Epoxy (EP) Conductive Compounds
from Epoxy Technology
EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
- Type: Thermally Conductive
- Form / Shape: Grease, Paste
from Techsil Limited
Elecolit ® 6603 is a thermally conductive epoxy with very good metal adhesion and slight flexibility. This grade has very good flow behavior and can easily be processed using a dispenser, spreading knife or spatula. Although designed for bonding applications, 6603 can also be used as a potting... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset
- Type: Electrically Conductive; Thermally Conductive
- Industry: Electronics
from Digi-Key Electronics
ECCOBOND 56C-CAT 9 KIT, 140.5GM [See More]
- Chemical System: Epoxy
- Use Temperature: -76 to 248
- Type: Thermally Conductive
- Thermal Conductivity: 3
from Ellsworth Adhesives
3M TC-2707 Thermally Conductive Epoxy Adhesive Gray is a two component epoxy that uses aluminum metal filler. It offers high adhesive strength, good gap filling, low viscosity for potting applications, and good surface wet out. 50 mL Duo-Pak Cartridge. [See More]
- Chemical System: Epoxy
- Cure / Technology: Two Component
- Type: Thermally Conductive
- Thermal Conductivity: 0.7200
from ELANTAS PDG, Inc.
Mineral-filled VPI resin - semi-flexible for transformers with improved heat dissipation [See More]
- Chemical System: Epoxy
- Composition: Filled
- Type: Thermally Conductive
- Cure / Technology: Thermoset; Single Component
from Master Bond, Inc.
Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]
- Chemical System: Epoxy
- Composition: Filled
- Type: Electrically Conductive
- Cure / Technology: Thermoset; Two Component
from Techsil Limited
MG Chemicals 8331 is a Silver Conductive Epoxy with a moderate cure time and high conductivity. This is an economical electronic epoxy with good electrical and thermal conductivities. The adhesive bonds very well to a variety of surfaces, it resists thermal and mechanical shocks and provides the low... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset
- Type: Electrically Conductive; Thermally Conductive
- Industry: Electronics
from Digi-Key Electronics
STYCAST 2850FT BLK18# 8.16KG [See More]
- Chemical System: Epoxy
- Use Temperature: -85 to ?
- Type: Thermally Conductive
from Master Bond, Inc.
EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]
- Chemical System: Epoxy
- Composition: Unfilled
- Type: Thermally Conductive
- Cure / Technology: Thermoset; Single Component
from Techsil Limited
MG Chemicals 8329TCM is a medium cure thermally conductive epoxy adhesive which has a convenient 1:1 mix ratio and a 45 minute work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to mechanical shocks and... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset
- Type: Thermally Conductive
- Industry: Electronics
from Digi-Key Electronics
STYCAST 2850FT BLU18# [See More]
- Chemical System: Epoxy
- Use Temperature: -85 to ?
- Type: Thermally Conductive
from Master Bond, Inc.
EP3HTND-2Med Black is a one part system that combines easy processing with excellent bonding properties. It cures in 20-30 minutes at 250°F or 5-10 minutes at 300°F and adheres well to a wide variety of substrates including glass, metals, ceramics and most plastics. This paste compound meets USP... [See More]
- Chemical System: Epoxy
- Composition: Unfilled
- Type: Thermally Conductive
- Cure / Technology: Thermoset; Single Component
from Techsil Limited
MG Chemicals 8331 is a Silver Conductive Epoxy with a moderate cure time and high conductivity. This is an economical electronic epoxy with good electrical and thermal conductivities. The adhesive bonds very well to a variety of surfaces, it resists thermal and mechanical shocks and provides the low... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset
- Type: Electrically Conductive; Thermally Conductive
- Industry: Electronics
from Digi-Key Electronics
STYCAST 2850FT BLK 3# 1.36KG [See More]
- Chemical System: Epoxy
- Use Temperature: -85 to ?
- Type: Thermally Conductive
from Master Bond, Inc.
Master Bond EP126 withstands very high temperatures, up to +600 °F, and has a glass transistion temperature of +240 °C. This two component product features unique handling properties as Part A is a moderate viscosity liquid and Part B is a powder. It can be easily mixed using a forgiving 100... [See More]
- Chemical System: Epoxy
- Composition: Unfilled
- Type: Thermally Conductive
- Cure / Technology: Thermoset; Two Component
from Techsil Limited
MG Chemicals 8330 Silver Conductive Epoxy is a higher conductivity version of the 8331 Silver Conductive Epoxy. It is an electronic grade epoxy which combines a moderate curing rate and a high conductivity. It bonds very well to most substrates used in electronic assemblies; resists thermal and... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset
- Type: Electrically Conductive; Thermally Conductive
- Industry: Electronics
from Digi-Key Electronics
STYCAST 2850FT BLU 3# INDIVIDUAL [See More]
- Chemical System: Epoxy
- Use Temperature: -85 to ?
- Type: Thermally Conductive
from Master Bond, Inc.
EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]
- Chemical System: Epoxy
- Composition: Unfilled
- Type: Thermally Conductive
- Cure / Technology: Thermoset; Single Component
from Techsil Limited
MG Chemicals 8330S is a Silver Conductive Epoxy with a slow cure time and extreme conductivity. This electronic grade epoxy combines a long working time and high conductivity. The cured conductive adhesive bonds very well to most substrates used in electronic assemblies, resists thermal and... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset
- Type: Electrically Conductive; Thermally Conductive
- Industry: Electronics
from Digi-Key Electronics
STYCAST 2850FT BK, 5 GAL PA [See More]
- Chemical System: Epoxy
- Use Temperature: -85 to ?
- Type: Thermally Conductive
from Master Bond, Inc.
Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]
- Chemical System: Polyphenylene Sulfide; Epoxy
- Composition: Filled
- Type: Electrically Conductive; Thermally Conductive
- Cure / Technology: Thermoset; Single Component
from Techsil Limited
MG Chemicals 8330S is a Silver Conductive Epoxy with a slow cure time and extreme conductivity. This electronic grade epoxy combines a long working time and high conductivity. The cured conductive adhesive bonds very well to most substrates used in electronic assemblies, resists thermal and... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset
- Type: Electrically Conductive; Thermally Conductive
- Industry: Electronics
from Digi-Key Electronics
STYCAST 2850FT BK 5GAL, 5 GAL PA [See More]
- Chemical System: Epoxy
- Use Temperature: -85 to ?
- Type: Thermally Conductive
from Master Bond, Inc.
EP35SP is a two component epoxy system specially formulated to resist high temperatures and aggressive chemicals. It has a paste viscosity with little to no flow when curing. [See More]
- Chemical System: Epoxy
- Composition: Unfilled
- Type: Thermally Conductive
- Cure / Technology: Thermoset; Two Component
from Techsil Limited
MG Chemicals 8329TCS is a slow cure electrically insulating epoxy adhesive. Combines a long working 1:1 mix ratio and a 4 hour work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to mechanical shocks and... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset
- Type: Thermally Conductive
- Industry: Electronics
from Digi-Key Electronics
TWO-PART EPOXY THERMAL SEALING, [See More]
- Chemical System: Epoxy
- Use Temperature: -76 to 302
- Type: Thermally Conductive
- Thermal Conductivity: 2.5
from Master Bond, Inc.
EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]
- Chemical System: Epoxy
- Composition: Unfilled
- Type: Thermally Conductive
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Techsil Limited
MG Chemicals 8329TCM is a medium cure thermally conductive epoxy adhesive which has a convenient 1:1 mix ratio and a 45 minute work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to mechanical shocks and... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset
- Type: Electrically Conductive; Thermally Conductive
- Industry: Electronics
from Digi-Key Electronics
NON-SAG 5 MINUTE BONDATHERM EPOX [See More]
- Chemical System: Epoxy
- Use Temperature: -58 to 266
- Type: Thermally Conductive
from Master Bond, Inc.
EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]
- Chemical System: Epoxy
- Composition: Unfilled
- Type: Thermally Conductive
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Techsil Limited
Elecolit ® 323 is a silver filled two part epoxy adhesive specially developed for bonding open chip components. This semiconducting grade has passed the autoclave test (1000h) and is suitable for use on semi conductors, it has no effect on bond wire adhesion. It can cured at either room... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset
- Type: Electrically Conductive
- Industry: Electronics
from Digi-Key Electronics
TOUGHENED, FLEXIBLE ADHESIVE SYS [See More]
- Chemical System: Epoxy
- Type: Thermally Conductive
from Master Bond, Inc.
Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature. The... [See More]
- Chemical System: Epoxy
- Composition: Unfilled
- Type: Electrically Conductive
- Cure / Technology: Thermoset; Two Component
from Techsil Limited
Elecolit ® 3653 is a 1 component silver filled, solvent-free conductive epoxy adhesive used in applications which are subject to vibrations or quick temperature fluctuations. This unique product can be cured thermally in a very short period of time and cures to a 60 - 75 Shore D material. Silver... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset
- Type: Electrically Conductive
- Industry: Electronics
from Digi-Key Electronics
FAST CURING THERMALLY CONDUCTIVE [See More]
- Chemical System: Epoxy
- Use Temperature: -40 to 248
- Type: Thermally Conductive
- Thermal Conductivity: 1.04
from Master Bond, Inc.
Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel strength exceeding 40 pli. The service... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
- Type: Electrically Conductive
- Form / Shape: Optional Premixed and Frozen; Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Grease, Paste
from Techsil Limited
Elecolit ® 414 is a single component silver-filled, electrically conductive coating substance that hardens into a flexible, chemical resistant, expandable, non-deformable and friction resistant film. Grey in colour, Elecolit ® 414 has a viscosity of 20,000 to 25,000 mPas and when used with... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset
- Type: Electrically Conductive
- Industry: Electronics
from Digi-Key Electronics
TWO DUAL CATRIDGES (BT-101-50M), [See More]
- Chemical System: Epoxy
- Use Temperature: -58 to 266
- Type: Thermally Conductive
from Master Bond, Inc.
Master Bond Polymer Adhesive EP33 is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond Polymer Adhesive EP33 produces high strength bonds whose... [See More]
- Chemical System: Epoxy
- Composition: Unfilled
- Type: Electrically Conductive
- Cure / Technology: Thermoset; Two Component
from Techsil Limited
Techsil ® EP25485 is a low viscosity, thermally conductive flame retardant potting and encapsulating compound. The mixed system has a long usable life and may be hot or cold cured. The system exhibits a good surface finish, high electrical strength, high thermal conductivity and low cure... [See More]
- Chemical System: Epoxy
- Cure / Technology: Two Component
- Type: Thermally Conductive
- Form / Shape: Liquid
from Digi-Key Electronics
TWO DUAL CATRIDGES (BT-102-50M), [See More]
- Chemical System: Epoxy
- Type: Thermally Conductive
from Master Bond, Inc.
Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will form bond strengths in excess of 2,500 psi (aluminum to aluminum). It bonds well to a variety of substrates... [See More]
- Chemical System: Epoxy
- Composition: Unfilled
- Type: Electrically Conductive
- Cure / Technology: Thermoset; Two Component
from Digi-Key Electronics
TWO DUAL CATRIDGES (BT-301-50M), [See More]
- Chemical System: Epoxy
- Use Temperature: -40 to 248
- Type: Thermally Conductive
- Thermal Conductivity: 1.04
from Master Bond, Inc.
Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]
- Chemical System: Epoxy
- Composition: Unfilled
- Type: Electrically Conductive
- Cure / Technology: Thermoset; Two Component
from Digi-Key Electronics
5 MINUTE CLEAR BONDATHERM EPOXY [See More]
- Chemical System: Epoxy
- Use Temperature: -58 to 266
- Type: Thermally Conductive
from Master Bond, Inc.
Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]
- Chemical System: Epoxy
- Composition: Unfilled
- Type: Thermally Conductive
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Digi-Key Electronics
FAST CURING THERMALLY CONDUCTIVE [See More]
- Chemical System: Epoxy
- Use Temperature: -40 to 248
- Type: Thermally Conductive
- Thermal Conductivity: 1.04
from Master Bond, Inc.
Master Bond Polymer System EP112AO is a solventless, moderate viscosity two component epoxy resin system which is specifically designed for high performance outdoor and indoor electrical and electronic applications where good thermal conductivity and electrial isolation is required. The two... [See More]
- Chemical System: Epoxy
- Composition: Filled
- Type: Thermally Conductive
- Cure / Technology: Thermoset; Two Component
from Digi-Key Electronics
TWO DUAL CARTRIDGES (BT-301-200M [See More]
- Chemical System: Epoxy
- Use Temperature: -40 to 248
- Type: Thermally Conductive
- Thermal Conductivity: 1.04
from Master Bond, Inc.
Master Bond EP30NS is a nanosilica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]
- Chemical System: Epoxy
- Composition: Filled
- Type: Thermally Conductive
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Digi-Key Electronics
SILVER FILLED BONDATHERM 2 GRAM [See More]
- Chemical System: Epoxy
- Type: Thermally Conductive
from Master Bond, Inc.
EP42-2LV Black is a two component, room temperature curing epoxy compound featuring low viscosity and superior chemical resistance. It meets NASA low outgassing specifications, is black in color and optically opaque. [See More]
- Chemical System: Epoxy
- Composition: Unfilled
- Type: Thermally Conductive
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Digi-Key Electronics
ALUMINUM FILLED BONDATHERM EPOXY [See More]
- Chemical System: Epoxy
- Type: Thermally Conductive
from Master Bond, Inc.
Offering impressive physical strength characteristics, EP41S-F is an electrically insulative two component epoxy that cures rapidly at ambient and elevated temperatures. Typically faster curing epoxies are somewhat less chemically resistant than other types of systems, but EP41S-F is one of the few... [See More]
- Chemical System: Epoxy
- Composition: Unfilled
- Type: Thermally Conductive
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from ACCRAbond, Inc.
INSTAbond ® 809FR. INSTAbond ® 809 FR exhibits good thermal conductivity, excellent flow properties, and low exotherm characteristics in large masses. INSTAbond ® 809 FR meets the requirements for UL-94 V-0 rating for flame retardancy. [See More]
- Chemical System: Epoxy
- Cure / Technology: Two Component
- Type: Thermally Conductive
- Features: Flame Retardant; UL Rating
from Protavic America, Inc.
Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for production needs. One... [See More]
- Chemical System: Epoxy
- Composition: Filled
- Type: Electrically Conductive; Thermally Conductive
- Cure / Technology: Thermoset; Single Component
from Epoxies Etc...
70-3800 is a low viscosity, aluminum filled, epoxy tooling resin. This system is used for making heat resistant cast tools or parts that require very good thermal conductivity. 70-3800 is easily machined, drilled, tapped, or polished, and is ideal for vacuum form molds, dies, drill jigs, injection... [See More]
- Chemical System: Epoxy
- Composition: Filled
- Type: Thermally Conductive
- Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
from Henkel Corporation - Electronics
One component, low temperature curing thermally conductive epoxy adhesive. [See More]
- Chemical System: Epoxy
- Cure / Technology: Single Component
- Type: Thermally Conductive
- Industry: Electronics
from OMEGA Engineering, Inc.
OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper products. [See More]
- Chemical System: Epoxy
- Cure / Technology: Two Component
- Type: Thermally Conductive
- Form / Shape: Liquid
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 84-1LMIT, Epoxy, Component assembly, Electrically Conductive Adhesive. LOCTITE ® ABLESTIK 84-1LMIT adhesive is designed for medium die attach applications. This adhesive is ideal for application by syringe dispensing or screen printing. Electrically conductive. High thermal... [See More]
- Chemical System: Epoxy
- Cure / Technology: Single Component
- Type: Thermally Conductive
- Form / Shape: Paste
from Sherwin-Williams Protective & Marine Coatings
CoroBond ™ CONDUCTIVE VINYL ESTER PRIMER is a conductive, elastomer modified epoxy vinyl ester. It is designed to provide superior adhesion to concrete and metal substrates, and resist mechanical stresses such as impact, abrasion, tensile and flexural stress. Excellent chemical resistance. [See More]
- Chemical System: Elastomer-Modified Epoxy; Epoxy; Alkyd; Vinyl
- Composition: Unfilled
- Type: Electrically Conductive
- Cure / Technology: Thermoset; Single Component
from Protavic America, Inc.
Epoxy system designed for underfill applications. This material is fast flowing and provides excellent properties for common device packaging. [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
- Type: Thermally Conductive
- Form / Shape: Die Bonding Adhesives; Liquid
from Epoxies Etc...
40-3905 is an electrically conductive system designed for applications requiring low temperature cures. 40-3905 will cure at room temperature in 18 hours or can be accelerated with mild heat. [See More]
- Chemical System: Epoxy
- Composition: Filled
- Type: Electrically Conductive
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 8-2, Epoxy, Non-conductive Die Attach Adhesive LOCTITE ® ABLESTIK 8-2 non-conductive die attach adhesive is designed for MEMs package applications. Designed as an instrument adhesive, LOCTITE ABLESTIK 8-2 adhesive offers eight times the thermal conductivity of unfilled epoxies. [See More]
- Chemical System: Epoxy
- Cure / Technology: Single Component
- Type: Thermally Conductive
from Protavic America, Inc.
A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals. [See More]
- Chemical System: Epoxy
- Composition: Filled
- Type: Electrically Conductive; Thermally Conductive
- Cure / Technology: Thermoset; Single Component
from Epoxies Etc...
10-3003 NS is a new high bond strength epoxy adhesive formulated for ease in handling and convenience for the end user. This system has a non critical mix ratio and adjustable flexibility. 10-3003 NS is also very safe to use due to the absence of harmful solvents and toxic chemicals in the... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Type: Thermally Conductive
- Form / Shape: Die Bonding Adhesives; Grease, Paste
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 872-7TN1, Epoxy, Non-conductive adhesive LOCTITE ® ABLESTIK 872-7TN1 is ideal for electronic applications requiring stress relief. Flexible. Thixotropic. High viscosity. Long work life. Easy handling. High thermal conductivity. Reduced stress [See More]
- Chemical System: Epoxy
- Cure / Technology: Two Component
- Type: Thermally Conductive
- Form / Shape: Paste
from Protavic America, Inc.
PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ is heat stable up to 150 °C. [See More]
- Chemical System: Epoxy
- Composition: Filled
- Type: Thermally Conductive
- Cure / Technology: Thermoset; Two Component
from Henkel Corporation - Industrial
Clear epoxy resin hardener which is one part of a two part epoxy system designed for use with a variety of LOCTITE HYSOL resins. LOCTITE ® PE 3164 is a clear epoxy resin hardener which forms a black, fast gelling, low viscosity, room temperature cure potting compound with high thermal... [See More]
- Chemical System: Epoxy
- Type: Thermally Conductive
from Henkel Corporation - Industrial
LOCTITE STYCAST 2762FT, Epoxy, High Temperature Resistance, High Thermal Conductivity, Potting, Encapsulant LOCTITE ® STYCAST 2762FT epoxy encapsulant is designed for potting electronic components exposed to harsh environments. This material is also ideal for large and complex castings that... [See More]
- Chemical System: Epoxy
- Cure / Technology: Two Component
- Type: Thermally Conductive
- Viscosity: 25000
from Henkel Corporation - Industrial
LOCTITE STYCAST 2850FTJ, Epoxy, Encapsulant. LOCTITE ® STYCAST 2850FTJ epoxy encapsulant is designed for use in high voltage applications where surface arcing or tracking is a concern. LOCTITE STYCAST 2850FTJ is recommended for encapsulation of components that require heat dissipation and... [See More]
- Chemical System: Epoxy
- Cure / Technology: Two Component
- Type: Thermally Conductive
- Viscosity: 225000
from Henkel Corporation - Industrial
LOCTITE STYCAST 2850KT CAT 24LV, Epoxy, Encapsulant LOCTITE ® STYCAST 2850KT CAT 24LV epoxy encapsulant is designed for heat sink replacement in non-integrated electrical components and assemblies. It is also recommended for use in high voltage applications where surface arching or tracking is a... [See More]
- Chemical System: Epoxy
- Cure / Technology: Two Component
- Type: Thermally Conductive
- Use Temperature: 85 to 221
from Henkel Corporation - Industrial
LOCTITE STYCAST 2851FT, Epoxy, Encapsulant LOCTITE ® STYCAST 2851FT is recommended for encapsulation of components that require heat dissipation and thermal shock properties . It has a low coefficient of thermal expansion and exhibits excellent resistance to a wide variety of industrial... [See More]
- Chemical System: Epoxy
- Cure / Technology: Single Component
- Type: Thermally Conductive
- Thermal Conductivity: 1.36
from Henkel Corporation - Industrial
LOCTITE STYCAST E 2534 FR CAT 9, Epoxy, Potting LOCTITE ® STYCAST E 2534 FR CAT 9 epoxy potting compound complies with recent demands on environmentally friendly products and does not contain brominated flame retardants. LOCTITE STYCAST E 2534 FR CAT 9 can be used with a variety of catalysts. [See More]
- Chemical System: Epoxy
- Cure / Technology: Two Component
- Type: Thermally Conductive
- Use Temperature: 40 to 302
from Henkel Corporation - Industrial
LOCTITE STYCAST EE 4215/HD 3561, Epoxy, Potting and Encapsulating. LOCTITE ® STYCAST EE 4215/HD 3561 is a filled system recommended for potting applications where rigid or flexible wire leads protrude directly from the encapsulation and where high impact strength is required. This system... [See More]
- Chemical System: Epoxy
- Cure / Technology: Two Component
- Type: Thermally Conductive
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 5025E, Epoxy Film, Die attach LOCTITE ® ABLESTIK 5025E unsupported epoxy adhesive film is ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not required. Thin, uniform bondline control. Provides RF/EMI shielding. Electrically... [See More]
- Chemical System: Epoxy
- Industry: Military
- Type: Thermally Conductive
- Thermal Conductivity: 6.5
from Henkel Corporation - Industrial
LOCTITE STYCAST 2850FT BL, Epoxy, Encapsulant. LOCTITE ® STYCAST 2850FT BL epoxy is designed for applications where electrical insulation and mechanical protection must be maintained while coping with heat transfer considerations. LOCTITE STYCAST 2850FT BL can be used with a variety of... [See More]
- Chemical System: Epoxy
- Cure / Technology: Two Component
- Type: Thermally Conductive
- Thermal Conductivity: 1.38