Polyurethane (PU, PUR) Conductive Compounds

Flexible, Two Component Silver Conductive Epoxy -- EP21TDCSFL
from Master Bond, Inc.

Master Bond Polymer System EP21TDCSFL is a two component, silver filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. Its most salient features are its high flexibility and elongation. This... [See More]

  • Chemical System: Polyurethane; Epoxy
  • Composition: Filled
  • Type: Electrically Conductive; Thermally Conductive
  • Cure / Technology: Thermoset; Two Component  
Highly Flexible Two Part Epoxy -- EP21TDC-7
from Master Bond, Inc.

Master Bond Polymer System EP21TDC-7 is a two component highly flexible epoxy resin system for high performance bonding, sealing, and coating. It is formulated to cure at ambient temperatures or more quickly at elevated temperatures with an easy to use one to seven mix ratio by weight. The cured... [See More]

  • Chemical System: Polyurethane; Epoxy
  • Composition: Filled
  • Type: Electrically Conductive
  • Cure / Technology: Thermoset; Two Component  
Medical Grade, Silver Conductive Epoxy Compound -- EP21TDCSMed
from Master Bond, Inc.

Master Bond Polymer System EP21TDCSMed is a two component, silver filled, electrically conductive adhesive/sealant that meets USP Class VI specifications for medical applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part... [See More]

  • Chemical System: Polyurethane; Epoxy
  • Composition: Filled
  • Type: Electrically Conductive; Thermally Conductive
  • Cure / Technology: Thermoset; Two Component  
Non-Drip, Polysulfide Based Two Component Adhesive -- EP21TPND-NV
from Master Bond, Inc.

Master Bond Polymer Adhesive EP21TPND is a two component polysulfide/epoxy based adhesive/ sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100 mix ratio (A/B) by weight. It readily develops a high bonding strength of more than 1000 psi at room... [See More]

  • Chemical System: Polyphenylene Sulfide; Polyurethane; Epoxy
  • Composition: Filled
  • Type: Electrically Conductive; Thermally Conductive
  • Cure / Technology: Thermoset; Two Component  
Room Temperature Curing, Toughened Two Part Epoxy -- EP21TDCHT
from Master Bond, Inc.

Master Bond Polymer Adhesive EP21TDCHT is a two component epoxy adhesive formulated to cure at room temperature or more rapidly at elevated temperatures, with a very forgiving and convenient one to one mix ratio. Upon curing the EP21TDCHT offers high shear and peel strength which allows it to be... [See More]

  • Chemical System: Polyurethane; Epoxy
  • Composition: Filled
  • Type: Electrically Conductive
  • Cure / Technology: Thermoset; Two Component  
Silver Filled, Electrically Conductive Epoxy -- EP21TDCS
from Master Bond, Inc.

Master Bond Polymer System EP21TDCS is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part silver conductive epoxy systems, the... [See More]

  • Chemical System: Polyurethane; Epoxy
  • Composition: Filled
  • Type: Electrically Conductive; Thermally Conductive
  • Cure / Technology: Thermoset; Two Component  
Toughened, Shock Resistant, Two Component Epoxy -- EP21TDC
from Master Bond, Inc.

Master Bond Polymer Adhesive EP21TDC is a two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one mix ratio, weight or volume. It readily develops a high bonding strength of more than 2800 psi at room... [See More]

  • Chemical System: Polyurethane; Epoxy
  • Composition: Filled
  • Type: Electrically Conductive
  • Cure / Technology: Thermoset; Two Component  
Two Component Epoxy with Outstanding Flexibility -- EP21TDC-2
from Master Bond, Inc.

Master Bond Polymer System EP21TDC-2 is a two component highly flexible epoxy resin compound for high performance bonding sealing, coating and encapsulation. It is formulated to cure fully at ambient temperature or more quickly at elevated temperature with a convenient, non-critical one to three mix... [See More]

  • Chemical System: Polyurethane; Epoxy
  • Composition: Filled
  • Type: Electrically Conductive
  • Cure / Technology: Thermoset; Two Component  
Two Component Highly Flexibilized Epoxy -- EP21TDC-2AO
from Master Bond, Inc.

Master Bond Polymer System EP21TDC-2AO is a two component highly flexible epoxy resin compound for high performance bonding sealing, coating, and encapsulation. It is formulated to cure fully at ambient temperature or more quickly at elevated temperature with a convenient one to three mix ratio by... [See More]

  • Chemical System: Polyurethane; Epoxy
  • Composition: Filled
  • Type: Electrically Conductive; Thermally Conductive
  • Cure / Technology: Thermoset; Two Component  
Encapsulants -- LOCTITE STYCAST US 0155
from Henkel Corporation - Industrial

LOCTITE STYCAST US 0155, Urethane, Potting and Encapsulating. LOCTITE ® STYCAST US 0155 is a low viscosity, flexible, flame retardant, castor oil/MDI based urethane potting/encapsulating compound. This material was designed for potting indoor and outdoor telephone connector blocks. It is... [See More]

  • Chemical System: Polyurethane
  • Cure / Technology: Two Component  
  • Type: Thermally Conductive
  • Form / Shape: Liquid
55 Shore D polyurethane adhesive -- 10-2055
from Epoxies Etc...

The 10-2055 and 10-2055 HV were developed to produce a general purpose, semi flexible polyurethane adhesive for bonding a wide variety of plastic and metal substrates. The flexibility of these adhesives allows bonding to substrates with high coefficients of thermal expansion (CTE) and substrates... [See More]

  • Chemical System: Polyurethane
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Type: Thermally Conductive
  • Form / Shape: Die Bonding Adhesives; Grease, Paste
UV Potting Material -- ANA-97174
from Protavic America, Inc.

ANA-97174 UV is a clear Ultraviolet/ Visible light curing adhesive. It is a low viscosity urethane modified acrylic casting system. It was developed for adhesive and coating applications. It is recommended for small electrical/electronic casting and encapsulating applications that require a unique... [See More]

  • Chemical System: Polyurethane
  • Composition: Unfilled
  • Type: Electrically Conductive
  • Cure / Technology: Thermoset; Two Component  ; UV or Radiation Cured
Flame Retardant Polyurethane -- 50-2369 FR
from Epoxies Etc...

The 50-2369FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-2369 FR Urethane is listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low exotherm, and excellent electrical... [See More]

  • Chemical System: Polyurethane
  • Composition: Filled
  • Type: Thermally Conductive
  • Cure / Technology: Thermoset; Two Component  
Thermally Conductive PU Potting Compound -- 20-2366FR
from Epoxies Etc...

20-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 20-2366 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical... [See More]

  • Chemical System: Polyurethane; Elastomeric
  • Composition: Unfilled
  • Type: Thermally Conductive
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Thermally Conductive PU Potting Compound -- 50-2366 FR
from Epoxies Etc...

50-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 50-2366 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical... [See More]

  • Chemical System: Polyurethane; Elastomeric
  • Composition: Filled
  • Type: Thermally Conductive
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing