Grease / Paste Conductive Compounds
from Master Bond, Inc.
Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]
- Form / Shape: Optional Premixed and Frozen; Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Grease, Paste
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Thermon, Inc
T-3 heat transfer compound now has higher temperature ratings than ever before while still creating an efficient thermal bond between a steam or electric heater and process pipes or equipment. A single "Thermonized ™"steam tracer utilizing Thermon's heat transfer compound is more cost... [See More]
- Form / Shape: Gap Filler, Foam in Place Gasket; Grease, Paste
- Cure / Technology: Single Component
- Type: Thermally Conductive
- Use Temperature: 32 to 850
from MacDermid Alpha Electronics Solutions
Product Overview. ATROX conductive die attach products provide a comprehensive solution with a reduced total cost of ownership, ushering in a new era of high-performance materials. Product Features. Thermal Conductivity. The ATROX 558-2C31 offers good thermal conductivity, greater than 5 W/m-K,... [See More]
- Form / Shape: Die Bonding Adhesives; Grease, Paste
- Cure / Technology: Thermoset
- Type: Electrically Conductive; Thermally Conductive
- Industry: Electronics; Semiconductors, IC's
from Fujipoly® America Corp.
Fujipoly ® America announces the release of its new SARCON ® SPG-70A. It is a high flow rate, high heat transferring compound that exhibits a thermal conductivity of 7.0 W/m °K and has the lowest thermal resistance among our dispensable SPG products. When applied between heat-generating... [See More]
- Form / Shape: Gap Filler, Foam in Place Gasket; Grease, Paste
- Chemical System: Silicone
- Type: Thermally Conductive
- Industry: Electronics
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SG560 Series Thermal Grease are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, available in options ranging from 1.0 to 5.0 W/m ·K. ◆ Low thermal impedance, with a minimum of 0.015 ℃*in ²/W at 30psi. ◆ Minimum... [See More]
- Form / Shape: Grease, Paste
- Industry: Electronics
- Type: Thermally Conductive
- Use Temperature: ? to 302
from RS Components, Ltd.
Electrolube HTC10S Thermal Grease [See More]
- Form / Shape: Grease, Paste
- Chemical System: Non-silicone
- Type: Thermally Conductive
from Master Bond, Inc.
EP3HTND-2Med Black is a one part system that combines easy processing with excellent bonding properties. It cures in 20-30 minutes at 250°F or 5-10 minutes at 300°F and adheres well to a wide variety of substrates including glass, metals, ceramics and most plastics. This paste compound meets USP... [See More]
- Form / Shape: Grease, Paste
- Chemical System: Epoxy
- Type: Thermally Conductive
- Composition: Unfilled
from Thermon, Inc
The New & Improved T-85 is a pre-mixed epoxy-based heat transfer compound with higher temperature ratings and the highest possible bond strength for use in moist and corrosive environments. T-85 is typically utilized on pumps, valves and equipment where maximum bond strength for tracing installation... [See More]
- Form / Shape: Die Bonding Adhesives; Grease, Paste
- Cure / Technology: Single Component
- Type: Thermally Conductive
- Use Temperature: 32 to 450
from MacDermid Alpha Electronics Solutions
Product Overview. ATROX ® CD 560-1 offers excellent substrate compatibility and low Resin Bleed-Out (RBO), ensuring reliable bonding to Pre-Plated Frame (PPF) and copper lead frames. It provides a long pot life of over 24 hours at room temperature and maintains a 12-month shelf life when stored... [See More]
- Form / Shape: Die Bonding Adhesives; Grease, Paste
- Cure / Technology: Thermoset
- Type: Electrically Conductive
- Industry: Electronics; Semiconductors, IC's
from Fujipoly® America Corp.
Fujipoly ® USA introduces new 5 and 6W/m-K SARCON ® thermally conductive greases to the North American market. SARCON ® SG-50NS and SG-60NS greases offer excellent stability over wide temperature ranges with low thermal resistance. They feature exceptionally low bleed and evaporation as... [See More]
- Form / Shape: Grease, Paste
- Industry: Electronics
- Type: Thermally Conductive
- Thermal Conductivity: 5 to 6
from RS Components, Ltd.
