Gap Filling Compound Conductive Compounds

Thermal - Adhesives, Epoxies, Greases, Pastes -- 1168-TG4040-2K-50CC-ND [TG4040-2K-50CC from T-Global Technology Co., Ltd.]
from Digi-Key Electronics

LIQUID TIM 50CC SYRINGE [See More]

  • Form / Shape: Gap Filler, Foam in Place Gasket
  • Use Temperature: -58 to 392
  • Type: Thermally Conductive
  • Thermal Conductivity: 3.5
BERGQUIST GAP FILLER TGF 3500LVO is a silicone, thermally conductive, liquid gap filler with industry-wide applications. -- BERGQUIST GAP FILLER TGF 3500LVO
from Henkel Adhesive Technologies - Aviation, Space and Rail

BERGQUIST ® GAP FILLER TGF 3500LVO is a silicone, two-component, high thermal conductivity, liquid gap filler. This product offers the mechanical property benefits of a silicone material with the additional feature of low outgassing. It can be used in industries ranging from automotive to... [See More]

  • Form / Shape: Gap Filler, Foam in Place Gasket; Liquid
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Cure / Technology: Thermoset
Extremely Compressible Thermal Gap Filler -- SARCON® PG45A
from Fujipoly® America Corp.

Fujipoly ® introduces Sarcon ® PG45A its newest high-performance, putty-like thermal interface material. This extremely low modulus gap filler exhibits a thermal resistance as low as 0.02 °C •in2/W at 43.5 PSI with a thermal conductivity of 4.5 W/m °K. Sarcon ® PG45A... [See More]

  • Form / Shape: Putty; Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Gap Fill: 0.0591 to 0.0984
Addition Cured Silicone is Optically Clear with Enhanced Low Temperature Serviceability -- MasterSil 157
from Master Bond, Inc.

MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]

  • Form / Shape: Gap Filler, Foam in Place Gasket; Liquid
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Composition: Unfilled
Thermal Interface Material
from Boyd Corporation

Thermal Interface Materials - Gap Fillers and Pads, Films, Tapes, Hardware. Electronic devices continue to become faster, smaller, and more powerful every day, enabling technological advancements across all industries. The Internet of Things, powered by embedded electronics and its complex... [See More]

  • Form / Shape: Gap Filler, Foam in Place Gasket
  • Type: Thermally Conductive
Thermal Conductive Pad -- BS75K
from Shiu Li Technology Co., Ltd

LiPOLY BS75K is a soft thermally conductive gap filler. With a thermal conductivity of 3.0 W/m*K and a low thermal impedance, BS75K is suitable for a wide range of applications. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for a wide... [See More]

  • Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Gap Fill: 0.0197 to 0.1969
Bergquist Gap Filler 1500 Thermally Conductive Adhesive Yellow 50 cc Cartridge -- GAP FILLER 1500 50CC [GF1500-00-60-50CC from Bergquist Company (The)]
from Ellsworth Adhesives

Bergquist Gap Filler 1500 Thermally Conductive Adhesive is a two component, liquid gap filling material that is designed as a form-in-place elastomer for fragile electronic assemblies and filling difficult air voids and gaps. It offers excellent shear thinning characteristics, slump resistance,... [See More]

  • Form / Shape: Gap Filler, Foam in Place Gasket
  • Cure / Technology: Two Component  
  • Type: Thermally Conductive
  • Thermal Conductivity: 1.8
Momentive TIA241GF Thermal Gap Filler 3.6kg Kit -- MOSI17211
from Techsil Limited

Momentive TIA241GF is a 2 part, thermally conductive silicone that is dispensed as a liquid and cured in place to create a heat path for efficient heat transfer. After being applied, the non-slumping paste consistency of TIA214GF provides physical stability to prevent run-off after dispense. [See More]

  • Form / Shape: Gap Filler, Foam in Place Gasket; Grease, Paste
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Industry: Electronics
Thermal - Adhesives, Epoxies, Greases, Pastes -- 1944-1094-ND [65-00-T630-0300 from Parker Hannifin / Seal / O-Ring & Engineered Seals Division]
from Digi-Key Electronics

THERM-A-GAP T630 0.7W/M-K 300CC [See More]

  • Form / Shape: Gap Filler, Foam in Place Gasket
  • Use Temperature: -67 to 392
  • Type: Thermally Conductive
  • Thermal Conductivity: 0.7000
BERGQUIST GAP PAD TGP 7000ULM, Thermally conductive soft gap filling material, For high performance applications -- BERGQUIST GAP PAD TGP 7000ULM
from Henkel Adhesive Technologies - Aviation, Space and Rail

BERGQUIST GAP PAD TGP 7000ULM is an extremely soft gap filling material rated at a thermal conductivity of 7.0 W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique... [See More]

  • Form / Shape: Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Industry: OEM or Industrial
High Performance Gap Filler -- SARCON ® GR80A
from Fujipoly® America Corp.

Highly Conformable and High Heat Conducting gel materials. SARCON ® Thermal Gap Filler Pads are highly conformable and high heat conducting gel materials in a versatile sheet form. They easily fit and adhere to most all shapes and sizes of components, including protrusions and recessed areas. [See More]

  • Form / Shape: Gap Filler, Foam in Place Gasket; Gel
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Gap Fill: 0.0394 to 0.1181
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22
from Master Bond, Inc.

Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]

  • Form / Shape: Optional Premixed and Frozen; Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Grease, Paste
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Filled
Thermal Conductive Pad -- PK223
from Shiu Li Technology Co., Ltd

LiPOLY ’s PK223 is a material designed for gap filling. The thermal conductivity is 2.0W/m*K. The hardness is Shore 00/30 with high flexibility, high compressibility, highly insulating, great self-adhesive, which can cover the tolerance of design making it very stable. It also offers... [See More]

  • Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Gap Fill: 0.0197 to 0.3937
Bergquist Gap Filler 2000 Thermally Conductive Adhesive Pink 50 cc Cartridge -- GAP FILLER 2000 50CC [GF2000-00-60-50CC from Bergquist Company (The)]
from Ellsworth Adhesives

Bergquist Gap Filler 2000 Thermally Conductive Adhesive is a two component, liquid gap filling material that is designed as a form-in-place elastomer for coupling hot electronic components. It cures at room or elevated temperatures and offers mechanical and chemical stability. 50 cc Cartridge. [See More]

  • Form / Shape: Gap Filler, Foam in Place Gasket
  • Cure / Technology: Two Component  
  • Type: Thermally Conductive
  • Thermal Conductivity: 2
Techsil® TIM11123GB Thermally Conductive RTV 310ml -- TESI19105
from Techsil Limited

Techsil ® TIM11123 (GB) Grey is a 200 micron, self-gapping, non-corrosive, 1-part room temperature vulcanizing (RTV) silicone rubber. It is one of a new family of products called acetone cure sealants. These products are cured rapidly in contact with atmospheric moisture to a tough rubber that... [See More]

  • Form / Shape: Gap Filler, Foam in Place Gasket
  • Type: Electrically Conductive; Thermally Conductive
Thermal - Adhesives, Epoxies, Greases, Pastes -- 1944-1134-ND [65-00-T630-0010 from Parker Hannifin / Seal / O-Ring & Engineered Seals Division]
from Digi-Key Electronics

THERM-A-GAP T630 0.7W/M-K 10CC [See More]

  • Form / Shape: Gap Filler, Foam in Place Gasket
  • Use Temperature: -67 to 392
  • Type: Thermally Conductive
  • Thermal Conductivity: 0.7000
High Performance Thermal Gap Filler -- SARCON® GR130A
from Fujipoly® America Corp.

Fujipoly ® recently released Sarcon ® GR130A, its newest high-performance, thermal gap filler pad. The highly conformable, gel-like sheets exhibit a thermal resistance as low as 0.02 °C •in2/W at 43.5 PSI with a thermal conductivity of 13 W/m °K. Sarcon ® GR130A is available... [See More]

  • Form / Shape: Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Gap Fill: 0.0118 to 0.0787
B-Staged Epoxy Meets Airbus Standards for Flame Retardancy & Toxicity -- EP36FR
from Master Bond, Inc.

EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]

  • Form / Shape: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Unfilled
Thermal Conductive Pad -- PK404
from Shiu Li Technology Co., Ltd

LiPOLY ’s PK404 is a material designed for gap filling. The thermal conductivity is 4.0W/m*K. The hardness is Shore 00/40 with high flexibility, high compressibility, highly insulating, great self-adhesive, which can cover the tolerance of design making it very stable. It also offers... [See More]

  • Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Gap Fill: 0.0197 to 0.3937
Thermal - Adhesives, Epoxies, Greases, Pastes -- 1944-1135-ND [65-02-T630-0030 from Parker Hannifin / Seal / O-Ring & Engineered Seals Division]
from Digi-Key Electronics

THERM-A-GAP T630 0.7W/M-K 30CC [See More]

  • Form / Shape: Gap Filler, Foam in Place Gasket
  • Use Temperature: -67 to 392
  • Type: Thermally Conductive
  • Thermal Conductivity: 0.7000
Highly Conformable and Non-Flammable, Higher Thermal interface material -- SARCON® PG80B
from Fujipoly® America Corp.

SARCON® Extremely Compressible Gap Filler Type (Putty Type) is a highly conformable, thermally conductive, non-flammable interface materials. The surface consistency is excellent for filling small air gaps and uneven mating surface, making reliable contact with various shapes and sizes of... [See More]

  • Form / Shape: Putty; Gap Filler, Foam in Place Gasket
  • Industry: Electronics; Semiconductors, IC's
  • Type: Thermally Conductive
  • Use Temperature: -40 to 302
Electrically and Thermally Conductive, Two Part Silicone Meets NASA Low Outgassing Specifications -- MasterSil 973S-LO
from Master Bond, Inc.

MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]

  • Form / Shape: Gap Filler, Foam in Place Gasket; Grease, Paste; Encapsulant or Conformal Coating
  • Chemical System: Silicone
  • Type: Electrically Conductive; Thermally Conductive
  • Composition: Filled
Thermal Conductive Pad -- PK504
from Shiu Li Technology Co., Ltd

LiPOLY ’s PK504 is a material designed for gap filling. The thermal conductivity is 5.0W/m*K. The hardness is Shore 00/50 with high flexibility, high compressibility, highly insulating, great self-adhesive, which can cover the tolerance of design making it very stable. It also offers... [See More]

  • Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Gap Fill: 0.0197 to 0.1969
Thermal - Adhesives, Epoxies, Greases, Pastes -- 3153-PK223DM-110-KIT-ND [PK223DM-110-KIT from Shiu Li Technology Co., Ltd]
from Digi-Key Electronics

TWO-PART THERMAL LIQUID GAP FILL [See More]

  • Form / Shape: Gap Filler, Foam in Place Gasket
  • Use Temperature: -76 to 392
  • Type: Thermally Conductive
  • Thermal Conductivity: 2
Two-Part Thermal Gap Filler -- SARCON® LG23A and LG30A
from Fujipoly® America Corp.

The SARCON® LG Series is the perfect solution for filling large, complex and uneven gaps between heat generating components that depend on reliable contact with a heat spreader to maintain optimal performance. SARCON® LG23A and LG30A easily dispense in a liquid form that will cure at room... [See More]

  • Form / Shape: Gap Filler, Foam in Place Gasket; Gel
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity -- EP3HTSDA-1
from Master Bond, Inc.

EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]

  • Form / Shape: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Liquid
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Unfilled
Thermal Conductive Pad -- PK605
from Shiu Li Technology Co., Ltd

LiPOLY ’s PK605 is a material designed for gap filling. The thermal conductivity is 6.0 W/m*K. The hardness is Shore 00/60 with high flexibility, high compressibility, highly insulating, great self-adhesive, which can cover the tolerance of design making it very stable. It also offers... [See More]

  • Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Gap Fill: 0.0197 to 0.1969
Thermal - Adhesives, Epoxies, Greases, Pastes -- 3153-PK223DM-110-ND [PK223DM-110 from Shiu Li Technology Co., Ltd]
from Digi-Key Electronics

TWO-PART THERMAL LIQUID GAP FILL [See More]

  • Form / Shape: Gap Filler, Foam in Place Gasket
  • Use Temperature: -76 to 392
  • Type: Thermally Conductive
  • Thermal Conductivity: 2
Electrically Conductive Die Attach Epoxy With High Glass Transition Temperature -- EP17HTS-DA
from Master Bond, Inc.

Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]

  • Form / Shape: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Liquid
  • Chemical System: Polyphenylene Sulfide; Epoxy
  • Type: Electrically Conductive; Thermally Conductive
  • Composition: Filled
Thermal Conductive Pad -- PK700
from Shiu Li Technology Co., Ltd

LiPOLY ’s PK700 is a material designed for gap filling. The thermal conductivity is 7.0 W/m*K. The hardness is Shore 00/55 with high flexibility, high compressibility, highly insulating, great self-adhesive, which can cover the tolerance of design making it very stable. It also offers... [See More]

  • Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Gap Fill: 0.0197 to 0.1969
Thermal - Adhesives, Epoxies, Greases, Pastes -- 3153-PK404DM-150-KIT-ND [PK404DM-150-KIT from Shiu Li Technology Co., Ltd]
from Digi-Key Electronics

TWO-PART THERMAL LIQUID GAP FILL [See More]

  • Form / Shape: Gap Filler, Foam in Place Gasket
  • Use Temperature: -67 to 401
  • Type: Thermally Conductive
  • Thermal Conductivity: 3.6
Epoxy Meets Airbus Standards for Flame Retardancy, Smoke and Gas Emissions -- EP93FRHT
from Master Bond, Inc.

EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]

  • Form / Shape: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Unfilled
Thermal Conductive Pad -- S282
from Shiu Li Technology Co., Ltd

LiPOLY ’s S282 is a thermally conductive pad designed for gap filling. The thermal conductivity is 1.7 W/m*K. It uses fiberglass cloth as the reinforcement material with great self-adhesive that can fit closely with non-flat heat sinks to increase the contact area. The low stress damped... [See More]

  • Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Gap Fill: 0.0197 to 0.1969
Thermal - Adhesives, Epoxies, Greases, Pastes -- 3153-PK404DM-150-ND [PK404DM-150 from Shiu Li Technology Co., Ltd]
from Digi-Key Electronics

TWO-PART THERMAL LIQUID GAP FILL [See More]

  • Form / Shape: Gap Filler, Foam in Place Gasket
  • Use Temperature: -67 to 401
  • Type: Thermally Conductive
  • Thermal Conductivity: 3.6
Epoxy with High Elongation Passes ISO 10993-5 Certification for Cytotoxicity -- EP40Med
from Master Bond, Inc.

EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]

  • Form / Shape: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Unfilled
Two-Part Fast Curing Thermal Conductive Expoxy -- TPS96
from Shiu Li Technology Co., Ltd

LiPOLY TPS96 is a two-pack epoxy material for gap filling. The viscosity and flowing is very low. The high deformation material , which can filling the gap closely, cover the tolerance, and has outstanding conduc- tivity, makes is suitable for filling the peculiar gap. [See More]

  • Form / Shape: Syringe/Cartridge/Pale; Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Industry: Electronics
Thermal - Adhesives, Epoxies, Greases, Pastes -- 3153-PK605DM-160-KIT-ND [PK605DM-160-KIT from Shiu Li Technology Co., Ltd]
from Digi-Key Electronics

TWO-PART THERMAL LIQUID GAP FILL [See More]

  • Form / Shape: Gap Filler, Foam in Place Gasket
  • Use Temperature: -67 to 392
  • Type: Thermally Conductive
  • Thermal Conductivity: 5
High Shear/Peel Strength, Room Temperature Curing Epoxy -- EP31
from Master Bond, Inc.

Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel strength exceeding 40 pli. The service... [See More]

  • Form / Shape: Optional Premixed and Frozen; Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Grease, Paste
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Cure / Technology: Thermoset; Two Component  
Ultra Low Oil-Bleed Thermal Conductive Gel Pad -- AS200
from Shiu Li Technology Co., Ltd

LiPOLY AS200 is a thermally conductive gel designed for gap filling. The thermal conductivity is 2.0 W/m*K. The hardness is Shore 00/30, with high flexibility and compressibility. AS200 has ultra-low oil bleeding properties, which helps reduce pollutants from silicon oil, keeping electronic... [See More]

  • Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Gap Fill: 0.0197 to 0.1969
Thermal - Adhesives, Epoxies, Greases, Pastes -- 3153-PK605DM-160-ND [PK605DM-160 from Shiu Li Technology Co., Ltd]
from Digi-Key Electronics

TWO-PART THERMAL LIQUID GAP FILL [See More]

  • Form / Shape: Gap Filler, Foam in Place Gasket
  • Use Temperature: -67 to 392
  • Type: Thermally Conductive
  • Thermal Conductivity: 5
High Tempreature and Thermal Cycling Resistant Epoxy -- EP33
from Master Bond, Inc.

Master Bond Polymer Adhesive EP33 is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond Polymer Adhesive EP33 produces high strength bonds whose... [See More]

  • Form / Shape: Optional Premixed and Frozen; Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Grease, Paste
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Unfilled
Ultra Low Oil-Bleed Thermal Conductive Gel Pad -- AS400
from Shiu Li Technology Co., Ltd

LiPOLY AS400 is a thermally conductive gel designed for gap filling. The thermal conductivity is 4.0 W/m*K. The hardness is Shore 00/45, with high flexibility and compressibility. AS400 has ultra-low oil bleeding properties, which helps reduce pollutants from silicon oil, keeping electronic... [See More]

  • Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Gap Fill: 0.0197 to 0.1969
Thermal - Adhesives, Epoxies, Greases, Pastes -- 345-1727-ND [PL-BT-601-50M from Wakefield-Vette, Inc.]
from Digi-Key Electronics

ULTIMIFLUX 1W/MK 50ML CARTRIDGE [See More]

  • Form / Shape: Gap Filler, Foam in Place Gasket
  • Use Temperature: -76 to 392
  • Type: Thermally Conductive
  • Thermal Conductivity: 1
Highly Flexible Addition Cured Silicone Offers Low Thermal Resistance -- MasterSil 151TC
from Master Bond, Inc.

MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]

  • Form / Shape: Gap Filler, Foam in Place Gasket; Liquid
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Composition: Filled
Ultra Soft and High Thermal Condcutive Gap Filler -- T-Work7000
from Shiu Li Technology Co., Ltd

Our high thermally conductive gap filler T-work7000 provides excellent compression and extremely low thermal resistance in form shape with high thermal conductivity for gap filling between electrical component and heatsink. [See More]

  • Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Gap Fill: 0.0197 to 0.1969
Thermal - Adhesives, Epoxies, Greases, Pastes -- 345-1728-ND [PL-BT-603-50M from Wakefield-Vette, Inc.]
from Digi-Key Electronics

ULTIMIFLUX 3W/MK 50ML CARTRIDGE [See More]

  • Form / Shape: Gap Filler, Foam in Place Gasket
  • Use Temperature: -76 to 392
  • Type: Thermally Conductive
  • Thermal Conductivity: 3
Low Exotherm, Two Component Epoxy -- EP29LP
from Master Bond, Inc.

Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will form bond strengths in excess of 2,500 psi (aluminum to aluminum). It bonds well to a variety of substrates... [See More]

  • Form / Shape: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Grease, Paste
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Unfilled
Thermal - Adhesives, Epoxies, Greases, Pastes -- 345-1729-ND [PL-BT-605-50M from Wakefield-Vette, Inc.]
from Digi-Key Electronics

ULTIMIFLUX 5W/MK 50ML CARTRIDGE [See More]

  • Form / Shape: Gap Filler, Foam in Place Gasket
  • Use Temperature: -76 to 392
  • Type: Thermally Conductive
  • Thermal Conductivity: 5
Low Outgassing, Optically Clear Two Component Epoxy -- EP29LPSP
from Master Bond, Inc.

Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]

  • Form / Shape: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Unfilled
Thermal - Adhesives, Epoxies, Greases, Pastes -- 345-1868-ND [GL-20-10 from Wakefield-Vette, Inc.]
from Digi-Key Electronics

ULTIMIFLUX GEL 10CC SYRINGE 3.5W [See More]

  • Form / Shape: Gap Filler, Foam in Place Gasket
  • Use Temperature: -67 to 392
  • Type: Thermally Conductive
  • Thermal Conductivity: 3.5
Low Viscosity, Electrically Insulating Epoxy Features Excellent Optical Clarity -- EP30LP-2
from Master Bond, Inc.

Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]

  • Form / Shape: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Unfilled
Thermal - Adhesives, Epoxies, Greases, Pastes -- 473-8327GF25-50CC-ND [8327GF25-50CC from MG Chemicals]
from Digi-Key Electronics

THERMAL GAP FILL LIQUID SILICONE [See More]

  • Form / Shape: Gap Filler, Foam in Place Gasket
  • Thermal Conductivity: 2.5
  • Type: Thermally Conductive
Moderate Viscosity Thermally Conductive Epoxy -- EP112AO
from Master Bond, Inc.

Master Bond Polymer System EP112AO is a solventless, moderate viscosity two component epoxy resin system which is specifically designed for high performance outdoor and indoor electrical and electronic applications where good thermal conductivity and electrial isolation is required. The two... [See More]

  • Form / Shape: Gap Filler, Foam in Place Gasket; Liquid
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Filled
Thermal - Adhesives, Epoxies, Greases, Pastes -- 473-8327GF41-50CC-ND [8327GF41-50CC from MG Chemicals]
from Digi-Key Electronics

THERMAL GAP FILL LIQUID SILICONE [See More]

  • Form / Shape: Gap Filler, Foam in Place Gasket
  • Thermal Conductivity: 4.1
  • Type: Thermally Conductive
Nanosilica Filled Optically Clear Epoxy with High Abrasion Resistance -- EP30NS
from Master Bond, Inc.

Master Bond EP30NS is a nanosilica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]

  • Form / Shape: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Filled
Thermal - Adhesives, Epoxies, Greases, Pastes -- 926-1574-ND [A17251-01 from Laird Technologies]
from Digi-Key Electronics

TPUTTY 607 75CC EFD CARTRIDGE [See More]

  • Form / Shape: Gap Filler, Foam in Place Gasket
  • Use Temperature: -40 to 302
  • Type: Thermally Conductive
  • Thermal Conductivity: 6.4
NASA Low Outgassing Rated Epoxy Features Enhanced Chemical Resistance -- EP42-2LV Black
from Master Bond, Inc.

EP42-2LV Black is a two component, room temperature curing epoxy compound featuring low viscosity and superior chemical resistance. It meets NASA low outgassing specifications, is black in color and optically opaque. [See More]

  • Form / Shape: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Unfilled
Thermal - Adhesives, Epoxies, Greases, Pastes -- 926-1575-ND [A17251-02 from Laird Technologies]
from Digi-Key Electronics

TPUTTY 607 180CC EFD CARTRIDGE [See More]

  • Form / Shape: Gap Filler, Foam in Place Gasket
  • Use Temperature: -40 to 302
  • Type: Thermally Conductive
  • Thermal Conductivity: 6.4
New Epoxy Offers Rapid Cures and Chemical Resistance -- EP41S-F
from Master Bond, Inc.

Offering impressive physical strength characteristics, EP41S-F is an electrically insulative two component epoxy that cures rapidly at ambient and elevated temperatures. Typically faster curing epoxies are somewhat less chemically resistant than other types of systems, but EP41S-F is one of the few... [See More]

  • Form / Shape: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Unfilled
Thermal - Adhesives, Epoxies, Greases, Pastes -- 926-1576-ND [A17251-03 from Laird Technologies]
from Digi-Key Electronics

TPUTTY 607 360CC EFD CARTRIDGE [See More]

  • Form / Shape: Gap Filler, Foam in Place Gasket
  • Use Temperature: -40 to 302
  • Type: Thermally Conductive
  • Thermal Conductivity: 6.4
Nickel Filled Electrically Conductive Epoxy System -- EP76M
from Master Bond, Inc.

Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part nickel conductive systems, EP76M... [See More]

  • Form / Shape: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Grease, Paste; Encapsulant or Conformal Coating
  • Chemical System: Epoxy
  • Type: Electrically Conductive; Thermally Conductive
  • Composition: Filled
Thermal - Adhesives, Epoxies, Greases, Pastes -- 926-1579-ND [A17170-03 from Laird Technologies]
from Digi-Key Electronics

TPUTTY 508 360CC EFD CARTRIDGE [See More]

  • Form / Shape: Gap Filler, Foam in Place Gasket
  • Use Temperature: -40 to 302
  • Type: Thermally Conductive
  • Thermal Conductivity: 3.7
One Component, High Temperature Resistant Epoxy -- EP36
from Master Bond, Inc.

Master Bond Polymer System EP36 is a unique one component high performance toughened epoxy system for electrical potting, casting, encapsulation, baked coatings and adhesive applications. It features an outstanding combination of properties including high temperature stability up to 500 °F,... [See More]

  • Form / Shape: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Liquid
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Unfilled
Thermal - Adhesives, Epoxies, Greases, Pastes -- 926-1854-ND [A16872-02 from Laird Technologies]
from Digi-Key Electronics

TPUTTY 403 75CC CARTRIDGE [See More]

  • Form / Shape: Gap Filler, Foam in Place Gasket
  • Use Temperature: -49 to 302
  • Type: Thermally Conductive
  • Thermal Conductivity: 2.3
One component, high temperature resistant epoxy system for bonding and sealing -- EP17HTDA-1
from Master Bond, Inc.

Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for conventional bonding and sealing. This system features an excellent die shear strength of 24-27 kg-f and can be used in a typical die size ranging from 4-400 mm2. EP17HTDA-1 can also be... [See More]

  • Form / Shape: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Liquid
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Unfilled
Thermal - Adhesives, Epoxies, Greases, Pastes -- 926-1855-ND [A16872-03 from Laird Technologies]
from Digi-Key Electronics

TPUTTY 403 180CC CARTRIDGE [See More]

  • Form / Shape: Gap Filler, Foam in Place Gasket
  • Use Temperature: -49 to 302
  • Type: Thermally Conductive
  • Thermal Conductivity: 2.3
One Part, Toughened Epoxy for Specialty Dam-and-Fill Encapsulation -- Supreme 3HTND-2DM
from Master Bond, Inc.

Supreme 3HTND-2DM is a rapid curing, toughened, one part epoxy system used for the dam-and-fill method for chip-on-board encapsulation. It passes ASTM E595 specifications for NASA low outgassing allowing it to be used in vacuum, aerospace, electro-optic and other related applications. Supreme... [See More]

  • Form / Shape: Gap Filler, Foam in Place Gasket; Grease, Paste
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Unfilled
Thermal - Adhesives, Epoxies, Greases, Pastes -- 926-1856-ND [A16872-04 from Laird Technologies]
from Digi-Key Electronics

TPUTTY 403 360CC CARTRIDGE [See More]

  • Form / Shape: Gap Filler, Foam in Place Gasket
  • Use Temperature: -49 to 302
  • Type: Thermally Conductive
  • Thermal Conductivity: 2.3
Optically Clear, Room Temperature Curing Epoxy Blocks UV Light Transmission -- EP30-2LB
from Master Bond, Inc.

Formulated to have special optical transmission properties, EP30-2LB is an optically clear epoxy that does not permit UV light transmission, but transmits well from 450-900 nm and above. It is a user friendly compound that has a non-critical ten to one mix ratio by weight. This system cures readily... [See More]

  • Form / Shape: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Unfilled
Thermal - Adhesives, Epoxies, Greases, Pastes -- BER330-ND [GF3500S35-00-60-50CC from Bergquist Company (The)]
from Digi-Key Electronics

GF3500S35 50CC DUAL CARTRIDGE [See More]

  • Form / Shape: Gap Filler, Foam in Place Gasket
  • Use Temperature: -76 to 392
  • Type: Thermally Conductive
  • Thermal Conductivity: 3.6
Room Temperature Curing Epoxy Features Low Thermal Resistance -- EP30TC
from Master Bond, Inc.

Formulated for thermal management applications, EP30TC is a two component epoxy that contains robust thermally conductive fillers with very fine particle sizes. It has thermal conductivity of 18-20 BTU •in/ft2 •hr • °F [2.60-2.88 W/(m •K)] and can be applied in sections as... [See More]

  • Form / Shape: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Filled
Thermal - Adhesives, Epoxies, Greases, Pastes -- BER331-ND [GF1000-00-15-50CC from Bergquist Company (The)]
from Digi-Key Electronics

GF1000 50CC DUAL CARTRIDGE [See More]

  • Form / Shape: Gap Filler, Foam in Place Gasket
  • Use Temperature: -76 to 347
  • Type: Thermally Conductive
  • Thermal Conductivity: 1
Room Temperature Curing, Two Component Epoxy System -- EP34
from Master Bond, Inc.

Master Bond Polymer System EP34 is a unique room temperature curing two component epoxy compound for high temperature potting and encapsulating applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non critical mix ratio (part A/part B: 100/70). [See More]

  • Form / Shape: Optional Premixed and Frozen; Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Grease, Paste
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Unfilled
Ceramabond -- 503
from Aremco Products, Inc.

High fired strength, dense ceramics [See More]

  • Form / Shape: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Liquid
  • Chemical System: Ceramic
  • Type: Thermally Conductive
  • Composition: Filled
BERGQUIST GAP PAD TGP 1350
from Henkel Corporation - Industrial

BERGQUIST GAP PAD TGP 1350, Highly Conformable, Thermally Conductive, Reworkable Gap Filling Material. BERGQUIST ® GAP PAD TGP 1350 is a highly compliant Gap Pad material that is ideal for fragile component leads. The material includes a PEN film, which facilitates rework and improves puncture... [See More]

  • Form / Shape: Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
  • Type: Thermally Conductive
Cement -- No. 31
from Sauereisen, Inc.

Sauereisen Cement No. 31 is a white, porcelain-like cement that is widely used throughout industry in a variety of applications. including assembling, sealing, insulating and cementing of ceramics, porcelain, metal, and glass. [See More]

  • Form / Shape: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Liquid; Powder
  • Chemical System: Ceramic
  • Type: Thermally Conductive
  • Composition: Unfilled
Thermal Interface Material -- GAP PAD HC 5.0
from Henkel Corporation - Electronics

GAP PAD ™ HC 5.0 is a soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique filler package and low-modulus resin formulation. The enhanced material is ideal for applications... [See More]

  • Form / Shape: Gap Filler, Foam in Place Gasket
  • Industry: Electronics
  • Type: Thermally Conductive
Epoxy Cast -- PTE-36977
from Protavic America, Inc.

PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ is heat stable up to 150 °C. [See More]

  • Form / Shape: Gap Filler, Foam in Place Gasket; Gel; Encapsulant or Conformal Coating
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Filled
Pyro-Putty® -- 657
from Aremco Products, Inc.

Used for repairing metal components, pinholes, cracks, and filling seams. [See More]

  • Form / Shape: Gap Filler, Foam in Place Gasket; Grease, Paste
  • Chemical System: Ceramic
  • Type: Thermally Conductive
  • Composition: Filled