Two Component System Conductive Compounds

Two-Part Thermal Gap Filler -- SARCON® LG23A and LG30A
from Fujipoly® America Corp.

The SARCON® LG Series is the perfect solution for filling large, complex and uneven gaps between heat generating components that depend on reliable contact with a heat spreader to maintain optimal performance. SARCON® LG23A and LG30A easily dispense in a liquid form that will cure at room... [See More]

  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Form / Shape: Gap Filler, Foam in Place Gasket; Gel
Techsil® EP25485 Black Flame Retardant Epoxy 5kg -- TESI19080
from Techsil Limited

Techsil ® EP25485 is a low viscosity, thermally conductive flame retardant potting and encapsulating compound. The mixed system has a long usable life and may be hot or cold cured. The system exhibits a good surface finish, high electrical strength, high thermal conductivity and low cure... [See More]

  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Form / Shape: Liquid
Biocompatible, Thermally Conductive Epoxy -- EPO-TEK® MED-T905BN-3
from Epoxy Technology

EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries.  Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Form / Shape: Grease, Paste
Addition Cured Silicone is Optically Clear with Enhanced Low Temperature Serviceability -- MasterSil 157
from Master Bond, Inc.

MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing; Addition Cure
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Composition: Unfilled
Bergquist Gap Filler 1500 Thermally Conductive Adhesive Yellow 50 cc Cartridge -- GAP FILLER 1500 50CC [GF1500-00-60-50CC from Bergquist Company (The)]
from Ellsworth Adhesives

Bergquist Gap Filler 1500 Thermally Conductive Adhesive is a two component, liquid gap filling material that is designed as a form-in-place elastomer for fragile electronic assemblies and filling difficult air voids and gaps. It offers excellent shear thinning characteristics, slump resistance,... [See More]

  • Cure / Technology: Two Component  
  • Form / Shape: Gap Filler, Foam in Place Gasket
  • Type: Thermally Conductive
  • Thermal Conductivity: 1.8
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22
from Master Bond, Inc.

Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Filled
Bergquist Gap Filler 2000 Thermally Conductive Adhesive Pink 50 cc Cartridge -- GAP FILLER 2000 50CC [GF2000-00-60-50CC from Bergquist Company (The)]
from Ellsworth Adhesives

Bergquist Gap Filler 2000 Thermally Conductive Adhesive is a two component, liquid gap filling material that is designed as a form-in-place elastomer for coupling hot electronic components. It cures at room or elevated temperatures and offers mechanical and chemical stability. 50 cc Cartridge. [See More]

  • Cure / Technology: Two Component  
  • Form / Shape: Gap Filler, Foam in Place Gasket
  • Type: Thermally Conductive
  • Thermal Conductivity: 2
Chemical Resistant, Two Part Epoxy Features Glass Transition Temperature of +240°C -- EP126
from Master Bond, Inc.

Master Bond EP126 withstands very high temperatures, up to +600 °F, and has a glass transistion temperature of +240 °C. This two component product features unique handling properties as Part A is a moderate viscosity liquid and Part B is a powder. It can be easily mixed using a forgiving 100... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Unfilled
Dow DOWSIL™ 3-6751 Thermally Conductive Adhesive Gray 1 kg Kit -- 3-6751 TC ADHESIVE 1KG KIT [4040433 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™ 3-6751 Thermally Conductive Adhesive Gray is a two component, heat curing, low viscosity silicone that is used to cool electronics, automotives, and power supply applications during thermal transfers. It also bonds well to metals, ceramics, filled plastics, and epoxy laminates. It... [See More]

  • Cure / Technology: Two Component  
  • Industry: Electronics
  • Type: Thermally Conductive
  • Thermal Conductivity: 1.1
Electrically and Thermally Conductive, Two Part Silicone Meets NASA Low Outgassing Specifications -- MasterSil 973S-LO
from Master Bond, Inc.

MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]

  • Cure / Technology: Thermoset; Two Component  ; Addition Cure
  • Chemical System: Silicone
  • Type: Electrically Conductive; Thermally Conductive
  • Composition: Filled
Dow SE 4445 CV Thermally Conductive Gel Gray 210 mL Cartridge -- SE 4445 CV KIT 210ML [4025973 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow SE 4445 CV Thermally Conductive Gel Gray is a two component, heat curing gel that is used for potting electronic modules, base material for thermally conductive gel sheet, and gap fill material between heat sinks and electronic heat sinks. It offers low viscosity, wide service temperature range,... [See More]

  • Cure / Technology: Two Component  
  • Thermal Conductivity: 1.26
  • Type: Thermally Conductive
  • Dielectric Strength: 127
Epoxy Features Exceptional Chemical and Heat Resistance -- EP35SP
from Master Bond, Inc.

EP35SP is a two component epoxy system specially formulated to resist high temperatures and aggressive chemicals. It has a paste viscosity with little to no flow when curing. [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Unfilled
Dow SYLGARD™ 3-6605 Thermally Conductive Encapsulant Gray 1.8 kg Kit -- 3-6605 CONDUCT ELAST 1.8KG [2263327 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow SYLGARD ™ 3-6605 Thermally Conductive Elastomer Gray is a two component, heat curing, medium viscosity, silicone elastomer that is used to protect electrical components from extreme environments, moisture, and stress. It is flowable, has good dielectric properties and chemical stability. [See More]

  • Cure / Technology: Two Component  
  • Thermal Conductivity: 0.8500
  • Type: Thermally Conductive
  • Tensile (Break): 850
Epoxy Meets Airbus Standards for Flame Retardancy, Smoke and Gas Emissions -- EP93FRHT
from Master Bond, Inc.

EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Unfilled
Dow SYLGARD™ 3-6605 Thermally Conductive Encapsulant Gray 13.6 kg Kit -- 3-6605 COND ELAST 13.6KG [3128571 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow SYLGARD ™ 3-6605 Thermally Conductive Elastomer Gray is a two component, heat curing, medium viscosity, silicone elastomer that is used to protect electrical components from extreme environments, moisture, and stress. It is flowable, has good dielectric properties and chemical stability. [See More]

  • Cure / Technology: Two Component  
  • Thermal Conductivity: 0.8500
  • Type: Thermally Conductive
  • Tensile (Break): 850
Epoxy with High Elongation Passes ISO 10993-5 Certification for Cytotoxicity -- EP40Med
from Master Bond, Inc.

EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Unfilled
Henkel Loctite 3888 Silver Filled Electrically Conductive Adhesive 2.5 g Packet -- 29840 [2027182 from Henkel Corporation - Industrial]
from Ellsworth Adhesives

Henkel Loctite 3888 is a room temperature cure epoxy adhesive designed for bonding of metals, ceramics, rubbers and plastics as used in electronic parts, where good adhesion combined with electrical and thermal conductivity is required. 2.5 g Packet. [See More]

  • Cure / Technology: Two Component  
  • Thermal Conductivity: 1.5
  • Type: Electrically Conductive
Extremely Soft MasterSil 170 Gel Encapsulant Offers Removability and Optical Clarity -- MasterSil 170 Gel
from Master Bond, Inc.

MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Composition: Unfilled
Henkel Loctite Ablestik 285 Thermally Conductive Adhesive Black 1 gal Pail -- 285 BLACK 18 LB. [1188112 from Henkel Corporation - Industrial]
from Ellsworth Adhesives

Henkel Loctite Ablestik 285 Black, formerly Emerson and Cuming ECCOBOND, is a thixotropic, epoxy adhesive paste that is designed to be used with a catalyst for applications exposed to cryogenic temperatures as well as bonding ceramics, metal, and heat sinks. It offers a low coefficient of thermal... [See More]

  • Cure / Technology: Two Component  
  • Thermal Conductivity: 1.22 to 1.44
  • Type: Thermally Conductive
  • Dielectric Strength: 450
Fast Curing, High Bond Strength Epoxy Adhesive -- EP51
from Master Bond, Inc.

Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature. The... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Unfilled
Henkel Loctite Ablestik 285 Thermally Conductive Adhesive Black 1 qt Can -- PF285B [PF285B from Henkel Corporation - Industrial]
from Ellsworth Adhesives

Henkel Loctite Ablestik 285 Black, formerly Emerson and Cuming ECCOBOND, is a thixotropic, epoxy adhesive paste that is designed to be used with a catalyst for applications exposed to cryogenic temperatures as well as bonding ceramics, metal, and heat sinks. It offers a low coefficient of thermal... [See More]

  • Cure / Technology: Two Component  
  • Thermal Conductivity: 1.22 to 1.44
  • Type: Thermally Conductive
  • Dielectric Strength: 450
High Shear/Peel Strength, Room Temperature Curing Epoxy -- EP31
from Master Bond, Inc.

Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel strength exceeding 40 pli. The service... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Form / Shape: Optional Premixed and Frozen; Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Grease, Paste
Henkel Loctite Ablestik 285 Thermally Conductive Adhesive Black 2 lb Can -- 285 BLACK 2LB INDIVIDUAL [1188111 from Henkel Corporation - Industrial]
from Ellsworth Adhesives

Henkel Loctite Ablestik 285 Black, formerly Emerson and Cuming ECCOBOND, is a two component, highly filled, epoxy adhesive paste that is used for applications exposed to cryogenic temperatures and for bonding heat sinks. It offers low coefficient of thermal expansion, low stress, versatility,... [See More]

  • Cure / Technology: Two Component  
  • Thermal Conductivity: 1.22 to 1.44
  • Type: Thermally Conductive
  • Dielectric Strength: 450
High Tempreature and Thermal Cycling Resistant Epoxy -- EP33
from Master Bond, Inc.

Master Bond Polymer Adhesive EP33 is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond Polymer Adhesive EP33 produces high strength bonds whose... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Unfilled
Henkel Loctite Ablestik 285 Thermally Conductive Adhesive Black 22 kg Pail -- 285 22KG [2056375 from Henkel Corporation - Industrial]
from Ellsworth Adhesives

Henkel Loctite Ablestik 285 Black, formerly Emerson and Cuming ECCOBOND, is a thixotropic, epoxy adhesive paste that is designed to be used with a catalyst for applications exposed to cryogenic temperatures as well as bonding ceramics, metal, and heat sinks. It offers a low coefficient of thermal... [See More]

  • Cure / Technology: Two Component  
  • Thermal Conductivity: 1.22 to 1.44
  • Type: Thermally Conductive
  • Dielectric Strength: 450
Highly Flexible Addition Cured Silicone Offers Low Thermal Resistance -- MasterSil 151TC
from Master Bond, Inc.

MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Composition: Filled
Henkel Loctite Ablestik 286 Thermally Conductive Adhesive Part A White 20 lb Pail -- 286 PTA WHT 20LB PAIL [1188150 from Henkel Corporation - Industrial]
from Ellsworth Adhesives

Henkel Loctite Ablestik 286 White, formerly Emerson and Cuming ECCOBOND, is a two component, room temperature curing, epoxy adhesive that is used for bonding plastics, metal, piping, and other maintenance applications. It offers good thermal conductivity, minimum flow, and easy use. Part A, 20 lb... [See More]

  • Cure / Technology: Two Component  
  • Thermal Conductivity: 1.04
  • Type: Thermally Conductive
  • Tensile (Break): 2200
Low Exotherm, Two Component Epoxy -- EP29LP
from Master Bond, Inc.

Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will form bond strengths in excess of 2,500 psi (aluminum to aluminum). It bonds well to a variety of substrates... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Unfilled
Henkel Loctite Ablestik 286 Thermally Conductive Adhesive Part A White 4 lb Pail -- 286 PTA WHT 4LB GALLON [1188148 from Henkel Corporation - Industrial]
from Ellsworth Adhesives

Henkel Loctite Ablestik 286 White, formerly Emerson and Cuming ECCOBOND, is a two component, room temperature curing, epoxy adhesive that is used for bonding plastics, metal, piping, and other maintenance applications. It offers good thermal conductivity, minimum flow, and easy use. Part A, 4 lb... [See More]

  • Cure / Technology: Two Component  
  • Thermal Conductivity: 1.04
  • Type: Thermally Conductive
  • Tensile (Break): 2200
Low Outgassing, Optically Clear Two Component Epoxy -- EP29LPSP
from Master Bond, Inc.

Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Unfilled
Henkel Loctite Ablestik 286 Thermally Conductive Adhesive Part B White 7 lb Pail -- 286 PTB 7LB GALLON [1188149 from Henkel Corporation - Industrial]
from Ellsworth Adhesives

Henkel Loctite Ablestik 286 White, formerly Emerson and Cuming ECCOBOND, is a two component, room temperature curing, epoxy adhesive that is used for bonding plastics, metal, piping, and other maintenance applications. It offers good thermal conductivity, minimum flow, and easy use. Part B, 7 lb... [See More]

  • Cure / Technology: Two Component  
  • Thermal Conductivity: 1.04
  • Type: Thermally Conductive
  • Tensile (Break): 2200
Dissipator® Adhesive -- Grade 745
from Hi-Tech Seals, Inc.

HERNON ® offers a complete line of structural acrylic adhesives. These systems are two-part, no mix, and reactive adhesives. Each acrylic adhesive has two components: the adhesive base or resin, and the Activator. Structural acrylic adhesives are termed “reactive ” cure systems. The... [See More]

  • Cure / Technology: Two Component  ; Reactive or Moisture Cured
  • Chemical System: Acrylic
  • Type: Thermally Conductive
  • Form / Shape: Grease, Paste
Metal Oxide Thickened Dimethyl Silicone Compound -- Bluesil™ V-740
from Bluestar Silicones USA Corp.

Metal Oxide Thickened Dimethyl Silicone Compound. Description. Bluesil V-740 is a metal oxide thickened dimethyl silicone compound. It is a white, heavy paste used for heat dissipation applications where high thermal conductivity is required. [See More]

  • Cure / Technology: Two Component  
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Form / Shape: Grease, Paste
Potting/Encapsulation Compound -- INSTAbond® 809FR
from ACCRAbond, Inc.

INSTAbond ® 809FR. INSTAbond ® 809 FR exhibits good thermal conductivity, excellent flow properties, and low exotherm characteristics in large masses. INSTAbond ® 809 FR meets the requirements for UL-94 V-0 rating for flame retardancy. [See More]

  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Features: Flame Retardant; UL Rating
55 Shore D polyurethane adhesive -- 10-2055
from Epoxies Etc...

The 10-2055 and 10-2055 HV were developed to produce a general purpose, semi flexible polyurethane adhesive for bonding a wide variety of plastic and metal substrates. The flexibility of these adhesives allows bonding to substrates with high coefficients of thermal expansion (CTE) and substrates... [See More]

  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Polyurethane
  • Type: Thermally Conductive
  • Form / Shape: Die Bonding Adhesives; Grease, Paste
Ceramabond -- 890
from Aremco Products, Inc.

Aremco ’s high temperature ceramic adhesives are unique inorganic formulations for bonding and sealing ceramics, metals, quartz, graphites, textiles, and composite materials used in design, process and maintenance applications to 3200 °F. These advanced materials, which exhibit high... [See More]

  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Form / Shape: Grease, Paste
  • Type: Electrically Conductive; Thermally Conductive
  • Industry: Electronics
Pourable, Addition-Curing RTV-2 Silicone Rubber -- ELASTOSIL® RT675 A/B
from Wacker Chemical Corp.

ELASTOSIL ® RT 675 A/B is a pourable, addition-curing RTV-2 silicone rubber. [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Silicone; Elastomeric
  • Type: Thermally Conductive
  • Form / Shape: Liquid
Clear Non-Yellowing Silicone Encapsulant -- PNS-56225
from Protavic America, Inc.

PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Silicone
  • Type: Electrically Conductive; Thermally Conductive
  • Composition: Unfilled
Cement -- No. 31
from Sauereisen, Inc.

Sauereisen Cement No. 31 is a white, porcelain-like cement that is widely used throughout industry in a variety of applications. including assembling, sealing, insulating and cementing of ceramics, porcelain, metal, and glass. [See More]

  • Cure / Technology: Two Component  ; Chemically Set
  • Chemical System: Ceramic
  • Type: Thermally Conductive
  • Composition: Unfilled
Electrically Non-Conductive Adhesives -- LOCTITE ABLESTIK 872-7TN1
from Henkel Corporation - Industrial

LOCTITE ABLESTIK 872-7TN1, Epoxy, Non-conductive adhesive LOCTITE ® ABLESTIK 872-7TN1 is ideal for electronic applications requiring stress relief. Flexible. Thixotropic. High viscosity. Long work life. Easy handling. High thermal conductivity. Reduced stress [See More]

  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Form / Shape: Paste
Engineered Materials -- Thermotech TE
from Materion Corporation

Thermotech TE ™ is a Silver-filled, electrically conductive high-vacuum compound specifically manufactured by Pure Tech for the sputtering target industry. Thermotech TE combines the excellent thermal and electrical conductive properties of pure Silver with a low vapor pressure sealant,... [See More]

  • Cure / Technology: Two Component  
  • Industry: Electronics
  • Type: Electrically Conductive
Thermally Conductive Epoxy -- OB-100 / OB-200 Series
from OMEGA Engineering, Inc.

OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper products. [See More]

  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Form / Shape: Liquid
Heat Transfer Compound -- T-802-Q
from Thermon, Inc

T-802 is a two-part low to medium temperature resin-based heat transfer compound for use in moist and corrosive environments. Thermon ’s heat transfer compounds provide an efficient thermal connection between the tracer and the process equipment. By eliminating the air voids that would... [See More]

  • Cure / Technology: Two Component  
  • Form / Shape: Grease, Paste
  • Type: Thermally Conductive
  • Industry: Corrosive / Moist Environments
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4501
from Hapco, Inc.

Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Form / Shape: Liquid
  • Type: Thermally Conductive
  • Industry: Electronics
Electrically Conductive Epoxy -- 40-3905
from Epoxies Etc...

40-3905 is an electrically conductive system designed for applications requiring low temperature cures. 40-3905 will cure at room temperature in 18 hours or can be accelerated with mild heat. [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Filled
Clear UV Adhesive -- ANA-97773
from Protavic America, Inc.

ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued shrinkage and movement. Bond lines are clear, colorless and exhibit low shrinkage during the curing process. [See More]

  • Cure / Technology: Thermoset; Two Component  ; UV or Radiation Cured
  • Composition: Unfilled
  • Type: Electrically Conductive
  • Form / Shape: Die Bonding Adhesives; Liquid
Encapsulants -- LOCTITE STYCAST 2762FT
from Henkel Corporation - Industrial

LOCTITE STYCAST 2762FT, Epoxy, High Temperature Resistance, High Thermal Conductivity, Potting, Encapsulant LOCTITE ® STYCAST 2762FT epoxy encapsulant is designed for potting electronic components exposed to harsh environments. This material is also ideal for large and complex castings that... [See More]

  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Viscosity: 25000
Di-Pak™ Rigid Eletrical Insulating Compound -- R-4528/7
from Hapco, Inc.

DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity). Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI-COAT R-4721 is easy to... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Form / Shape: Liquid
  • Type: Thermally Conductive
  • Industry: Electronics
Flame Retardant Polyurethane -- 50-2369 FR
from Epoxies Etc...

The 50-2369FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-2369 FR Urethane is listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low exotherm, and excellent electrical... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Polyurethane
  • Type: Thermally Conductive
  • Composition: Filled
Electro-Conductive Epoxy Adhesive -- ACE-40010AB
from Protavic America, Inc.

Two part Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the assembly ofnon heat cure products and can be used for repair work in the field. It also has a convenient 1:1 mix ratio. [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Type: Electrically Conductive; Thermally Conductive
  • Composition: Filled
Encapsulants -- LOCTITE STYCAST 2850FTJ
from Henkel Corporation - Industrial

LOCTITE STYCAST 2850FTJ, Epoxy, Encapsulant. LOCTITE ® STYCAST 2850FTJ epoxy encapsulant is designed for use in high voltage applications where surface arcing or tracking is a concern. LOCTITE STYCAST 2850FTJ is recommended for encapsulation of components that require heat dissipation and... [See More]

  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Viscosity: 225000
Thermally Conductive PU Potting Compound -- 20-2366FR
from Epoxies Etc...

20-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 20-2366 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical... [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Polyurethane; Elastomeric
  • Type: Thermally Conductive
  • Composition: Unfilled
Epoxy Cast -- PTE-36977
from Protavic America, Inc.

PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ is heat stable up to 150 °C. [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Filled
Encapsulants -- LOCTITE STYCAST 2850KT CAT 24LV
from Henkel Corporation - Industrial

LOCTITE STYCAST 2850KT CAT 24LV, Epoxy, Encapsulant LOCTITE ® STYCAST 2850KT CAT 24LV epoxy encapsulant is designed for heat sink replacement in non-integrated electrical components and assemblies. It is also recommended for use in high voltage applications where surface arching or tracking is a... [See More]

  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Use Temperature: 85 to 221
Room Temp Curing Epoxy Adhesive -- ATE-46446
from Protavic America, Inc.

Filled epoxy system for high thermal applications such as heat-sink bonding. This material has 2.2 Wm °K thermal performance with supporting laser flash data. Room temperature cure. [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Filled
Encapsulants -- LOCTITE STYCAST 5952-1
from Henkel Corporation - Industrial

LOCTITE STYCAST 5952-1, Silicone, Potting or Encapsulant. LOCTITE ® STYCAST 5952-1 is designed for encapsulation of heat generating devices. It is also recommended for applications requiring a non-corrosive casting and coating. Electrically non-conductive. Good elongation strength. Moderate tear... [See More]

  • Cure / Technology: Two Component  
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Thermal Conductivity: 0.8000
Encapsulants -- LOCTITE STYCAST E 2534 FR CAT 9
from Henkel Corporation - Industrial

LOCTITE STYCAST E 2534 FR CAT 9, Epoxy, Potting LOCTITE ® STYCAST E 2534 FR CAT 9 epoxy potting compound complies with recent demands on environmentally friendly products and does not contain brominated flame retardants. LOCTITE STYCAST E 2534 FR CAT 9 can be used with a variety of catalysts. [See More]

  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Use Temperature: 40 to 302
Encapsulants -- LOCTITE STYCAST EE 4215/HD 3561
from Henkel Corporation - Industrial

LOCTITE STYCAST EE 4215/HD 3561, Epoxy, Potting and Encapsulating. LOCTITE ® STYCAST EE 4215/HD 3561 is a filled system recommended for potting applications where rigid or flexible wire leads protrude directly from the encapsulation and where high impact strength is required. This system... [See More]

  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Type: Thermally Conductive
Encapsulants -- LOCTITE STYCAST US 0155
from Henkel Corporation - Industrial

LOCTITE STYCAST US 0155, Urethane, Potting and Encapsulating. LOCTITE ® STYCAST US 0155 is a low viscosity, flexible, flame retardant, castor oil/MDI based urethane potting/encapsulating compound. This material was designed for potting indoor and outdoor telephone connector blocks. It is... [See More]

  • Cure / Technology: Two Component  
  • Chemical System: Polyurethane
  • Type: Thermally Conductive
  • Form / Shape: Liquid
Metal Rebuilding Material -- LOCTITE PC 3466
from Henkel Corporation - Industrial

2-part, room temperature-cure, pourable epoxy system heavily reinforced with aluminum powder. LOCTITE ® PC 3466 (known as LOCTITE FIXMASTER ALUMINUM LIQUID) is a gray, 2-part, room temperature-cure, pourable epoxy system heavily reinforced with aluminum powder. It is used for filling or leveling... [See More]

  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Type: Thermally Conductive
Potting Compounds -- LOCTITE STYCAST 2850FT BL
from Henkel Corporation - Industrial

LOCTITE STYCAST 2850FT BL, Epoxy, Encapsulant. LOCTITE ® STYCAST 2850FT BL epoxy is designed for applications where electrical insulation and mechanical protection must be maintained while coping with heat transfer considerations. LOCTITE STYCAST 2850FT BL can be used with a variety of... [See More]

  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Thermal Conductivity: 1.38