Electrolube HTC35SL Thermal Grease [See More]
- Form / Shape: Grease, Paste
- Chemical System: Non-silicone
- Type: Thermally Conductive
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Form / Shape: Gap Filler, Foam in Place Gasket; Grease, Paste; Encapsulant or Conformal Coating
- Chemical System: Silicone
- Type: Electrically Conductive; Thermally Conductive
- Composition: Filled
from Thermon, Inc
T-99 is a specialty high temperature heat transfer compound formulated to provide high thermal stability and bond strength up to 1204°C (2200°F). Unlike other grades of heat transfer compounds, it is also electrically non-conductive (when cured). It is supplied ready to use and may be applied by... [See More]
- Form / Shape: Die Bonding Adhesives; Grease, Paste
- Cure / Technology: Single Component
- Type: Thermally Conductive
- Use Temperature: 32 to 2200
from MacDermid Alpha Electronics Solutions
Product Overview. ATROX ® 800HT6B: Conductive die attach paste providing a balance of thermal conductivity and mechanical flexibility for stress-sensitive components. [See More]
- Form / Shape: Die Bonding Adhesives; Grease, Paste
- Industry: Electronics; Semiconductors, IC's
- Type: Electrically Conductive; Thermally Conductive
from Fujipoly® America Corp.
Sarcon ® SG-07SL and SG-26SL are highly thermally conductive, non-reactive silicone-based greases that offer low thermal resistance and maintain a nonflow able composition. Unique binding agents and product formulation ensure the lowest amount of bleed and evaporation. Suited for thin bond line... [See More]
- Form / Shape: Grease, Paste
- Chemical System: Silicone
- Type: Thermally Conductive
- Industry: Electronics; Semiconductors, IC's
from RS Components, Ltd.
MG Super Thermal grease II 3ml [See More]
- Form / Shape: Grease, Paste
- Type: Thermally Conductive
from Master Bond, Inc.
Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel strength exceeding 40 pli. The service... [See More]
- Form / Shape: Optional Premixed and Frozen; Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Grease, Paste
- Chemical System: Epoxy
- Type: Electrically Conductive
- Cure / Technology: Thermoset; Two Component
from MacDermid Alpha Electronics Solutions
Product Overview. Electrolube ® UVFlex is a next-generation, solvent-free, UV-curable conformal coating engineered for demanding electronics applications. Its unique elasticity helps maintain coating integrity through extreme thermal cycling and harsh environmental conditions, delivering... [See More]
- Form / Shape: Liquid; Grease, Paste; Encapsulant or Conformal Coating
- Industry: Electronics; Semiconductors, IC's
- Type: Thermally Conductive
- Use Temperature: -85 to 302
from Fujipoly® America Corp.
SARCON ® SPG-25B-NS from Fujipoly ® is an easy to dispense, low- viscosity, silicone free compound that exhibits a thermal conductivity of 2.5 W/m °K and a thermal resistance of only 2.1 °K •cm2/W. When applied between heat-generating components and a nearby heat sink or... [See More]
- Form / Shape: Gap Filler, Foam in Place Gasket; Grease, Paste
- Industry: Electronics
- Type: Thermally Conductive
- Use Temperature: -40 to 248
from RS Components, Ltd.
MG Super Thermal grease II 25ml [See More]
- Form / Shape: Grease, Paste
- Type: Thermally Conductive
from Master Bond, Inc.
Master Bond Polymer Adhesive EP33 is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond Polymer Adhesive EP33 produces high strength bonds whose... [See More]
- Form / Shape: Optional Premixed and Frozen; Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Grease, Paste
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Unfilled
from MacDermid Alpha Electronics Solutions
Product Overview. A one-component, low-temperature curing epoxy adhesive designed specifically for bonding heat-sensitive devices. Ideal for applications in camera modules and other optical devices where low thermal exposure is critical, the AD13-9692B offers strong adhesion at temperatures low... [See More]
- Form / Shape: Liquid; Grease, Paste
- Cure / Technology: Single Component
- Type: Thermally Conductive
- Industry: Electronics; Optical; Semiconductors, IC's
from RS Components, Ltd.
MG Super Thermal grease II 85ml [See More]
- Form / Shape: Grease, Paste
- Type: Thermally Conductive
from Master Bond, Inc.
Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will form bond strengths in excess of 2,500 psi (aluminum to aluminum). It bonds well to a variety of substrates... [See More]
- Form / Shape: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Grease, Paste
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Unfilled
from MacDermid Alpha Electronics Solutions
Product Overview. HTC Heat Transfer Compound is a non-silicone thermal interface material recommended for efficient and reliable thermal coupling of electrical and electronic components, or between any surfaces where thermal conductivity or heat dissipation is important. It is ideal for application... [See More]
- Form / Shape: Powder; Grease, Paste
- Chemical System: Silicone
- Type: Thermally Conductive
- Industry: Electronics; Semiconductors, IC's
from RS Components, Ltd.
Heat Sink Compound tube 100g [See More]
- Form / Shape: Grease, Paste
- Thermal Conductivity: 0.4100
- Type: Thermally Conductive
from Master Bond, Inc.
Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part nickel conductive systems, EP76M... [See More]
- Form / Shape: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Grease, Paste; Encapsulant or Conformal Coating
- Chemical System: Epoxy
- Type: Electrically Conductive; Thermally Conductive
- Composition: Filled
from MacDermid Alpha Electronics Solutions
Product Overview. HTCP Non-Silicone Thermal Interface Material is a "Plus" version of Electrolube ’s successful HTC, offering ultimate thermal conductivity along with the benefits of a non-silicone base oil. The exceptional properties of HTCP result from the novel use of various metal oxide... [See More]
- Form / Shape: Powder; Grease, Paste
- Chemical System: Silicone
- Type: Thermally Conductive
- Industry: Electronics; Semiconductors, IC's
from RS Components, Ltd.
Heat Sink Compound seringue 20g [See More]
- Form / Shape: Grease, Paste
- Use Temperature: 572
- Type: Thermally Conductive
from Master Bond, Inc.
Supreme 3HTND-2DM is a rapid curing, toughened, one part epoxy system used for the dam-and-fill method for chip-on-board encapsulation. It passes ASTM E595 specifications for NASA low outgassing allowing it to be used in vacuum, aerospace, electro-optic and other related applications. Supreme... [See More]
- Form / Shape: Gap Filler, Foam in Place Gasket; Grease, Paste
- Chemical System: Epoxy
- Type: Thermally Conductive
- Composition: Unfilled
from MacDermid Alpha Electronics Solutions
Product Overview. HTS Silicone Heat Transfer Compound is a metal oxide-filled silicone oil, providing an extremely efficient and thermally conductive interface material that operates over a wide temperature range. Electrolube Heat Transfer Compound is recommended for achieving efficient and reliable... [See More]
- Form / Shape: Powder; Grease, Paste
- Chemical System: Silicone
- Type: Electrically Conductive; Thermally Conductive
- Composition: Filled
from RS Components, Ltd.
860 60G Tub of Heat Trans Comp Silicone [See More]
- Form / Shape: Grease, Paste
- Use Temperature: 392
- Type: Thermally Conductive
- Thermal Conductivity: 0.7000
from Master Bond, Inc.
Master Bond EP62-1AO is a two component, flowable epoxy system with an exceptionally long open time at ambient temperature. [See More]
- Form / Shape: Grease, Paste
- Chemical System: Epoxy
- Type: Thermally Conductive
- Composition: Unfilled
from MacDermid Alpha Electronics Solutions
Product Overview. HTSP Silicone Heat Transfer Compound Plus is a modified "Plus" version of Electrolube ’s successful HTS, offering superior thermal conductivity and a wide temperature range through the use of silicone base oils. Its exceptional properties stem from the novel use of metal... [See More]
- Form / Shape: Powder; Grease, Paste
- Chemical System: Silicone
- Type: Thermally Conductive
- Industry: Electronics; Semiconductors, IC's
from RS Components, Ltd.
860 150G Tube Silicone Heat Trans Compd [See More]
- Form / Shape: Grease, Paste
- Use Temperature: 392
- Type: Thermally Conductive
- Thermal Conductivity: 0.7000
from Master Bond, Inc.
Master Bond Polymer System EP77M-1 is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. It readily develops a high bonding strength of more than 2000 psi tensile... [See More]
- Form / Shape: Gap Filler, Foam in Place Gasket; Grease, Paste
- Chemical System: Epoxy
- Type: Thermally Conductive
- Composition: Filled
from RS Components, Ltd.
Jelt 006018 [See More]
- Form / Shape: Grease, Paste
- Chemical System: Silicone; Silicone
- Type: Thermally Conductive
from Master Bond, Inc.
Master Bond Polymer System EP79 is a two component, silver coated nickel filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. EP79 offers a convenient one-to-one mix ratio by weight or... [See More]
- Form / Shape: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Grease, Paste
- Chemical System: Epoxy
- Type: Electrically Conductive; Thermally Conductive
- Composition: Filled
from RS Components, Ltd.
Electrolube ERHTCP02S Thermal Grease [See More]
- Form / Shape: Grease, Paste
- Chemical System: Non-silicone
- Type: Thermally Conductive
from Wacker Chemical Corp.
SEMICOSIL ® 979 EC is a RTV-1 amine cure silicone rubber that cures on contact with moisture in the air. Special features. Low volume resistivity. Thixotropic paste. Solvated. Excellent adhesion to many substrates. Application. SEMICOSIL ® 979 EC is an electrically conductive adhesive for... [See More]
- Form / Shape: Grease, Paste
- Chemical System: Silicone; Elastomeric
- Type: Electrically Conductive
- Cure / Technology: Thermoset; Single Component; Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing
from Protavic America, Inc.
Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for production needs. One... [See More]
- Form / Shape: Die Bonding Adhesives; Grease, Paste
- Chemical System: Epoxy
- Type: Electrically Conductive; Thermally Conductive
- Composition: Filled
from Techsil Limited
Momentive TIA241GF is a 2 part, thermally conductive silicone that is dispensed as a liquid and cured in place to create a heat path for efficient heat transfer. After being applied, the non-slumping paste consistency of TIA214GF provides physical stability to prevent run-off after dispense. [See More]
- Form / Shape: Gap Filler, Foam in Place Gasket; Grease, Paste
- Chemical System: Silicone
- Type: Thermally Conductive
- Industry: Electronics
from Epoxy Technology
EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]
- Form / Shape: Grease, Paste
- Chemical System: Epoxy
- Type: Thermally Conductive
- Cure / Technology: Thermoset; Two Component
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-NS10 ™ epoxy is developed for general purpose applications requiring high performance bond or connection of electrically conductive components/materials for enhanced electrical conductivity. G6E-NS10 ™ has been developed based on advanced proprietary technology that... [See More]
- Form / Shape: Grease, Paste
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Sauereisen, Inc.
Sauereisen Adhesive Paste No. 19 is an inorganic, odorless, nontoxic cement used for bonding glass, porcelain, wood, felt, cork, metals and ceramic fiber. Some typical applications include protection of exposed metal surfaces during heat treating, bonding wallboard to brick or concrete and cementing... [See More]
- Form / Shape: Die Bonding Adhesives; Grease, Paste
- Chemical System: Ceramic
- Type: Thermally Conductive
- Composition: Unfilled
from Shiu Li Technology Co., Ltd
LiPOLY's TPS series is a low-density, potting material. Its low density and lightweight properties enhance product performance, reduce production costs. The product has a thermal conductivity of 0.55-1.50 W/m*K and can cure at room temperature or high temperatures. [See More]
- Form / Shape: Gap Filler, Foam in Place Gasket; Liquid; Grease, Paste
- Chemical System: Silicone
- Type: Thermally Conductive
- Cure / Technology: Room Temperature Vulcanizing or Curing
from Nordson EFD
Our innovative, non-silicone thermal compounds provide an ideal thermal solution by ensuring reliable heat transfer over a longer time than most industrial thermal interface materials. Conventional, silicone-based heat sink compounds and thermal greases tend to spread after a number of heating and... [See More]
- Form / Shape: Grease, Paste
- Chemical System: Synthetic Based
- Type: Thermally Conductive
- Composition: Unfilled
from Hi-Tech Seals, Inc.
HERNON ® offers a complete line of structural acrylic adhesives. These systems are two-part, no mix, and reactive adhesives. Each acrylic adhesive has two components: the adhesive base or resin, and the Activator. Structural acrylic adhesives are termed “reactive ” cure systems. The... [See More]
- Form / Shape: Grease, Paste
- Chemical System: Acrylic
- Type: Thermally Conductive
- Cure / Technology: Two Component ; Reactive or Moisture Cured
from Epoxies Etc...
The 10-2055 and 10-2055 HV were developed to produce a general purpose, semi flexible polyurethane adhesive for bonding a wide variety of plastic and metal substrates. The flexibility of these adhesives allows bonding to substrates with high coefficients of thermal expansion (CTE) and substrates... [See More]
- Form / Shape: Die Bonding Adhesives; Grease, Paste
- Chemical System: Polyurethane
- Type: Thermally Conductive
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
from Bluestar Silicones USA Corp.
Metal Oxide Thickened Dimethyl Silicone Compound. Description. Bluesil V-740 is a metal oxide thickened dimethyl silicone compound. It is a white, heavy paste used for heat dissipation applications where high thermal conductivity is required. [See More]
- Form / Shape: Grease, Paste
- Chemical System: Silicone
- Type: Thermally Conductive
- Cure / Technology: Two Component
from Aremco Products, Inc.
High thermal conductivity, probes, sensors [See More]
- Form / Shape: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Grease, Paste
- Chemical System: Ceramic
- Type: Thermally Conductive
- Composition: Filled
from OMEGA Engineering, Inc.
OMEGATHERM thermal conducting paste is a high temperature and high thermally conductive paste product. They are specially formulated for permanent and temporary bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics,... [See More]
- Form / Shape: Grease, Paste
- Chemical System: Silicone
- Type: Thermally Conductive
- Cure / Technology: Single Component
from Monocrystal, Inc.
AGH – series. Application: High conductive low firing silver paste for fine line screen printing. Silver conductor is specially designed to form the conductive coating and bond area to the glass and ceramic substrate by screen printing method. Composition variations: AGH-A-60 – 60%... [See More]
- Form / Shape: Grease, Paste
- Industry: Electronics
- Type: Electrically Conductive
from Graphene Laboratories, Inc.
DESCRIPTION: Traditional silver-based adhesives require up to 80% weight load of silver fillers and as a result tend to be costly, brittle and prone to mechanical failure. G6E-NS11 ™ has been developed based on advanced proprietary technology that requires 15% or less silver content to be at... [See More]
- Form / Shape: Grease, Paste
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Shiu Li Technology Co., Ltd
LiPOLY ’s TIM12/TIM14 is a one-part silicon-based thermally conductive adhesive that can be cured at room temperature or high temperature. It not only produces low stress, low thermal resistance, low viscosity, and good adhesion to components, but also maintains insulating properties. It... [See More]
- Form / Shape: Die Bonding Adhesives; Gel; Grease, Paste
- Chemical System: Silicone
- Type: Thermally Conductive
- Cure / Technology: Single Component; Room Temperature Vulcanizing or Curing (optional feature); High Heat
from Epoxies Etc...
20-2121 is formulated for electronic potting, encapsulating and casting applications. The 20-2121 is a two-component, low viscosity, room temperature curing system. This is an easy to use product that does not contain TDI, MbOCA or Mercury. 20-2121 will cushion and protect sensitive electronic... [See More]
- Form / Shape: Grease, Paste
- Chemical System: Polyurethane
- Type: Thermally Conductive
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Aremco Products, Inc.
Aremco ’s high temperature ceramic adhesives are unique inorganic formulations for bonding and sealing ceramics, metals, quartz, graphites, textiles, and composite materials used in design, process and maintenance applications to 3200 °F. These advanced materials, which exhibit high... [See More]
- Form / Shape: Grease, Paste
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Type: Electrically Conductive; Thermally Conductive
- Industry: Electronics
from OMEGA Engineering, Inc.
OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper products. [See More]
- Form / Shape: Grease, Paste
- Chemical System: Silicone
- Type: Thermally Conductive
- Cure / Technology: Single Component
from Graphene Laboratories, Inc.
G6 Epoxy® is excited to announce the release of our latest product - a one-component electrically conductive epoxy. This innovative solution provides excellent electrical conductivity and bonding strength in a single component formula, making it easier and more convenient to use than traditional... [See More]
- Form / Shape: Grease, Paste
- Chemical System: Epoxy
- Type: Electrically Conductive
- Cure / Technology: Thermoset; Single Component
from Epoxies Etc...
Epoxies, Etc... has engineered these materials to satisfy the requirements of many demanding coating and bonding applications that require electrical conductivity. [See More]
- Form / Shape: Die Bonding Adhesives; Grease, Paste
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Unfilled
from Aremco Products, Inc.
Used for repairing metal components, pinholes, cracks, and filling seams. [See More]
- Form / Shape: Gap Filler, Foam in Place Gasket; Grease, Paste
- Chemical System: Ceramic
- Type: Thermally Conductive
- Composition: Filled
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-FRP ™ is a flexible version of our G6E-P ™ general purpose epoxy. G6E-FRP ™ epoxy was developed primarily for high-performance bonding, connection, sealing and coating applications requiring a flexible bond or connection of electrically conductive components or... [See More]
- Form / Shape: Grease, Paste
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-FXNS ™ epoxy is developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials as well as for low electrical resistivity. G6E-FXNS ™ is developed based on advanced proprietary technology that requires... [See More]
- Form / Shape: Grease, Paste
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-FXSG ™ epoxy is primarily developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials requiring low electrical resistivity. G6-FXSG ™ is well suited for bonding of dissimilar materials that are... [See More]
- Form / Shape: Grease, Paste
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-P ™ epoxy is primarily developed for general purpose applications requiring high-performance bond or connection of electrically conductive components/materials. G6E-P ™ is formulated with proprietary nanomaterials and fillers. G6E-P ™ epoxy can be cured at room... [See More]
- Form / Shape: Grease, Paste
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-HTC ™ epoxy is developed primarily for applications requiring a high-performance bond or connection of electrically conductive components/materials that operate at higher temperatures. G6E-HTC ™ epoxy ’s properties result from being formulated with proprietary... [See More]
- Form / Shape: Grease, Paste
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-HTNS ™ epoxy is developed primarily for applications requiring a high-performance bond or connection of electrically conductive components/materials which operate at higher temperatures requiring low electrical resistivity. G6E-HTNS ™ is developed based on advanced... [See More]
- Form / Shape: Grease, Paste
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-HTSG ™ epoxy is primarily developed for applications requiring a high-performance bond or connection of electrically conductive components/materials which operate at higher temperatures and which require low electrical resistivity. G6E-HTSG ™ epoxy is formulated with... [See More]
- Form / Shape: Grease, Paste
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Graphene Laboratories, Inc.
Our G6E-TSHV ™ Epoxy has been specifically developed for general purpose applications that necessitate the bonding or connecting of thermally conductive components/materials. It is designed to provide efficient heat transfer between components or surfaces, while also providing the bonding and... [See More]
- Form / Shape: Grease, Paste
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled