Yttria Specialty Ceramics

7 Results
Ceramic Components for Plasma Etch Equipment
from CoorsTek

CoorsTek advanced, high-purity ceramic components are built to withstand the extreme environments in plasma etch (or "dry" etch) chambers — including vapor phase chemical etchants, high voltage RF (radio frequency) and microwave plasma, volatile byproducts, and aggressive cleaning cycles. ETCH... [See More]

  • Specialty Ceramic Type: Silicon Carbide; Yttria; Aluminum Nitride
  • Shape / Form: Custom Shape
  • Composition or ASTM/EN Cement Type : Aluminas (Al2O3): PlasmaPure™, Sapphal™ Aluminum Nitride; PureSiC® Silicon Carbide
  • Applications: Chemical or material processing
Yttria Partially Stabilized Zirconia (YTZP) Ceramic Component
from San Jose Delta Associates, Inc.

While the same design features common to alumina ceramics; blind holes, threads etc. are easily produced in Zirconia the grinding time required is about fifty percent more. The post-grinding surface finish is significantly better than a comparable feature in most aluminas. Zirconia is much more... [See More]

  • Specialty Ceramic Type: Yttria; Zirconia
  • Max Use Temperature: 1500
  • Shape / Form: Custom Shape
  • Thermal Conductivity: 2.2
Y2O3 99.99% Ø9.5x5mm 500g - 0481569
from Umicore Metal Deposition Solutions

Coating material. Yttrium oxide. Purity. 99.99%. Form. Tablet. Dimensions. Ø 9.5 x 5 mm. Quantity. 500 g. Theoretical density at 20 °C in g/cm ³. 5.0. Melting point in °C. 2410. 10 ⁻ ² mbar in °C. ~ 2300. 10 ⁻ ¹ mbar in °C. ~ 2700. Boiling point in... [See More]

  • Specialty Ceramic Type: Yttria
  • Width / OD: 0.3740
  • Length: 0.1969
  • Density: 5
Yttria
from Kyocera Corporation

Its excellent plasma resistance is ideal for applications in semiconductor processing equipment, where particle contamination must be avoided. It contributes to productivity improvement due by reducing equipment maintenance requirements. [See More]

  • Specialty Ceramic Type: Yttria
  • Thermal Conductivity: 14
  • Shape / Form: Custom Shape
  • CTE: 7.2 to 7.6
Zirconia Based Material -- Z900
from Morgan Advanced Materials

A zirconia-based material, partially stabilised with yttria. Contains 94.0% ZrO2 and HfO2 in combination, plus 5.4% Y2O3 and 0.25% Al2O3. This ceramic possesses enhanced mechanical properties. [See More]

  • Specialty Ceramic Type: Yttria; Zirconia
  • MOR / Flexural Strength: 130533
  • Thermal Conductivity: 2.9
  • Modulus of Elasticity: 2.90E7
Ceramic Etch Windows for Plasma Etch Equipment
from CoorsTek

Windows are chamber lids designed to transmit RF (radio frequency) and microwave energy into the plasma etch chamber while resisting erosion from the harsh plasma etch environment. An effective window has a low loss tangent (high transmittance) across RF and microwave frequencies. Otherwise, energy... [See More]

  • Specialty Ceramic Type: Silicon Carbide; Yttria; Aluminum Nitride
  • Shape / Form: Custom Shape
  • Composition or ASTM/EN Cement Type : Aluminas (Al2O3): PlasmaPure™, Sapphal™ Aluminum Nitride; PureSiC® Silicon Carbide
  • Applications: Chemical or material processing
Ceramic Focus Rings for Plasma Etch Equipment
from CoorsTek

Focus/edge rings are designed to improve etch uniformity around the wafer edge or perimeter. When used with an electrostatic chuck (e-chuck), the wafer rests on the edge focus ring - held in place by the electrostatic charge. ADVANCED CERAMIC COMPONENTS. CoorsTek advanced, high-purity ceramic... [See More]

  • Specialty Ceramic Type: Silicon Carbide; Yttria; Aluminum Nitride
  • Shape / Form: Custom Shape
  • Composition or ASTM/EN Cement Type : Aluminas (Al2O3): PlasmaPure™, Sapphal™ Aluminum Nitride; PureSiC® Silicon Carbide
  • Applications: Chemical or material processing