Specialty / Other Conductive Compounds Datasheets

Thermal - Pads, Sheets -- 1168-1411-ND [T62-150-150-0.13-0 from T-Global Technology Co., Ltd.]
from Digi-Key Electronics

T62 GRAPHITE 150X150X0.13MM [See More]

  • Chemical System: Graphite
  • Thermal Conductivity: 20
  • Type: Thermally Conductive
Non-silicone, Polysynthetic-based Thermal Grease -- SARCON ® SG 07NS
from Fujipoly® America Corp.

Sarcon ® SG-07SL and SG-26SL are highly thermally conductive, non-reactive silicone-based greases that offer low thermal resistance and maintain a nonflowable composition. Unique binding agents and product formulation ensure the lowest amount of bleed and evaporation. Suited for thin bond line... [See More]

  • Chemical System: Polysynthetic
  • Form / Shape: Grease, Paste
  • Type: Thermally Conductive
  • Industry: Electronics; Semiconductors, IC's
LOCTITE ABLESTIK QMI536HT(BORON) (Known as Hysol QMI536HT) -- 8799542116353
from Henkel Corporation - Electronics

(Known as Hysol QMI536HT ). LOCTITE ABLESTIK QMI536HT(BORON) is a high thermal version of QMI536 and is ideal for mixed stacked die applications. Non-die damaging filler. [See More]

  • Chemical System: Boron Nitride Filled
  • Industry: Electronics
  • Type: Thermally Conductive
  • Thermal Conductivity: 0.9000
Engineered Solder Materials -- Indalloy® Alloys Liquid at Room Temperature
from Indium Corporation

Several low melting point Indalloy ® alloys are liquid at room temperature. These gallium-based alloys are non-toxic replacements for mercury. The gallium-based alloys have far lower vapor pressure than mercury, reducing both the amount and toxicity of metal vapor exposure. Excellent Thermal and... [See More]

  • Chemical System: Metal
  • Form / Shape: Liquid
  • Type: Thermally Conductive
  • Industry: Semiconductors, IC's
One Component, Electrically Conductive Coating System -- MB600G
from Master Bond, Inc.

Ideal for electromagnetic interference (EMI) and radio frequency interference (RFI) shielding applications, MB600G is an aqueous based, sodium silicate system with a graphite filler. Electrically conductive, graphite filled materials are widely used for shielding and static dissipation applications... [See More]

  • Chemical System: Sodium Silicate System
  • Composition: Filled
  • Type: Electrically Conductive; Thermally Conductive
  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
from RS Components, Ltd.

Silicon-free heat sink compound. Easy to apply with the practical syringe. Extremely high thermal conductivity. For the thermal coupling of electronic components. Thermal Conductivity = 0.9W/m ·K. Material = Non-Silicone. Maximum Operating Temperature = +130 °C. Minimum Operating... [See More]

  • Chemical System: Non-Silicone
  • Form / Shape: Grease, Paste
  • Type: Thermally Conductive
  • Use Temperature: -58 to 266
CoroBond™ Conductive Vinyl Ester Primer
from Sherwin-Williams Protective & Marine Coatings

CoroBond ™ CONDUCTIVE VINYL ESTER PRIMER is a conductive, elastomer modified epoxy vinyl ester. It is designed to provide superior adhesion to concrete and metal substrates, and resist mechanical stresses such as impact, abrasion, tensile and flexural stress. Excellent chemical resistance. [See More]

  • Chemical System: Elastomer-Modified Epoxy; Epoxy; Alkyd; Vinyl
  • Composition: Unfilled
  • Type: Electrically Conductive
  • Cure / Technology: Thermoset; Single Component
Elastomeric potting & encapsulating compound -- 20-2125
from Epoxies Etc...

20-2125 is formulated for electronic potting, encapsulating and casting applications. The 20-2125 is a two-component, low viscosity, room temperature curing system. This is an easy to use product that does not contain TDI, MbOCA or Mercury. 20-2125 will cushion and protect sensitive electronic... [See More]

  • Chemical System: Polyol, Isocyanate
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Type: Thermally Conductive
  • Form / Shape: Grease, Paste
Dissipator® -- 745
from Hernon Manufacturing, Inc.

Dissipator ® structural acrylics provide specific adhesion for bonding electrical heat sink components with high thermal conductivity. Heat trapped and not dissipated by the components can lead to premature component failure and costly repair and replacement. Thermal conductivity is assured and... [See More]

  • Chemical System: Modified Acrylic; Acrylic
  • Composition: Unfilled
  • Type: Thermally Conductive
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Thermal Compound -- TC70
from Nordson EFD

Our innovative, non-silicone thermal compounds provide an ideal thermal solution by ensuring reliable heat transfer over a longer time than most industrial thermal interface materials. Conventional, silicone-based heat sink compounds and thermal greases tend to spread after a number of heating and... [See More]

  • Chemical System: Synthetic Based
  • Composition: Unfilled
  • Type: Thermally Conductive
  • Cure / Technology: Single Component
Clear UV Adhesive -- ANA-97773
from Protavic America, Inc.

ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued shrinkage and movement. Bond lines are clear, colorless and exhibit low shrinkage during the curing process. [See More]

  • Type: Electrically Conductive
  • Cure / Technology: Thermoset; Two Component  ; UV or Radiation Cured
  • Composition: Unfilled
  • Form / Shape: Die Bonding Adhesives; Liquid
Insa-Lute Hi-Temp Cement -- No. 7
from Sauereisen, Inc.

Sauereisen Insa-Lute Hi Temp Cement No. 7 is a sodium silicate adhesive cement used by leading electrical manufacturers. The cement exhibits outstanding resistance to heat and electricity. Typical applications include instrumentation assembly, coating and embedding of resistance wires, and... [See More]

  • Chemical System: Sodium Silicate Adhesive Cement; Ceramic
  • Composition: Unfilled
  • Type: Thermally Conductive
  • Form / Shape: Die Bonding Adhesives; Liquid; Encapsulant or Conformal Coating