Filled Conductive Compounds

Electrically and Thermally Conductive Epoxy Adhesive -- EPO-TEK® EK1000-1-D
from Epoxy Technology

EPO-TEK ® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical, and... [See More]

  • Composition: Filled
  • Chemical System: Epoxy
  • Type: Electrically Conductive; Thermally Conductive
  • Cure / Technology: Thermoset; Single Component
Pedigree® -- 40 VTC-40F
from ELANTAS PDG, Inc.

Mineral-filled VPI resin - semi-flexible for transformers with improved heat dissipation [See More]

  • Composition: Filled
  • Chemical System: Alkyd
  • Type: Thermally Conductive
  • Cure / Technology: Thermoset; Single Component
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22
from Master Bond, Inc.

Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]

  • Composition: Filled
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Cure / Technology: Thermoset; Two Component  
Highly Thermal Conductive and Non-Flammable Silicone Putty Sheet -- SARCON ® XR-Um-AL
from Fujipoly® America Corp.

Sarcon ® XR-Um-Al has one surface with aluminum film, which enable to remove eve n after application ( before operation) and there is no-pull-out effect. Putty nature enables low contact thermal resistance. Low Molecular Siloxane content is very low. Has a flame retardancy of UL specification 94... [See More]

  • Composition: Filled
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Form / Shape: Putty; Gap Filler, Foam in Place Gasket
Biocompatible, Nanosilica Filled LED Curable Adhesive -- LED405Med
from Master Bond, Inc.

Master Bond LED405Med is a one part, nanofilled system that cures quickly upon exposure to a 405 nm LED light. It does not require a UV light source. It meets ISO 10993-5 for cytotoxicity and resists sterilization. It can cure up to 1/8 think and has low shrinkage upon cure. It also features... [See More]

  • Composition: Filled
  • Cure / Technology: Thermoset; Single Component; LED Cure
  • Type: Thermally Conductive
  • Form / Shape: Liquid
Dual Curing, Thixotropic Adhesive -- UV22DC80-10F
from Master Bond, Inc.

One part, nanosilica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]

  • Composition: Filled
  • Chemical System: UV Curing
  • Type: Thermally Conductive
  • Cure / Technology: UV or Radiation Cured; Single Component; Dual Curing
Electrically and Thermally Conductive, Two Part Silicone Meets NASA Low Outgassing Specifications -- MasterSil 973S-LO
from Master Bond, Inc.

MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]

  • Composition: Filled
  • Chemical System: Silicone
  • Type: Electrically Conductive; Thermally Conductive
  • Cure / Technology: Thermoset; Two Component  ; Addition Cure
Electrically Conductive Die Attach Epoxy With High Glass Transition Temperature -- EP17HTS-DA
from Master Bond, Inc.

Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]

  • Composition: Filled
  • Chemical System: Polyphenylene Sulfide; Epoxy
  • Type: Electrically Conductive; Thermally Conductive
  • Cure / Technology: Thermoset; Single Component
Epoxy Adhesive with Ultra Low Thermal Resistance -- EP48TC
from Master Bond, Inc.

For advanced PCB assembly and heat sink bonding applications, Master Bond offers EP48TC, a specially formulated adhesive that features ultra low thermal resistance of 5-7 x 10-6 K •m2/W. This system uses high thermal conductive fillers and is capable of being applied in bond lines as thin as... [See More]

  • Composition: Filled
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Highly Flexible Addition Cured Silicone Offers Low Thermal Resistance -- MasterSil 151TC
from Master Bond, Inc.

MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]

  • Composition: Filled
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Moderate Viscosity Thermally Conductive Epoxy -- EP112AO
from Master Bond, Inc.

Master Bond Polymer System EP112AO is a solventless, moderate viscosity two component epoxy resin system which is specifically designed for high performance outdoor and indoor electrical and electronic applications where good thermal conductivity and electrial isolation is required. The two... [See More]

  • Composition: Filled
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Cure / Technology: Thermoset; Two Component  
Nanosilica Filled Optically Clear Epoxy with High Abrasion Resistance -- EP30NS
from Master Bond, Inc.

Master Bond EP30NS is a nanosilica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]

  • Composition: Filled
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Nickel Filled Electrically Conductive Epoxy System -- EP76M
from Master Bond, Inc.

Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part nickel conductive systems, EP76M... [See More]

  • Composition: Filled
  • Chemical System: Epoxy
  • Type: Electrically Conductive; Thermally Conductive
  • Cure / Technology: Thermoset; Two Component  
Room Temperature Curing Epoxy Features Low Thermal Resistance -- EP30TC
from Master Bond, Inc.

Formulated for thermal management applications, EP30TC is a two component epoxy that contains robust thermally conductive fillers with very fine particle sizes. It has thermal conductivity of 18-20 BTU •in/ft2 •hr • °F [2.60-2.88 W/(m •K)] and can be applied in sections as... [See More]

  • Composition: Filled
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Thermally Conductive, Dimensionally Stable Epoxy -- EP121AO
from Master Bond, Inc.

Master Bond EP121AO is a two component, high performance epoxy resin system featuring high thermal stability, high thermal conductivity, superior electrical insulation properties and outstanding dimensional stability for coating, sealing, potting and encapsulation for service up to 450-500 °F. [See More]

  • Composition: Filled
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Cure / Technology: Thermoset; Two Component  
Toughened, Urethane Based Epoxy System Meets USP Class VI Specifications -- EP30DPBFMed
from Master Bond, Inc.

Master Bond EP30DPBFMed is a two part, flexibilized epoxy-urethane hybrid system that can be used for bonding, sealing, coating, and encapsulation. [See More]

  • Composition: Filled
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Two Component Silver Conductive Epoxy -- EP77M-1
from Master Bond, Inc.

Master Bond Polymer System EP77M-1 is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. It readily develops a high bonding strength of more than 2000 psi tensile... [See More]

  • Composition: Filled
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Cure / Technology: Thermoset; Two Component  
Two Component, Silver Coated, Nickel Filled Epoxy -- EP79
from Master Bond, Inc.

Master Bond Polymer System EP79 is a two component, silver coated nickel filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. EP79 offers a convenient one-to-one mix ratio by weight or... [See More]

  • Composition: Filled
  • Chemical System: Epoxy
  • Type: Electrically Conductive; Thermally Conductive
  • Cure / Technology: Thermoset; Two Component  
Two Part, Nickel Conductive Epoxy Meets NASA Low Outgassing Specifications -- EP21TDCN-LO
from Master Bond, Inc.

Featuring a low volume resistivity of 5-10 ohm-cm, EP21TDCN-LO is a nickel conductive system for high performance bonding and sealing applications. This smooth paste formulation is easy to handle and has a one to one mix ratio by weight or volume. It is a toughened system, formulated to withstand... [See More]

  • Composition: Filled
  • Chemical System: Epoxy
  • Type: Electrically Conductive; Thermally Conductive
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Ceramabond -- 503
from Aremco Products, Inc.

High fired strength, dense ceramics [See More]

  • Composition: Filled
  • Chemical System: Ceramic
  • Type: Thermally Conductive
  • Cure / Technology: Thermoset
Electro-Conductive Epoxy Adhesive -- ACE-10131
from Protavic America, Inc.

Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for production needs. One... [See More]

  • Composition: Filled
  • Chemical System: Epoxy
  • Type: Electrically Conductive; Thermally Conductive
  • Cure / Technology: Thermoset; Single Component
Aluminum filled epoxy system -- 70-3800R
from Epoxies Etc...

70-3800 is a low viscosity, aluminum filled, epoxy tooling resin. This system is used for making heat resistant cast tools or parts that require very good thermal conductivity. 70-3800 is easily machined, drilled, tapped, or polished, and is ideal for vacuum form molds, dies, drill jigs, injection... [See More]

  • Composition: Filled
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
Pyro-Putty® -- 657
from Aremco Products, Inc.

Used for repairing metal components, pinholes, cracks, and filling seams. [See More]

  • Composition: Filled
  • Chemical System: Ceramic
  • Type: Thermally Conductive
  • Cure / Technology: Thermoset
Epoxy Adhesive -- PNE-30270
from Protavic America, Inc.

A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals. [See More]

  • Composition: Filled
  • Chemical System: Epoxy
  • Type: Electrically Conductive; Thermally Conductive
  • Cure / Technology: Thermoset; Single Component
Electrically Conductive Epoxy -- 40-3905
from Epoxies Etc...

40-3905 is an electrically conductive system designed for applications requiring low temperature cures. 40-3905 will cure at room temperature in 18 hours or can be accelerated with mild heat. [See More]

  • Composition: Filled
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Epoxy Cast -- PTE-36977
from Protavic America, Inc.

PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ is heat stable up to 150 °C. [See More]

  • Composition: Filled
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Cure / Technology: Thermoset; Two Component  
Room Temp Curing Epoxy Adhesive -- ATE-46446
from Protavic America, Inc.

Filled epoxy system for high thermal applications such as heat-sink bonding. This material has 2.2 Wm °K thermal performance with supporting laser flash data. Room temperature cure. [See More]

  • Composition: Filled
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Cure / Technology: Thermoset; Two Component