a low volatile siloxane, silicone adhesive sealant that cures at room temperature. It offers primerless adhesion to many substrates and high elongation once cured. Ideal for use as an insulating adhesive seal and fixing for electrical and electronic parts. Can also be... [See More]
- Chemical System: Silicone; Elastomeric
- Industry: Electronics
from Shiu Li Technology Co., Ltd
LiPOLY BS75K is a soft thermally conductive gap filler. With a thermal conductivity of 3.0 W/m*K and a low thermal impedance, BS75K is suitable for a wide range of applications. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for a wide... [See More]
- Chemical System: Silicone
- Gap Fill: 0.0197 to 0.1969
- Form / Shape: Pad; Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
- Industry: Electronics
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 813J01 BIPAX, Silicone, Non-corrosive, Encapsulant LOCTITE ® ABLESTIK 813J01 BIPAX exhibits very low stress upon cure thus preventing component cracking and other stress-related problems. This adhesive can be cured at room temperature in thick or thin sections. It is... [See More]
- Chemical System: Silicone
- Viscosity: 40000
- Cure / Technology: Single Component
from Henkel Adhesive Technologies - Aviation, Space and Rail
BERGQUIST ® GAP PAD TGP 5000 is a silicone based, thermally conductive, fiberglass reinforced and S-class soft gap pad. Its highly conformable nature and S-class softness ensures that it conforms to demanding contours and maintains structural integrity. Fiberglass reinforcement provides... [See More]
- Chemical System: Silicone
- Industry: OEM or Industrial
- Form / Shape: Pad
- Use Temperature: -76 to 392
from Techsil Limited
Momentive SnapSIL TN3085 is a thermally conductive, low volatile siloxane, silicone adhesive that cures at room temperature to form an elastic, flame retardant silicone rubber. It offers primerless adhesion to many substrates. Designed for bonding applications in power supplies, securing PCB's to... [See More]
- Chemical System: Silicone; Elastomeric
- Industry: Electronics
from Shiu Li Technology Co., Ltd
LiPOLY BS87 is an ultra-soft thermally conductive gel pad with a thermal conductivity of 3.0 W/m*K. BS87 offers excellent compression under minimal force with high recovery characteristics. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for... [See More]
- Chemical System: Silicone
- Gap Fill: 0.0197 to 0.1969
- Form / Shape: Pad; Sheet Form, Die-cut Parts
- Industry: Electronics
from Henkel Corporation - Industrial
LOCTITE STYCAST 5952-1, Silicone, Potting or Encapsulant. LOCTITE ® STYCAST 5952-1 is designed for encapsulation of heat generating devices. It is also recommended for applications requiring a non-corrosive casting and coating. Electrically non-conductive. Good elongation strength. Moderate tear... [See More]
- Chemical System: Silicone
- Cure / Technology: Two Component
- Type: High Dielectric
- Thermal Conductivity: 0.8000
from Henkel Adhesive Technologies - Aviation, Space and Rail
BERGQUIST GAP PAD TGP 7000ULM is an extremely soft gap filling material rated at a thermal conductivity of 7.0 W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique... [See More]
- Chemical System: Silicone
- Industry: OEM or Industrial
- Form / Shape: Pad; Gap Filler, Foam in Place Gasket
- Use Temperature: -76 to 392
from Techsil Limited
Momentive SnapSIL TN3305 is a low volatile siloxane, silicone adhesive sealant that cures at room temperature. It offers primerless adhesion to many substrates and high elongation once cured. Ideal for use as an insulating adhesive seal and fixing for electrical and electronic parts. Can also be... [See More]
- Chemical System: Silicone; Elastomeric
- Industry: Electronics
from Shiu Li Technology Co., Ltd
LiPOLY ’s S282 is a thermally conductive pad designed for gap filling. The thermal conductivity is 1.7 W/m*K. It uses fiberglass cloth as the reinforcement material with great self-adhesive that can fit closely with non-flat heat sinks to increase the contact area. The low stress damped... [See More]
- Chemical System: Silicone
- Gap Fill: 0.0197 to 0.1969
- Form / Shape: Pad; Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
- Industry: Electronics
from Henkel Adhesive Technologies - Aviation, Space and Rail
BERGQUIST ® LIQUI FORM TLF 6000HG thermally conductive gel interface material is designed to meet the demanding requirements in certain telecom market applications. Its unique formulation assures a balanced mix of high thermal conductivity, good dispensing efficiency and high thermal... [See More]
- Chemical System: Silicone
- Industry: OEM or Industrial
- Form / Shape: Gel; Paste
from Techsil Limited
Momentive SnapSIL TN3305 is a low volatile siloxane, silicone adhesive sealant that cures at room temperature. It offers primerless adhesion to many substrates and high elongation once cured. Ideal for use as an insulating adhesive seal and fixing for electrical and electronic parts. Can also be... [See More]
- Chemical System: Silicone; Elastomeric
- Industry: Electronics
from Shiu Li Technology Co., Ltd
LiPOLY S393 is a product with high ductile thermal conductivity. Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material. It won't easy to break and deformwhether stamped, punched, strip type, or custom cutting. Your best choice... [See More]
- Chemical System: Silicone
- Form / Shape: Pad; Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
- Type: High Dielectric
- Gap Fill: 0.0197 to 0.3937
from Techsil Limited
Momentive SnapSIL TN3075 is a low volatile siloxane, silicone adhesive sealant that cures at room temperature. It offers primerless adhesion to many substrates. Ideal for use as an insulating adhesive seal and fixing for electrical and electronic parts. Can also be used as a waterproof sealant for... [See More]
- Chemical System: Silicone; Elastomeric
- Industry: Electronics
from Shiu Li Technology Co., Ltd
LiPOLY S818 is a product with high ductile thermal conductivity.Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material.It won't easy to break and deform whether stamped, punched, strip type, or custom cutting. Your best choice... [See More]
- Chemical System: Silicone
- Form / Shape: Pad; Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
- Type: High Dielectric
- Gap Fill: 0.0197 to 0.3937
from Techsil Limited
Momentive SnapSIL TN3075 is a low volatile siloxane, silicone adhesive sealant that cures at room temperature. It offers primerless adhesion to many substrates. Ideal for use as an insulating adhesive seal and fixing for electrical and electronic parts. Can also be used as a waterproof sealant for... [See More]
- Chemical System: Silicone; Elastomeric
- Industry: Electronics
from Shiu Li Technology Co., Ltd
LiPOLY DCTP140-s is a thermal insulator uses fiberglass cloth as a reinforcement material, combined with thermal conductive silicon, giving it high thermal conduction and great compression strength. The thermal conductivity is 4.5 W/m*K, the thickness is 0.25~0.45mm. Its high insulation and... [See More]
- Chemical System: Silicone
- Form / Shape: Pad; Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
- Type: High Dielectric
- Gap Fill: 0.0098 to 0.0177
from Techsil Limited
Momentive TIA241GF is a 2 part, thermally conductive silicone that is dispensed as a liquid and cured in place to create a heat path for efficient heat transfer. After being applied, the non-slumping paste consistency of TIA214GF provides physical stability to prevent run-off after dispense. [See More]
- Chemical System: Silicone
- Industry: Electronics
- Form / Shape: Grease, Paste; Gap Filler, Foam in Place Gasket
- Features: Flame Retardant
from Shiu Li Technology Co., Ltd
LiPOLY PR27 is a very thin high insulator with a thickness of 0.15mm. It uses Polyimide Film as the reinforcement material, which can increase the tensile strength. It has great dielectric strength and can withstand 12K voltages. It ’s suitable for high power transistors, electrical equipment,... [See More]
- Chemical System: Silicone
- Gap Fill: 0.0059
- Form / Shape: Pad; Sheet Form, Die-cut Parts
- Industry: Electronics
from Techsil Limited
Momentive TIA350R is a one-component, heat curable silicone adhesive designed for thermally conductive applications. This grade cures quickly upon exposure to heat and adheres well to a wide variety of substrates. Recommended for use as a thermal interface material between dies and heat spreaders,... [See More]
- Chemical System: Silicone; Elastomeric
- Use Temperature: -40 to 200
- Industry: Electronics
from Shiu Li Technology Co., Ltd
LiPOLY ’s thermal insulator SH1500/2000/3000 uses fiberglass cloth as a reinforcement material, combined with thermal conductive silicon, giving it high thermal conduction and great compression strength. The thermal conductivity is 1.5/2.0/3.0 W/m*K, the thickness is 0.23~0.35mm. Its high... [See More]
- Chemical System: Silicone
- Gap Fill: 0.0091 to 0.0138
- Form / Shape: Pad; Sheet Form, Die-cut Parts
- Industry: Electronics
from Techsil Limited
Momentive TSE322 is a heat curable silicone adhesive sealant which will bond to many substrates without the need for a primer and cures rapidly at elevated temperatures. Product Benefits. Easy to use, one-component material. Fast cure at elevated temperature. Offers self-adhesion properties. [See More]
- Chemical System: Silicone; Elastomeric
- Industry: Electronics
- Type: High Dielectric
from Shiu Li Technology Co., Ltd
LiPOLY T-top81 is an ultra-soft, highly conformable, non-flammable interface material. T-top81 is a high deflection material, designed to allow minimal stress on components while offering excellent thermal conductivity and low thermal resistance. With a thermal conductivity of 8.0 W/m*K, T-top81... [See More]
- Chemical System: Silicone
- Gap Fill: 0.0197 to 0.1969
- Form / Shape: Sheet Form, Die-cut Parts
- Industry: Electronics
from Techsil Limited
TSE3331 is a two part, heat curing silicone from Momentive Performance Materials designed for potting and encapsulation where flammability and/or thermal conductivity is of concern. It provides excellent flame retardant properties and very stable dielectric properties over a broad range of operating... [See More]
- Chemical System: Silicone; Elastomeric
- Use Temperature: -55 to 200
- Industry: Electronics
from Shiu Li Technology Co., Ltd
Our high thermally conductive gap filler T-work 7000 provides excellent compression and extremely low thermal resistance in form shape with high thermal conductivity for gap filling between electrical component and heatsink. [See More]
- Chemical System: Silicone
- Gap Fill: 0.0197 to 0.1969
- Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
- Industry: Electronics
from Techsil Limited
Techsil ® TIM11021G is a silicone compound that provides high thermal conductivity. It exhibits virtually no oil separation and minimal weight loss at elevated temperatures, which contributes to stability of TIM interface under broad operational temperature ranges. Techsil ® TIM- 11021G is... [See More]
- Chemical System: Silicone; Elastomeric
from Shiu Li Technology Co., Ltd
LiPOLY T-work 8000 is a high performance thermally conductive interface pad. T-work 8000 offers outstanding thermal conductivity at 15.0 W/m*K and extremely low thermal resistance under minimal force. T-work 8000 offers excellent compression, filling small air gaps and uneven surfaces, ensuring an... [See More]
- Chemical System: Silicone
- Gap Fill: 0.0197 to 0.1969
- Form / Shape: Sheet Form, Die-cut Parts
- Industry: Electronics