EMI / RFI Shielding Material Thermal Compounds and Thermal Interface Materials

Copper-filled, Electrically And Thermally Conductive Epoxy -- EPO-TEK® 430
from Epoxy Technology

EPO-TEK ® 430 is a copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for inter-connecting, grounding and EMI RF shielding. Fast curing at relatively low temperatures may be realized. [See More]

  • Features: Electrically Conductive; EMI/RFI Shielding
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Flexible, Electrically Conductive Two Component Epoxy -- EP79FL
from Master Bond, Inc.

EP79FL is a silver coated nickel filled polymer system that forms high strength bonds that are resistant to extreme cryogenic temperatures. It is electrically conductive and has a volume resistivity of <0.005 ohm-cm. As a silver coated nickel filled system, it is much more cost effective than... [See More]

  • Features: Anti-static, ESD; Electrically Conductive; EMI/RFI Shielding; Non-corrosive; Flexible; Dissimilar Substrates
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing