Electronics (PCB / SMT Assembly) Conductive Compounds
from Ellsworth Adhesives
Bergquist Poly-Pad 1000 Thermally Conductive Fiberglass with a filled polyester resin, is used for high performance applications and devices that require non-silicone conformal coatings such as power supplies, semiconductors, and automotive electronics. It also offers high thermal resistance. 12 in... [See More]
- Industry: Automotive; Electronics; Semiconductors, IC's
- Cure / Technology: Single Component
- Type: Thermally Conductive
- Thermal Conductivity: 1.2
from Dongguan Sheen Electronic Technology Co., Ltd.
CSF series Carbon Fiber Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Exceptional thermal conductivity options ranging from 15 to 45 W/mK. ◆ Available in various thicknesses from 0.3 to 12.0 mm. ◆ Features natural tackiness for easy application... [See More]
- Industry: Electronics
- Use Temperature: ? to 320
- Type: Thermally Conductive
- Thermal Conductivity: 25
from Hernon Manufacturing, Inc.
Dissipator ® 745 is a thermally conductive room temperature cure adhesive that is designed for bonding electrical components to heat sink with a controlled gap. Dissipator ® 745, through a special shimming property, insulates the component electrically while allowing thermal conductivity. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Type: Thermally Conductive
from MacDermid Alpha Electronics Solutions
A silver sinter paste, providing high thermal and electrical conductivity. Product Overview. The ALPHA ® Argomax ® 2020 Paste is a high-performance silver sinter paste used in applications that require excellent thermal and electrical conductivity. This paste is particularly suited for... [See More]
- Industry: Automotive; Electronics; Semiconductors, IC's
- Form / Shape: Die Bonding Adhesives; Grease, Paste
- Type: Thermally Conductive
from Cri-Tech, Inc.
Cri-plastMP ™ PFA Electrically Conductive Compounds are formulated to meet your static dissipative/conductive, ATEX requirements in multiple applications. Specific grades can be processed by injection, extrusion, transfer molding, and compression molding. Superior static dissipative compounds... [See More]
- Industry: Electronics; Electric Power; Injection/Transfer Molding, Linings, Tubing, Sheet/Film
- Features: Anti-static, ESD
- Type: Electrically Conductive
- Tensile (Break): 493125
from CHT USA Inc.
CHT's AS1707 is a 1-part, alkoxy cured, thermally conductive, low volatile, RTV silicone adhesive paste. AS1707 is formulated to meet the requirements for use as a space grade adhesive. AS1707 has low thermal outgassing properties and a wide operational temperature range. In addition to meeting... [See More]
- Industry: Automotive; Electronics
- Chemical System: Silicone
- Type: Thermally Conductive
- Cure / Technology: Single Component; Alkoxy
from Quantaflex Printed Electronics Inc.
A high level of custom engineering and problem solving. Designing electrical shielding components requires a high level of custom engineering and problem solving. Nothing should be left to chance because the goal is to create a part that protects the electronic device (and your customers) from the... [See More]
- Industry: Electronics; Semiconductors, IC's
- Form / Shape: Foam; Gap Filler, Foam in Place Gasket; Liquid
- Type: Thermally Conductive
- Features: EMI/RFI Shielding
from Fujipoly® America Corp.
bull; CF210A is the newest Fujipoly thermal gap filler. • CF210A incorporates carbon fibers along with traditional fillers found in thermal gap filler materials. • CF210A is rated at 21 W/m •K. • Compliance is closer to a much lower conductivity gap filler (Fujipoly- Sarcon... [See More]
- Industry: Electronics; Semiconductors, IC's
- Chemical System: carbon fibers along with traditional fillers found in thermal gap filler materials
- Type: Thermally Conductive
- Form / Shape: Gap Filler, Foam in Place Gasket
from Master Bond, Inc.
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Optical; Semiconductors, IC's
- Chemical System: Silicone
- Type: Thermally Conductive
- Composition: Unfilled
from Ellsworth Adhesives
Dow DOWSIL ™ 3-1818 Thermally Conductive Adhesive Gray is a one component, thixotropic adhesive that is used for bonding with common materials in the electronics industry. It has a fast heat cure, glass beads for controlling bond line thickness, self priming, good dielectric properties, and... [See More]
- Industry: Electronics
- Cure / Technology: Single Component
- Type: Thermally Conductive
- Thermal Conductivity: 1.8
from Dongguan Sheen Electronic Technology Co., Ltd.
CSF series Carbon Fiber Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Exceptional thermal conductivity options ranging from 15 to 45 W/mK. ◆ Available in various thicknesses from 0.3 to 12.0 mm. ◆ Features natural tackiness for easy application... [See More]
- Industry: Electronics
- Use Temperature: ? to 320
- Type: Thermally Conductive
- Thermal Conductivity: 15
from Hernon Manufacturing, Inc.
Hernon Dissipator 745D is a thermally conductive room temperature cure adhesive that is designed for bonding electrical components to heat sink with a controlled gap. Dissipator 745D, through a special shimming property, insulates the component electrically while allowing thermal... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Type: Thermally Conductive
from CHT USA Inc.
CHT's QSil 563 is a 2-part, platinum cure, 100% silicone solids elastomer designed for electronic potting and encapsulation applications. QSil 562 offers a hard, low modulus material that is readily repairable. QSil 563 is thermally conductive to aid in efficient heat dissipation. This silicone... [See More]
- Industry: Automotive; Electronics
- Cure / Technology: Two Component ; Addition
- Type: Thermally Conductive
- Features: Flame Retardant; UL Rating
from Fujipoly® America Corp.
Fujipoly ® introduces Sarcon ® PG45A its newest high-performance, putty-like thermal interface material. This extremely low modulus gap filler exhibits a thermal resistance as low as 0.02 °C •in2/W at 43.5 PSI with a thermal conductivity of 4.5 W/m °K. Sarcon ® PG45A... [See More]
- Industry: Electronics; Semiconductors, IC's
- Chemical System: Silicone
- Type: Thermally Conductive
- Form / Shape: Putty; Gap Filler, Foam in Place Gasket
from Master Bond, Inc.
Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Ellsworth Adhesives
Dow DOWSIL ™ TC-5150 Blue is a one component, high performance, non-curable, thermally conductive gap filler designed to dissipate heat from electronics to a heat sink providing a reliable cooling solution for a wide variety of substrates. It is reworkable, easy to dispense, has low thermal... [See More]
- Industry: Automotive; Electronics; Semiconductors, IC's
- Cure / Technology: Single Component
- Type: Thermally Conductive
- Form / Shape: Gap Filler, Foam in Place Gasket
from Dongguan Sheen Electronic Technology Co., Ltd.
CSF series Carbon Fiber Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Exceptional thermal conductivity options ranging from 15 to 45 W/mK. ◆ Available in various thicknesses from 0.3 to 12.0 mm. ◆ Features natural tackiness for easy application... [See More]
- Industry: Electronics
- Use Temperature: ? to 320
- Type: Thermally Conductive
- Thermal Conductivity: 35
from Hernon Manufacturing, Inc.
Hernon Dissipator 746D is a thermally conductive adhesive formulated for bonding electrical components to heat sinks or printed circuit boards. Fast room temperature cure combined with excellent heat dissipation for thermally sensitive components and controlled strength for service repair provide... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Chemical System: Silicone
- Type: Thermally Conductive
- Cure / Technology: Room Temperature Vulcanizing or Curing
from CHT USA Inc.
CHT's SE3000 is a 2-part, platinum cure silicone elastomer designed for electronic potting and encapsulation applications. It offers good prtection against chemicals, environmental contamination, mechanical shock, vibration and impact damage. SE3000 can be used in applications where low flammability... [See More]
- Industry: Electronics
- Cure / Technology: Two Component ; Addition
- Type: Thermally Conductive
- Features: Flame Retardant; UL Rating
from Fujipoly® America Corp.
Fujipoly ® America announces the release of its new SARCON ® SPG-70A. It is a high flow rate, high heat transferring compound that exhibits a thermal conductivity of 7.0 W/m °K and has the lowest thermal resistance among our dispensable SPG products. When applied between heat-generating... [See More]
- Industry: Electronics
- Chemical System: Silicone
- Type: Thermally Conductive
- Form / Shape: Gap Filler, Foam in Place Gasket; Grease, Paste
from Master Bond, Inc.
EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's; Aerospace
- Chemical System: Epoxy
- Type: Thermally Conductive
- Composition: Unfilled
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SP Series Phase Change Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.8 to 6.0 W/m ·K. ◆ Low thermal impedance, reaching as low as 0.015 ℃*in ²/W at 50psi, ensuring... [See More]
- Industry: Electronics
- Use Temperature: -40 to 257
- Type: Thermally Conductive
- Thermal Conductivity: 6
from CHT USA Inc.
CHT's QSil 553 is a 2-part, platinum cure, silicone potting compound and encapsulant designed to protect electronic components from harsh environmental conditions and shock and vibration. It features a low viscosity for convenient dispensing and will easily flow throughout components. Because of its... [See More]
- Industry: Automotive; Electronics; OEM or Industrial
- Cure / Technology: Two Component ; Addition
- Type: Thermally Conductive
- Features: Flame Retardant; UL Rating
from Fujipoly® America Corp.
Silicone Gap Filler Pad for Absorption of Electromagnetic Wave. Features. Effective to absorb and damp a wide range of electromagnetic waves. Also effective as a high performance thermal interface material. Easily filling small gaps of IC chip surface with soft gel texture. Good workability to... [See More]
- Industry: Electronics; Semiconductors, IC's
- Chemical System: Silicone
- Type: Thermally Conductive
- Form / Shape: Gap Filler, Foam in Place Gasket
from Master Bond, Inc.
EP3HTND-2Med Black is a one part system that combines easy processing with excellent bonding properties. It cures in 20-30 minutes at 250°F or 5-10 minutes at 300°F and adheres well to a wide variety of substrates including glass, metals, ceramics and most plastics. This paste compound meets USP... [See More]
- Industry: Aerospace; Electronics; Electric Power; Photonics; Semiconductors, IC's
- Chemical System: Epoxy
- Type: Thermally Conductive
- Composition: Unfilled
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SF Series Silicone Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.5 to 15.0 W/m ·K. ◆ Available in various thicknesses from 0.3 to 10.0 mm. ◆ Highly compressible, soft,... [See More]
- Industry: Electronics
- Use Temperature: -58 to 392
- Type: Thermally Conductive
- Thermal Conductivity: 4
from Fujipoly® America Corp.
FEATURES: • Highly Conformable and High Heat Conducting Gel materials. • SARCON Thermal Gap Filler Pads are highly conformable and high heat conducting gel materials in a versatile sheet form. • Easily fit and adhere to most all shapes and sizes of components, including protrusions... [See More]
- Industry: Electronics
- Chemical System: Silicone
- Type: Thermally Conductive
- Form / Shape: Gap Filler, Foam in Place Gasket
from Master Bond, Inc.
One part, nano silica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: UV Curing
- Type: Thermally Conductive
- Composition: Filled
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SE Series two-component Thermal Gel are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, available in options ranging from 2.0 to 8.0 W/m ·K. ◆ Soft and elastic after curing, maintaining the required thickness and providing... [See More]
- Industry: Electronics
- Chemical System: Silicone
- Type: Thermally Conductive
- Form / Shape: Gel
from Fujipoly® America Corp.
Highly Conformable and High Heat Conducting gel materials. SARCON ® Thermal Gap Filler Pads are highly conformable and high heat conducting gel materials in a versatile sheet form. They easily fit and adhere to most all shapes and sizes of components, including protrusions and recessed areas. [See More]
- Industry: Electronics; Semiconductors, IC's
- Chemical System: Silicone
- Type: Thermally Conductive
- Form / Shape: Gap Filler, Foam in Place Gasket; Gel
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Silicone
- Type: Electrically Conductive; Thermally Conductive
- Composition: Filled
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's TIV800 Series RTV Thermal Conductive Adhesive are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, available in options ranging from 1.0 to 2.0 W/m ·K. ◆ High bonding performance. ◆ Good stability, long-term high... [See More]
- Industry: Electronics
- Chemical System: Silicone
- Type: Thermally Conductive
- Use Temperature: -58 to 392
from Fujipoly® America Corp.
Fujipoly ® recently released Sarcon ® GR130A, its newest high-performance, thermal gap filler pad. The highly conformable, gel-like sheets exhibit a thermal resistance as low as 0.02 °C •in2/W at 43.5 PSI with a thermal conductivity of 13 W/m °K. Sarcon ® GR130A is available... [See More]
- Industry: Electronics; Semiconductors, IC's
- Chemical System: Silicone
- Type: Thermally Conductive
- Form / Shape: Gap Filler, Foam in Place Gasket
from Master Bond, Inc.
EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Epoxy
- Type: Thermally Conductive
- Composition: Unfilled
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SC Series Thermal Films are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 0.8 to 5.0 W/m ·K. ◆ Optional fiberglass or polyimide film can be used as the reinforcement carrier. ◆ High mechanical... [See More]
- Industry: Electronics
- Chemical System: Silicone
- Type: Thermally Conductive
- Use Temperature: -58 to 392
from Fujipoly® America Corp.
Fujipoly ® USA introduces new 5 and 6W/m-K SARCON ® thermally conductive greases to the North American market. SARCON ® SG-50NS and SG-60NS greases offer excellent stability over wide temperature ranges with low thermal resistance. They feature exceptionally low bleed and evaporation as... [See More]
- Industry: Electronics
- Form / Shape: Grease, Paste
- Type: Thermally Conductive
- Thermal Conductivity: 5 to 6
from Master Bond, Inc.
Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Polyphenylene Sulfide; Epoxy
- Type: Electrically Conductive; Thermally Conductive
- Composition: Filled
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SC Series Thermal Films are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 0.8 to 5.0 W/m ·K. ◆ Optional fiberglass or polyimide film can be used as the reinforcement carrier. ◆ High mechanical... [See More]
- Industry: Electronics
- Chemical System: Silicone
- Type: Thermally Conductive
- Use Temperature: -58 to 392
from Fujipoly® America Corp.
SARCON ® PG130A from Fujipoly ® is one of the industry ’s newest high-performance thermal interface materials that is extremely compressible. This double-sticky surface TIM is a great choice for applications that have delicate or wide-variation component heights and require extremely... [See More]
- Industry: Electronics; Semiconductors, IC's
- Form / Shape: Putty; Gap Filler, Foam in Place Gasket
- Type: Thermally Conductive
- Gap Fill: 0.0118 to 0.0787
from Master Bond, Inc.
EP35SP is a two component epoxy system specially formulated to resist high temperatures and aggressive chemicals. It has a paste viscosity with little to no flow when curing. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's; Downhole
- Chemical System: Epoxy
- Type: Thermally Conductive
- Composition: Unfilled
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SF Series Silicone Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.5 to 15.0 W/m ·K. ◆ Available in various thicknesses from 0.3 to 10.0 mm. ◆ Highly compressible, soft,... [See More]
- Industry: Electronics
- Use Temperature: -40 to 248
- Type: Thermally Conductive
- Thermal Conductivity: 15
from Fujipoly® America Corp.
SARCON® Extremely Compressible Gap Filler Type (Putty Type) is a highly conformable, thermally conductive, non-flammable interface materials. The surface consistency is excellent for filling small air gaps and uneven mating surface, making reliable contact with various shapes and sizes of... [See More]
- Industry: Electronics; Semiconductors, IC's
- Form / Shape: Putty; Gap Filler, Foam in Place Gasket
- Type: Thermally Conductive
- Use Temperature: -40 to 302
from Master Bond, Inc.
EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Epoxy
- Type: Thermally Conductive
- Composition: Unfilled
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SG560 Series Thermal Grease are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, available in options ranging from 1.0 to 5.0 W/m ·K. ◆ Low thermal impedance, with a minimum of 0.015 ℃*in ²/W at 30psi. ◆ Minimum... [See More]
- Industry: Electronics
- Form / Shape: Grease, Paste
- Type: Thermally Conductive
- Use Temperature: ? to 302
from Fujipoly® America Corp.
SARCON ® SPG-25B-NS from Fujipoly ® is an easy to dispense, low- viscosity, silicone free compound that exhibits a thermal conductivity of 2.5 W/m °K and a thermal resistance of only 2.1 °K •cm2/W. When applied between heat-generating components and a nearby heat sink or... [See More]
- Industry: Electronics
- Form / Shape: Gap Filler, Foam in Place Gasket; Grease, Paste
- Type: Thermally Conductive
- Use Temperature: -40 to 248
from Master Bond, Inc.
EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]
- Industry: Electronics; OEM or Industrial
- Chemical System: Epoxy
- Type: Thermally Conductive
- Composition: Unfilled
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's AF Series Silicone-free Thermal Pads (Non-silicone Thermal Pads) are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.0 to 8.0 W/m ·K. ◆ Available in various thicknesses from 0.5 to 5.0 mm. ◆... [See More]
- Industry: Electronics
- Chemical System: Silicone
- Type: Thermally Conductive
- Use Temperature: -40 to 248
from Fujipoly® America Corp.
Fujipoly ® recently introduced a comprehensive engineering kit that includes free samples of (20) different Sarcon ® Thermal Interface Materials. The sample kit gives engineers the flexibility to test the performance properties of multiple Sarcon ® materials in order to find the perfect... [See More]
- Industry: Electronics; Semiconductors, IC's
- Type: Thermally Conductive
from Master Bond, Inc.
MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]
- Industry: Aerospace; Electronics; Photonics; OEM or Industrial; Optical; Semiconductors, IC's
- Chemical System: Silicone
- Type: Thermally Conductive
- Composition: Unfilled
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SF Series Silicone Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.5 to 15.0 W/m ·K. ◆ Available in various thicknesses from 0.3 to 10.0 mm. ◆ Highly compressible, soft,... [See More]
- Industry: Electronics
- Use Temperature: -58 to 302
- Type: Thermally Conductive
- Thermal Conductivity: 7
from Fujipoly® America Corp.
SARCON ® PG65A from Fujipoly ® is one of the industry ’s newest high-performance thermal interface materials that is extremely compressible. This double-sticky surface TIM is a great choice for applications that have delicate or wide-variation component heights and require extremely... [See More]
- Industry: Aerospace; Automotive; Electronics; OEM or Industrial
- Chemical System: Silicone
- Type: Thermally Conductive
- Form / Shape: Putty; Gap Filler, Foam in Place Gasket
from Master Bond, Inc.
Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature. The... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Unfilled
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SF Series Silicone Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.5 to 15.0 W/m ·K. ◆ Available in various thicknesses from 0.3 to 10.0 mm. ◆ Highly compressible, soft,... [See More]
- Industry: Electronics
- Use Temperature: -58 to 392
- Type: Thermally Conductive
- Thermal Conductivity: 5
from Fujipoly® America Corp.
The SARCON® LG Series is the perfect solution for filling large, complex and uneven gaps between heat generating components that depend on reliable contact with a heat spreader to maintain optimal performance. SARCON® LG23A and LG30A easily dispense in a liquid form that will cure at room... [See More]
- Industry: Electronics; Semiconductors, IC's
- Chemical System: Silicone
- Type: Thermally Conductive
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel strength exceeding 40 pli. The service... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Chemical System: Epoxy
- Type: Electrically Conductive
- Cure / Technology: Thermoset; Two Component
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SP Series Phase Change Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.8 to 6.0 W/m ·K. ◆ Low thermal impedance, reaching as low as 0.015 ℃*in ²/W at 50psi, ensuring... [See More]
- Industry: Electronics
- Use Temperature: -40 to 257
- Type: Thermally Conductive
- Thermal Conductivity: 4
from Master Bond, Inc.
Master Bond Polymer Adhesive EP33 is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond Polymer Adhesive EP33 produces high strength bonds whose... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Unfilled
from Epoxies Etc...
40-3905 is an electrically conductive system designed for applications requiring low temperature cures. 40-3905 will cure at room temperature in 18 hours or can be accelerated with mild heat. [See More]
- Industry: Electronics
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from ThreeBond International, Inc.
Electrically Conductive Resins. These Electrically conductive resin can connect multiple electrical contacts simultaneously and make it possible to create an electrical connection in materials that cannot be soldered. They are electro-conductive resins made up of synthetic resin and a conductive... [See More]
- Industry: Automotive; Electronics
- Chemical System: Silicone
- Type: Electrically Conductive
- Composition: Filled
from Henkel Adhesive Technologies - Aviation, Space and Rail
LOCTITE ® ABLESTIK QMI529HT-LV conductive die attach adhesive has been formulated for use in high throughput die attach applications. Electrically conductive. Thermally conductive. Good dispensing characteristics. Hydrophobic [See More]
- Industry: Electronics; OEM or Industrial
- Cure / Technology: Thermoset
- Type: Electrically Conductive
- CTE: 34
from Monocrystal, Inc.
AGH – series. Application: High conductive low firing silver paste for fine line screen printing. Silver conductor is specially designed to form the conductive coating and bond area to the glass and ceramic substrate by screen printing method. Composition variations: AGH-A-60 – 60%... [See More]
- Industry: Electronics
- Form / Shape: Grease, Paste
- Type: Electrically Conductive
from Metalor Technologies USA Corporation
Electrically and thermally conductive adhesives for microelectronic applications. Working in partnership with valued customers, we have carried out extensive development programmes to customize silver flakes and powders to suit many electronic applications. We are acknowledged as a leading supplier... [See More]
- Industry: Electronics
- Type: Electrically Conductive
from Henkel Corporation - Electronics
ABLESTIK ABLEBOND 958-8C is an electrically conductive epoxy designed for solder replacement in microelectronic interconnect applications. It may be used with thick film metalizations or traditional printed circuit board surfaces. [See More]
- Industry: Electronics
- Type: Electrically Conductive
from Epoxy Technology
EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]
- Industry: Electronics; Photonics; Optical
- Chemical System: Epoxy
- Type: Thermally Conductive
- Cure / Technology: Thermoset; Two Component
from Aremco Products, Inc.
Aremco offers an expansive range of ceramic-based materials used for the assembly of high temperature, high power electrical devices, and high temperature fixtures, molds and tooling. These materials, based on aluminum oxide, aluminum nitride, magnesium oxide, silicon dioxide, silicon carbide,... [See More]
- Industry: Electronics
- Form / Shape: Liquid; Encapsulant or Conformal Coating
- Type: Thermally Conductive
- Features: Dissimilar Substrates
from Sanchem, Inc.
is the electrical contact grease of choice in new electrical installations and maintenance because of its excellent performance in keeping metals free from corrosion. This rust preventitive has been used for over 50 years to preventing corrosion in electrical connectors from low micro-power... [See More]
- Industry: Electronics; Electric Power
- Cure / Technology: Non-Drying
- Type: Electrically Conductive
- Form / Shape: Gel
from Ohmite Manufacturing Co.
Ohmite thermal interface materials (TIMs) are designed for use in applications requiring reliable performance, low contact resistance, long life, low maintenance and high thermal conductivity. The flexible graphite materials are die-cut to ensure exact fit and reduce module-to-module variation... [See More]
- Industry: Electronics; Electric Power; OEM or Industrial
- Chemical System: Flexible Graphite Material
- Type: Thermally Conductive
- Use Temperature: -40 to 752
from Protavic America, Inc.
PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]
- Industry: Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Chemical System: Silicone
- Type: Electrically Conductive; Thermally Conductive
- Composition: Unfilled
from Nordson EFD
Our innovative, non-silicone thermal compounds provide an ideal thermal solution by ensuring reliable heat transfer over a longer time than most industrial thermal interface materials. Conventional, silicone-based heat sink compounds and thermal greases tend to spread after a number of heating and... [See More]
- Industry: Electronics; Semiconductors, IC's
- Chemical System: Synthetic Based
- Type: Thermally Conductive
- Composition: Unfilled
from Hi-Tech Seals, Inc.
HERNON ® offers a complete line of structural acrylic adhesives. These systems are two-part, no mix, and reactive adhesives. Each acrylic adhesive has two components: the adhesive base or resin, and the Activator. Structural acrylic adhesives are termed “reactive ” cure systems. The... [See More]
- Industry: Electronics
- Chemical System: Acrylic
- Type: Thermally Conductive
- Cure / Technology: Two Component ; Reactive or Moisture Cured
from Sauereisen, Inc.
Sauereisen Cement No. 31 is a white, porcelain-like cement that is widely used throughout industry in a variety of applications. including assembling, sealing, insulating and cementing of ceramics, porcelain, metal, and glass. [See More]
- Industry: Electronics; Electric Power
- Chemical System: Ceramic
- Type: Thermally Conductive
- Composition: Unfilled
from Wacker Chemical Corp.
SEMICOSIL ® 979 EC is a RTV-1 amine cure silicone rubber that cures on contact with moisture in the air. Special features. Low volume resistivity. Thixotropic paste. Solvated. Excellent adhesion to many substrates. Application. SEMICOSIL ® 979 EC is an electrically conductive adhesive for... [See More]
- Industry: Electronics
- Chemical System: Silicone; Elastomeric
- Type: Electrically Conductive
- Cure / Technology: Thermoset; Single Component; Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing
from Shiu Li Technology Co., Ltd
LiPOLY DTT44 is a soft thermally conductive gel pad specifically designed for networking applications. DTT44 is designed to focus on Dk and Df to reduce interference in RF modules. DTT44 has a thermal conductivity of 3.0 W/m*K. This product can be supplied as standard sheets, custom die-cuts or... [See More]
- Industry: Electronics
- Chemical System: Silicone
- Type: Thermally Conductive
- Form / Shape: Sheet Form, Die-cut Parts
from Hapco, Inc.
Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame... [See More]
- Industry: Electronics
- Cure / Technology: Thermoset; Two Component
- Type: Thermally Conductive
- Form / Shape: Liquid
from Bluestar Silicones USA Corp.
Metal Oxide Thickened Dimethyl Silicone Compound. Description. Bluesil V-740 is a metal oxide thickened dimethyl silicone compound. It is a white, heavy paste used for heat dissipation applications where high thermal conductivity is required. [See More]
- Industry: Electronics; Electric Power; Semiconductors, IC's
- Chemical System: Silicone
- Type: Thermally Conductive
- Cure / Technology: Two Component
from Materion Corporation
Thermotech TE ™ is a Silver-filled, electrically conductive high-vacuum compound specifically manufactured by Pure Tech for the sputtering target industry. Thermotech TE combines the excellent thermal and electrical conductive properties of pure Silver with a low vapor pressure sealant,... [See More]
- Industry: Electronics
- Cure / Technology: Two Component
- Type: Electrically Conductive
from Techsil Limited
Elecolit ® 6603 is a thermally conductive epoxy with very good metal adhesion and slight flexibility. This grade has very good flow behavior and can easily be processed using a dispenser, spreading knife or spatula. Although designed for bonding applications, 6603 can also be used as a potting... [See More]
- Industry: Electronics
- Chemical System: Epoxy
- Type: Electrically Conductive; Thermally Conductive
- Cure / Technology: Thermoset
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-NS10 ™ epoxy is developed for general purpose applications requiring high performance bond or connection of electrically conductive components/materials for enhanced electrical conductivity. G6E-NS10 ™ has been developed based on advanced proprietary technology that... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; PCB Manufacture / Repair, EMI / RFI Shielding, Display Packaging / Bonding, Solder Replacement
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Epoxies Etc...
20-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 20-2366 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical... [See More]
- Industry: Electronics
- Chemical System: Polyurethane; Elastomeric
- Type: Thermally Conductive
- Composition: Unfilled
from Henkel Corporation - Electronics
With the increasing proliferation of wireless devices, designers are challenged with various electromagnetic waves from multiple sources radiating at the same spectrum of frequencies resulting in electromagnetic interference(EMI). Radio-frequency(RF) emitting devices require effective isolation to... [See More]
- Industry: Electronics
- Cure / Technology: Single Component
- Type: Electrically Conductive
- Form / Shape: Liquid; Encapsulant or Conformal Coating
from Aremco Products, Inc.
High fired strength, dense ceramics [See More]
- Industry: Electronics; OEM or Industrial; Gas Ignitors, Sagger Plates, Temp Probes
- Chemical System: Ceramic
- Type: Thermally Conductive
- Composition: Filled
from Protavic America, Inc.
ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued shrinkage and movement. Bond lines are clear, colorless and exhibit low shrinkage during the curing process. [See More]
- Industry: Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Composition: Unfilled
- Type: Electrically Conductive
- Cure / Technology: Thermoset; Two Component ; UV or Radiation Cured
from Wacker Chemical Corp.
WACKER ’s silicone adhesives and sealants are based on many years of experience, innovative research and comprehensive technological expertise. In a wide variety of industries, especially in lighting technology, flowable or non-sag silicone products offer decisive advantages in performance and... [See More]
- Industry: Electronics
- Chemical System: Silicone; Elastomeric
- Type: Thermally Conductive
from Shiu Li Technology Co., Ltd
LiPOLY DTT65 is a soft thermally conductive gel pad specifically designed for networking applications. DTT65 is designed to focus on Dk and Df to reduce interference in RF modules. DTT65 has a thermal conductivity of 5.0 W/m*K. This product can be supplied as standard sheets, custom die-cuts or... [See More]
- Industry: Electronics
- Chemical System: Silicone
- Type: Thermally Conductive
- Form / Shape: Sheet Form, Die-cut Parts
from Hapco, Inc.
DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity). Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI-COAT R-4721 is easy to... [See More]
- Industry: Electronics
- Cure / Technology: Thermoset; Two Component
- Type: Thermally Conductive
- Form / Shape: Liquid
from Techsil Limited
MG Chemicals 8331 is a Silver Conductive Epoxy with a moderate cure time and high conductivity. This is an economical electronic epoxy with good electrical and thermal conductivities. The adhesive bonds very well to a variety of surfaces, it resists thermal and mechanical shocks and provides the low... [See More]
- Industry: Electronics
- Chemical System: Epoxy
- Type: Electrically Conductive; Thermally Conductive
- Cure / Technology: Thermoset
from Graphene Laboratories, Inc.
DESCRIPTION: Traditional silver-based adhesives require up to 80% weight load of silver fillers and as a result tend to be costly, brittle and prone to mechanical failure. G6E-NS11 ™ has been developed based on advanced proprietary technology that requires 15% or less silver content to be at... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; PCB Manufacture / Repair, EMI / RFI Shielding, Display Packaging / Bonding, Solder Replacement
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Henkel Corporation - Electronics
Gap Pad ® 1000HD was designed to with-stand applications requiring high durability. The coated polyimide carrier on one side of the material allows easy rework, excellent handling characteristics and puncture resistance. The conformable and elastic nature of Gap Pad ® 1000HD allows excellent... [See More]
- Industry: Electronics
- Type: Thermally Conductive
from Aremco Products, Inc.
Aremco ’s high temperature ceramic adhesives are unique inorganic formulations for bonding and sealing ceramics, metals, quartz, graphites, textiles, and composite materials used in design, process and maintenance applications to 3200 °F. These advanced materials, which exhibit high... [See More]
- Industry: Electronics
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Type: Electrically Conductive; Thermally Conductive
- Form / Shape: Grease, Paste
from Protavic America, Inc.
Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for production needs. One... [See More]
- Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Chemical System: Epoxy
- Type: Electrically Conductive; Thermally Conductive
- Composition: Filled
from Shiu Li Technology Co., Ltd
LiPOLY G566 Graphite Sheet has great thermal conductivity on the X and Y axis. The thermal conductivity is 1700W/m*K. It is flexible, which is suitable for thin products and high capability mobile devices. [See More]
- Industry: Electronics
- Chemical System: Graphite
- Type: Thermally Conductive
- Form / Shape: Sheet Form, Die-cut Parts
from Techsil Limited
MG Chemicals 8329TCM is a medium cure thermally conductive epoxy adhesive which has a convenient 1:1 mix ratio and a 45 minute work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to mechanical shocks and... [See More]
- Industry: Electronics
- Chemical System: Epoxy
- Type: Thermally Conductive
- Cure / Technology: Thermoset
from Graphene Laboratories, Inc.
G6 Epoxy® is excited to announce the release of our latest product - a one-component electrically conductive epoxy. This innovative solution provides excellent electrical conductivity and bonding strength in a single component formula, making it easier and more convenient to use than traditional... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial
- Chemical System: Epoxy
- Type: Electrically Conductive
- Cure / Technology: Thermoset; Single Component
from Henkel Corporation - Electronics
The new Gap Pad 1000SF is a thermally conductive, electrically insulating, silicone-free polymer specially designed for silicone-sensative applications. The material is ideal for applications with high standoff and flatness tolerances. Gap Pad 1000SF is reinforced for easy material handling and... [See More]
- Industry: Electronics
- Type: Thermally Conductive
from Protavic America, Inc.
Epoxy system designed for underfill applications. This material is fast flowing and provides excellent properties for common device packaging. [See More]
- Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Chemical System: Epoxy
- Type: Thermally Conductive
- Cure / Technology: Thermoset; Single Component
from Shiu Li Technology Co., Ltd
LiPOLY TR332CU has outstanding parallel thermal conduction and has high flexibility, which is suitable for thin products like mobile devices. [See More]
- Industry: Electronics
- Chemical System: Graphite, Copper, Acrylic
- Type: Thermally Conductive
- Form / Shape: Sheet Form, Die-cut Parts
from Techsil Limited
MG Chemicals 8331 is a Silver Conductive Epoxy with a moderate cure time and high conductivity. This is an economical electronic epoxy with good electrical and thermal conductivities. The adhesive bonds very well to a variety of surfaces, it resists thermal and mechanical shocks and provides the low... [See More]
- Industry: Electronics
- Chemical System: Epoxy
- Type: Electrically Conductive; Thermally Conductive
- Cure / Technology: Thermoset
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-FRP ™ is a flexible version of our G6E-P ™ general purpose epoxy. G6E-FRP ™ epoxy was developed primarily for high-performance bonding, connection, sealing and coating applications requiring a flexible bond or connection of electrically conductive components or... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Fiber-Optics Packaging, Flexible Photovoltaic (Solar) Cell Packaging, Surface Acoustic Wave (SAW) Devices
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Henkel Corporation - Electronics
Gap Pad ® 1450 is a highly compliant Gap Pad material that is ideal for fragile component leads. The material includes a permanent liner, which facilitates rework and improves puncture resistance and handling characteristics. The un-lined side of Gap Pad ® 1450 maintains a conformable, yet... [See More]
- Industry: Electronics
- Type: Thermally Conductive
from Protavic America, Inc.
PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ is heat stable up to 150 °C. [See More]
- Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Chemical System: Epoxy
- Type: Thermally Conductive
- Composition: Filled
from Shiu Li Technology Co., Ltd
LiPOLY BS75K is a soft thermally conductive gap filler. With a thermal conductivity of 3.0 W/m*K and a low thermal impedance, BS75K is suitable for a wide range of applications. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for a wide... [See More]
- Industry: Electronics
- Chemical System: Silicone
- Type: Thermally Conductive
- Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
from Techsil Limited
MG Chemicals 8330 Silver Conductive Epoxy is a higher conductivity version of the 8331 Silver Conductive Epoxy. It is an electronic grade epoxy which combines a moderate curing rate and a high conductivity. It bonds very well to most substrates used in electronic assemblies; resists thermal and... [See More]
- Industry: Electronics
- Chemical System: Epoxy
- Type: Electrically Conductive; Thermally Conductive
- Cure / Technology: Thermoset
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-FXNS ™ epoxy is developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials as well as for low electrical resistivity. G6E-FXNS ™ is developed based on advanced proprietary technology that requires... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Fiber-Optics Packaging, Solder Replacement
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Henkel Corporation - Electronics
Gap Pad 1500 has an ideal filler blend that gives it a low modulus characteristic that maintains optimal thermal performance yet still allows for easy handling. The natural tack on both sides of the material allows for good compliance to adjacent surfaces of components, minimizing interfacial... [See More]
- Industry: Electronics
- Type: Thermally Conductive
from Shiu Li Technology Co., Ltd
LiPOLY BS87 is an ultra-soft thermally conductive gel pad with a thermal conductivity of 3.0 W/m*K. BS87 offers excellent compression under minimal force with high recovery characteristics. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for... [See More]
- Industry: Electronics
- Chemical System: Silicone
- Type: Thermally Conductive
- Form / Shape: Sheet Form, Die-cut Parts
from Techsil Limited
MG Chemicals 8330S is a Silver Conductive Epoxy with a slow cure time and extreme conductivity. This electronic grade epoxy combines a long working time and high conductivity. The cured conductive adhesive bonds very well to most substrates used in electronic assemblies, resists thermal and... [See More]
- Industry: Electronics
- Chemical System: Epoxy
- Type: Electrically Conductive; Thermally Conductive
- Cure / Technology: Thermoset
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-FXSG ™ epoxy is primarily developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials requiring low electrical resistivity. G6-FXSG ™ is well suited for bonding of dissimilar materials that are... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Fiber-Optics Packaging, Solder Replacement
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Henkel Corporation - Electronics
Gap Pad 1500R has the same highly conformable, low modulus polymer as the standard Gap Pad 1500. The fiberglass reinforcement allows for easy material handling and enhances puncture, shear and tear resistance. The natural tack on both sides of the material allows for good compliance to mating... [See More]
- Industry: Electronics
- Type: Thermally Conductive
from Shiu Li Technology Co., Ltd
LiPOLY ’s S282 is a thermally conductive pad designed for gap filling. The thermal conductivity is 1.7 W/m*K. It uses fiberglass cloth as the reinforcement material with great self-adhesive that can fit closely with non-flat heat sinks to increase the contact area. The low stress damped... [See More]
- Industry: Electronics
- Chemical System: Silicone
- Type: Thermally Conductive
- Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
from Techsil Limited
MG Chemicals 8330S is a Silver Conductive Epoxy with a slow cure time and extreme conductivity. This electronic grade epoxy combines a long working time and high conductivity. The cured conductive adhesive bonds very well to most substrates used in electronic assemblies, resists thermal and... [See More]
- Industry: Electronics
- Chemical System: Epoxy
- Type: Electrically Conductive; Thermally Conductive
- Cure / Technology: Thermoset
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-P ™ epoxy is primarily developed for general purpose applications requiring high-performance bond or connection of electrically conductive components/materials. G6E-P ™ is formulated with proprietary nanomaterials and fillers. G6E-P ™ epoxy can be cured at room... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Photovoltaic (Solar) Cells, Casting, Coating & Encapsulation, Display Packaging / Bonding, Temperature Sensitive Electronics, Solder Replacement
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Henkel Corporation - Electronics
Gap Pad 1500S30 is a highly compliant Gap Pad material that is ideal for fragile component leads.The material is fiberglass reinforced for improved puncture resistance and handling characteristics. Gap Pad 1500S30 maintains a conformable, yet elastic nature that provides excellent interfacing and... [See More]
- Industry: Electronics
- Type: Thermally Conductive
from Shiu Li Technology Co., Ltd
LiPOLY S393 is a product with high ductile thermal conductivity. Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material. It won't easy to break and deformwhether stamped, punched, strip type, or custom cutting. Your best choice... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Silicone
- Type: Thermally Conductive
- Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
from Techsil Limited
MG Chemicals 8329TCS is a slow cure electrically insulating epoxy adhesive. Combines a long working 1:1 mix ratio and a 4 hour work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to mechanical shocks and... [See More]
- Industry: Electronics
- Chemical System: Epoxy
- Type: Thermally Conductive
- Cure / Technology: Thermoset
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-HTC ™ epoxy is developed primarily for applications requiring a high-performance bond or connection of electrically conductive components/materials that operate at higher temperatures. G6E-HTC ™ epoxy ’s properties result from being formulated with proprietary... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; EMI / RFI Shielding, Grounding, Casting, Coating & Encapsulation
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Henkel Corporation - Electronics
Gap Pad 2000S40 is recommended for low-stress applications that require a mid to high thermally conductive interface material. The highly conformable nature of the material allows the pad to fill in air voids and air gaps between PC boards and heat sinks or metal chassis with stepped topography,... [See More]
- Industry: Electronics
- Type: Thermally Conductive
from Shiu Li Technology Co., Ltd
LiPOLY S818 is a product with high ductile thermal conductivity.Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material.It won't easy to break and deform whether stamped, punched, strip type, or custom cutting. Your best choice... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Silicone
- Type: Thermally Conductive
- Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
from Techsil Limited
MG Chemicals 8329TCM is a medium cure thermally conductive epoxy adhesive which has a convenient 1:1 mix ratio and a 45 minute work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to mechanical shocks and... [See More]
- Industry: Electronics
- Chemical System: Epoxy
- Type: Electrically Conductive; Thermally Conductive
- Cure / Technology: Thermoset
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-HTNS ™ epoxy is developed primarily for applications requiring a high-performance bond or connection of electrically conductive components/materials which operate at higher temperatures requiring low electrical resistivity. G6E-HTNS ™ is developed based on advanced... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Radio Frequency Identification (RFID) tags, EMI / RFI Shielding, Solder Replacement
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Henkel Corporation - Electronics
Gap Pad 2200SF is a thermally conductive, electrically isolating, silicone-free polymer specially designed for silicone-sensitive applications. The material is ideal for applications with uneven topologies and high stackup tolerances. Gap Pad 2200SF is reinforced for easy material handling and added... [See More]
- Industry: Electronics
- Type: Thermally Conductive
from Shiu Li Technology Co., Ltd
LiPOLY DCTP140-s is a thermal insulator uses fiberglass cloth as a reinforcement material, combined with thermal conductive silicon, giving it high thermal conduction and great compression strength. The thermal conductivity is 4.5 W/m*K, the thickness is 0.25~0.45mm. Its high insulation and... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Silicone
- Type: Thermally Conductive
- Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
from Techsil Limited
Momentive CRTV5120 is a high performance, semi-conductive silicone adhesive. This one-part RTV offers fast cure and a resistivity of 200 - 800 ohm-cm. CRTV5120 offers a primerless adhesion to many metals, plastics and glass. This product is ideal for gaskets & seals for electronics that need EMI... [See More]
- Industry: Electronics
- Chemical System: Silicone; Elastomeric
- Type: Electrically Conductive
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-HTSG ™ epoxy is primarily developed for applications requiring a high-performance bond or connection of electrically conductive components/materials which operate at higher temperatures and which require low electrical resistivity. G6E-HTSG ™ epoxy is formulated with... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; EMI / RFI Shielding, Grounding, Casting, Coating & Encapsulation, Solder Replacement
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Henkel Corporation - Electronics
Gap Pad ® 2202SF is a high performance, 2.0 W/m-K, thermally conductive gap filling material. The Gap Pad ® 2202SF compound is silicone-free by design and offers exceptionally low interfacial resistances to adjacent surfaces. Gap Pad ® 2202SF is specifically designed for... [See More]
- Industry: Electronics
- Type: Thermally Conductive
from Shiu Li Technology Co., Ltd
LiPOLY PR27 is a very thin high insulator with a thickness of 0.15mm. It uses Polyimide Film as the reinforcement material, which can increase the tensile strength. It has great dielectric strength and can withstand 12K voltages. It ’s suitable for high power transistors, electrical equipment,... [See More]
- Industry: Electronics
- Chemical System: Silicone
- Type: Thermally Conductive
- Form / Shape: Sheet Form, Die-cut Parts
from Techsil Limited
TSE3281-G is a thermally conductive silicone adhesive from Momentive Performance Materials. This one component material is non-corrosive and has excellent adhesion properties to a wide variety of substrates. Potential applications for TSE3281-G include sealing and bonding for thermally conductive... [See More]
- Industry: Electronics
- Chemical System: Silicone; Elastomeric
- Type: Thermally Conductive
from Graphene Laboratories, Inc.
Our G6E-TSHV ™ Epoxy has been specifically developed for general purpose applications that necessitate the bonding or connecting of thermally conductive components/materials. It is designed to provide efficient heat transfer between components or surfaces, while also providing the bonding and... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Thermal Interface Materials (TIMs), Solar panels
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Henkel Corporation - Electronics
Gap Pad ® 3004SF is high performance, 3.0 W/m-K, thermally conductive gap filling material. Gap Pad ® 3004SF is silicone-free by design and offers exceptionally low interfacial resistances to adjacent surfaces. Gap Pad ® 3004SF is designed for applications that are silicone-sensitive. [See More]
- Industry: Electronics
- Type: Thermally Conductive
from Shiu Li Technology Co., Ltd
LiPOLY ’s thermal insulator SH1500/2000/3000 uses fiberglass cloth as a reinforcement material, combined with thermal conductive silicon, giving it high thermal conduction and great compression strength. The thermal conductivity is 1.5/2.0/3.0 W/m*K, the thickness is 0.23~0.35mm. Its high... [See More]
- Industry: Electronics
- Chemical System: Silicone
- Type: Thermally Conductive
- Form / Shape: Sheet Form, Die-cut Parts
from Techsil Limited
Momentive SnapSIL TN3005 is a low volatile siloxane, silicone adhesive sealant that cures at room temperature. It offers primerless adhesion to many substrates and high elongation once cured. Ideal for use as an insulating adhesive seal and fixing for electrical and electronic parts. Can also be... [See More]
- Industry: Electronics
- Chemical System: Silicone; Elastomeric
- Type: Thermally Conductive
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-RTC ™ Room Temperature Curable Carbon Filled Electrically Conductive epoxy is developed primarily for applications requiring curing at room temperature. G6E-RTC ™ epoxy is formulated with proprietary nanomaterials and fillers to provide its performance characteristics. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Photovoltaic (Solar) Cells, Casting, Coating & Encapsulation, EMI / RFI Shielding, Cold Solder Replacement
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Henkel Corporation - Electronics
Gap Pad ® 3500ULM (ultra low-modulus) is an extremely soft gap filling material rated at a thermal conductivity of 3.5 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique 3.5 W/m-K filler package and ultra-low modulus resin formulation. The enhanced... [See More]
- Industry: Electronics
- Type: Thermally Conductive
from Shiu Li Technology Co., Ltd
LiPOLY T-top81 is an ultra-soft, highly conformable, non-flammable interface material. T-top81 is a high deflection material, designed to allow minimal stress on components while offering excellent thermal conductivity and low thermal resistance. With a thermal conductivity of 8.0 W/m*K, T-top81... [See More]
- Industry: Electronics
- Chemical System: Silicone
- Type: Thermally Conductive
- Form / Shape: Sheet Form, Die-cut Parts
from Techsil Limited
Momentive SnapSIL TN3005 is a low volatile siloxane, silicone adhesive sealant that cures at room temperature. It offers primerless adhesion to many substrates and high elongation once cured. Ideal for use as an insulating adhesive seal and fixing for electrical and electronic parts. Can also be... [See More]
- Industry: Electronics
- Chemical System: Silicone; Elastomeric
- Type: Thermally Conductive
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-RTSG ™ epoxy is developed primarily for applications that require curing at room temperature. Room temperature curing eliminates the necessity for a heating oven. This allows easier and safer bond/connection of conductive components or materials. G6E-RTSG ™ epoxy is also... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; PCB Manufacture/Repair, Photovoltaic Cell Packaging, Temperature Sensitive Electronics Bonding, Display Packaging/Bonding
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Henkel Corporation - Electronics
Gap Pad 5000S35 is a fiberglass-reinforced filler and polymer featuring a high thermal conductivity. The material yields extremely soft characteristics while maintaining elasticity and conformability.The fiberglass reinforcement provides easy handling and converting, added electrical isolation and... [See More]
- Industry: Electronics
- Type: Thermally Conductive
from Shiu Li Technology Co., Ltd
Our high thermally conductive gap filler T-work 7000 provides excellent compression and extremely low thermal resistance in form shape with high thermal conductivity for gap filling between electrical component and heatsink. [See More]
- Industry: Electronics
- Chemical System: Silicone
- Type: Thermally Conductive
- Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
from Techsil Limited
Momentive SnapSIL TN3085 is a thermally conductive, low volatile siloxane, silicone adhesive that cures at room temperature to form an elastic, flame retardant silicone rubber. It offers primerless adhesion to many substrates. Designed for bonding applications in power supplies, securing PCB's to... [See More]
- Industry: Electronics
- Chemical System: Silicone; Elastomeric
- Type: Thermally Conductive
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-SG ™ epoxy is developed for general purpose applications requiring high-performance bond or connection of electrically conductive components/materials that require low electrical resistivity. G6E-SG ™ is formulated with proprietary nanomaterials and fillers. G6E-SG... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Photovoltaic (Solar) Cells, Casting, Coating & Encapsulation, EMI / RFI Shielding, Solder Replacement, Display Packaging / Bonding
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Henkel Corporation - Electronics
GAP PAD ™ HC 5.0 is a soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique filler package and low-modulus resin formulation. The enhanced material is ideal for applications... [See More]
- Industry: Electronics
- Form / Shape: Gap Filler, Foam in Place Gasket
- Type: Thermally Conductive
from Shiu Li Technology Co., Ltd
LiPOLY T-work 8000 is a high performance thermally conductive interface pad. T-work 8000 offers outstanding thermal conductivity at 15.0 W/m*K and extremely low thermal resistance under minimal force. T-work 8000 offers excellent compression, filling small air gaps and uneven surfaces, ensuring an... [See More]
- Industry: Electronics
- Chemical System: Silicone
- Type: Thermally Conductive
- Form / Shape: Sheet Form, Die-cut Parts
from Techsil Limited
Momentive SnapSIL TN3305 is a low volatile siloxane, silicone adhesive sealant that cures at room temperature. It offers primerless adhesion to many substrates and high elongation once cured. Ideal for use as an insulating adhesive seal and fixing for electrical and electronic parts. Can also be... [See More]
- Industry: Electronics
- Chemical System: Silicone; Elastomeric
- Type: Thermally Conductive
from Graphene Laboratories, Inc.
Our G6E-TSAL ™ Epoxy has been specifically developed for general purpose applications that necessitate the bonding or connecting of thermally conductive components/materials. It is designed to provide efficient heat transfer between components or surfaces, while also providing the bonding and... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Thermal Interface Materials (TIMs), Solar panels
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled