Two Component System Conductive Compounds
from MacDermid Alpha Electronics Solutions
Product Description. ER2188 General purpose epoxy potting compound is a two part epoxy resin for general use within the electronics industry. It ’s a good all round resin offering a cost effective solution for a wide range of applications where protection is required. ER2188 is flame retardant... [See More]
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Type: Thermally Conductive
- Industry: Electronics
from Ellsworth Adhesives
3M TC-2707 Thermally Conductive Epoxy Adhesive Gray is a two component epoxy that uses aluminum metal filler. It offers high adhesive strength, good gap filling, low viscosity for potting applications, and good surface wet out. 50 mL Duo-Pak Cartridge. [See More]
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Type: Thermally Conductive
- Thermal Conductivity: 0.7200
from Fujipoly® America Corp.
The SARCON® LG Series is the perfect solution for filling large, complex and uneven gaps between heat generating components that depend on reliable contact with a heat spreader to maintain optimal performance. SARCON® LG23A and LG30A easily dispense in a liquid form that will cure at room... [See More]
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Silicone
- Type: Thermally Conductive
- Form / Shape: Gap Filler, Foam in Place Gasket; Gel
from CHT USA Inc.
CHT's QSil 563 is a 2-part, platinum cure, 100% silicone solids elastomer designed for electronic potting and encapsulation applications. QSil 562 offers a hard, low modulus material that is readily repairable. QSil 563 is thermally conductive to aid in efficient heat dissipation. This silicone... [See More]
- Cure / Technology: Two Component ; Addition
- Industry: Automotive; Electronics
- Type: Thermally Conductive
- Features: Flame Retardant; UL Rating
from Master Bond, Inc.
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing; Addition Cure
- Chemical System: Silicone
- Type: Thermally Conductive
- Composition: Unfilled
from MacDermid Alpha Electronics Solutions
Product Description. ER2220 Highly thermally conductive epoxy potting compound is a flame retardant, two part epoxy resin. Designed to meet increasing demands for efficient thermal dissipation, ER2220 combines ease of processing with an enhanced thermal conductivity when compared to traditional... [See More]
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Type: Thermally Conductive
- Features: Flame Retardant
from Ellsworth Adhesives
3M Thermally Conductive Epoxy Adhesive TC-2810 Cream is a two component, boron nitride filled adhesive that offers low outgassing, good thermal conductivity, and low chloride ion content. 50 mL Duo-Pak Cartridge. [See More]
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Type: Thermally Conductive
- Thermal Conductivity: 0.8000 to 1.4
from CHT USA Inc.
CHT's SE3000 is a 2-part, platinum cure silicone elastomer designed for electronic potting and encapsulation applications. It offers good prtection against chemicals, environmental contamination, mechanical shock, vibration and impact damage. SE3000 can be used in applications where low flammability... [See More]
- Cure / Technology: Two Component ; Addition
- Industry: Electronics
- Type: Thermally Conductive
- Features: Flame Retardant; UL Rating
from Master Bond, Inc.
Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from MacDermid Alpha Electronics Solutions
Product Description. UR5044 flame retardant polyurethane resin is a UL94 approved two part system has been developed for potting and encapsulation of electronics. Once cured it has a dark blue finish and is soft enough that it can be dug out if required for rework and repair. Its flexibility and its... [See More]
- Cure / Technology: Two Component
- Chemical System: Polyurethane
- Type: Thermally Conductive
- Industry: Electronics
from Ellsworth Adhesives
Bergquist Gap Filler 1500 Thermally Conductive Adhesive is a two component, liquid gap filling material that is designed as a form-in-place elastomer for fragile electronic assemblies and filling difficult air voids and gaps. It offers excellent shear thinning characteristics, slump resistance,... [See More]
- Cure / Technology: Two Component
- Form / Shape: Gap Filler, Foam in Place Gasket
- Type: Thermally Conductive
- Thermal Conductivity: 1.8
from CHT USA Inc.
CHT's QSil 553 is a 2-part, platinum cure, silicone potting compound and encapsulant designed to protect electronic components from harsh environmental conditions and shock and vibration. It features a low viscosity for convenient dispensing and will easily flow throughout components. Because of its... [See More]
- Cure / Technology: Two Component ; Addition
- Industry: Automotive; Electronics; OEM or Industrial
- Type: Thermally Conductive
- Features: Flame Retardant; UL Rating
from Master Bond, Inc.
Master Bond EP126 withstands very high temperatures, up to +600 °F, and has a glass transistion temperature of +240 °C. This two component product features unique handling properties as Part A is a moderate viscosity liquid and Part B is a powder. It can be easily mixed using a forgiving 100... [See More]
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Type: Thermally Conductive
- Composition: Unfilled
from MacDermid Alpha Electronics Solutions
Product Description. GF400 thermal gap filler is a two part, liquid silicone based thermally conductive material which cures at room temperature or can be accelerated using heat. It has exceptional thermal performance (4.0 W/m.K) and after curing GF400 forms a low modulus elastomer preventing the... [See More]
- Cure / Technology: Thermoset; Two Component
- Chemical System: Silicone
- Type: Thermally Conductive
- Form / Shape: Gap Filler, Foam in Place Gasket; Liquid
from Ellsworth Adhesives
Bergquist Gap Filler 2000 Thermally Conductive Adhesive is a two component, liquid gap filling material that is designed as a form-in-place elastomer for coupling hot electronic components. It cures at room or elevated temperatures and offers mechanical and chemical stability. 50 cc Cartridge. [See More]
- Cure / Technology: Two Component
- Form / Shape: Gap Filler, Foam in Place Gasket
- Type: Thermally Conductive
- Thermal Conductivity: 2
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Cure / Technology: Thermoset; Two Component ; Addition Cure
- Chemical System: Silicone
- Type: Electrically Conductive; Thermally Conductive
- Composition: Filled
from MacDermid Alpha Electronics Solutions
Product Description. ER2221 thermally conductive epoxy potting compound has been formulated as high temperature resistant and thermally conductive encapsulation resin which retains excellent characteristics throughout thermal cycling. ER2221 exhibits excellent thermal resistance up to an operating... [See More]
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Type: Thermally Conductive
- Industry: Aerospace; Automotive; Electronics; OEM or Industrial
from Ellsworth Adhesives
Dow DOWSIL ™ Q1-9226 Thermally Conductive Adhesive Gray is a two component, heat curing, silicone adhesive that is used for bonding with a variety of substrates such as filled plastics, metals, epoxies, laminate boards, and ceramics. It is typically used for bonding substrates to heat sinks... [See More]
- Cure / Technology: Two Component
- Thermal Conductivity: 0.7400
- Type: Thermally Conductive
- Tensile (Break): 508
from Master Bond, Inc.
EP35SP is a two component epoxy system specially formulated to resist high temperatures and aggressive chemicals. It has a paste viscosity with little to no flow when curing. [See More]
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Type: Thermally Conductive
- Composition: Unfilled
from MacDermid Alpha Electronics Solutions
Product Description. ER2074 Thermally conductive epoxy resin is a flame retardant system with UL94 V-0 approval. The flame retardant technology used is halogen free leading to relatively low toxicity fumes and low smoke emission and the lack of abrasive fillers means that there is lower wear on... [See More]
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Type: Thermally Conductive
- Features: Flame Retardant
from Ellsworth Adhesives
Dow SE 4445 CV Thermally Conductive Gel Gray is a two component, heat curing gel that is used for potting electronic modules, base material for thermally conductive gel sheet, and gap fill material between heat sinks and electronic heat sinks. It offers low viscosity, wide service temperature range,... [See More]
- Cure / Technology: Two Component
- Thermal Conductivity: 1.26
- Type: Thermally Conductive
- Dielectric Strength: 127
from Master Bond, Inc.
EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Epoxy
- Type: Thermally Conductive
- Composition: Unfilled
from MacDermid Alpha Electronics Solutions
Product Description. UR5097 thermally conductive polyurethane potting compound exhibits excellent thermal conductivity making it ideal for applications where heat dissipation is required. The cured resin is resistant to a wide or cycling temperature range making it an ideal choice for applications... [See More]
- Cure / Technology: Two Component
- Chemical System: Polyurethane
- Type: Thermally Conductive
- Industry: Electronics
from Ellsworth Adhesives
Henkel Loctite 3888 is a room temperature cure epoxy adhesive designed for bonding of metals, ceramics, rubbers and plastics as used in electronic parts, where good adhesion combined with electrical and thermal conductivity is required. 2.5 g Packet. [See More]
- Cure / Technology: Two Component
- Thermal Conductivity: 1.5
- Type: Electrically Conductive
from Master Bond, Inc.
EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Epoxy
- Type: Thermally Conductive
- Composition: Unfilled
from Ellsworth Adhesives
Henkel Loctite Ablestik 285 Black, formerly Emerson and Cuming ECCOBOND, is a thixotropic, epoxy adhesive paste that is designed to be used with a catalyst for applications exposed to cryogenic temperatures as well as bonding ceramics, metal, and heat sinks. It offers a low coefficient of thermal... [See More]
- Cure / Technology: Two Component
- Thermal Conductivity: 1.22 to 1.44
- Type: Thermally Conductive
- Dielectric Strength: 450
from Master Bond, Inc.
MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Silicone
- Type: Thermally Conductive
- Composition: Unfilled
from Ellsworth Adhesives
Henkel Loctite Ablestik 285 Black, formerly Emerson and Cuming ECCOBOND, is a thixotropic, epoxy adhesive paste that is designed to be used with a catalyst for applications exposed to cryogenic temperatures as well as bonding ceramics, metal, and heat sinks. It offers a low coefficient of thermal... [See More]
- Cure / Technology: Two Component
- Thermal Conductivity: 1.22 to 1.44
- Type: Thermally Conductive
- Dielectric Strength: 450
from Master Bond, Inc.
Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature. The... [See More]
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Unfilled
from Ellsworth Adhesives
Henkel Loctite Ablestik 285 Black, formerly Emerson and Cuming ECCOBOND, is a two component, highly filled, epoxy adhesive paste that is used for applications exposed to cryogenic temperatures and for bonding heat sinks. It offers low coefficient of thermal expansion, low stress, versatility,... [See More]
- Cure / Technology: Two Component
- Thermal Conductivity: 1.22 to 1.44
- Type: Thermally Conductive
- Dielectric Strength: 450
from Master Bond, Inc.
Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel strength exceeding 40 pli. The service... [See More]
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Type: Electrically Conductive
- Form / Shape: Optional Premixed and Frozen; Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Grease, Paste
from Ellsworth Adhesives
Henkel Loctite Ablestik 285 Black, formerly Emerson and Cuming ECCOBOND, is a thixotropic, epoxy adhesive paste that is designed to be used with a catalyst for applications exposed to cryogenic temperatures as well as bonding ceramics, metal, and heat sinks. It offers a low coefficient of thermal... [See More]
- Cure / Technology: Two Component
- Thermal Conductivity: 1.22 to 1.44
- Type: Thermally Conductive
- Dielectric Strength: 450
from Master Bond, Inc.
Master Bond Polymer Adhesive EP33 is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond Polymer Adhesive EP33 produces high strength bonds whose... [See More]
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Unfilled
from Ellsworth Adhesives
Henkel Loctite Ablestik 286 White, formerly Emerson and Cuming ECCOBOND, is a two component, room temperature curing, epoxy adhesive that is used for bonding plastics, metal, piping, and other maintenance applications. It offers good thermal conductivity, minimum flow, and easy use. Part A, 20 lb... [See More]
- Cure / Technology: Two Component
- Thermal Conductivity: 1.04
- Type: Thermally Conductive
- Tensile (Break): 2200
from Master Bond, Inc.
MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Silicone
- Type: Thermally Conductive
- Composition: Filled
from Ellsworth Adhesives
Henkel Loctite Ablestik 286 White, formerly Emerson and Cuming ECCOBOND, is a two component, room temperature curing, epoxy adhesive that is used for bonding plastics, metal, piping, and other maintenance applications. It offers good thermal conductivity, minimum flow, and easy use. Part A, 4 lb... [See More]
- Cure / Technology: Two Component
- Thermal Conductivity: 1.04
- Type: Thermally Conductive
- Tensile (Break): 2200
from Master Bond, Inc.
Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will form bond strengths in excess of 2,500 psi (aluminum to aluminum). It bonds well to a variety of substrates... [See More]
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Unfilled
from Ellsworth Adhesives
Henkel Loctite Ablestik 286 White, formerly Emerson and Cuming ECCOBOND, is a two component, room temperature curing, epoxy adhesive that is used for bonding plastics, metal, piping, and other maintenance applications. It offers good thermal conductivity, minimum flow, and easy use. Part B, 7 lb... [See More]
- Cure / Technology: Two Component
- Thermal Conductivity: 1.04
- Type: Thermally Conductive
- Tensile (Break): 2200
from Master Bond, Inc.
Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Unfilled
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 872-7TN1, Epoxy, Non-conductive adhesive LOCTITE ® ABLESTIK 872-7TN1 is ideal for electronic applications requiring stress relief. Flexible. Thixotropic. High viscosity. Long work life. Easy handling. High thermal conductivity. Reduced stress [See More]
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Type: Thermally Conductive
- Form / Shape: Paste
from Materion Corporation
Thermotech TE ™ is a Silver-filled, electrically conductive high-vacuum compound specifically manufactured by Pure Tech for the sputtering target industry. Thermotech TE combines the excellent thermal and electrical conductive properties of pure Silver with a low vapor pressure sealant,... [See More]
- Cure / Technology: Two Component
- Industry: Electronics
- Type: Electrically Conductive
from Sauereisen, Inc.
Sauereisen Cement No. 31 is a white, porcelain-like cement that is widely used throughout industry in a variety of applications. including assembling, sealing, insulating and cementing of ceramics, porcelain, metal, and glass. [See More]
- Cure / Technology: Two Component ; Chemically Set
- Chemical System: Ceramic
- Type: Thermally Conductive
- Composition: Unfilled
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-NS10 ™ epoxy is developed for general purpose applications requiring high performance bond or connection of electrically conductive components/materials for enhanced electrical conductivity. G6E-NS10 ™ has been developed based on advanced proprietary technology that... [See More]
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Hapco, Inc.
Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame... [See More]
- Cure / Technology: Thermoset; Two Component
- Form / Shape: Liquid
- Type: Thermally Conductive
- Industry: Electronics
from Aremco Products, Inc.
Aremco ’s high temperature ceramic adhesives are unique inorganic formulations for bonding and sealing ceramics, metals, quartz, graphites, textiles, and composite materials used in design, process and maintenance applications to 3200 °F. These advanced materials, which exhibit high... [See More]
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Form / Shape: Grease, Paste
- Type: Electrically Conductive; Thermally Conductive
- Industry: Electronics
from Techsil Limited
Techsil ® EP25485 is a low viscosity, thermally conductive flame retardant potting and encapsulating compound. The mixed system has a long usable life and may be hot or cold cured. The system exhibits a good surface finish, high electrical strength, high thermal conductivity and low cure... [See More]
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Type: Thermally Conductive
- Form / Shape: Liquid
from Epoxies Etc...
The 10-2055 and 10-2055 HV were developed to produce a general purpose, semi flexible polyurethane adhesive for bonding a wide variety of plastic and metal substrates. The flexibility of these adhesives allows bonding to substrates with high coefficients of thermal expansion (CTE) and substrates... [See More]
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Polyurethane
- Type: Thermally Conductive
- Form / Shape: Die Bonding Adhesives; Grease, Paste
from Bluestar Silicones USA Corp.
Metal Oxide Thickened Dimethyl Silicone Compound. Description. Bluesil V-740 is a metal oxide thickened dimethyl silicone compound. It is a white, heavy paste used for heat dissipation applications where high thermal conductivity is required. [See More]
- Cure / Technology: Two Component
- Chemical System: Silicone
- Type: Thermally Conductive
- Form / Shape: Grease, Paste
from Wacker Chemical Corp.
ELASTOSIL ® RT 675 A/B is a pourable, addition-curing RTV-2 silicone rubber. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Silicone; Elastomeric
- Type: Thermally Conductive
- Form / Shape: Liquid
from Protavic America, Inc.
PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]
- Cure / Technology: Thermoset; Two Component
- Chemical System: Silicone
- Type: Electrically Conductive; Thermally Conductive
- Composition: Unfilled
from Hi-Tech Seals, Inc.
HERNON ® offers a complete line of structural acrylic adhesives. These systems are two-part, no mix, and reactive adhesives. Each acrylic adhesive has two components: the adhesive base or resin, and the Activator. Structural acrylic adhesives are termed “reactive ” cure systems. The... [See More]
- Cure / Technology: Two Component ; Reactive or Moisture Cured
- Chemical System: Acrylic
- Type: Thermally Conductive
- Form / Shape: Grease, Paste
from Epoxy Technology
EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Type: Thermally Conductive
- Form / Shape: Grease, Paste
from ACCRAbond, Inc.
INSTAbond ® 809FR. INSTAbond ® 809 FR exhibits good thermal conductivity, excellent flow properties, and low exotherm characteristics in large masses. INSTAbond ® 809 FR meets the requirements for UL-94 V-0 rating for flame retardancy. [See More]
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Type: Thermally Conductive
- Features: Flame Retardant; UL Rating
from OMEGA Engineering, Inc.
OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper products. [See More]
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Type: Thermally Conductive
- Form / Shape: Liquid
from Henkel Corporation - Industrial
LOCTITE STYCAST 2762FT, Epoxy, High Temperature Resistance, High Thermal Conductivity, Potting, Encapsulant LOCTITE ® STYCAST 2762FT epoxy encapsulant is designed for potting electronic components exposed to harsh environments. This material is also ideal for large and complex castings that... [See More]
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Type: Thermally Conductive
- Viscosity: 25000
from Graphene Laboratories, Inc.
DESCRIPTION: Traditional silver-based adhesives require up to 80% weight load of silver fillers and as a result tend to be costly, brittle and prone to mechanical failure. G6E-NS11 ™ has been developed based on advanced proprietary technology that requires 15% or less silver content to be at... [See More]
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Hapco, Inc.
DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity). Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI-COAT R-4721 is easy to... [See More]
- Cure / Technology: Thermoset; Two Component
- Form / Shape: Liquid
- Type: Thermally Conductive
- Industry: Electronics
from Epoxies Etc...
40-3905 is an electrically conductive system designed for applications requiring low temperature cures. 40-3905 will cure at room temperature in 18 hours or can be accelerated with mild heat. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Protavic America, Inc.
ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued shrinkage and movement. Bond lines are clear, colorless and exhibit low shrinkage during the curing process. [See More]
- Cure / Technology: Thermoset; Two Component ; UV or Radiation Cured
- Composition: Unfilled
- Type: Electrically Conductive
- Form / Shape: Die Bonding Adhesives; Liquid
from Henkel Corporation - Industrial
LOCTITE STYCAST 2850FTJ, Epoxy, Encapsulant. LOCTITE ® STYCAST 2850FTJ epoxy encapsulant is designed for use in high voltage applications where surface arcing or tracking is a concern. LOCTITE STYCAST 2850FTJ is recommended for encapsulation of components that require heat dissipation and... [See More]
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Type: Thermally Conductive
- Viscosity: 225000
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-FRP ™ is a flexible version of our G6E-P ™ general purpose epoxy. G6E-FRP ™ epoxy was developed primarily for high-performance bonding, connection, sealing and coating applications requiring a flexible bond or connection of electrically conductive components or... [See More]
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Epoxies Etc...
The 50-2369FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-2369 FR Urethane is listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low exotherm, and excellent electrical... [See More]
- Cure / Technology: Thermoset; Two Component
- Chemical System: Polyurethane
- Type: Thermally Conductive
- Composition: Filled
from Protavic America, Inc.
Two part Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the assembly ofnon heat cure products and can be used for repair work in the field. It also has a convenient 1:1 mix ratio. [See More]
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Type: Electrically Conductive; Thermally Conductive
- Composition: Filled
from Henkel Corporation - Industrial
LOCTITE STYCAST 2850KT CAT 24LV, Epoxy, Encapsulant LOCTITE ® STYCAST 2850KT CAT 24LV epoxy encapsulant is designed for heat sink replacement in non-integrated electrical components and assemblies. It is also recommended for use in high voltage applications where surface arching or tracking is a... [See More]
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Type: Thermally Conductive
- Use Temperature: 85 to 221
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-FXNS ™ epoxy is developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials as well as for low electrical resistivity. G6E-FXNS ™ is developed based on advanced proprietary technology that requires... [See More]
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Epoxies Etc...
20-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 20-2366 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical... [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Polyurethane; Elastomeric
- Type: Thermally Conductive
- Composition: Unfilled
from Protavic America, Inc.
PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ is heat stable up to 150 °C. [See More]
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Type: Thermally Conductive
- Composition: Filled
from Henkel Corporation - Industrial
LOCTITE STYCAST 5952-1, Silicone, Potting or Encapsulant. LOCTITE ® STYCAST 5952-1 is designed for encapsulation of heat generating devices. It is also recommended for applications requiring a non-corrosive casting and coating. Electrically non-conductive. Good elongation strength. Moderate tear... [See More]
- Cure / Technology: Two Component
- Chemical System: Silicone
- Type: Thermally Conductive
- Thermal Conductivity: 0.8000
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-FXSG ™ epoxy is primarily developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials requiring low electrical resistivity. G6-FXSG ™ is well suited for bonding of dissimilar materials that are... [See More]
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Protavic America, Inc.
Filled epoxy system for high thermal applications such as heat-sink bonding. This material has 2.2 Wm °K thermal performance with supporting laser flash data. Room temperature cure. [See More]
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Type: Thermally Conductive
- Composition: Filled
from Henkel Corporation - Industrial
LOCTITE STYCAST E 2534 FR CAT 9, Epoxy, Potting LOCTITE ® STYCAST E 2534 FR CAT 9 epoxy potting compound complies with recent demands on environmentally friendly products and does not contain brominated flame retardants. LOCTITE STYCAST E 2534 FR CAT 9 can be used with a variety of catalysts. [See More]
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Type: Thermally Conductive
- Use Temperature: 40 to 302
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-P ™ epoxy is primarily developed for general purpose applications requiring high-performance bond or connection of electrically conductive components/materials. G6E-P ™ is formulated with proprietary nanomaterials and fillers. G6E-P ™ epoxy can be cured at room... [See More]
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Henkel Corporation - Industrial
LOCTITE STYCAST EE 4215/HD 3561, Epoxy, Potting and Encapsulating. LOCTITE ® STYCAST EE 4215/HD 3561 is a filled system recommended for potting applications where rigid or flexible wire leads protrude directly from the encapsulation and where high impact strength is required. This system... [See More]
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Type: Thermally Conductive
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-HTC ™ epoxy is developed primarily for applications requiring a high-performance bond or connection of electrically conductive components/materials that operate at higher temperatures. G6E-HTC ™ epoxy ’s properties result from being formulated with proprietary... [See More]
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Henkel Corporation - Industrial
LOCTITE STYCAST US 0155, Urethane, Potting and Encapsulating. LOCTITE ® STYCAST US 0155 is a low viscosity, flexible, flame retardant, castor oil/MDI based urethane potting/encapsulating compound. This material was designed for potting indoor and outdoor telephone connector blocks. It is... [See More]
- Cure / Technology: Two Component
- Chemical System: Polyurethane
- Type: Thermally Conductive
- Form / Shape: Liquid
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-HTNS ™ epoxy is developed primarily for applications requiring a high-performance bond or connection of electrically conductive components/materials which operate at higher temperatures requiring low electrical resistivity. G6E-HTNS ™ is developed based on advanced... [See More]
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Henkel Corporation - Industrial
2-part, room temperature-cure, pourable epoxy system heavily reinforced with aluminum powder. LOCTITE ® PC 3466 (known as LOCTITE FIXMASTER ALUMINUM LIQUID) is a gray, 2-part, room temperature-cure, pourable epoxy system heavily reinforced with aluminum powder. It is used for filling or leveling... [See More]
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Type: Thermally Conductive
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-HTSG ™ epoxy is primarily developed for applications requiring a high-performance bond or connection of electrically conductive components/materials which operate at higher temperatures and which require low electrical resistivity. G6E-HTSG ™ epoxy is formulated with... [See More]
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Henkel Corporation - Industrial
LOCTITE STYCAST 2850FT BL, Epoxy, Encapsulant. LOCTITE ® STYCAST 2850FT BL epoxy is designed for applications where electrical insulation and mechanical protection must be maintained while coping with heat transfer considerations. LOCTITE STYCAST 2850FT BL can be used with a variety of... [See More]
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Type: Thermally Conductive
- Thermal Conductivity: 1.38
from Graphene Laboratories, Inc.
Our G6E-TSHV ™ Epoxy has been specifically developed for general purpose applications that necessitate the bonding or connecting of thermally conductive components/materials. It is designed to provide efficient heat transfer between components or surfaces, while also providing the bonding and... [See More]
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-RTC ™ Room Temperature Curable Carbon Filled Electrically Conductive epoxy is developed primarily for applications requiring curing at room temperature. G6E-RTC ™ epoxy is formulated with proprietary nanomaterials and fillers to provide its performance characteristics. [See More]
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-RTSG ™ epoxy is developed primarily for applications that require curing at room temperature. Room temperature curing eliminates the necessity for a heating oven. This allows easier and safer bond/connection of conductive components or materials. G6E-RTSG ™ epoxy is also... [See More]
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-SG ™ epoxy is developed for general purpose applications requiring high-performance bond or connection of electrically conductive components/materials that require low electrical resistivity. G6E-SG ™ is formulated with proprietary nanomaterials and fillers. G6E-SG... [See More]
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Graphene Laboratories, Inc.
Our G6E-TSAL ™ Epoxy has been specifically developed for general purpose applications that necessitate the bonding or connecting of thermally conductive components/materials. It is designed to provide efficient heat transfer between components or surfaces, while also providing the bonding and... [See More]
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled