Electrical Power / HV (Coils, Motors) Conductive Compounds
from ELANTAS North America LLC
Mineral-filled VPI resin - semi-flexible for transformers with improved heat dissipation [See More]
- Industry: Aerospace; Automotive; Electric Power; OEM or Industrial
- Chemical System: Alkyd
- Type: Thermally Conductive
- Composition: Filled
from Master Bond, Inc.
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Optical; Semiconductors, IC's
- Chemical System: Silicone
- Type: Thermally Conductive
- Composition: Unfilled
from Ellsworth Adhesives
Henkel Loctite STYCAST 2850FT Blue, formerly Emerson and Cuming, is a two component, thermally conductive, epoxy encapsulant that is used for encapsulating components that are exposed to thermal shock and need heat dissipation. It has a low coefficient of thermal expansion and excellent electrical... [See More]
- Industry: Electric Power
- Cure / Technology: Two Component
- Type: Thermally Conductive
- Thermal Conductivity: 1.1 to 1.28
from Hernon Manufacturing, Inc.
Dissipator ® 745 is a thermally conductive room temperature cure adhesive that is designed for bonding electrical components to heat sink with a controlled gap. Dissipator ® 745, through a special shimming property, insulates the component electrically while allowing thermal conductivity. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Type: Thermally Conductive
from Cri-Tech, Inc.
Cri-plastMP ™ PFA Electrically Conductive Compounds are formulated to meet your static dissipative/conductive, ATEX requirements in multiple applications. Specific grades can be processed by injection, extrusion, transfer molding, and compression molding. Superior static dissipative compounds... [See More]
- Industry: Electronics; Electric Power; Injection/Transfer Molding, Linings, Tubing, Sheet/Film
- Features: Anti-static, ESD
- Type: Electrically Conductive
- Tensile (Break): 493125
from Master Bond, Inc.
Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Ellsworth Adhesives
Henkel Loctite STYCAST 2850KT Blue, formerly Emerson and Cuming, is a two component, room temperature curing, epoxy encapsulant that is used for high voltage components and replacing heat sinks. It contains a filler that is gritty. It offers a low coefficient of thermal expansion, reduce stress, and... [See More]
- Industry: Electric Power
- Cure / Technology: Two Component
- Type: Thermally Conductive
- Thermal Conductivity: 2.29 to 2.78
from Hernon Manufacturing, Inc.
Hernon Dissipator 745D is a thermally conductive room temperature cure adhesive that is designed for bonding electrical components to heat sink with a controlled gap. Dissipator 745D, through a special shimming property, insulates the component electrically while allowing thermal... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Type: Thermally Conductive
from Master Bond, Inc.
EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's; Aerospace
- Chemical System: Epoxy
- Type: Thermally Conductive
- Composition: Unfilled
from Ellsworth Adhesives
Henkel Loctite STYCAST 2850KT Blue, formerly Emerson and Cuming, is a two component, room temperature curing, epoxy encapsulant that is used for high voltage components and replacing heat sinks. It contains a filler that is gritty. It offers a low coefficient of thermal expansion, reduce stress, and... [See More]
- Industry: Electric Power
- Cure / Technology: Two Component
- Type: Thermally Conductive
- Thermal Conductivity: 2.29 to 2.78
from Hernon Manufacturing, Inc.
Hernon Dissipator 746D is a thermally conductive adhesive formulated for bonding electrical components to heat sinks or printed circuit boards. Fast room temperature cure combined with excellent heat dissipation for thermally sensitive components and controlled strength for service repair provide... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Chemical System: Silicone
- Type: Thermally Conductive
- Cure / Technology: Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
EP3HTND-2Med Black is a one part system that combines easy processing with excellent bonding properties. It cures in 20-30 minutes at 250°F or 5-10 minutes at 300°F and adheres well to a wide variety of substrates including glass, metals, ceramics and most plastics. This paste compound meets USP... [See More]
- Industry: Aerospace; Electronics; Electric Power; Photonics; Semiconductors, IC's
- Chemical System: Epoxy
- Type: Thermally Conductive
- Composition: Unfilled
from Ellsworth Adhesives
Henkel Loctite STYCAST 2850MT Blue, formerly Emerson and Cuming, is a two component, room temperature and heat curing, epoxy encapsulant that is used for high voltage applications and for components that are exposed to thermal shock and need heat dissipation. It offers a low coefficient of thermal... [See More]
- Industry: Electric Power
- Cure / Technology: Two Component
- Type: Thermally Conductive
- Thermal Conductivity: 1.5 to 1.9
from Master Bond, Inc.
One part, nano silica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: UV Curing
- Type: Thermally Conductive
- Composition: Filled
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Silicone
- Type: Electrically Conductive; Thermally Conductive
- Composition: Filled
from Master Bond, Inc.
EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Epoxy
- Type: Thermally Conductive
- Composition: Unfilled
from Master Bond, Inc.
Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Polyphenylene Sulfide; Epoxy
- Type: Electrically Conductive; Thermally Conductive
- Composition: Filled
from Master Bond, Inc.
EP35SP is a two component epoxy system specially formulated to resist high temperatures and aggressive chemicals. It has a paste viscosity with little to no flow when curing. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's; Downhole
- Chemical System: Epoxy
- Type: Thermally Conductive
- Composition: Unfilled
from Master Bond, Inc.
EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Epoxy
- Type: Thermally Conductive
- Composition: Unfilled
from Master Bond, Inc.
Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature. The... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Unfilled
from Master Bond, Inc.
Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel strength exceeding 40 pli. The service... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Chemical System: Epoxy
- Type: Electrically Conductive
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer Adhesive EP33 is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond Polymer Adhesive EP33 produces high strength bonds whose... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Unfilled
from Master Bond, Inc.
MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Silicone
- Type: Thermally Conductive
- Composition: Filled
from Master Bond, Inc.
Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will form bond strengths in excess of 2,500 psi (aluminum to aluminum). It bonds well to a variety of substrates... [See More]
- Industry: Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Unfilled
from Master Bond, Inc.
Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]
- Industry: Aerospace; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Unfilled
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-NS10 ™ epoxy is developed for general purpose applications requiring high performance bond or connection of electrically conductive components/materials for enhanced electrical conductivity. G6E-NS10 ™ has been developed based on advanced proprietary technology that... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; PCB Manufacture / Repair, EMI / RFI Shielding, Display Packaging / Bonding, Solder Replacement
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Protavic America, Inc.
PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]
- Industry: Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Chemical System: Silicone
- Type: Electrically Conductive; Thermally Conductive
- Composition: Unfilled
from Shiu Li Technology Co., Ltd
LiPOLY S393 is a product with high ductile thermal conductivity. Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material. It won't easy to break and deformwhether stamped, punched, strip type, or custom cutting. Your best choice... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Silicone
- Type: Thermally Conductive
- Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
from Epoxies Etc...
50-3122 is a one component (no mixing is necessary) epoxy adhesive with a unique combination of physical properties. This adhesive provides both high shear and high peel strengths. It is also able to maintain exceptionally strong bonds over a wide temperature range of -60 to +205 °C. 50-3122 is... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial
- Chemical System: Epoxy
- Type: Thermally Conductive
- Composition: Filled
from Ohmite Manufacturing Co.
Ohmite thermal interface materials (TIMs) are designed for use in applications requiring reliable performance, low contact resistance, long life, low maintenance and high thermal conductivity. The flexible graphite materials are die-cut to ensure exact fit and reduce module-to-module variation... [See More]
- Industry: Electronics; Electric Power; OEM or Industrial
- Chemical System: Flexible Graphite Material
- Type: Thermally Conductive
- Use Temperature: -40 to 752
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Industry: Electronics; Electric Power
- Chemical System: Polyamide
- Type: Thermally Conductive
- Cure / Technology: Thermoplastic / Hot Melt
from Bluestar Silicones USA Corp.
Metal Oxide Thickened Dimethyl Silicone Compound. Description. Bluesil V-740 is a metal oxide thickened dimethyl silicone compound. It is a white, heavy paste used for heat dissipation applications where high thermal conductivity is required. [See More]
- Industry: Electronics; Electric Power; Semiconductors, IC's
- Chemical System: Silicone
- Type: Thermally Conductive
- Cure / Technology: Two Component
from Sanchem, Inc.
is the electrical contact grease of choice in new electrical installations and maintenance because of its excellent performance in keeping metals free from corrosion. This rust preventitive has been used for over 50 years to preventing corrosion in electrical connectors from low micro-power... [See More]
- Industry: Electronics; Electric Power
- Cure / Technology: Non-Drying
- Type: Electrically Conductive
- Form / Shape: Gel
from Sauereisen, Inc.
Sauereisen Cement No. 31 is a white, porcelain-like cement that is widely used throughout industry in a variety of applications. including assembling, sealing, insulating and cementing of ceramics, porcelain, metal, and glass. [See More]
- Industry: Electronics; Electric Power
- Chemical System: Ceramic
- Type: Thermally Conductive
- Composition: Unfilled
from Graphene Laboratories, Inc.
DESCRIPTION: Traditional silver-based adhesives require up to 80% weight load of silver fillers and as a result tend to be costly, brittle and prone to mechanical failure. G6E-NS11 ™ has been developed based on advanced proprietary technology that requires 15% or less silver content to be at... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; PCB Manufacture / Repair, EMI / RFI Shielding, Display Packaging / Bonding, Solder Replacement
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Protavic America, Inc.
ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued shrinkage and movement. Bond lines are clear, colorless and exhibit low shrinkage during the curing process. [See More]
- Industry: Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Composition: Unfilled
- Type: Electrically Conductive
- Cure / Technology: Thermoset; Two Component ; UV or Radiation Cured
from Shiu Li Technology Co., Ltd
LiPOLY S818 is a product with high ductile thermal conductivity.Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material.It won't easy to break and deform whether stamped, punched, strip type, or custom cutting. Your best choice... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Silicone
- Type: Thermally Conductive
- Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
from Epoxies Etc...
50-3150 FR has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-3150 FR Black Epoxy with Catalyst 190 and Catalyst 105 are listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low shrinkage, and outstanding insulation... [See More]
- Industry: Electronics; Electric Power
- Chemical System: Epoxy
- Type: Thermally Conductive
- Composition: Unfilled
from Graphene Laboratories, Inc.
G6 Epoxy® is excited to announce the release of our latest product - a one-component electrically conductive epoxy. This innovative solution provides excellent electrical conductivity and bonding strength in a single component formula, making it easier and more convenient to use than traditional... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial
- Chemical System: Epoxy
- Type: Electrically Conductive
- Cure / Technology: Thermoset; Single Component
from Protavic America, Inc.
Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for production needs. One... [See More]
- Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Chemical System: Epoxy
- Type: Electrically Conductive; Thermally Conductive
- Composition: Filled
from Shiu Li Technology Co., Ltd
LiPOLY DCTP140-s is a thermal insulator uses fiberglass cloth as a reinforcement material, combined with thermal conductive silicon, giving it high thermal conduction and great compression strength. The thermal conductivity is 4.5 W/m*K, the thickness is 0.25~0.45mm. Its high insulation and... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Silicone
- Type: Thermally Conductive
- Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-FRP ™ is a flexible version of our G6E-P ™ general purpose epoxy. G6E-FRP ™ epoxy was developed primarily for high-performance bonding, connection, sealing and coating applications requiring a flexible bond or connection of electrically conductive components or... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Fiber-Optics Packaging, Flexible Photovoltaic (Solar) Cell Packaging, Surface Acoustic Wave (SAW) Devices
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Protavic America, Inc.
Epoxy system designed for underfill applications. This material is fast flowing and provides excellent properties for common device packaging. [See More]
- Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Chemical System: Epoxy
- Type: Thermally Conductive
- Cure / Technology: Thermoset; Single Component
from Shiu Li Technology Co., Ltd
LiPOLY T-top99-s offers outstanding thermal conductivity at 24.0 W/m*K and extremely low thermal resistance under minimal force.T-top99-s offers excellent compression, filling small air gaps on uneven surfaces, ensuring an efficient and consistent transfer of heat. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Silicone
- Type: Thermally Conductive
- Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-FXNS ™ epoxy is developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials as well as for low electrical resistivity. G6E-FXNS ™ is developed based on advanced proprietary technology that requires... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Fiber-Optics Packaging, Solder Replacement
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Protavic America, Inc.
PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ is heat stable up to 150 °C. [See More]
- Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Chemical System: Epoxy
- Type: Thermally Conductive
- Composition: Filled
from Shiu Li Technology Co., Ltd
LiPOLY's TPS series is a low-density, potting material. Its low density and lightweight properties enhance product performance, reduce production costs. The product has a thermal conductivity of 0.55-1.50 W/m*K and can cure at room temperature or high temperatures. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Chemical System: Silicone
- Type: Thermally Conductive
- Cure / Technology: Room Temperature Vulcanizing or Curing
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-FXSG ™ epoxy is primarily developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials requiring low electrical resistivity. G6-FXSG ™ is well suited for bonding of dissimilar materials that are... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Fiber-Optics Packaging, Solder Replacement
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Shiu Li Technology Co., Ltd
Non-Silicone Thermal Compound N800C-s is made of non-silicon resin material. No low molecular siloxane volatilization and low total volatile gas, no electrical contact & pollution problems. N800C-s can have low thermal resistance and high thermal conductivity. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial
- Chemical System: Non-Silicone
- Type: Thermally Conductive
- Form / Shape: Sheet Form, Die-cut Parts
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-P ™ epoxy is primarily developed for general purpose applications requiring high-performance bond or connection of electrically conductive components/materials. G6E-P ™ is formulated with proprietary nanomaterials and fillers. G6E-P ™ epoxy can be cured at room... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Photovoltaic (Solar) Cells, Casting, Coating & Encapsulation, Display Packaging / Bonding, Temperature Sensitive Electronics, Solder Replacement
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Shiu Li Technology Co., Ltd
LiPOLY N-putty2-s series is a non-silicon thermally conductive material without volatilization of low molecular siloxane, and low total volatile gas. With a thermal conductivity of 5.0 W/m*K, the high deformation can perfectly fill small air gaps to eliminate tolerances. It also can overcome... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial
- Chemical System: Non-Silicone
- Type: Thermally Conductive
- Form / Shape: Syringe/Cartridge/Pale
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-HTC ™ epoxy is developed primarily for applications requiring a high-performance bond or connection of electrically conductive components/materials that operate at higher temperatures. G6E-HTC ™ epoxy ’s properties result from being formulated with proprietary... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; EMI / RFI Shielding, Grounding, Casting, Coating & Encapsulation
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Shiu Li Technology Co., Ltd
LiPOLY's NL-putty series is a silicone free, low-density gel filling material. Its low density and lightweight characteristics enhance product performance, reduce production costs. Commonly used in electronic products and automotive electronic devices, this series has a thermal conductivity of... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Chemical System: Silicone Free
- Type: Thermally Conductive
- Form / Shape: Syringe/Cartridge/Pale; Gap Filler, Foam in Place Gasket; Gel; Liquid
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-HTNS ™ epoxy is developed primarily for applications requiring a high-performance bond or connection of electrically conductive components/materials which operate at higher temperatures requiring low electrical resistivity. G6E-HTNS ™ is developed based on advanced... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Radio Frequency Identification (RFID) tags, EMI / RFI Shielding, Solder Replacement
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Shiu Li Technology Co., Ltd
LiPOLY S-putty5-s is a one-part dispensable material with thermal conductivity 10.0 W/m*K. It also can overcome overflow and drying problems to increase the thermal conductivity. S-putty5-s is a great alternative to thermal grease and ideally suited for dispensing using the dispensing robot. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial
- Chemical System: Silicone
- Type: Thermally Conductive
- Form / Shape: Syringe/Cartridge/Pale
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-HTSG ™ epoxy is primarily developed for applications requiring a high-performance bond or connection of electrically conductive components/materials which operate at higher temperatures and which require low electrical resistivity. G6E-HTSG ™ epoxy is formulated with... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; EMI / RFI Shielding, Grounding, Casting, Coating & Encapsulation, Solder Replacement
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Shiu Li Technology Co., Ltd
LiPOLY TEM96D is a thermally conductive absorber based upon soft magnetic materials dispersed in a polymeric resin. It has a thermalconductivity of 5.0 W/m*K and dissipates electromagnetic radiation rapidly to mitigate against EMI issues. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Silicone
- Type: Thermally Conductive
- Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
from Graphene Laboratories, Inc.
Our G6E-TSHV ™ Epoxy has been specifically developed for general purpose applications that necessitate the bonding or connecting of thermally conductive components/materials. It is designed to provide efficient heat transfer between components or surfaces, while also providing the bonding and... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Thermal Interface Materials (TIMs), Solar panels
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Shiu Li Technology Co., Ltd
LiPOLY HC-93 is a stereoscopic thermal conductive silicone rubber cap as substrate through a special production process. Due to its excellent characteristic of high thermal conductivity, insulation, shockproof and convenient assembly, it is widely used in heat transistor refer to TO220 / TO3P,... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Silicone
- Type: Thermally Conductive
- Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-RTC ™ Room Temperature Curable Carbon Filled Electrically Conductive epoxy is developed primarily for applications requiring curing at room temperature. G6E-RTC ™ epoxy is formulated with proprietary nanomaterials and fillers to provide its performance characteristics. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Photovoltaic (Solar) Cells, Casting, Coating & Encapsulation, EMI / RFI Shielding, Cold Solder Replacement
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Shiu Li Technology Co., Ltd
LiPOLY SP is a stereoscopic thermal conductive silicone rubber cap as substrate through a special production process. Due to its excellent characteristic of high thermal conductivity, insulation, shockproof and convenient assembly, it is widely used in heat transistor refer to TO220 / TO3P, diode,... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Silicone
- Type: Thermally Conductive
- Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-RTSG ™ epoxy is developed primarily for applications that require curing at room temperature. Room temperature curing eliminates the necessity for a heating oven. This allows easier and safer bond/connection of conductive components or materials. G6E-RTSG ™ epoxy is also... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; PCB Manufacture/Repair, Photovoltaic Cell Packaging, Temperature Sensitive Electronics Bonding, Display Packaging/Bonding
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Shiu Li Technology Co., Ltd
LiPOLY TP200 is a stereoscopic thermal conductive silicone rubber cap as substrate through a special production process. Due to its excellent characteristic of high thermal conductivity, insulation, shockproof and convenient assembly, it is widely used in heat transistor refer to TO220 / TO3P,... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Silicone
- Type: Thermally Conductive
- Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-SG ™ epoxy is developed for general purpose applications requiring high-performance bond or connection of electrically conductive components/materials that require low electrical resistivity. G6E-SG ™ is formulated with proprietary nanomaterials and fillers. G6E-SG... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Photovoltaic (Solar) Cells, Casting, Coating & Encapsulation, EMI / RFI Shielding, Solder Replacement, Display Packaging / Bonding
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Shiu Li Technology Co., Ltd
LiPOLY AS02-s is a material with double sided inherent tack, low thermal resistance and high thermal conductivity. It has excellent compressive strength characteristics and good electrical isolation function for high-power electronic components, making it the best choice for thin design... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Silicone
- Type: Thermally Conductive
- Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
from Graphene Laboratories, Inc.
Our G6E-TSAL ™ Epoxy has been specifically developed for general purpose applications that necessitate the bonding or connecting of thermally conductive components/materials. It is designed to provide efficient heat transfer between components or surfaces, while also providing the bonding and... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Thermal Interface Materials (TIMs), Solar panels
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled