Die Bonding Adhesive / Compound Conductive Compounds

Electrically and Thermally Conductive Epoxy Adhesive -- EPO-TEK® EK1000-1-D
from Epoxy Technology

EPO-TEK ® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical, and... [See More]

  • Form / Shape: Die Bonding Adhesives; Grease, Paste
  • Chemical System: Epoxy
  • Type: Electrically Conductive; Thermally Conductive
  • Composition: Filled
Electrically and Highly Thermally Conductive Die Attach Adhesive -- ALPHA® ATROX® HT900-1
from MacDermid Alpha Electronics Solutions

ATROX ® HT900-1 is a thermosetting conductive die attach adhesive designed for LED packages. The unique chemistry of the ATROX ® HT900-1 allows the material to be cured at lower temperatures compared to standard die attach adhesives, while maintaining its material properties. ATROX ®... [See More]

  • Form / Shape: Die Bonding Adhesives
  • Cure / Technology: Thermoset; Cured by Thermal Processing in Standard IR, Full Convection, Conduction or Vapor Phase Oven Equipment
  • Type: Electrically Conductive
  • Industry: Electronics; Semiconductors, IC's
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22
from Master Bond, Inc.

Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]

  • Form / Shape: Optional Premixed and Frozen; Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Grease, Paste
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Filled
Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity -- EP3HTSDA-1
from Master Bond, Inc.

EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]

  • Form / Shape: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Liquid
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Unfilled
Electrically Conductive Die Attach Epoxy With High Glass Transition Temperature -- EP17HTS-DA
from Master Bond, Inc.

Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]

  • Form / Shape: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Liquid
  • Chemical System: Polyphenylene Sulfide; Epoxy
  • Type: Electrically Conductive; Thermally Conductive
  • Composition: Filled
Fast Curing High Glass Transition Temperature Epoxy -- EP65HT-1
from Master Bond, Inc.

Master Bond Polymer System EP65HT-1 represents a breakthrough in epoxy adhesive technology in that it features the unusual combination of ultra-fast cures and high temperature resistance. While typical fast setting epoxies normally possess glass transition temperatures below 85 °C, EP65HT-1 has... [See More]

  • Form / Shape: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Liquid
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Unfilled
Fast Curing, High Bond Strength Epoxy Adhesive -- EP51
from Master Bond, Inc.

Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature. The... [See More]

  • Form / Shape: Die Bonding Adhesives; Liquid
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Unfilled
Fast Curing, High Temperature Resistant Epoxy -- EP65HT
from Master Bond, Inc.

Master Bond Polymer System EP65HT represents a breakthrough in epoxy adhesive technology in that it features the unusual combination of ultra-fast cures and high temperature resistance. While typical fast setting epoxies normally possess glass transition temperatures below 85 °C, EP65HT has an... [See More]

  • Form / Shape: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Liquid
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Unfilled
Fast Curing, Thermal Cycling Resistant Epoxy Adhesive -- EP51M
from Master Bond, Inc.

Master Bond Polymer Adhesive EP51M is a fast "3 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature. The... [See More]

  • Form / Shape: Die Bonding Adhesives; Liquid
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Unfilled
Flexibilized Epoxy System -- Supreme 10HTFL
from Master Bond, Inc.

Master Bond Polymer System Supreme 10HTFL features a unique blend of physical properties including outstanding peel strength, very high shear strength and a wide service temperature range of 4K to +350 °F making it suitable for cryogenic applications. Supreme 10HTFL features highly desirable... [See More]

  • Form / Shape: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Liquid
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Unfilled
High Shear/Peel Strength, Room Temperature Curing Epoxy -- EP31
from Master Bond, Inc.

Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel strength exceeding 40 pli. The service... [See More]

  • Form / Shape: Optional Premixed and Frozen; Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Grease, Paste
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Cure / Technology: Thermoset; Two Component  
High Tempreature and Thermal Cycling Resistant Epoxy -- EP33
from Master Bond, Inc.

Master Bond Polymer Adhesive EP33 is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond Polymer Adhesive EP33 produces high strength bonds whose... [See More]

  • Form / Shape: Optional Premixed and Frozen; Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Grease, Paste
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Unfilled
Low Exotherm, Two Component Epoxy -- EP29LP
from Master Bond, Inc.

Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will form bond strengths in excess of 2,500 psi (aluminum to aluminum). It bonds well to a variety of substrates... [See More]

  • Form / Shape: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Grease, Paste
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Unfilled
Nickel Filled Electrically Conductive Epoxy System -- EP76M
from Master Bond, Inc.

Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part nickel conductive systems, EP76M... [See More]

  • Form / Shape: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Grease, Paste; Encapsulant or Conformal Coating
  • Chemical System: Epoxy
  • Type: Electrically Conductive; Thermally Conductive
  • Composition: Filled
One Component, High Temperature Resistant Epoxy -- EP36
from Master Bond, Inc.

Master Bond Polymer System EP36 is a unique one component high performance toughened epoxy system for electrical potting, casting, encapsulation, baked coatings and adhesive applications. It features an outstanding combination of properties including high temperature stability up to 500 °F,... [See More]

  • Form / Shape: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Liquid
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Unfilled
One component, high temperature resistant epoxy system for bonding and sealing -- EP17HTDA-1
from Master Bond, Inc.

Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for conventional bonding and sealing. This system features an excellent die shear strength of 24-27 kg-f and can be used in a typical die size ranging from 4-400 mm2. EP17HTDA-1 can also be... [See More]

  • Form / Shape: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Liquid
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Unfilled
Room Temperature Curing, Two Component Epoxy System -- EP34
from Master Bond, Inc.

Master Bond Polymer System EP34 is a unique room temperature curing two component epoxy compound for high temperature potting and encapsulating applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non critical mix ratio (part A/part B: 100/70). [See More]

  • Form / Shape: Optional Premixed and Frozen; Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Grease, Paste
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Unfilled
Thermally Conductive, Dimensionally Stable Epoxy -- EP121AO
from Master Bond, Inc.

Master Bond EP121AO is a two component, high performance epoxy resin system featuring high thermal stability, high thermal conductivity, superior electrical insulation properties and outstanding dimensional stability for coating, sealing, potting and encapsulation for service up to 450-500 °F. [See More]

  • Form / Shape: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Liquid
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Filled
Two Component, Fast Curing Epoxy Adhesive -- EP65
from Master Bond, Inc.

Master Bond Polymer Adhesive EP65 represents a breakthrough in epoxy adhesive technology featuring hitherto unattainable balance of processing strengths. This two component adhesive system is formulated to cure exceptionally quickly at ambient temperatures e.g. 8-10 minutes, shorter lives at higher... [See More]

  • Form / Shape: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Liquid
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Unfilled
Two Component, Silver Coated, Nickel Filled Epoxy -- EP79
from Master Bond, Inc.

Master Bond Polymer System EP79 is a two component, silver coated nickel filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. EP79 offers a convenient one-to-one mix ratio by weight or... [See More]

  • Form / Shape: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Grease, Paste
  • Chemical System: Epoxy
  • Type: Electrically Conductive; Thermally Conductive
  • Composition: Filled
Ceramabond -- 503
from Aremco Products, Inc.

High fired strength, dense ceramics [See More]

  • Form / Shape: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Liquid
  • Chemical System: Ceramic
  • Type: Thermally Conductive
  • Composition: Filled
55 Shore D polyurethane adhesive -- 10-2055
from Epoxies Etc...

The 10-2055 and 10-2055 HV were developed to produce a general purpose, semi flexible polyurethane adhesive for bonding a wide variety of plastic and metal substrates. The flexibility of these adhesives allows bonding to substrates with high coefficients of thermal expansion (CTE) and substrates... [See More]

  • Form / Shape: Die Bonding Adhesives; Grease, Paste
  • Chemical System: Polyurethane
  • Type: Thermally Conductive
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
Clear Non-Yellowing Silicone Encapsulant -- PNS-56225
from Protavic America, Inc.

PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]

  • Form / Shape: Die Bonding Adhesives; Liquid; Encapsulant or Conformal Coating
  • Chemical System: Silicone
  • Type: Electrically Conductive; Thermally Conductive
  • Composition: Unfilled
Adhesive Paste -- No. 19
from Sauereisen, Inc.

Sauereisen Adhesive Paste No. 19 is an inorganic, odorless, nontoxic cement used for bonding glass, porcelain, wood, felt, cork, metals and ceramic fiber. Some typical applications include protection of exposed metal surfaces during heat treating, bonding wallboard to brick or concrete and cementing... [See More]

  • Form / Shape: Die Bonding Adhesives; Grease, Paste
  • Chemical System: Ceramic
  • Type: Thermally Conductive
  • Composition: Unfilled
Aluminum filled epoxy system -- 70-3800R
from Epoxies Etc...

70-3800 is a low viscosity, aluminum filled, epoxy tooling resin. This system is used for making heat resistant cast tools or parts that require very good thermal conductivity. 70-3800 is easily machined, drilled, tapped, or polished, and is ideal for vacuum form molds, dies, drill jigs, injection... [See More]

  • Form / Shape: Die Bonding Adhesives; Liquid
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Filled
Clear UV Adhesive -- ANA-97773
from Protavic America, Inc.

ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued shrinkage and movement. Bond lines are clear, colorless and exhibit low shrinkage during the curing process. [See More]

  • Form / Shape: Die Bonding Adhesives; Liquid
  • Composition: Unfilled
  • Type: Electrically Conductive
  • Cure / Technology: Thermoset; Two Component  ; UV or Radiation Cured
Cement -- No. 31
from Sauereisen, Inc.

Sauereisen Cement No. 31 is a white, porcelain-like cement that is widely used throughout industry in a variety of applications. including assembling, sealing, insulating and cementing of ceramics, porcelain, metal, and glass. [See More]

  • Form / Shape: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Liquid; Powder
  • Chemical System: Ceramic
  • Type: Thermally Conductive
  • Composition: Unfilled
Electrically Conductive Epoxy -- 40-3905
from Epoxies Etc...

40-3905 is an electrically conductive system designed for applications requiring low temperature cures. 40-3905 will cure at room temperature in 18 hours or can be accelerated with mild heat. [See More]

  • Form / Shape: Die Bonding Adhesives
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Filled
Electro-Conductive Epoxy Adhesive -- ACE-10131
from Protavic America, Inc.

Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for production needs. One... [See More]

  • Form / Shape: Die Bonding Adhesives; Grease, Paste
  • Chemical System: Epoxy
  • Type: Electrically Conductive; Thermally Conductive
  • Composition: Filled
Epoxy Adhesive -- ANE-20904
from Protavic America, Inc.

Epoxy system designed for underfill applications. This material is fast flowing and provides excellent properties for common device packaging. [See More]

  • Form / Shape: Die Bonding Adhesives; Liquid
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Cure / Technology: Thermoset; Single Component
Silicone Encapsulant -- PTS-46303
from Protavic America, Inc.

PTS-46303 A/B ™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include... [See More]

  • Form / Shape: Die Bonding Adhesives; Gel; Encapsulant or Conformal Coating
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Composition: Filled