Electronics (PCB / SMT Assembly) Conductive Compounds

126 Results
Addition Cured Silicone is Optically Clear with Enhanced Low Temperature Serviceability -- MasterSil 157
from Master Bond, Inc.

MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Optical; Semiconductors, IC's
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Composition: Unfilled
1-Part, Thermally Conductive, Black, RTV Silicone Adhesive, UL Listed -- AS1802-Black
from CHT USA Inc.

CHT ’s AS1802 Black is a 1-part, non-corrosive, neutral cure, thermally conductive, black RTV silicone adhesive sealant. It is one in a range of CHT ’s acetone cure products which are all solvent-free. It features a fast skin over time at 4 minutes. AS1802 Black is designed with... [See More]

  • Industry: Automotive; Electronics
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Cure / Technology: Single Component; Acetone
Dow DOWSIL™ 3-1818 TC Adhesive Gray 1.5 kg Cartridge -- 3-1818 TC ADHESIVE 1.5KG [4014893 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™ 3-1818 Thermally Conductive Adhesive Gray is a one component, thixotropic adhesive that is used for bonding with common materials in the electronics industry. It has a fast heat cure, glass beads for controlling bond line thickness, self priming, good dielectric properties, and... [See More]

  • Industry: Electronics
  • Cure / Technology: Single Component
  • Type: Thermally Conductive
  • Thermal Conductivity: 1.8
LOCTITE ABLESTIK QMI529HT-LV, BMI Hybrid, Die Attach, Conductive Adhesive -- LOCTITE ABLESTIK QMI529HT-LV
from Henkel Adhesive Technologies - Aviation, Space and Rail

LOCTITE ® ABLESTIK QMI529HT-LV conductive die attach adhesive has been formulated for use in high throughput die attach applications. Electrically conductive. Thermally conductive. Good dispensing characteristics. Hydrophobic [See More]

  • Industry: Electronics; OEM or Industrial
  • Cure / Technology: Thermoset
  • Type: Electrically Conductive
  • CTE: 34
Extremely Compressible Thermal Gap Filler -- SARCON® PG45A
from Fujipoly® America Corp.

Fujipoly ® introduces Sarcon ® PG45A its newest high-performance, putty-like thermal interface material. This extremely low modulus gap filler exhibits a thermal resistance as low as 0.02 °C •in2/W at 43.5 PSI with a thermal conductivity of 4.5 W/m °K. Sarcon ® PG45A... [See More]

  • Industry: Electronics; Semiconductors, IC's
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Form / Shape: Putty; Gap Filler, Foam in Place Gasket
Thermal Interface Materials for Heatsinkable Devices -- TGH-TP1
from Ohmite Manufacturing Co.

Ohmite thermal interface materials (TIMs) are designed for use in applications requiring reliable performance, low contact resistance, long life, low maintenance and high thermal conductivity. The flexible graphite materials are die-cut to ensure exact fit and reduce module-to-module variation... [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial
  • Chemical System: Flexible Graphite Material
  • Type: Thermally Conductive
  • Use Temperature: -40 to 752
5G mmWave Thermal Conductive Gel Pad -- DTT44-s
from Shiu Li Technology Co., Ltd

LiPOLY DTT44 is a soft thermally conductive gel pad specifically designed for networking applications. DTT44 is designed to focus on Dk and Df to reduce interference in RF modules. DTT44 has a thermal conductivity of 3.0 W/m*K. This product can be supplied as standard sheets, custom die-cuts or... [See More]

  • Industry: Electronics
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Form / Shape: Sheet Form, Die-cut Parts
CONDUCTIVE SILVER-CARBON EPOXY -- G6E-NS10
from G6 Epoxy

DESCRIPTION: G6E-NS10 ™ epoxy is developed for general purpose applications requiring high performance bond or connection of electrically conductive components/materials for enhanced electrical conductivity. G6E-NS10 ™ has been developed based on advanced proprietary technology that... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; PCB Manufacture / Repair, EMI / RFI Shielding, Display Packaging / Bonding, Solder Replacement
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Filled
Electrically Conductive Compounds -- Cri-plastMP™ PFA
from Cri-Tech, Inc.

Cri-plastMP ™ PFA Electrically Conductive Compounds are formulated to meet your static dissipative/conductive, ATEX requirements in multiple applications. Specific grades can be processed by injection, extrusion, transfer molding, and compression molding. Superior static dissipative compounds... [See More]

  • Industry: Electronics; Electric Power; Injection/Transfer Molding, Linings, Tubing, Sheet/Film
  • Features: Anti-static, ESD
  • Type: Electrically Conductive
  • Tensile (Break): 493125
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22
from Master Bond, Inc.

Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Filled
1-Part, Thermally Conductive, RTV Silicone Adhesive -- AS1802
from CHT USA Inc.

CHT ’s AS1802 is a 1-part, gray, non-corrosive, neutral cure, thermally conductive, RTV silicone adhesive sealant. It is one in a range of CHT ’s acetone cure products which are all solvent-free. It features a fast skin over time at 4 minutes. AS1802 is designed with excellent primerless... [See More]

  • Industry: Automotive; Electronics
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Cure / Technology: Single Component; Acetone
Form-In-Place Gap Filler -- SARCON® SPG-70A
from Fujipoly® America Corp.

Fujipoly ® America announces the release of its new SARCON ® SPG-70A. It is a high flow rate, high heat transferring compound that exhibits a thermal conductivity of 7.0 W/m °K and has the lowest thermal resistance among our dispensable SPG products. When applied between heat-generating... [See More]

  • Industry: Electronics
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Form / Shape: Gap Filler, Foam in Place Gasket; Grease, Paste
5G mmWave Thermal Conductive Gel Pad -- DTT65-s
from Shiu Li Technology Co., Ltd

LiPOLY DTT65 is a soft thermally conductive gel pad specifically designed for networking applications. DTT65 is designed to focus on Dk and Df to reduce interference in RF modules. DTT65 has a thermal conductivity of 5.0 W/m*K. This product can be supplied as standard sheets, custom die-cuts or... [See More]

  • Industry: Electronics
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Form / Shape: Sheet Form, Die-cut Parts
CONDUCTIVE SILVER-CARBON EPOXY -- G6E-NS11
from G6 Epoxy

DESCRIPTION: Traditional silver-based adhesives require up to 80% weight load of silver fillers and as a result tend to be costly, brittle and prone to mechanical failure. G6E-NS11 ™ has been developed based on advanced proprietary technology that requires 15% or less silver content to be at... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; PCB Manufacture / Repair, EMI / RFI Shielding, Display Packaging / Bonding, Solder Replacement
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Filled
B-Staged Epoxy Meets Airbus Standards for Flame Retardancy & Toxicity -- EP36FR
from Master Bond, Inc.

EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's; Aerospace
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Unfilled
1-Part, Thermally Conductive, Space-Grade Silicone Adhesive, UL Listed -- AS1707
from CHT USA Inc.

CHT's AS1707 is a 1-part, alkoxy cured, thermally conductive, low volatile, RTV silicone adhesive paste. AS1707 is formulated to meet the requirements for use as a space grade adhesive. AS1707 has low thermal outgassing properties and a wide operational temperature range. In addition to meeting... [See More]

  • Industry: Automotive; Electronics
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Cure / Technology: Single Component; Alkoxy
High Performance Gap Filler -- SARCON ® GR80A
from Fujipoly® America Corp.

Highly Conformable and High Heat Conducting gel materials. SARCON ® Thermal Gap Filler Pads are highly conformable and high heat conducting gel materials in a versatile sheet form. They easily fit and adhere to most all shapes and sizes of components, including protrusions and recessed areas. [See More]

  • Industry: Electronics; Semiconductors, IC's
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Form / Shape: Gap Filler, Foam in Place Gasket; Gel
Complex Thermal Conductive Material -- G566A/G566AP
from Shiu Li Technology Co., Ltd

LiPOLY G566 Graphite Sheet has great thermal conductivity on the X and Y axis. The thermal conductivity is 1700W/m*K. It is flexible, which is suitable for thin products and high capability mobile devices. [See More]

  • Industry: Electronics
  • Chemical System: Graphite
  • Type: Thermally Conductive
  • Form / Shape: Sheet Form, Die-cut Parts
FLEXIBLE CARBON-FILLED ELECTRICALLY CONDUCTIVE EPOXY -- G6E-FRP
from G6 Epoxy

DESCRIPTION: G6E-FRP ™ is a flexible version of our G6E-P ™ general purpose epoxy. G6E-FRP ™ epoxy was developed primarily for high-performance bonding, connection, sealing and coating applications requiring a flexible bond or connection of electrically conductive components or... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Fiber-Optics Packaging, Flexible Photovoltaic (Solar) Cell Packaging, Surface Acoustic Wave (SAW) Devices
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Filled
Biocompatible, Non-Drip Epoxy Resists Repeated Sterilizations -- EP3HTND-2Med Black
from Master Bond, Inc.

EP3HTND-2Med Black is a one part system that combines easy processing with excellent bonding properties. It cures in 20-30 minutes at 250°F or 5-10 minutes at 300°F and adheres well to a wide variety of substrates including glass, metals, ceramics and most plastics. This paste compound meets USP... [See More]

  • Industry: Aerospace; Electronics; Electric Power; Photonics; Semiconductors, IC's
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Unfilled
2-Part, Silicone Potting Compound and Encapsulant, UL Listed -- QSil-563
from CHT USA Inc.

CHT's QSil 563 is a 2-part, platinum cure, 100% silicone solids elastomer designed for electronic potting and encapsulation applications. QSil 562 offers a hard, low modulus material that is readily repairable. QSil 563 is thermally conductive to aid in efficient heat dissipation. This silicone... [See More]

  • Industry: Automotive; Electronics
  • Cure / Technology: Two Component  ; Addition
  • Type: Thermally Conductive
  • Features: Flame Retardant; UL Rating
High Performance Thermal Gap Filler -- SARCON® GR130A
from Fujipoly® America Corp.

Fujipoly ® recently released Sarcon ® GR130A, its newest high-performance, thermal gap filler pad. The highly conformable, gel-like sheets exhibit a thermal resistance as low as 0.02 °C •in2/W at 43.5 PSI with a thermal conductivity of 13 W/m °K. Sarcon ® GR130A is available... [See More]

  • Industry: Electronics; Semiconductors, IC's
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Form / Shape: Gap Filler, Foam in Place Gasket
Complex Thermal Conductive Material -- TR332CU
from Shiu Li Technology Co., Ltd

LiPOLY TR332CU has outstanding parallel thermal conduction and has high flexibility, which is suitable for thin products like mobile devices. [See More]

  • Industry: Electronics
  • Chemical System: Graphite, Copper, Acrylic
  • Type: Thermally Conductive
  • Form / Shape: Sheet Form, Die-cut Parts
FLEXIBLE SILVER-CARBON ELECTRICALLY CONDUCTIVE EPOXY -- G6E-FXNS
from G6 Epoxy

DESCRIPTION: G6E-FXNS ™ epoxy is developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials as well as for low electrical resistivity. G6E-FXNS ™ is developed based on advanced proprietary technology that requires... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Fiber-Optics Packaging, Solder Replacement
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Filled
Chemical Resistant, Two Part Epoxy Features Glass Transition Temperature of +240°C -- EP126
from Master Bond, Inc.

Master Bond EP126 withstands very high temperatures, up to +600 °F, and has a glass transistion temperature of +240 °C. This two component product features unique handling properties as Part A is a moderate viscosity liquid and Part B is a powder. It can be easily mixed using a forgiving 100... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Unfilled
2-Part, Thermally Conductive Silicone Encapsulants, UL Listed -- SE3000
from CHT USA Inc.

CHT's SE3000 is a 2-part, platinum cure silicone elastomer designed for electronic potting and encapsulation applications. It offers good prtection against chemicals, environmental contamination, mechanical shock, vibration and impact damage. SE3000 can be used in applications where low flammability... [See More]

  • Industry: Electronics
  • Cure / Technology: Two Component  ; Addition
  • Type: Thermally Conductive
  • Features: Flame Retardant; UL Rating
High Thermal Conductivity Non-Silicone Greases -- SARCON® SG-50NS and SG-60NS
from Fujipoly® America Corp.

Fujipoly ® USA introduces new 5 and 6W/m-K SARCON ® thermally conductive greases to the North American market. SARCON ® SG-50NS and SG-60NS greases offer excellent stability over wide temperature ranges with low thermal resistance. They feature exceptionally low bleed and evaporation as... [See More]

  • Industry: Electronics
  • Form / Shape: Grease, Paste
  • Type: Thermally Conductive
  • Thermal Conductivity: 5 to 6
Exceptionally Soft Thermal Conductive Gel Pad -- BS75K
from Shiu Li Technology Co., Ltd

LiPOLY BS75K is a soft thermally conductive gap filler. With a thermal conductivity of 3.0 W/m*K and a low thermal impedance, BS75K is suitable for a wide range of applications. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for a wide... [See More]

  • Industry: Electronics
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
FLEXIBLE SILVER-GRAPHENE ELECTRICALLY CONDUCTIVE EPOXY -- G6E-FXSG
from G6 Epoxy

DESCRIPTION: G6E-FXSG ™ epoxy is primarily developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials requiring low electrical resistivity. G6-FXSG ™ is well suited for bonding of dissimilar materials that are... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Fiber-Optics Packaging, Solder Replacement
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Filled
Dual Curing, Thixotropic Adhesive -- UV22DC80-10F
from Master Bond, Inc.

One part, nanosilica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
  • Chemical System: UV Curing
  • Type: Thermally Conductive
  • Composition: Filled
2-Part, Thermally Conductive Silicone Potting Compound and Encapsulant, UL Listed -- QSil-553
from CHT USA Inc.

CHT's QSil 553 is a 2-part, platinum cure, silicone potting compound and encapsulant designed to protect electronic components from harsh environmental conditions and shock and vibration. It features a low viscosity for convenient dispensing and will easily flow throughout components. Because of its... [See More]

  • Industry: Automotive; Electronics; OEM or Industrial
  • Cure / Technology: Two Component  ; Addition
  • Type: Thermally Conductive
  • Features: Flame Retardant; UL Rating
Highly Conformable and Non-Flammable, Higher Thermal interface material -- SARCON® PG80B
from Fujipoly® America Corp.

SARCON® Extremely Compressible Gap Filler Type (Putty Type) is a highly conformable, thermally conductive, non-flammable interface materials. The surface consistency is excellent for filling small air gaps and uneven mating surface, making reliable contact with various shapes and sizes of... [See More]

  • Industry: Electronics; Semiconductors, IC's
  • Form / Shape: Putty; Gap Filler, Foam in Place Gasket
  • Type: Thermally Conductive
  • Use Temperature: -40 to 302
Exceptionally Soft Thermal Conductive Gel Pad -- BS87
from Shiu Li Technology Co., Ltd

LiPOLY BS87 is an ultra-soft thermally conductive gel pad with a thermal conductivity of 3.0 W/m*K. BS87 offers excellent compression under minimal force with high recovery characteristics. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for... [See More]

  • Industry: Electronics
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Form / Shape: Sheet Form, Die-cut Parts
GENERAL PURPOSE CARBON-FILLED ELECTRICALLY CONDUCTIVE EPOXY -- G6E-P
from G6 Epoxy

DESCRIPTION: G6E-P ™ epoxy is primarily developed for general purpose applications requiring high-performance bond or connection of electrically conductive components/materials. G6E-P ™ is formulated with proprietary nanomaterials and fillers. G6E-P ™ epoxy can be cured at room... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Photovoltaic (Solar) Cells, Casting, Coating & Encapsulation, Display Packaging / Bonding, Temperature Sensitive Electronics, Solder Replacement
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Filled
Electrically and Thermally Conductive, Two Part Silicone Meets NASA Low Outgassing Specifications -- MasterSil 973S-LO
from Master Bond, Inc.

MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Silicone
  • Type: Electrically Conductive; Thermally Conductive
  • Composition: Filled
Silicone Free Form-in-Place Thermal Gap Filler -- SARCON® SPG-25B-NS
from Fujipoly® America Corp.

SARCON ® SPG-25B-NS from Fujipoly ® is an easy to dispense, low- viscosity, silicone free compound that exhibits a thermal conductivity of 2.5 W/m °K and a thermal resistance of only 2.1 °K •cm2/W. When applied between heat-generating components and a nearby heat sink or... [See More]

  • Industry: Electronics
  • Form / Shape: Gap Filler, Foam in Place Gasket; Grease, Paste
  • Type: Thermally Conductive
  • Use Temperature: -40 to 248
Exceptionally Soft Thermal Conductive Gel Pad -- S282-s
from Shiu Li Technology Co., Ltd

LiPOLY ’s S282 is a thermally conductive pad designed for gap filling. The thermal conductivity is 1.7 W/m*K. It uses fiberglass cloth as the reinforcement material with great self-adhesive that can fit closely with non-flat heat sinks to increase the contact area. The low stress damped... [See More]

  • Industry: Electronics
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
HIGH TEMPERATURE CARBON-FILLED ELECTRICALLY CONDUCTIVE EPOXY -- G6E-HTC
from G6 Epoxy

DESCRIPTION: G6E-HTC ™ epoxy is developed primarily for applications requiring a high-performance bond or connection of electrically conductive components/materials that operate at higher temperatures. G6E-HTC ™ epoxy ’s properties result from being formulated with proprietary... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; EMI / RFI Shielding, Grounding, Casting, Coating & Encapsulation
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Filled
Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity -- EP3HTSDA-1
from Master Bond, Inc.

EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Unfilled
Thermal Interface Material Sample Kit -- SARCON®
from Fujipoly® America Corp.

Fujipoly ® recently introduced a comprehensive engineering kit that includes free samples of (20) different Sarcon ® Thermal Interface Materials. The sample kit gives engineers the flexibility to test the performance properties of multiple Sarcon ® materials in order to find the perfect... [See More]

  • Industry: Electronics; Semiconductors, IC's
  • Type: Thermally Conductive
High Insulating Thermal Conductive Film -- PR27
from Shiu Li Technology Co., Ltd

LiPOLY PR27 is a very thin high insulator with a thickness of 0.15mm. It uses Polyimide Film as the reinforcement material, which can increase the tensile strength. It has great dielectric strength and can withstand 12K voltages. It ’s suitable for high power transistors, electrical equipment,... [See More]

  • Industry: Electronics
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Form / Shape: Sheet Form, Die-cut Parts
HIGH TEMPERATURE SILVER-CARBON CONDUCTIVE EPOXY -- G6E-HTNS
from G6 Epoxy

DESCRIPTION: G6E-HTNS ™ epoxy is developed primarily for applications requiring a high-performance bond or connection of electrically conductive components/materials which operate at higher temperatures requiring low electrical resistivity. G6E-HTNS ™ is developed based on advanced... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Radio Frequency Identification (RFID) tags, EMI / RFI Shielding, Solder Replacement
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Filled
Electrically Conductive Die Attach Epoxy With High Glass Transition Temperature -- EP17HTS-DA
from Master Bond, Inc.

Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Polyphenylene Sulfide; Epoxy
  • Type: Electrically Conductive; Thermally Conductive
  • Composition: Filled
Two-Part Thermal Gap Filler -- SARCON® LG23A and LG30A
from Fujipoly® America Corp.

The SARCON® LG Series is the perfect solution for filling large, complex and uneven gaps between heat generating components that depend on reliable contact with a heat spreader to maintain optimal performance. SARCON® LG23A and LG30A easily dispense in a liquid form that will cure at room... [See More]

  • Industry: Electronics; Semiconductors, IC's
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
High Insulating Thermal Conductive Film -- SH1500/2000/3000
from Shiu Li Technology Co., Ltd

LiPOLY ’s thermal insulator SH1500/2000/3000 uses fiberglass cloth as a reinforcement material, combined with thermal conductive silicon, giving it high thermal conduction and great compression strength. The thermal conductivity is 1.5/2.0/3.0 W/m*K, the thickness is 0.23~0.35mm. Its high... [See More]

  • Industry: Electronics
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Form / Shape: Sheet Form, Die-cut Parts
HIGH TEMPERATURE SILVER-GRAPHENE ELECTRICALLY CONDUCTIVE EPOXY -- G6E-HTSG
from G6 Epoxy

DESCRIPTION: G6E-HTSG ™ epoxy is primarily developed for applications requiring a high-performance bond or connection of electrically conductive components/materials which operate at higher temperatures and which require low electrical resistivity. G6E-HTSG ™ epoxy is formulated with... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; EMI / RFI Shielding, Grounding, Casting, Coating & Encapsulation, Solder Replacement
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Filled
Epoxy Features Exceptional Chemical and Heat Resistance -- EP35SP
from Master Bond, Inc.

EP35SP is a two component epoxy system specially formulated to resist high temperatures and aggressive chemicals. It has a paste viscosity with little to no flow when curing. [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's; Downhole
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Unfilled
High Thermal Conductive Gap Filler -- T-top81
from Shiu Li Technology Co., Ltd

LiPOLY T-top81 is an ultra-soft, highly conformable, non-flammable interface material. T-top81 is a high deflection material, designed to allow minimal stress on components while offering excellent thermal conductivity and low thermal resistance. With a thermal conductivity of 8.0 W/m*K, T-top81... [See More]

  • Industry: Electronics
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Form / Shape: Sheet Form, Die-cut Parts
ROOM TEMPERATURE CURABLE CARBON-FILLED ELECTRICALLY CONDUCTIVE EPOXY -- G6E-RTC
from G6 Epoxy

DESCRIPTION: G6E-RTC ™ Room Temperature Curable Carbon Filled Electrically Conductive epoxy is developed primarily for applications requiring curing at room temperature. G6E-RTC ™ epoxy is formulated with proprietary nanomaterials and fillers to provide its performance characteristics. [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Photovoltaic (Solar) Cells, Casting, Coating & Encapsulation, EMI / RFI Shielding, Cold Solder Replacement
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Filled
Epoxy Meets Airbus Standards for Flame Retardancy, Smoke and Gas Emissions -- EP93FRHT
from Master Bond, Inc.

EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Unfilled
High Thermal Conductive Gap Filler -- T-Work7000
from Shiu Li Technology Co., Ltd

Our high thermally conductive gap filler T-work7000 provides excellent compression and extremely low thermal resistance in form shape with high thermal conductivity for gap filling between electrical component and heatsink. [See More]

  • Industry: Electronics
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
ROOM TEMPERATURE CURABLE SILVER-GRAPHENE ELECTRICALLY CONDUCTIVE EPOXY -- G6E-RTSG
from G6 Epoxy

DESCRIPTION: G6E-RTSG ™ epoxy is developed primarily for applications that require curing at room temperature. Room temperature curing eliminates the necessity for a heating oven. This allows easier and safer bond/connection of conductive components or materials. G6E-RTSG ™ epoxy is also... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; PCB Manufacture/Repair, Photovoltaic Cell Packaging, Temperature Sensitive Electronics Bonding, Display Packaging/Bonding
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Filled
Epoxy with High Elongation Passes ISO 10993-5 Certification for Cytotoxicity -- EP40Med
from Master Bond, Inc.

EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]

  • Industry: Electronics; OEM or Industrial
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Unfilled
High Thermal Conductive Gap Filler -- T-work8000
from Shiu Li Technology Co., Ltd

LiPOLY T-work8000 is a high performance thermally conductive interface pad. T-work8000 offers outstanding thermal conductivity at 15.0 W/m*K and extremely low thermal resistance under minimal force. T-work8000 offers excellent compression, filling small air gaps and uneven surfaces, ensuring an... [See More]

  • Industry: Electronics
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Form / Shape: Sheet Form, Die-cut Parts
SILVER-GRAPHENE CONDUCTIVE EPOXY -- G6E-SG
from G6 Epoxy

DESCRIPTION: G6E-SG ™ epoxy is developed for general purpose applications requiring high-performance bond or connection of electrically conductive components/materials that require low electrical resistivity. G6E-SG ™ is formulated with proprietary nanomaterials and fillers. G6E-SG... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Photovoltaic (Solar) Cells, Casting, Coating & Encapsulation, EMI / RFI Shielding, Solder Replacement, Display Packaging / Bonding
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Filled
Extremely Soft MasterSil 170 Gel Encapsulant Offers Removability and Optical Clarity -- MasterSil 170 Gel
from Master Bond, Inc.

MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]

  • Industry: Aerospace; Electronics; Photonics; OEM or Industrial; Optical; Semiconductors, IC's
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Composition: Unfilled
High Thermal Conductive Gap Filler -- T-work9000
from Shiu Li Technology Co., Ltd

LiPOLY T-work9000 offers outstanding thermal conductivity at 20.0 W/m*K and extremely low thermal resistance under minimal force. T-work9000 offers excellent compression, filling small air gaps on uneven surfaces, ensuring an efficient and consistent transfer of heat. [See More]

  • Industry: Electronics
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Form / Shape: Sheet Form, Die-cut Parts
Fast Curing, High Bond Strength Epoxy Adhesive -- EP51
from Master Bond, Inc.

Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature. The... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Unfilled
Non-Silicone Thermal Conductive Pad -- N700A
from Shiu Li Technology Co., Ltd

LiPOLY Non-Silicone Thermal Compound N700A/B is made of non-silicon resin material and none low-molecular-weight siloxane. N700A/B helps avoid electrical contact problems. N700 is flexible and has great thermal conduction, making the thermal resistance as low as possible. The thermal conductivity is... [See More]

  • Industry: Electronics
  • Chemical System: Non-Silicone
  • Type: Thermally Conductive
  • Form / Shape: Sheet Form, Die-cut Parts
High Shear/Peel Strength, Room Temperature Curing Epoxy -- EP31
from Master Bond, Inc.

Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel strength exceeding 40 pli. The service... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Cure / Technology: Thermoset; Two Component  
Non-Silicone Thermal Conductive Pad -- N700C
from Shiu Li Technology Co., Ltd

Non-Silicone Thermal Compound N700C is made of non-silicon resin material and none low-molecular-weight siloxane. N700C helps avoid electrical contact problems. N700 is flexible and has great thermal conduction, making the thermal resistance as low as possible. The thermal conductivity is 5.0W/m*K. [See More]

  • Industry: Electronics
  • Chemical System: Non-Silicone
  • Type: Thermally Conductive
  • Form / Shape: Sheet Form, Die-cut Parts
High Tempreature and Thermal Cycling Resistant Epoxy -- EP33
from Master Bond, Inc.

Master Bond Polymer Adhesive EP33 is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond Polymer Adhesive EP33 produces high strength bonds whose... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Unfilled
Non-Silicone Thermal Conductive Pad -- N800A
from Shiu Li Technology Co., Ltd

Non-Silicone Thermal Compound N800AH is made of non-silicon resin material and none low-molecular-weight siloxane. N800AH helps avoid electrical contact problems. N800 is flexible and has great thermal conduction, making the thermal resistance as low as possible. The thermal conductivity is... [See More]

  • Industry: Electronics
  • Chemical System: Non-Silicone
  • Type: Thermally Conductive
  • Form / Shape: Sheet Form, Die-cut Parts
Highly Flexible Addition Cured Silicone Offers Low Thermal Resistance -- MasterSil 151TC
from Master Bond, Inc.

MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Composition: Filled
Non-Silicone Thermal Conductive Putty -- N-Putty
from Shiu Li Technology Co., Ltd

LiPOLY N-putty series is silicone-free and dispensable thermally conductive material. With a thermal conductivity from 3.5 W/m*K, this product can be used successfully to remove manufacturing tolerances. It is ideally suited for dispensing using the N-putty dispensing robot. [See More]

  • Industry: Electronics
  • Chemical System: Non-Silicone
  • Type: Thermally Conductive
  • Form / Shape: Syringe/Cartridge/Pale
Low Exotherm, Two Component Epoxy -- EP29LP
from Master Bond, Inc.

Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will form bond strengths in excess of 2,500 psi (aluminum to aluminum). It bonds well to a variety of substrates... [See More]

  • Industry: Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Unfilled
Non-Silicone Thermal Conductive Putty -- N-Putty 2
from Shiu Li Technology Co., Ltd

LiPOLY N-putty2 series is silicone-free and dispensable thermally conductive material. With a thermal conductivity from 5.0 W/m*K, this product can be used successfully to remove manufacturing tolerances. It is ideally suited for dispensing using the N-putty2 dispensing robot. [See More]

  • Industry: Electronics
  • Chemical System: Non-Silicone
  • Type: Thermally Conductive
  • Form / Shape: Syringe/Cartridge/Pale
?utomotive Pastes
from Monocrystal, Inc.

AGH – series. Application: High conductive low firing silver paste for fine line screen printing. Silver conductor is specially designed to form the conductive coating and bond area to the glass and ceramic substrate by screen printing method. Composition variations: AGH-A-60 – 60%... [See More]

  • Industry: Electronics
  • Form / Shape: Grease, Paste
  • Type: Electrically Conductive
Elecolit® 6603 Thermally Conductive Epoxy 30gm -- PNEL00008
from Techsil Limited

Elecolit ® 6603 is a thermally conductive epoxy with very good metal adhesion and slight flexibility. This grade has very good flow behavior and can easily be processed using a dispenser, spreading knife or spatula. Although designed for bonding applications, 6603 can also be used as a potting... [See More]

  • Industry: Electronics
  • Chemical System: Epoxy
  • Type: Electrically Conductive; Thermally Conductive
  • Cure / Technology: Thermoset
Die Attach Adhesives
from Metalor Technologies USA Corporation

Electrically and thermally conductive adhesives for microelectronic applications. Working in partnership with valued customers, we have carried out extensive development programmes to customize silver flakes and powders to suit many electronic applications. We are acknowledged as a leading supplier... [See More]

  • Industry: Electronics
  • Type: Electrically Conductive
ABLESTIK ABLEBOND 958-8C -- 8799556337665
from Henkel Corporation - Electronics

ABLESTIK ABLEBOND 958-8C is an electrically conductive epoxy designed for solder replacement in microelectronic interconnect applications. It may be used with thick film metalizations or traditional printed circuit board surfaces. [See More]

  • Industry: Electronics
  • Type: Electrically Conductive
Cement -- No. 31
from Sauereisen, Inc.

Sauereisen Cement No. 31 is a white, porcelain-like cement that is widely used throughout industry in a variety of applications. including assembling, sealing, insulating and cementing of ceramics, porcelain, metal, and glass. [See More]

  • Industry: Electronics; Electric Power
  • Chemical System: Ceramic
  • Type: Thermally Conductive
  • Composition: Unfilled
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4501
from Hapco, Inc.

Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame... [See More]

  • Industry: Electronics
  • Cure / Technology: Thermoset; Two Component  
  • Type: Thermally Conductive
  • Form / Shape: Liquid
Electrically Conductive Epoxy -- 40-3905
from Epoxies Etc...

40-3905 is an electrically conductive system designed for applications requiring low temperature cures. 40-3905 will cure at room temperature in 18 hours or can be accelerated with mild heat. [See More]

  • Industry: Electronics
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Filled
Electrically Conductive Silicone Adhesive -- SEMICOSIL® 979 EC
from Wacker Chemical Corp.

SEMICOSIL ® 979 EC is a RTV-1 amine cure silicone rubber that cures on contact with moisture in the air. Special features. Low volume resistivity. Thixotropic paste. Solvated. Excellent adhesion to many substrates. Application. SEMICOSIL ® 979 EC is an electrically conductive adhesive for... [See More]

  • Industry: Electronics
  • Chemical System: Silicone; Elastomeric
  • Type: Electrically Conductive
  • Cure / Technology: Thermoset; Single Component; Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing
Dissipator® Adhesive -- Grade 745
from Hi-Tech Seals, Inc.

HERNON ® offers a complete line of structural acrylic adhesives. These systems are two-part, no mix, and reactive adhesives. Each acrylic adhesive has two components: the adhesive base or resin, and the Activator. Structural acrylic adhesives are termed “reactive ” cure systems. The... [See More]

  • Industry: Electronics
  • Chemical System: Acrylic
  • Type: Thermally Conductive
  • Cure / Technology: Two Component  ; Reactive or Moisture Cured
Metal Oxide Thickened Dimethyl Silicone Compound -- Bluesil™ V-740
from Bluestar Silicones USA Corp.

Metal Oxide Thickened Dimethyl Silicone Compound. Description. Bluesil V-740 is a metal oxide thickened dimethyl silicone compound. It is a white, heavy paste used for heat dissipation applications where high thermal conductivity is required. [See More]

  • Industry: Electronics; Electric Power; Semiconductors, IC's
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Cure / Technology: Two Component  
Thermal Compound -- TC70
from Nordson EFD

Our innovative, non-silicone thermal compounds provide an ideal thermal solution by ensuring reliable heat transfer over a longer time than most industrial thermal interface materials. Conventional, silicone-based heat sink compounds and thermal greases tend to spread after a number of heating and... [See More]

  • Industry: Electronics; Semiconductors, IC's
  • Chemical System: Synthetic Based
  • Type: Thermally Conductive
  • Composition: Unfilled
Clear Non-Yellowing Silicone Encapsulant -- PNS-56225
from Protavic America, Inc.

PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]

  • Industry: Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Silicone
  • Type: Electrically Conductive; Thermally Conductive
  • Composition: Unfilled
Aremco-Seal -- 613
from Aremco Products, Inc.

Aremco offers an expansive range of ceramic-based materials used for the assembly of high temperature, high power electrical devices, and high temperature fixtures, molds and tooling. These materials, based on aluminum oxide, aluminum nitride, magnesium oxide, silicon dioxide, silicon carbide,... [See More]

  • Industry: Electronics
  • Form / Shape: Liquid; Encapsulant or Conformal Coating
  • Type: Thermally Conductive
  • Features: Dissimilar Substrates
Biocompatible, Thermally Conductive Epoxy -- EPO-TEK® MED-T905BN-3
from Epoxy Technology

EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries.  Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]

  • Industry: Electronics; Photonics; Optical
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Cure / Technology: Thermoset; Two Component  
NO-OX-ID "A-Special" Electrical Contact Grease
from Sanchem, Inc.

is the electrical contact grease of choice in new electrical installations and maintenance because of its excellent performance in keeping metals free from corrosion. This rust preventitive has been used for over 50 years to preventing corrosion in electrical connectors from low micro-power... [See More]

  • Industry: Electronics; Electric Power
  • Cure / Technology: Non-Drying
  • Type: Electrically Conductive
  • Form / Shape: Gel
Engineered Materials -- Thermotech TE
from Materion Corporation

Thermotech TE ™ is a Silver-filled, electrically conductive high-vacuum compound specifically manufactured by Pure Tech for the sputtering target industry. Thermotech TE combines the excellent thermal and electrical conductive properties of pure Silver with a low vapor pressure sealant,... [See More]

  • Industry: Electronics
  • Cure / Technology: Two Component  
  • Type: Electrically Conductive
MG Chemicals 8331 Silver Conductive Epoxy 115gm -- MGEP00007
from Techsil Limited

MG Chemicals 8331 is a Silver Conductive Epoxy with a moderate cure time and high conductivity. This is an economical electronic epoxy with good electrical and thermal conductivities. The adhesive bonds very well to a variety of surfaces, it resists thermal and mechanical shocks and provides the low... [See More]

  • Industry: Electronics
  • Chemical System: Epoxy
  • Type: Electrically Conductive; Thermally Conductive
  • Cure / Technology: Thermoset
Conformal EMI Shielding Material -- LOCTITE ABLESTIK EMI 8660S
from Henkel Corporation - Electronics

With the increasing proliferation of wireless devices, designers are challenged with various electromagnetic waves from multiple sources radiating at the same spectrum of frequencies resulting in electromagnetic interference(EMI). Radio-frequency(RF) emitting devices require effective isolation to... [See More]

  • Industry: Electronics
  • Cure / Technology: Single Component
  • Type: Electrically Conductive
  • Form / Shape: Liquid; Encapsulant or Conformal Coating
Di-Pak™ Rigid Eletrical Insulating Compound -- R-4528/7
from Hapco, Inc.

DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity). Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI-COAT R-4721 is easy to... [See More]

  • Industry: Electronics
  • Cure / Technology: Thermoset; Two Component  
  • Type: Thermally Conductive
  • Form / Shape: Liquid
Thermally Conductive PU Potting Compound -- 20-2366FR
from Epoxies Etc...

20-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 20-2366 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical... [See More]

  • Industry: Electronics
  • Chemical System: Polyurethane; Elastomeric
  • Type: Thermally Conductive
  • Composition: Unfilled
Flowable, One-component Silicone Sealant -- CENUSIL® RT 760 CN A/B
from Wacker Chemical Corp.

WACKER ’s silicone adhesives and sealants are based on many years of experience, innovative research and comprehensive technological expertise. In a wide variety of industries, especially in lighting technology, flowable or non-sag silicone products offer decisive advantages in performance and... [See More]

  • Industry: Electronics
  • Chemical System: Silicone; Elastomeric
  • Type: Thermally Conductive
Clear UV Adhesive -- ANA-97773
from Protavic America, Inc.

ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued shrinkage and movement. Bond lines are clear, colorless and exhibit low shrinkage during the curing process. [See More]

  • Industry: Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Composition: Unfilled
  • Type: Electrically Conductive
  • Cure / Technology: Thermoset; Two Component  ; UV or Radiation Cured
Ceramabond -- 503
from Aremco Products, Inc.

High fired strength, dense ceramics [See More]

  • Industry: Electronics; OEM or Industrial; Gas Ignitors, Sagger Plates, Temp Probes
  • Chemical System: Ceramic
  • Type: Thermally Conductive
  • Composition: Filled
MG Chemicals Med Cure Thermal Epoxy Adhesive 6ml -- MGEP00014
from Techsil Limited

MG Chemicals 8329TCM is a medium cure thermally conductive epoxy adhesive which has a convenient 1:1 mix ratio and a 45 minute work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to mechanical shocks and... [See More]

  • Industry: Electronics
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Cure / Technology: Thermoset
Gap Pad 1000HD -- 8806383648769
from Henkel Corporation - Electronics

Gap Pad ® 1000HD was designed to with-stand applications requiring high durability. The coated polyimide carrier on one side of the material allows easy rework, excellent handling characteristics and puncture resistance. The conformable and elastic nature of Gap Pad ® 1000HD allows excellent... [See More]

  • Industry: Electronics
  • Type: Thermally Conductive
Electro-Conductive Epoxy Adhesive -- ACE-10131
from Protavic America, Inc.

Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for production needs. One... [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Epoxy
  • Type: Electrically Conductive; Thermally Conductive
  • Composition: Filled
Ceramabond -- 890
from Aremco Products, Inc.

Aremco ’s high temperature ceramic adhesives are unique inorganic formulations for bonding and sealing ceramics, metals, quartz, graphites, textiles, and composite materials used in design, process and maintenance applications to 3200 °F. These advanced materials, which exhibit high... [See More]

  • Industry: Electronics
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Type: Electrically Conductive; Thermally Conductive
  • Form / Shape: Grease, Paste
MG Chemicals Silver Conductive Epoxy (10 Min) 14gm -- MGEP00006
from Techsil Limited

MG Chemicals 8331 is a Silver Conductive Epoxy with a moderate cure time and high conductivity. This is an economical electronic epoxy with good electrical and thermal conductivities. The adhesive bonds very well to a variety of surfaces, it resists thermal and mechanical shocks and provides the low... [See More]

  • Industry: Electronics
  • Chemical System: Epoxy
  • Type: Electrically Conductive; Thermally Conductive
  • Cure / Technology: Thermoset
Gap Pad 1000SF -- 8806383747073
from Henkel Corporation - Electronics

The new Gap Pad 1000SF is a thermally conductive, electrically insulating, silicone-free polymer specially designed for silicone-sensative applications. The material is ideal for applications with high standoff and flatness tolerances. Gap Pad 1000SF is reinforced for easy material handling and... [See More]

  • Industry: Electronics
  • Type: Thermally Conductive
Epoxy Adhesive -- ANE-20904
from Protavic America, Inc.

Epoxy system designed for underfill applications. This material is fast flowing and provides excellent properties for common device packaging. [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Cure / Technology: Thermoset; Single Component
MG Chemicals Silver Conductive Epoxy (10 Min) 19gm -- MGEP00004
from Techsil Limited

MG Chemicals 8330 Silver Conductive Epoxy is a higher conductivity version of the 8331 Silver Conductive Epoxy. It is an electronic grade epoxy which combines a moderate curing rate and a high conductivity. It bonds very well to most substrates used in electronic assemblies; resists thermal and... [See More]

  • Industry: Electronics
  • Chemical System: Epoxy
  • Type: Electrically Conductive; Thermally Conductive
  • Cure / Technology: Thermoset
Gap Pad 1450 -- 8806384107521
from Henkel Corporation - Electronics

Gap Pad ® 1450 is a highly compliant Gap Pad material that is ideal for fragile component leads. The material includes a permanent liner, which facilitates rework and improves puncture resistance and handling characteristics. The un-lined side of Gap Pad ® 1450 maintains a conformable, yet... [See More]

  • Industry: Electronics
  • Type: Thermally Conductive
Epoxy Cast -- PTE-36977
from Protavic America, Inc.

PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ is heat stable up to 150 °C. [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Filled
MG Chemicals Silver Conductive Epoxy (4 Hour) 21gm -- MGEP00005
from Techsil Limited

MG Chemicals 8330S is a Silver Conductive Epoxy with a slow cure time and extreme conductivity. This electronic grade epoxy combines a long working time and high conductivity. The cured conductive adhesive bonds very well to most substrates used in electronic assemblies, resists thermal and... [See More]

  • Industry: Electronics
  • Chemical System: Epoxy
  • Type: Electrically Conductive; Thermally Conductive
  • Cure / Technology: Thermoset
Gap Pad 1500 -- 8806384238593
from Henkel Corporation - Electronics

Gap Pad 1500 has an ideal filler blend that gives it a low modulus characteristic that maintains optimal thermal performance yet still allows for easy handling. The natural tack on both sides of the material allows for good compliance to adjacent surfaces of components, minimizing interfacial... [See More]

  • Industry: Electronics
  • Type: Thermally Conductive
MG Chemicals Silver Conductive Epoxy (4 Hour)125gm -- MGEP00008
from Techsil Limited

MG Chemicals 8330S is a Silver Conductive Epoxy with a slow cure time and extreme conductivity. This electronic grade epoxy combines a long working time and high conductivity. The cured conductive adhesive bonds very well to most substrates used in electronic assemblies, resists thermal and... [See More]

  • Industry: Electronics
  • Chemical System: Epoxy
  • Type: Electrically Conductive; Thermally Conductive
  • Cure / Technology: Thermoset
Gap Pad 1500R -- 8806384435201
from Henkel Corporation - Electronics

Gap Pad 1500R has the same highly conformable, low modulus polymer as the standard Gap Pad 1500. The fiberglass reinforcement allows for easy material handling and enhances puncture, shear and tear resistance. The natural tack on both sides of the material allows for good compliance to mating... [See More]

  • Industry: Electronics
  • Type: Thermally Conductive
MG Chemicals Slow Cure Thermal Epoxy Adhesive 6ml -- MGEP00003
from Techsil Limited

MG Chemicals 8329TCS is a slow cure electrically insulating epoxy adhesive. Combines a long working 1:1 mix ratio and a 4 hour work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to mechanical shocks and... [See More]

  • Industry: Electronics
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Cure / Technology: Thermoset
Gap Pad 1500S30 -- 8806384533505
from Henkel Corporation - Electronics

Gap Pad 1500S30 is a highly compliant Gap Pad material that is ideal for fragile component leads.The material is fiberglass reinforced for improved puncture resistance and handling characteristics. Gap Pad 1500S30 maintains a conformable, yet elastic nature that provides excellent interfacing and... [See More]

  • Industry: Electronics
  • Type: Thermally Conductive
MG Chemicals Thermal Conductive Epoxy 50ml -- MGEP00002
from Techsil Limited

MG Chemicals 8329TCM is a medium cure thermally conductive epoxy adhesive which has a convenient 1:1 mix ratio and a 45 minute work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to mechanical shocks and... [See More]

  • Industry: Electronics
  • Chemical System: Epoxy
  • Type: Electrically Conductive; Thermally Conductive
  • Cure / Technology: Thermoset
Gap Pad 2000S40 -- 8806384697345
from Henkel Corporation - Electronics

Gap Pad 2000S40 is recommended for low-stress applications that require a mid to high thermally conductive interface material. The highly conformable nature of the material allows the pad to fill in air voids and air gaps between PC boards and heat sinks or metal chassis with stepped topography,... [See More]

  • Industry: Electronics
  • Type: Thermally Conductive
Momentive CRTV5120 Semi Conductive Silicone 30cc -- MOSI17207
from Techsil Limited

Momentive CRTV5120 is a high performance, semi-conductive silicone adhesive. This one-part RTV offers fast cure and a resistivity of 200 - 800 ohm-cm. CRTV5120 offers a primerless adhesion to many metals, plastics and glass. This product is ideal for gaskets & seals for electronics that need EMI... [See More]

  • Industry: Electronics
  • Chemical System: Silicone; Elastomeric
  • Type: Electrically Conductive
Gap Pad 2200SF -- 8806383845377
from Henkel Corporation - Electronics

Gap Pad 2200SF is a thermally conductive, electrically isolating, silicone-free polymer specially designed for silicone-sensitive applications. The material is ideal for applications with uneven topologies and high stackup tolerances. Gap Pad 2200SF is reinforced for easy material handling and added... [See More]

  • Industry: Electronics
  • Type: Thermally Conductive
Momentive SilCool TSE3281 G Thermal Silicone 1kg -- MOSI01220
from Techsil Limited

TSE3281-G is a thermally conductive silicone adhesive from Momentive Performance Materials. This one component material is non-corrosive and has excellent adhesion properties to a wide variety of substrates. Potential applications for TSE3281-G include sealing and bonding for thermally conductive... [See More]

  • Industry: Electronics
  • Chemical System: Silicone; Elastomeric
  • Type: Thermally Conductive
Gap Pad 2202SF -- 8806383878145
from Henkel Corporation - Electronics

Gap Pad ® 2202SF is a high performance, 2.0 W/m-K, thermally conductive gap filling material. The Gap Pad ® 2202SF compound is silicone-free by design and offers exceptionally low interfacial resistances to adjacent surfaces. Gap Pad ® 2202SF is specifically designed for... [See More]

  • Industry: Electronics
  • Type: Thermally Conductive
Momentive SnapSIL TN3005 Clear Silicone 310ml -- MOSI01370
from Techsil Limited

Momentive SnapSIL TN3005 is a low volatile siloxane, silicone adhesive sealant that cures at room temperature. It offers primerless adhesion to many substrates and high elongation once cured. Ideal for use as an insulating adhesive seal and fixing for electrical and electronic parts. Can also be... [See More]

  • Industry: Electronics
  • Chemical System: Silicone; Elastomeric
  • Type: Thermally Conductive
Gap Pad 3004SF -- 8806384861185
from Henkel Corporation - Electronics

Gap Pad ® 3004SF is high performance, 3.0 W/m-K, thermally conductive gap filling material. Gap Pad ® 3004SF is silicone-free by design and offers exceptionally low interfacial resistances to adjacent surfaces. Gap Pad ® 3004SF is designed for applications that are silicone-sensitive. [See More]

  • Industry: Electronics
  • Type: Thermally Conductive
Momentive SnapSIL TN3005 White Silicone 310ml -- MOSI01371
from Techsil Limited

Momentive SnapSIL TN3005 is a low volatile siloxane, silicone adhesive sealant that cures at room temperature. It offers primerless adhesion to many substrates and high elongation once cured. Ideal for use as an insulating adhesive seal and fixing for electrical and electronic parts. Can also be... [See More]

  • Industry: Electronics
  • Chemical System: Silicone; Elastomeric
  • Type: Thermally Conductive
Gap Pad 3500ULM -- 8806384893953
from Henkel Corporation - Electronics

Gap Pad ® 3500ULM (ultra low-modulus) is an extremely soft gap filling material rated at a thermal conductivity of 3.5 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique 3.5 W/m-K filler package and ultra-low modulus resin formulation. The enhanced... [See More]

  • Industry: Electronics
  • Type: Thermally Conductive
Momentive SnapSIL TN3085 Grey Silicone 310ml -- MOSI01362
from Techsil Limited

Momentive SnapSIL TN3085 is a thermally conductive, low volatile siloxane, silicone adhesive that cures at room temperature to form an elastic, flame retardant silicone rubber. It offers primerless adhesion to many substrates. Designed for bonding applications in power supplies, securing PCB's to... [See More]

  • Industry: Electronics
  • Chemical System: Silicone; Elastomeric
  • Type: Thermally Conductive
Gap Pad 5000S35 -- 8806384959489
from Henkel Corporation - Electronics

Gap Pad 5000S35 is a fiberglass-reinforced filler and polymer featuring a high thermal conductivity. The material yields extremely soft characteristics while maintaining elasticity and conformability.The fiberglass reinforcement provides easy handling and converting, added electrical isolation and... [See More]

  • Industry: Electronics
  • Type: Thermally Conductive
Momentive SnapSIL TN3305 Black Silicone 310ml -- MOSI01369
from Techsil Limited

Momentive SnapSIL TN3305 is a low volatile siloxane, silicone adhesive sealant that cures at room temperature. It offers primerless adhesion to many substrates and high elongation once cured. Ideal for use as an insulating adhesive seal and fixing for electrical and electronic parts. Can also be... [See More]

  • Industry: Electronics
  • Chemical System: Silicone; Elastomeric
  • Type: Thermally Conductive
Gap Pad A2000 -- 8806384664577
from Henkel Corporation - Electronics

Gap Pad A2000 acts as a thermal interface and electrical insulator between electrical components and heat sinks. In the thickness range of 10 to 40 mil, Gap Pad A2000 is supplied with natural tack on both sides, allowing for excellent compliance to the adjacent surfaces of components. The 40 mil... [See More]

  • Industry: Electronics
  • Type: Thermally Conductive
Momentive SnapSIL TN3305 Clear Silicone 310ml -- MOSI01367
from Techsil Limited

Momentive SnapSIL TN3305 is a low volatile siloxane, silicone adhesive sealant that cures at room temperature. It offers primerless adhesion to many substrates and high elongation once cured. Ideal for use as an insulating adhesive seal and fixing for electrical and electronic parts. Can also be... [See More]

  • Industry: Electronics
  • Chemical System: Silicone; Elastomeric
  • Type: Thermally Conductive
Gap Pad A3000 -- 8806384828417
from Henkel Corporation - Electronics

Gap Pad A3000 is a thermally conductive, filled-polymer laminate, supplied on a reinforcing mesh for added electrical isolation, easy material handling and enhanced puncture, shear and tear resistance. Gap Pad A3000 has a reinforcement layer on the dark gold side of the material that assists in... [See More]

  • Industry: Electronics
  • Type: Thermally Conductive
Momentive SnapSIL TN3705 Black Silicone 310ml -- MOSI01366
from Techsil Limited

Momentive SnapSIL TN3075 is a low volatile siloxane, silicone adhesive sealant that cures at room temperature. It offers primerless adhesion to many substrates. Ideal for use as an insulating adhesive seal and fixing for electrical and electronic parts. Can also be used as a waterproof sealant for... [See More]

  • Industry: Electronics
  • Chemical System: Silicone; Elastomeric
  • Type: Thermally Conductive
Gap Pad EMI 1.0 -- 8807037599745
from Henkel Corporation - Electronics

Gap Pad EMI 1.0 is a highly conformable, combination gap filling material offering both thermal conductivity performance and Electromagnetic Energy absorption (cavity resonances and/or cross-talk causing Electromagnetic Interference) at frequencies of 1GHz and higher. The material offers EMI... [See More]

  • Industry: Electronics
  • Type: Thermally Conductive
Momentive SnapSIL TN3705 Clear Silicone 310ml -- MOSI01364
from Techsil Limited

Momentive SnapSIL TN3075 is a low volatile siloxane, silicone adhesive sealant that cures at room temperature. It offers primerless adhesion to many substrates. Ideal for use as an insulating adhesive seal and fixing for electrical and electronic parts. Can also be used as a waterproof sealant for... [See More]

  • Industry: Electronics
  • Chemical System: Silicone; Elastomeric
  • Type: Thermally Conductive
Thermal Interface Material -- GAP PAD HC 5.0
from Henkel Corporation - Electronics

GAP PAD ™ HC 5.0 is a soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique filler package and low-modulus resin formulation. The enhanced material is ideal for applications... [See More]

  • Industry: Electronics
  • Form / Shape: Gap Filler, Foam in Place Gasket
  • Type: Thermally Conductive