Silicone Conductive Compounds

2173835
from RS Components, Ltd.

General purpose silicone grease suitable to be used in various applications and in a wide operating temperature range. This metal oxide filled silicone oil paste, gives a superior thermal conductivity for thermal coupling of electrical and electronic components. The thermal grease is efficient and... [See More]

  • Chemical System: Silicone
  • Form / Shape: Grease, Paste
  • Type: Thermally Conductive
  • Use Temperature: -40 to 392
Extremely Compressible Thermal Gap Filler -- SARCON® PG45A
from Fujipoly® America Corp.

Fujipoly ® introduces Sarcon ® PG45A its newest high-performance, putty-like thermal interface material. This extremely low modulus gap filler exhibits a thermal resistance as low as 0.02 °C •in2/W at 43.5 PSI with a thermal conductivity of 4.5 W/m °K. Sarcon ® PG45A... [See More]

  • Chemical System: Silicone
  • Form / Shape: Putty; Gap Filler, Foam in Place Gasket
  • Type: Thermally Conductive
  • Gap Fill: 0.0591 to 0.0984
Thermal - Adhesives, Epoxies, Greases, Pastes -- 08946-ND [8946 from 3M]
from Digi-Key Electronics

SILICONE PASTE 8 OZ CLEAR [See More]

  • Chemical System: Silicone
  • Use Temperature: -40 to 399
  • Type: Thermally Conductive
BERGQUIST GAP FILLER TGF 3500LVO is a silicone, thermally conductive, liquid gap filler with industry-wide applications. -- BERGQUIST GAP FILLER TGF 3500LVO
from Henkel Adhesive Technologies - Aviation, Space and Rail

BERGQUIST ® GAP FILLER TGF 3500LVO is a silicone, two-component, high thermal conductivity, liquid gap filler. This product offers the mechanical property benefits of a silicone material with the additional feature of low outgassing. It can be used in industries ranging from automotive to... [See More]

  • Chemical System: Silicone
  • Cure / Technology: Thermoset
  • Type: Thermally Conductive
  • Form / Shape: Gap Filler, Foam in Place Gasket; Liquid
Addition Cured Silicone is Optically Clear with Enhanced Low Temperature Serviceability -- MasterSil 157
from Master Bond, Inc.

MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]

  • Chemical System: Silicone
  • Composition: Unfilled
  • Type: Thermally Conductive
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing; Addition Cure
High Insulating Thermal Conductive Pad/Film -- PR27
from Shiu Li Technology Co., Ltd

LiPOLY PR27 is a very thin high insulator with a thickness of 0.15mm. It uses Polyimide Film as the reinforcement material, which can increase the tensile strength. It has great dielectric strength and can withstand 12K voltages. It ’s suitable for high power transistors, electrical equipment,... [See More]

  • Chemical System: Silicone
  • Form / Shape: Sheet Form, Die-cut Parts
  • Type: Thermally Conductive
  • Gap Fill: 0.0059
Momentive CRTV5120 Semi Conductive Silicone 170gm -- MOSI01358
from Techsil Limited

Momentive CRTV5120 is a high performance, semi-conductive silicone adhesive. This one-part RTV offers fast cure and a resistivity of 200 - 800 ohm-cm. CRTV5120 offers a primer less adhesion to many metals, plastics and glass. This product is ideal for gaskets & seals for electronics that need... [See More]

  • Chemical System: Silicone; Elastomeric
  • Type: Electrically Conductive
Henkel Loctite STYCAST 5952 Thermally Conductive Encapsulant Part A Red 1 qt Can -- 5952 PTA RED 1LB [1188234 from Henkel Corporation - Industrial]
from Ellsworth Adhesives

Henkel Loctite STYCAST 5952 Red, formerly Emerson and Cuming, is a two component, addition cured, filled silicone encapsulant that is used for encapsulating electronic components that generate heat such as sensors, transformers, and power supplies. It is non-corrosive, reversion resistant, and has... [See More]

  • Chemical System: Silicone
  • Cure / Technology: Two Component  
  • Type: Thermally Conductive
  • Thermal Conductivity: 0.8500
2778200 [CT40-5 from ITW Chemtronics]
from RS Components, Ltd.

Heat sink grease gives excellent thermal conductivity. Will not dry out, harden or melt. Maximises heat transfer between circuit components & heat sinks. Thermal Conductivity = 0.63W/m ·K. Material = Silicone. Maximum Operating Temperature = +200 °C. Minimum Operating Temperature = -73... [See More]

  • Chemical System: Silicone
  • Form / Shape: Grease, Paste
  • Type: Thermally Conductive
  • Use Temperature: -99 to 392
High Performance Gap Filler -- SARCON ® GR80A
from Fujipoly® America Corp.

Highly Conformable and High Heat Conducting gel materials. SARCON ® Thermal Gap Filler Pads are highly conformable and high heat conducting gel materials in a versatile sheet form. They easily fit and adhere to most all shapes and sizes of components, including protrusions and recessed areas. [See More]

  • Chemical System: Silicone
  • Form / Shape: Gap Filler, Foam in Place Gasket; Gel
  • Type: Thermally Conductive
  • Gap Fill: 0.0394 to 0.1181
Thermal - Adhesives, Epoxies, Greases, Pastes -- 249G-ND [249G from Aavid Thermalloy, LLC]
from Digi-Key Electronics

THERMALCOTE GREASE TUBE 1OZ [See More]

  • Chemical System: Silicone
  • Use Temperature: -40 to 399
  • Type: Thermally Conductive
  • Thermal Conductivity: 0.7600
BERGQUIST GAP PAD TGP 10000ULM, Thermal interface material, Gap pad, Thermal performance at low pressures -- BERGQUIST GAP PAD TGP 10000ULM
from Henkel Adhesive Technologies - Aviation, Space and Rail

BERGQUIST ® GAP PAD TGP 10000ULM is an extremely soft gap filling material rated at a thermal conductivity of 10.0 W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the... [See More]

  • Chemical System: Silicone
  • Industry: OEM or Industrial
  • Type: Thermally Conductive
  • Use Temperature: -76 to 392
Electrically and Thermally Conductive, Two Part Silicone Meets NASA Low Outgassing Specifications -- MasterSil 973S-LO
from Master Bond, Inc.

MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]

  • Chemical System: Silicone
  • Composition: Filled
  • Type: Electrically Conductive; Thermally Conductive
  • Cure / Technology: Thermoset; Two Component  ; Addition Cure
High Insulating Thermal Conductive Pad/Film -- SH1500/2000/3000
from Shiu Li Technology Co., Ltd

LiPOLY ’s thermal insulator SH1500/2000/3000 uses fiberglass cloth as a reinforcement material, combined with thermal conductive silicon, giving it high thermal conduction and great compression strength. The thermal conductivity is 1.5/2.0/3.0 W/m*K, the thickness is 0.23~0.35mm. Its high... [See More]

  • Chemical System: Silicone
  • Form / Shape: Sheet Form, Die-cut Parts
  • Type: Thermally Conductive
  • Gap Fill: 0.0091 to 0.0138
Momentive CRTV5120 Semi Conductive Silicone 30cc -- MOSI17207
from Techsil Limited

Momentive CRTV5120 is a high performance, semi-conductive silicone adhesive. This one-part RTV offers fast cure and a resistivity of 200 - 800 ohm-cm. CRTV5120 offers a primerless adhesion to many metals, plastics and glass. This product is ideal for gaskets & seals for electronics that need EMI... [See More]

  • Chemical System: Silicone; Elastomeric
  • Industry: Electronics
  • Type: Electrically Conductive
Henkel Loctite STYCAST 5952 Thermally Conductive Encapsulant Part B White 1 qt Can -- 5952 PTB 1LB [1188235 from Henkel Corporation - Industrial]
from Ellsworth Adhesives

Henkel Loctite STYCAST 5952 White, formerly Emerson and Cuming, is a two component, addition cured, filled silicone encapsulant that is used for encapsulating electronic components that generate heat such as sensors, transformers, and power supplies. It is non-corrosive, reversion resistant, and has... [See More]

  • Chemical System: Silicone
  • Cure / Technology: Two Component  
  • Type: Thermally Conductive
  • Thermal Conductivity: 0.8500
2833739 [GAPPAD203.2X406.4125MIL from Bergquist Company (The)]
from RS Components, Ltd.

Electrical insulators and thermal conductors. Adapted for electrical insulation and as thermal joints on assemblies of components where the height varies. The material has excellent elasticity. The thicknesses available (0.5, 1, 2 and 3 mm) mean that GAP Pads can be used when the texture of the... [See More]

  • Chemical System: Silicone
  • Use Temperature: -76 to 392
  • Type: Thermally Conductive
  • Thermal Conductivity: 0.8000
High Performance Thermal Gap Filler -- SARCON® GR130A
from Fujipoly® America Corp.

Fujipoly ® recently released Sarcon ® GR130A, its newest high-performance, thermal gap filler pad. The highly conformable, gel-like sheets exhibit a thermal resistance as low as 0.02 °C •in2/W at 43.5 PSI with a thermal conductivity of 13 W/m °K. Sarcon ® GR130A is available... [See More]

  • Chemical System: Silicone
  • Form / Shape: Gap Filler, Foam in Place Gasket
  • Type: Thermally Conductive
  • Gap Fill: 0.0118 to 0.0787
Thermal - Adhesives, Epoxies, Greases, Pastes -- 250G-ND [250G from Aavid Thermalloy, LLC]
from Digi-Key Electronics

THERMALCOTE GREASE TUBE 2OZ [See More]

  • Chemical System: Silicone
  • Use Temperature: -40 to 399
  • Type: Thermally Conductive
  • Thermal Conductivity: 0.7600
BERGQUIST GAP PAD TGP 5000 is a silicone, highly conformable, fiberglass reinforced gap pad with a thermal conductivity of 5 W/mK. -- BERGQUIST GAP PAD TGP 5000
from Henkel Adhesive Technologies - Aviation, Space and Rail

BERGQUIST ® GAP PAD TGP 5000 is a silicone based, thermally conductive, fiberglass reinforced and S-class soft gap pad. Its highly conformable nature and S-class softness ensures that it conforms to demanding contours and maintains structural integrity. Fiberglass reinforcement provides... [See More]

  • Chemical System: Silicone
  • Industry: OEM or Industrial
  • Type: Thermally Conductive
  • Use Temperature: -76 to 392
Extremely Soft MasterSil 170 Gel Encapsulant Offers Removability and Optical Clarity -- MasterSil 170 Gel
from Master Bond, Inc.

MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]

  • Chemical System: Silicone
  • Composition: Unfilled
  • Type: Thermally Conductive
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Thermal Conductive Absorber Pad -- AEM83A/B
from Shiu Li Technology Co., Ltd

LiPOLY AEM83 is an absorber pad, which is made of soft magnetic material and polymer resin. It can transfer electromagnetic radiation to thermal energy and lose it quickly. [See More]

  • Chemical System: Silicone
  • Form / Shape: Sheet Form, Die-cut Parts
  • Type: Thermally Conductive
  • Gap Fill: 0.0031 to 0.0197
Momentive SilCool TSE3281 G Thermal Silicone 1kg -- MOSI01220
from Techsil Limited

TSE3281-G is a thermally conductive silicone adhesive from Momentive Performance Materials. This one component material is non-corrosive and has excellent adhesion properties to a wide variety of substrates. Potential applications for TSE3281-G include sealing and bonding for thermally conductive... [See More]

  • Chemical System: Silicone; Elastomeric
  • Industry: Electronics
  • Type: Thermally Conductive
Henkel Loctite STYCAST 5954 Thermally Conductive Encapsulant Part A Red 1 gal Pail -- 5954 PTA RED 15LB [1188242 from Henkel Corporation - Industrial]
from Ellsworth Adhesives

Henkel Loctite STYCAST 5954 Red Silicone Encapsulant, formerly Emerson and Cuming, is a two component, highly filled silicone that is used for encapsulating heat generating electronic components such as sensors, power supplies, and transformers. It has very high thermal conductivity, excellent... [See More]

  • Chemical System: Silicone
  • Cure / Technology: Two Component  
  • Type: Thermally Conductive
  • Thermal Conductivity: 1.15
3012810
from RS Components, Ltd.

A metal oxide filled silicone oil providing an extremely efficient and effective thermally conductive compound which will operate over a wide temperature range. For use where reliable thermal coupling of electrical and electronic components is required or between any surface where thermal... [See More]

  • Chemical System: Silicone
  • Form / Shape: Grease, Paste
  • Type: Thermally Conductive
  • Use Temperature: -58 to 392
Two-Part Thermal Gap Filler -- SARCON® LG23A and LG30A
from Fujipoly® America Corp.

The SARCON® LG Series is the perfect solution for filling large, complex and uneven gaps between heat generating components that depend on reliable contact with a heat spreader to maintain optimal performance. SARCON® LG23A and LG30A easily dispense in a liquid form that will cure at room... [See More]

  • Chemical System: Silicone
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Type: Thermally Conductive
  • Form / Shape: Gap Filler, Foam in Place Gasket; Gel
Thermal - Adhesives, Epoxies, Greases, Pastes -- 251G-ND [251G from Aavid Thermalloy, LLC]
from Digi-Key Electronics

THERMALCOTE GREASE CAN 1LB [See More]

  • Chemical System: Silicone
  • Use Temperature: -40 to 399
  • Type: Thermally Conductive
  • Thermal Conductivity: 0.7600
BERGQUIST GAP PAD TGP 7000ULM, Thermally conductive soft gap filling material, For high performance applications -- BERGQUIST GAP PAD TGP 7000ULM
from Henkel Adhesive Technologies - Aviation, Space and Rail

BERGQUIST GAP PAD TGP 7000ULM is an extremely soft gap filling material rated at a thermal conductivity of 7.0 W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique... [See More]

  • Chemical System: Silicone
  • Form / Shape: Gap Filler, Foam in Place Gasket
  • Type: Thermally Conductive
  • Industry: OEM or Industrial
Highly Flexible Addition Cured Silicone Offers Low Thermal Resistance -- MasterSil 151TC
from Master Bond, Inc.

MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]

  • Chemical System: Silicone
  • Composition: Filled
  • Type: Thermally Conductive
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Thermal Conductive Absorber Pad -- DTT44-5G
from Shiu Li Technology Co., Ltd

LiPOLY DTT44 is a soft thermally conductive gel pad specifically designed for networking applications. DTT44 is designed to focus on Dk and Df to reduce interference in RF modules. DTT44 has a thermal conductivity of 3.0 W/m*K. This product can be supplied as standard sheets, custom die-cuts or... [See More]

  • Chemical System: Silicone
  • Form / Shape: Sheet Form, Die-cut Parts
  • Type: Thermally Conductive
  • Gap Fill: 0.0197 to 0.1969
Momentive SnapSIL TN3005 Clear Silicone 310ml -- MOSI01370
from Techsil Limited

Momentive SnapSIL TN3005 is a low volatile siloxane, silicone adhesive sealant that cures at room temperature. It offers primerless adhesion to many substrates and high elongation once cured. Ideal for use as an insulating adhesive seal and fixing for electrical and electronic parts. Can also be... [See More]

  • Chemical System: Silicone; Elastomeric
  • Industry: Electronics
  • Type: Thermally Conductive
Henkel Loctite STYCAST 5954 Thermally Conductive Encapsulant Part A Red 1 qt Can -- 5954 PTA RED 1LB [1188240 from Henkel Corporation - Industrial]
from Ellsworth Adhesives

Henkel Loctite STYCAST 5954 Red Silicone Encapsulant, formerly Emerson and Cuming, is a two component, addition cured, highly filled, silicone encapsulant that is used for encapsulating electronic components that generate heat such as sensors, transformers, and power supplies. It is non-corrosive,... [See More]

  • Chemical System: Silicone
  • Cure / Technology: Two Component  
  • Type: Thermally Conductive
  • Thermal Conductivity: 1.15
3012826
from RS Components, Ltd.

A silicone based oil with various metal oxide (ceramic) powders for providing the best in thermal conductivity. The materials are electrically insulative to ensure that leakage of currents can not be formed should the paste come into contact with other parts of the assembly. For use where a large... [See More]

  • Chemical System: Silicone
  • Form / Shape: Grease, Paste
  • Type: Thermally Conductive
  • Use Temperature: -58 to 392
Thermal - Adhesives, Epoxies, Greases, Pastes -- 345-1006-ND [120-SA from Wakefield-Vette, Inc.]
from Digi-Key Electronics

SILICONE GREASE 4 GRAM [See More]

  • Chemical System: Silicone
  • Use Temperature: -40 to 392
  • Type: Thermally Conductive
  • Thermal Conductivity: 0.7300
BERGQUIST LIQUI FORM TLF 6000HG, Thermally conductive gel, Pre-cured -- BERGQUIST LIQUI FORM TLF 6000HG
from Henkel Adhesive Technologies - Aviation, Space and Rail

BERGQUIST ® LIQUI FORM TLF 6000HG thermally conductive gel interface material is designed to meet the demanding requirements in certain telecom market applications. Its unique formulation assures a balanced mix of high thermal conductivity, good dispensing efficiency and high thermal... [See More]

  • Chemical System: Silicone
  • Form / Shape: Paste; Gel
  • Type: Thermally Conductive
  • Industry: OEM or Industrial
NASA Low Outgassing, Thermally Conductive Two Part Silicone -- MasterSil 972TC-LO
from Master Bond, Inc.

MasterSil 972TC-LO is capable of transferring heat with a thermal conductivity of 7-9 BTU •in/ft ² •hr • °F [1.01-1.30 W/(m •K)], while retaining superior dielectric properties. It bonds well to a wide variety of substrates, including metals, composites, glass, ceramics... [See More]

  • Chemical System: Silicone
  • Composition: Unfilled
  • Type: Thermally Conductive
  • Cure / Technology: Thermoset; Two Component  
Thermal Conductive Absorber Pad -- DTT65-5G
from Shiu Li Technology Co., Ltd

LiPOLY DTT65 is a soft thermally conductive gel pad specifically designed for networking applications. DTT65 is designed to focus on Dk and Df to reduce interference in RF modules. DTT65 has a thermal conductivity of 5.0 W/m*K. This product can be supplied as standard sheets, custom die-cuts or... [See More]

  • Chemical System: Silicone
  • Form / Shape: Sheet Form, Die-cut Parts
  • Type: Thermally Conductive
  • Gap Fill: 0.0197 to 0.1969
Momentive SnapSIL TN3005 White Silicone 310ml -- MOSI01371
from Techsil Limited

Momentive SnapSIL TN3005 is a low volatile siloxane, silicone adhesive sealant that cures at room temperature. It offers primerless adhesion to many substrates and high elongation once cured. Ideal for use as an insulating adhesive seal and fixing for electrical and electronic parts. Can also be... [See More]

  • Chemical System: Silicone; Elastomeric
  • Industry: Electronics
  • Type: Thermally Conductive
Henkel Loctite STYCAST 5954 Thermally Conductive Encapsulant Part B White 1 gal Pail -- 5954 PTB WHT 15LB [1188243 from Henkel Corporation - Industrial]
from Ellsworth Adhesives

Henkel Loctite STYCAST 5954 White Silicone Encapsulant, formerly Emerson and Cuming, is a two component, highly filled silicone that is used for encapsulating heat generating electronic components such as sensors, power supplies, and transformers. It has very high thermal conductivity, excellent... [See More]

  • Chemical System: Silicone
  • Cure / Technology: Two Component  
  • Type: Thermally Conductive
  • Thermal Conductivity: 1.15
446493
from RS Components, Ltd.

T-flex â „ ¢ 300 is a silicone gel combined with a ceramic powder to offer a unique combination of compliancy, thermal resistance and price. At pressures of 50 psi, it deflects over 50% the original thickness. This high rate of compliancy allows the material to totally blanket the... [See More]

  • Chemical System: Silicone
  • Use Temperature: -40 to 320
  • Type: Thermally Conductive
  • Thermal Conductivity: 1.2
Thermal - Adhesives, Epoxies, Greases, Pastes -- 345-1007-ND [120-2 from Wakefield-Vette, Inc.]
from Digi-Key Electronics

SILICONE GREASE 2 OZ JAR [See More]

  • Chemical System: Silicone
  • Use Temperature: -40 to 392
  • Type: Thermally Conductive
  • Thermal Conductivity: 0.7300
Non-Drip, Thermal Conductive One Component Silicone -- MasterSil 705TC
from Master Bond, Inc.

Master Bond MasterSil 705TC is a one component, thermally conductive, electrically isolating silicone for bonding, sealing and coating applications. It features outstanding thermal conductivity and is well suited for applications that require flexibility and high temperature resistance. It cures... [See More]

  • Chemical System: Silicone
  • Composition: Unfilled
  • Type: Thermally Conductive
  • Cure / Technology: Thermoset; Single Component; Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing
Thermal Conductive Absorber Pad -- TEM96B
from Shiu Li Technology Co., Ltd

LiPOLY TEM96B is a thermally conductive absorber based upon soft magnetic materials dispersed in a polymeric resin. It has a thermal conductivity of 3.0 W/m*K and dissipates electromagnetic radiation rapidly to mitigate against EMI issues. [See More]

  • Chemical System: Silicone
  • Form / Shape: Sheet Form, Die-cut Parts
  • Type: Thermally Conductive
  • Gap Fill: 0.0197 to 0.1969
Momentive SnapSIL TN3085 Grey Silicone 310ml -- MOSI01362
from Techsil Limited

Momentive SnapSIL TN3085 is a thermally conductive, low volatile siloxane, silicone adhesive that cures at room temperature to form an elastic, flame retardant silicone rubber. It offers primerless adhesion to many substrates. Designed for bonding applications in power supplies, securing PCB's to... [See More]

  • Chemical System: Silicone; Elastomeric
  • Industry: Electronics
  • Type: Thermally Conductive
Henkel Loctite STYCAST 5954 Thermally Conductive Encapsulant Part B White 1 qt Can -- 5954 PTB WHT 1LB [1188241 from Henkel Corporation - Industrial]
from Ellsworth Adhesives

Henkel Loctite STYCAST 5954 White Silicone Encapsulant, formerly Emerson and Cuming, is a two component, addition cured, highly filled, silicone encapsulant that is used for encapsulating electronic components that generate heat such as sensors, transformers, and power supplies. It is non-corrosive,... [See More]

  • Chemical System: Silicone
  • Cure / Technology: Two Component  
  • Type: Thermally Conductive
  • Thermal Conductivity: 1.15
446572
from RS Components, Ltd.

T-flex â „ ¢ 300 is a silicone gel combined with a ceramic powder to offer a unique combination of compliancy, thermal resistance and price. At pressures of 50 psi, it deflects over 50% the original thickness. This high rate of compliancy allows the material to totally blanket the... [See More]

  • Chemical System: Silicone
  • Use Temperature: -40 to 320
  • Type: Thermally Conductive
  • Thermal Conductivity: 1.2
Thermal - Adhesives, Epoxies, Greases, Pastes -- 345-1008-ND [120-5 from Wakefield-Vette, Inc.]
from Digi-Key Electronics

SILICONE GREASE 5 OZ TUBE [See More]

  • Chemical System: Silicone
  • Use Temperature: -40 to 392
  • Type: Thermally Conductive
  • Thermal Conductivity: 0.7300
Thermally Conductive Flame Retardant Silicone -- MasterSil 156
from Master Bond, Inc.

Featuring superb electrical insulation properties, MasterSil 156 is a two component, moderate viscosity silicone system for high performance potting, encapsulation and sealing. It combines high temperature resistance, flexibility, low shrinkage upon cure and thermal conductivity exceeding 8-9 BTU... [See More]

  • Chemical System: Silicone
  • Composition: Unfilled
  • Type: Thermally Conductive
  • Cure / Technology: Thermoset; Two Component  
Thermal Conductive Pad -- BS75K
from Shiu Li Technology Co., Ltd

LiPOLY BS75K is a soft thermally conductive gap filler. With a thermal conductivity of 3.0 W/m*K and a low thermal impedance, BS75K is suitable for a wide range of applications. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for a wide... [See More]

  • Chemical System: Silicone
  • Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
  • Type: Thermally Conductive
  • Gap Fill: 0.0197 to 0.1969
Momentive SnapSIL TN3305 Black Silicone 310ml -- MOSI01369
from Techsil Limited

Momentive SnapSIL TN3305 is a low volatile siloxane, silicone adhesive sealant that cures at room temperature. It offers primerless adhesion to many substrates and high elongation once cured. Ideal for use as an insulating adhesive seal and fixing for electrical and electronic parts. Can also be... [See More]

  • Chemical System: Silicone; Elastomeric
  • Industry: Electronics
  • Type: Thermally Conductive
Techspray 1978 Silicone Free Heat Sink Compound Gray 4 oz Tube -- 1978-DP [1978-DP from Techspray, an ITW Company]
from Ellsworth Adhesives

Techspray Silicone Free Heat Sink Compound is used to cool thermistors, calrods, thermocouple wells, and other electrical components. It is non-ozone depleting, easy to apply, and will not harden, separate, or crack. 4 oz Tube. [See More]

  • Chemical System: Silicone
  • Cure / Technology: Single Component
  • Type: Thermally Conductive
  • Thermal Conductivity: 0.7000
446582
from RS Components, Ltd.

T-flex â „ ¢ 300 is a silicone gel combined with a ceramic powder to offer a unique combination of compliancy, thermal resistance and price. At pressures of 50 psi, it deflects over 50% the original thickness. This high rate of compliancy allows the material to totally blanket the... [See More]

  • Chemical System: Silicone
  • Use Temperature: -40 to 320
  • Type: Thermally Conductive
  • Thermal Conductivity: 1.2
Thermal - Adhesives, Epoxies, Greases, Pastes -- 345-1009-ND [120-8 from Wakefield-Vette, Inc.]
from Digi-Key Electronics

SILICONE GREASE 8 OZ JAR [See More]

  • Chemical System: Silicone
  • Use Temperature: -40 to 392
  • Type: Thermally Conductive
  • Thermal Conductivity: 0.7300
Two Component, Thermally Conductive Urethane Modified Epoxy Gel-Like System -- Super Gel 9AO
from Master Bond, Inc.

Featuring resounding softness and dimensional stability, Super Gel 9AO is a two component system that delivers superior thermal conductivity and electrical insulation values. Excellent flow properties and low exotherm enable it to be cast in larger sections up to 2-3 inches thick. Super Gel 9... [See More]

  • Chemical System: Polyurethane; Silicone; Epoxy
  • Composition: Unfilled
  • Type: Thermally Conductive
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Thermal Conductive Pad -- BS87
from Shiu Li Technology Co., Ltd

LiPOLY BS87 is an ultra-soft thermally conductive gel pad with a thermal conductivity of 3.0 W/m*K. BS87 offers excellent compression under minimal force with high recovery characteristics. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for... [See More]

  • Chemical System: Silicone
  • Form / Shape: Sheet Form, Die-cut Parts
  • Type: Thermally Conductive
  • Gap Fill: 0.0197 to 0.1969
Momentive SnapSIL TN3305 Clear Silicone 310ml -- MOSI01367
from Techsil Limited

Momentive SnapSIL TN3305 is a low volatile siloxane, silicone adhesive sealant that cures at room temperature. It offers primerless adhesion to many substrates and high elongation once cured. Ideal for use as an insulating adhesive seal and fixing for electrical and electronic parts. Can also be... [See More]

  • Chemical System: Silicone; Elastomeric
  • Industry: Electronics
  • Type: Thermally Conductive
4980225 [ST-08-220R/A from Bergquist Company (The)]
from RS Components, Ltd.

These grey silicone tubular insulators are designed for components in TO220 or TO247 enclosures. Dimensions = 25 x 11mm. Thickness = 0.45mm. Length = 25mm. Width = 115mm. Thermal Conductivity = 0.8W/m ·K. Material = Silicone [See More]

  • Chemical System: Silicone
  • Thermal Conductivity: 0.8000
  • Type: Thermally Conductive
Thermal - Adhesives, Epoxies, Greases, Pastes -- 345-1010-ND [120-80 from Wakefield-Vette, Inc.]
from Digi-Key Electronics

SILICONE GREASE 5 LBS CAN [See More]

  • Chemical System: Silicone
  • Use Temperature: -40 to 392
  • Type: Thermally Conductive
  • Thermal Conductivity: 0.7300
Thermal Conductive Pad -- PK223
from Shiu Li Technology Co., Ltd

LiPOLY ’s PK223 is a material designed for gap filling. The thermal conductivity is 2.0W/m*K. The hardness is Shore 00/30 with high flexibility, high compressibility, highly insulating, great self-adhesive, which can cover the tolerance of design making it very stable. It also offers... [See More]

  • Chemical System: Silicone
  • Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
  • Type: Thermally Conductive
  • Gap Fill: 0.0197 to 0.3937
Momentive SnapSIL TN3705 Black Silicone 310ml -- MOSI01366
from Techsil Limited

Momentive SnapSIL TN3075 is a low volatile siloxane, silicone adhesive sealant that cures at room temperature. It offers primerless adhesion to many substrates. Ideal for use as an insulating adhesive seal and fixing for electrical and electronic parts. Can also be used as a waterproof sealant for... [See More]

  • Chemical System: Silicone; Elastomeric
  • Industry: Electronics
  • Type: Thermally Conductive
4980275 [SC-08-220R/A from Bergquist Company (The)]
from RS Components, Ltd.

These grey silicone enclosed tubular insulators (cap type) are designed for components in TO220 or TO247 enclosures. Dimensions = 24 x 13mm. Thickness = 0.45mm. Length = 24mm. Width = 13mm. Thermal Conductivity = 0.8W/m ·K. Material = Silicone [See More]

  • Chemical System: Silicone
  • Thermal Conductivity: 0.8000
  • Type: Thermally Conductive
Thermal - Adhesives, Epoxies, Greases, Pastes -- 473-1097-ND [860-150G from MG Chemicals]
from Digi-Key Electronics

HEAT TRANS COMPOUND SILICONE [See More]

  • Chemical System: Silicone
  • Use Temperature: -40 to 392
  • Type: Thermally Conductive
  • Thermal Conductivity: 0.6600
Thermal Conductive Pad -- PK404
from Shiu Li Technology Co., Ltd

LiPOLY ’s PK404 is a material designed for gap filling. The thermal conductivity is 4.0W/m*K. The hardness is Shore 00/40 with high flexibility, high compressibility, highly insulating, great self-adhesive, which can cover the tolerance of design making it very stable. It also offers... [See More]

  • Chemical System: Silicone
  • Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
  • Type: Thermally Conductive
  • Gap Fill: 0.0197 to 0.3937
Momentive SnapSIL TN3705 Clear Silicone 310ml -- MOSI01364
from Techsil Limited

Momentive SnapSIL TN3075 is a low volatile siloxane, silicone adhesive sealant that cures at room temperature. It offers primerless adhesion to many substrates. Ideal for use as an insulating adhesive seal and fixing for electrical and electronic parts. Can also be used as a waterproof sealant for... [See More]

  • Chemical System: Silicone; Elastomeric
  • Industry: Electronics
  • Type: Thermally Conductive
7074724
from RS Components, Ltd.

This silicone heat sink paste has a self-life of 18 months from the date of manufacture when stored in the original, unopened container at or below 25 °C. Applications include: electronic components e.g. IC, CPU, MOS, LED, M/B, P/S, LCD-TV, Notebook PC, telecom device, wireless hub, DDRII... [See More]

  • Chemical System: Silicone
  • Form / Shape: Grease, Paste
  • Type: Thermally Conductive
  • Use Temperature: -40 to 356
Thermal - Adhesives, Epoxies, Greases, Pastes -- 860-60G-ND [860-60G from MG Chemicals]
from Digi-Key Electronics

HEAT TRANS COMPOUND SILICONE [See More]

  • Chemical System: Silicone
  • Use Temperature: -40 to 392
  • Type: Thermally Conductive
  • Thermal Conductivity: 0.6600
Thermal Conductive Pad -- PK504
from Shiu Li Technology Co., Ltd

LiPOLY ’s PK504 is a material designed for gap filling. The thermal conductivity is 5.0W/m*K. The hardness is Shore 00/50 with high flexibility, high compressibility, highly insulating, great self-adhesive, which can cover the tolerance of design making it very stable. It also offers... [See More]

  • Chemical System: Silicone
  • Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
  • Type: Thermally Conductive
  • Gap Fill: 0.0197 to 0.1969
Momentive TIA241GF Thermal Gap Filler 3.6kg Kit -- MOSI17211
from Techsil Limited

Momentive TIA241GF is a 2 part, thermally conductive silicone that is dispensed as a liquid and cured in place to create a heat path for efficient heat transfer. After being applied, the non-slumping paste consistency of TIA214GF provides physical stability to prevent run-off after dispense. [See More]

  • Chemical System: Silicone
  • Form / Shape: Gap Filler, Foam in Place Gasket; Grease, Paste
  • Type: Thermally Conductive
  • Industry: Electronics
7074733
from RS Components, Ltd.

This silicone heat sink paste has a self-life of 18 months from the date of manufacture when stored in the original, unopened container at or below 25 °C. Applications include: electronic components e.g. IC, CPU, MOS, LED, M/B, P/S, LCD-TV, Notebook PC, telecom device, wireless hub, DDRII... [See More]

  • Chemical System: Silicone
  • Form / Shape: Grease, Paste
  • Type: Thermally Conductive
  • Use Temperature: -40 to 356
Thermal - Adhesives, Epoxies, Greases, Pastes -- 926-1000-ND [A15423-03 from Laird Technologies]
from Digi-Key Electronics

THERMAL GREASE 30CC TGREASE 1500 [See More]

  • Chemical System: Silicone
  • Use Temperature: 257 to ?
  • Type: Thermally Conductive
  • Thermal Conductivity: 1.2
Thermal Conductive Pad -- PK605
from Shiu Li Technology Co., Ltd

LiPOLY ’s PK605 is a material designed for gap filling. The thermal conductivity is 6.0 W/m*K. The hardness is Shore 00/60 with high flexibility, high compressibility, highly insulating, great self-adhesive, which can cover the tolerance of design making it very stable. It also offers... [See More]

  • Chemical System: Silicone
  • Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
  • Type: Thermally Conductive
  • Gap Fill: 0.0197 to 0.1969
Momentive TIA350R Thermal Silicone Adhesive 1.04kg -- MOSI17210
from Techsil Limited

Momentive TIA350R is a one-component, heat curable silicone adhesive designed for thermally conductive applications. This grade cures quickly upon exposure to heat and adheres well to a wide variety of substrates. Recommended for use as a thermal interface material between dies and heat spreaders,... [See More]

  • Chemical System: Silicone; Elastomeric
  • Industry: Electronics
  • Type: Thermally Conductive
  • Use Temperature: -40 to 200
7074736
from RS Components, Ltd.

This silicone heat sink paste has a self-life of 18 months from the date of manufacture when stored in the original, unopened container at or below 25 °C. Applications include: electronic components e.g. IC, CPU, MOS, LED, M/B, P/S, LCD-TV, Notebook PC, telecom device, wireless hub, DDRII... [See More]

  • Chemical System: Silicone
  • Form / Shape: Grease, Paste
  • Type: Thermally Conductive
  • Use Temperature: -40 to 356
Thermal - Adhesives, Epoxies, Greases, Pastes -- 926-1003-ND [A15423-02 from Laird Technologies]
from Digi-Key Electronics

THERMAL GREASE 10CC TGREASE 1500 [See More]

  • Chemical System: Silicone
  • Use Temperature: 257 to ?
  • Type: Thermally Conductive
  • Thermal Conductivity: 1.2
Thermal Conductive Pad -- PK700
from Shiu Li Technology Co., Ltd

LiPOLY ’s PK700 is a material designed for gap filling. The thermal conductivity is 7.0 W/m*K. The hardness is Shore 00/55 with high flexibility, high compressibility, highly insulating, great self-adhesive, which can cover the tolerance of design making it very stable. It also offers... [See More]

  • Chemical System: Silicone
  • Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
  • Type: Thermally Conductive
  • Gap Fill: 0.0197 to 0.1969
Momentive TSE322 Dielectric Silicone Adhesive 1kg -- MOSI01181
from Techsil Limited

Momentive TSE322 is a heat curable silicone adhesive sealant which will bond to many substrates without the need for a primer and cures rapidly at elevated temperatures. Product Benefits. Easy to use, one-component material. Fast cure at elevated temperature. Offers self-adhesion properties. [See More]

  • Chemical System: Silicone; Elastomeric
  • Industry: Electronics
  • Type: Thermally Conductive
8805812 [188958F00000G from Aavid Thermalloy, LLC]
from RS Components, Ltd.

Aavid Thermalloy In-Sil-8 series thermal interface pads provide thermal conductance and electrical isolation in one package. In-Sil-8 pads are silicone-based insulators that come with thermally conductive fillers to isolate up to 6000 volts AC. In-Sil-8 pads withstand the rigors of assembly, harsh... [See More]

  • Chemical System: Silicone
  • Type: Thermally Conductive
Thermal - Adhesives, Epoxies, Greases, Pastes -- 926-1004-ND [A16241-01 from Laird Technologies]
from Digi-Key Electronics

THERMAL GREASE 30CC TGREASE 1500 [See More]

  • Chemical System: Silicone
  • Use Temperature: 257 to ?
  • Type: Thermally Conductive
  • Thermal Conductivity: 1.2
Thermal Conductive Pad -- S282
from Shiu Li Technology Co., Ltd

LiPOLY ’s S282 is a thermally conductive pad designed for gap filling. The thermal conductivity is 1.7 W/m*K. It uses fiberglass cloth as the reinforcement material with great self-adhesive that can fit closely with non-flat heat sinks to increase the contact area. The low stress damped... [See More]

  • Chemical System: Silicone
  • Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
  • Type: Thermally Conductive
  • Gap Fill: 0.0197 to 0.1969
Momentive TSE3331 Electronic Potting Silicone 2kg -- MOSI17151
from Techsil Limited

TSE3331 is a two part, heat curing silicone from Momentive Performance Materials designed for potting and encapsulation where flammability and/or thermal conductivity is of concern. It provides excellent flame retardant properties and very stable dielectric properties over a broad range of operating... [See More]

  • Chemical System: Silicone; Elastomeric
  • Industry: Electronics
  • Type: Thermally Conductive
  • Use Temperature: -55 to 200
8805816 [188854F00000G from Aavid Thermalloy, LLC]
from RS Components, Ltd.

Aavid Thermalloy In-Sil-8 series thermal interface pads provide thermal conductance and electrical isolation in one package. In-Sil-8 pads are silicone-based insulators that come with thermally conductive fillers to isolate up to 6000 volts AC. In-Sil-8 pads withstand the rigors of assembly, harsh... [See More]

  • Chemical System: Silicone
  • Type: Thermally Conductive
Thermal - Adhesives, Epoxies, Greases, Pastes -- 926-1577-ND [A17170-01 from Laird Technologies]
from Digi-Key Electronics

TPUTTY 508 [See More]

  • Chemical System: Silicone
  • Use Temperature: -40 to 302
  • Type: Thermally Conductive
  • Thermal Conductivity: 3.7
Thermal Conductive Putty -- H-PUTTY
from Shiu Li Technology Co., Ltd

Thermal Conductive Putty | LiPOLY H-putty is a tolerance filled, thermally conductive putty that maintains high compressibility with low stress, high reliability, and will not flow vertically. Our H-putty can replace thermals pads in design gaps of 0.1mm-3.0mm. H-Putty has a bond line thickness of... [See More]

  • Chemical System: Silicone
  • Form / Shape: Syringe/Cartridge/Pale
  • Type: Thermally Conductive
  • Industry: Electronics
Techsil® TIM11021G Thermal Silicone Paste 310ml -- TESI19081
from Techsil Limited

Techsil ® TIM11021G is a silicone compound that provides high thermal conductivity. It exhibits virtually no oil separation and minimal weight loss at elevated temperatures, which contributes to stability of TIM interface under broad operational temperature ranges. Techsil ® TIM- 11021G is... [See More]

  • Chemical System: Silicone; Elastomeric
  • Type: Thermally Conductive
8805819 [188858F00000G from Aavid Thermalloy, LLC]
from RS Components, Ltd.

Aavid Thermalloy In-Sil-8 series thermal interface pads provide thermal conductance and electrical isolation in one package. In-Sil-8 pads are silicone-based insulators that come with thermally conductive fillers to isolate up to 6000 volts AC. In-Sil-8 pads withstand the rigors of assembly, harsh... [See More]

  • Chemical System: Silicone
  • Type: Thermally Conductive
Thermal - Adhesives, Epoxies, Greases, Pastes -- 926-1578-ND [A17170-02 from Laird Technologies]
from Digi-Key Electronics

TPUTTY 508 [See More]

  • Chemical System: Silicone
  • Use Temperature: -40 to 302
  • Type: Thermally Conductive
  • Thermal Conductivity: 3.7
Thermal Conductive Putty -- S-PUTTY
from Shiu Li Technology Co., Ltd

Thermal Conductive Putty | LiPOLY S-putty is a thermally conductive putty that is great for filling small air gaps. The thermal conductivity is between 2.0~6.0 W/m*K. The high deformation material can fill gaps closely, cover high tolerance, overcome issues with overflow and solve drying problems to... [See More]

  • Chemical System: Silicone
  • Form / Shape: Syringe/Cartridge/Pale
  • Type: Thermally Conductive
  • Industry: Electronics
8805825 [188823F00000G from Aavid Thermalloy, LLC]
from RS Components, Ltd.

Aavid Thermalloy In-Sil-8 series thermal interface pads provide thermal conductance and electrical isolation in one package. In-Sil-8 pads are silicone-based insulators that come with thermally conductive fillers to isolate up to 6000 volts AC. In-Sil-8 pads withstand the rigors of assembly, harsh... [See More]

  • Chemical System: Silicone
  • Type: Thermally Conductive
Thermal - Adhesives, Epoxies, Greases, Pastes -- CT40-5-ND [CT40-5 from ITW Chemtronics]
from Digi-Key Electronics

SILICONE GREASE 5 0Z TUBE [See More]

  • Chemical System: Silicone
  • Use Temperature: 5 to 392
  • Type: Thermally Conductive
  • Thermal Conductivity: 0.6300
Thermal Conductive Putty -- SH-PUTTY3
from Shiu Li Technology Co., Ltd

LiPOLY SH-putty3 is a tolerance filled, thermally conductive putty that maintains high compressibility with low stress, high reliability, and will not flow vertically. Our SH-putty3 can replace thermals pads in design gaps of 0.1mm-3.0mm. SH-putty3 has a bond line thickness of 100-3000 μm. The... [See More]

  • Chemical System: Silicone
  • Form / Shape: Syringe/Cartridge/Pale
  • Type: Thermally Conductive
  • Industry: Electronics
8805828 [188923F00000G from Aavid Thermalloy, LLC]
from RS Components, Ltd.

Aavid Thermalloy In-Sil-8 series thermal interface pads provide thermal conductance and electrical isolation in one package. In-Sil-8 pads are silicone-based insulators that come with thermally conductive fillers to isolate up to 6000 volts AC. In-Sil-8 pads withstand the rigors of assembly, harsh... [See More]

  • Chemical System: Silicone
  • Type: Thermally Conductive
Thermal - Adhesives, Epoxies, Greases, Pastes -- TC1-10G-ND [TC1-10G from Chip Quik, Inc.]
from Digi-Key Electronics

HEAT SINK COMPOUND - HIGH DENSIT [See More]

  • Chemical System: Silicone
  • Thermal Conductivity: 0.6700
  • Type: Thermally Conductive
Two-Part Fast Curing Thermal Conductive Expoxy -- TPS96
from Shiu Li Technology Co., Ltd

LiPOLY TPS96 is a two-pack epoxy material for gap filling. The viscosity and flowing is very low. The high deformation material , which can filling the gap closely, cover the tolerance, and has outstanding conduc- tivity, makes is suitable for filling the peculiar gap. [See More]

  • Chemical System: Silicone
  • Form / Shape: Syringe/Cartridge/Pale; Gap Filler, Foam in Place Gasket
  • Type: Thermally Conductive
  • Industry: Electronics
9156042
from RS Components, Ltd.

These gel type silicone thermal interface pads offer high performance and come in a multitude of thermal conductivity ratings and thicknesses. They are ultra-soft and have a natural tack making instillation simple and widening their potential scope of applications. The GCS030GF range is glass filled... [See More]

  • Chemical System: Silicone
  • Use Temperature: -67 to 392
  • Type: Thermally Conductive
  • Thermal Conductivity: 4
Thermal - Adhesives, Epoxies, Greases, Pastes -- TC1-200G-ND [TC1-200G from Chip Quik, Inc.]
from Digi-Key Electronics

HEAT SINK COMPOUND - HIGH DENSIT [See More]

  • Chemical System: Silicone
  • Thermal Conductivity: 0.6700
  • Type: Thermally Conductive
Ultra Low Oil-Bleed Thermal Conductive Gel Pad -- AS200
from Shiu Li Technology Co., Ltd

LiPOLY AS200 is a thermally conductive gel designed for gap filling. The thermal conductivity is 2.0 W/m*K. The hardness is Shore 00/30, with high flexibility and compressibility. AS200 has ultra-low oil bleeding properties, which helps reduce pollutants from silicon oil, keeping electronic... [See More]

  • Chemical System: Silicone
  • Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
  • Type: Thermally Conductive
  • Gap Fill: 0.0197 to 0.1969
9156048
from RS Components, Ltd.

These gel type silicone thermal interface pads offer high performance and come in a multitude of thermal conductivity ratings and thicknesses. They are ultra-soft and have a natural tack making instillation simple and widening their potential scope of applications. The GCS030GF range is glass filled... [See More]

  • Chemical System: Silicone
  • Use Temperature: -67 to 392
  • Type: Thermally Conductive
  • Thermal Conductivity: 4
Thermal - Adhesives, Epoxies, Greases, Pastes -- TC1-20G-ND [TC1-20G from Chip Quik, Inc.]
from Digi-Key Electronics

HEAT SINK COMPOUND - HIGH DENSIT [See More]

  • Chemical System: Silicone
  • Thermal Conductivity: 0.6700
  • Type: Thermally Conductive
Ultra Low Oil-Bleed Thermal Conductive Gel Pad -- AS400
from Shiu Li Technology Co., Ltd

LiPOLY AS400 is a thermally conductive gel designed for gap filling. The thermal conductivity is 4.0 W/m*K. The hardness is Shore 00/45, with high flexibility and compressibility. AS400 has ultra-low oil bleeding properties, which helps reduce pollutants from silicon oil, keeping electronic... [See More]

  • Chemical System: Silicone
  • Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
  • Type: Thermally Conductive
  • Gap Fill: 0.0197 to 0.1969
9156051
from RS Components, Ltd.

These gel type silicone thermal interface pads offer high performance and come in a multitude of thermal conductivity ratings and thicknesses. They are ultra-soft and have a natural tack making instillation simple and widening their potential scope of applications. The GCS030GF range is glass filled... [See More]

  • Chemical System: Silicone
  • Use Temperature: -67 to 392
  • Type: Thermally Conductive
  • Thermal Conductivity: 4
Thermal - Adhesives, Epoxies, Greases, Pastes -- TC2-10G-ND [TC2-10G from Chip Quik, Inc.]
from Digi-Key Electronics

HEAT SINK COMPOUND - GREY ULTRA [See More]

  • Chemical System: Silicone
  • Use Temperature: -40 to 302
  • Type: Thermally Conductive
  • Thermal Conductivity: 4.3
Ultra Soft and High Thermal Condcutive Gap Filler -- T-pad900
from Shiu Li Technology Co., Ltd

LiPOLY T-pad900 is an ultra-soft, highly conformable, non-flammable interface material. T-pad900 is designed to allow minimal stress on components while offering excellent thermal conductivity and low thermal resistance. With a thermal conductivity of 9.0 W/m*K, T-pad900 offers excellent performance... [See More]

  • Chemical System: Silicone
  • Form / Shape: Sheet Form, Die-cut Parts
  • Type: Thermally Conductive
  • Gap Fill: 0.0197 to 0.1969
9156054
from RS Components, Ltd.

These gel type silicone thermal interface pads offer high performance and come in a multitude of thermal conductivity ratings and thicknesses. They are ultra-soft and have a natural tack making instillation simple and widening their potential scope of applications. The GCS030GF range is glass filled... [See More]

  • Chemical System: Silicone
  • Use Temperature: -67 to 392
  • Type: Thermally Conductive
  • Thermal Conductivity: 4
Thermal - Adhesives, Epoxies, Greases, Pastes -- TC2-20G-ND [TC2-20G from Chip Quik, Inc.]
from Digi-Key Electronics

HEAT SINK COMPOUND - GREY ULTRA [See More]

  • Chemical System: Silicone
  • Use Temperature: -40 to 302
  • Type: Thermally Conductive
  • Thermal Conductivity: 4.3
Ultra Soft and High Thermal Condcutive Gap Filler -- T-top81
from Shiu Li Technology Co., Ltd

LiPOLY T-top81 is an ultra-soft, highly conformable, non-flammable interface material. T-top81 is a high deflection material, designed to allow minimal stress on components while offering excellent thermal conductivity and low thermal resistance. With a thermal conductivity of 8.0 W/m*K, T-top81... [See More]

  • Chemical System: Silicone
  • Form / Shape: Sheet Form, Die-cut Parts
  • Type: Thermally Conductive
  • Gap Fill: 0.0197 to 0.1969
9156058
from RS Components, Ltd.

These gel type silicone thermal interface pads offer high performance and come in a multitude of thermal conductivity ratings and thicknesses. They are ultra-soft and have a natural tack making instillation simple and widening their potential scope of applications. The GCS030GF range is glass filled... [See More]

  • Chemical System: Silicone
  • Use Temperature: -67 to 392
  • Type: Thermally Conductive
  • Thermal Conductivity: 6
Thermal - Adhesives, Epoxies, Greases, Pastes -- TC2-50G-ND [TC2-50G from Chip Quik, Inc.]
from Digi-Key Electronics

HEAT SINK COMPOUND - GREY ULTRA [See More]

  • Chemical System: Silicone
  • Use Temperature: -40 to 302
  • Type: Thermally Conductive
  • Thermal Conductivity: 4.3
Ultra Soft and High Thermal Condcutive Gap Filler -- T-Work7000
from Shiu Li Technology Co., Ltd

Our high thermally conductive gap filler T-work7000 provides excellent compression and extremely low thermal resistance in form shape with high thermal conductivity for gap filling between electrical component and heatsink. [See More]

  • Chemical System: Silicone
  • Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
  • Type: Thermally Conductive
  • Gap Fill: 0.0197 to 0.1969
9156060
from RS Components, Ltd.

These gel type silicone thermal interface pads offer high performance and come in a multitude of thermal conductivity ratings and thicknesses. They are ultra-soft and have a natural tack making instillation simple and widening their potential scope of applications. The GCS030GF range is glass filled... [See More]

  • Chemical System: Silicone
  • Use Temperature: -67 to 392
  • Type: Thermally Conductive
  • Thermal Conductivity: 6
Thermal - Pads, Sheets -- 1009AC-60-ND [1009AC-60 from Bergquist Company (The)]
from Digi-Key Electronics

THERM PAD 11.1MMX7.92MM W/ADH [See More]

  • Chemical System: Silicone
  • Thermal Conductivity: 1.2
  • Type: Thermally Conductive
Ultra Soft and High Thermal Condcutive Gap Filler -- T-Work8000
from Shiu Li Technology Co., Ltd

LiPOLY T-work8000 is a high performance thermally conductive interface pad. T-work8000 offers outstanding thermal conductivity at 15.0 W/m*K and extremely low thermal resistance under minimal force. T-work8000 offers excellent compression, filling small air gaps and uneven surfaces, ensuring an... [See More]

  • Chemical System: Silicone
  • Form / Shape: Sheet Form, Die-cut Parts
  • Type: Thermally Conductive
  • Gap Fill: 0.0197 to 0.1969
9156064
from RS Components, Ltd.

These gel type silicone thermal interface pads offer high performance and come in a multitude of thermal conductivity ratings and thicknesses. They are ultra-soft and have a natural tack making instillation simple and widening their potential scope of applications. The GCS030GF range is glass filled... [See More]

  • Chemical System: Silicone
  • Use Temperature: -67 to 392
  • Type: Thermally Conductive
  • Thermal Conductivity: 6
Thermal - Pads, Sheets -- 102-5103-ND [SF100-101005 from CUI Devices]
from Digi-Key Electronics

THERM PAD 10MMX10MM 1 SHT=820 PC [See More]

  • Chemical System: Silicone
  • Thermal Conductivity: 1.5
  • Type: Thermally Conductive
Ultra Soft and High Thermal Condcutive Gap Filler -- T-Work9000
from Shiu Li Technology Co., Ltd

LiPOLY T-work9000 offers outstanding thermal conductivity at 20.0 W/m*K and extremely low thermal resistance under minimal force. T-work9000 offers excellent compression, filling small air gaps on uneven surfaces, ensuring an efficient and consistent transfer of heat. [See More]

  • Chemical System: Silicone
  • Form / Shape: Sheet Form, Die-cut Parts
  • Type: Thermally Conductive
  • Gap Fill: 0.0197 to 0.1969
Chemical,Heat Sink Comp,1 lb,Silicone Free,Jar -- 70207177 [1978-1 from Techspray, an ITW Company]
from Allied Electronics, Inc.

Features exceptionally low bleed and evaporation characteristics. Will not harden, dry out or melt; will not contaminate wave and solder baths. Meets or exceeds KS 21343 and MIL-C-47113. Use with both metal and plastic. Ideal for Electronic Applications. Avoids Silicone Contamination for Soldering [See More]

  • Chemical System: Silicone
  • Form / Shape: Grease, Paste
  • Type: Thermally Conductive
  • Use Temperature: -40 to 392
Clear Non-Yellowing Silicone Encapsulant -- PNS-56225
from Protavic America, Inc.

PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]

  • Chemical System: Silicone
  • Composition: Unfilled
  • Type: Electrically Conductive; Thermally Conductive
  • Cure / Technology: Thermoset; Two Component  
BERGQUIST GAP PAD TGP 1350
from Henkel Corporation - Industrial

BERGQUIST GAP PAD TGP 1350, Highly Conformable, Thermally Conductive, Reworkable Gap Filling Material. BERGQUIST ® GAP PAD TGP 1350 is a highly compliant Gap Pad material that is ideal for fragile component leads. The material includes a PEN film, which facilitates rework and improves puncture... [See More]

  • Chemical System: Silicone
  • Form / Shape: Gap Filler, Foam in Place Gasket
  • Type: Thermally Conductive
Electrically Conductive Silicone Adhesive -- SEMICOSIL® 979 EC
from Wacker Chemical Corp.

SEMICOSIL ® 979 EC is a RTV-1 amine cure silicone rubber that cures on contact with moisture in the air. Special features. Low volume resistivity. Thixotropic paste. Solvated. Excellent adhesion to many substrates. Application. SEMICOSIL ® 979 EC is an electrically conductive adhesive for... [See More]

  • Chemical System: Silicone; Elastomeric
  • Cure / Technology: Thermoset; Single Component; Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing
  • Type: Electrically Conductive
  • Form / Shape: Grease, Paste
Metal Oxide Thickened Dimethyl Silicone Compound -- Bluesil™ V-740
from Bluestar Silicones USA Corp.

Metal Oxide Thickened Dimethyl Silicone Compound. Description. Bluesil V-740 is a metal oxide thickened dimethyl silicone compound. It is a white, heavy paste used for heat dissipation applications where high thermal conductivity is required. [See More]

  • Chemical System: Silicone
  • Cure / Technology: Two Component  
  • Type: Thermally Conductive
  • Form / Shape: Grease, Paste
High Thermally Conductive Paste -- OMEGATHERM® OT-201 Series
from OMEGA Engineering, Inc.

OMEGATHERM thermal conducting paste is a high temperature and high thermally conductive paste product. They are specially formulated for permanent and temporary bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics,... [See More]

  • Chemical System: Silicone
  • Cure / Technology: Single Component
  • Type: Thermally Conductive
  • Form / Shape: Grease, Paste
Thermally Conductive Silicone Rubber -- 50-1225
from Epoxies Etc...

50-1225 is a low viscosity, room temperature curing, RTV silicone potting and encapsulating compound. When cured, this material forms a soft, highly flexible, flame retardant, and thermally conductive package. [See More]

  • Chemical System: Silicone; Elastomeric
  • Composition: Unfilled
  • Type: Thermally Conductive
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Chemical; Silicone Free; Heat Sink Grease; Tube, 8 g syringe -- 70219353
from Allied Electronics, Inc.

The tube dispenser for precise application of silicone compound that facilitates heat transfer away from electronics and electrical components. Excellent Thermal Conductivity and Dielectric Properties. Will Not Dry Out, Harden or Melt. Noncorrosive and Nonflammable. Thermally Stable from –40... [See More]

  • Chemical System: Silicone
  • Form / Shape: Grease, Paste
  • Type: Thermally Conductive
Silicone Encapsulant -- PTS-46303
from Protavic America, Inc.

PTS-46303 A/B ™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include... [See More]

  • Chemical System: Silicone
  • Composition: Filled
  • Type: Thermally Conductive
  • Cure / Technology: Thermoset; Two Component  
Electrically Non-Conductive Adhesives -- LOCTITE ABLESTIK 12-2
from Henkel Corporation - Industrial

LOCTITE ABLESTIK 12-2, Silicone, General Assembly LOCTITE ® ABLESTIK 12-2 adhesive is the lower viscosity version of ABLETHERM 12-1 adhesive. It is designed for bonding applications which require high thermal conductivity and reworkability. Thermally conductive. Reworkable. Unfilled [See More]

  • Chemical System: Silicone
  • Cure / Technology: Single Component
  • Type: Thermally Conductive
Flowable, One-component Silicone Sealant -- CENUSIL® RT 760 CN A/B
from Wacker Chemical Corp.

WACKER ’s silicone adhesives and sealants are based on many years of experience, innovative research and comprehensive technological expertise. In a wide variety of industries, especially in lighting technology, flowable or non-sag silicone products offer decisive advantages in performance and... [See More]

  • Chemical System: Silicone; Elastomeric
  • Industry: Electronics
  • Type: Thermally Conductive
Thermally Conductive Grease -- OT-201 Series
from OMEGA Engineering, Inc.

OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper products. [See More]

  • Chemical System: Silicone
  • Cure / Technology: Single Component
  • Type: Thermally Conductive
  • Form / Shape: Grease, Paste
Chemical; Silicone; Heat Sink Grease; Tube; -- 70219367
from Allied Electronics, Inc.

The tube dispenser for precise application of silicone compound that facilitates heat transfer away from electronics and electrical components. Excellent Thermal Conductivity and Dielectric Properties. Will Not Dry Out, Harden or Melt. Noncorrosive and Nonflammable. Thermally Stable from –40... [See More]

  • Chemical System: Silicone
  • Form / Shape: Grease, Paste
  • Type: Thermally Conductive
  • Use Temperature: -40 to 342
Electrically Non-Conductive Adhesives -- LOCTITE ABLESTIK 813J01 BIPAX
from Henkel Corporation - Industrial

LOCTITE ABLESTIK 813J01 BIPAX, Silicone, Non-corrosive, Encapsulant LOCTITE ® ABLESTIK 813J01 BIPAX exhibits very low stress upon cure thus preventing component cracking and other stress-related problems. This adhesive can be cured at room temperature in thick or thin sections. It is... [See More]

  • Chemical System: Silicone
  • Cure / Technology: Single Component
  • Type: Thermally Conductive
  • Viscosity: 40000
HEAT SINK HTC SILICONE 1 OZ. -- 70159753 [10/1/1935 from GC Electronics]
from Allied Electronics, Inc.

Wrist Strap Ground Cords, Ground Cord. Higher thermal conductivity formula has all the same benefits of conventional heat sink greases, plus is exceptionally stable in high humidity applications. All GC Aerosols, Except as noted contain no Ecology-Damaging Fluorocarbons [See More]

  • Chemical System: Silicone
  • Form / Shape: Grease, Paste
  • Type: Thermally Conductive
  • Use Temperature: -40 to 400
Encapsulants -- LOCTITE STYCAST 5952-1
from Henkel Corporation - Industrial

LOCTITE STYCAST 5952-1, Silicone, Potting or Encapsulant. LOCTITE ® STYCAST 5952-1 is designed for encapsulation of heat generating devices. It is also recommended for applications requiring a non-corrosive casting and coating. Electrically non-conductive. Good elongation strength. Moderate tear... [See More]

  • Chemical System: Silicone
  • Cure / Technology: Two Component  
  • Type: Thermally Conductive
  • Thermal Conductivity: 0.8000
SILICONE HEAT SINK COMPOUND, TUBE, 1 FL. OZ. -- 70159792 [10/9/2016 from GC Electronics]
from Allied Electronics, Inc.

Heat Sink, 2.350 Specific Gravity. Silicone Heat Sink Compound, Odorless, 1 Fl. Oz Tube. All GC Aerosols, Except as noted contain no Ecology-Damaging Fluorocarbons [See More]

  • Chemical System: Silicone
  • Form / Shape: Grease, Paste
  • Type: Thermally Conductive
  • Use Temperature: -40 to 400