EMI / RFI Shielding Material Conductive Compounds
from Quantaflex Printed Electronics Inc.
A high level of custom engineering and problem solving. Designing electrical shielding components requires a high level of custom engineering and problem solving. Nothing should be left to chance because the goal is to create a part that protects the electronic device (and your customers) from the... [See More]
- Features: EMI/RFI Shielding
- Form / Shape: Foam; Gap Filler, Foam in Place Gasket; Liquid
- Type: Thermally Conductive
- Industry: Electronics; Semiconductors, IC's
from Master Bond, Inc.
Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]
- Features: Anti-static, ESD; EMI/RFI Shielding; Flexible; Dissimilar Substrates
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Master Bond, Inc.
Master Bond Polymer System EP65HT-1 represents a breakthrough in epoxy adhesive technology in that it features the unusual combination of ultra-fast cures and high temperature resistance. While typical fast setting epoxies normally possess glass transition temperatures below 85 °C, EP65HT-1 has... [See More]
- Features: Anti-static, ESD; EMI/RFI Shielding
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Unfilled
from Master Bond, Inc.
Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature. The... [See More]
- Features: Anti-static, ESD; EMI/RFI Shielding
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Unfilled
from Master Bond, Inc.
Master Bond Polymer System EP65HT represents a breakthrough in epoxy adhesive technology in that it features the unusual combination of ultra-fast cures and high temperature resistance. While typical fast setting epoxies normally possess glass transition temperatures below 85 °C, EP65HT has an... [See More]
- Features: Anti-static, ESD; EMI/RFI Shielding
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Unfilled
from Master Bond, Inc.
Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel strength exceeding 40 pli. The service... [See More]
- Features: Anti-static, ESD; EMI/RFI Shielding; Flexible; Dissimilar Substrates
- Chemical System: Epoxy
- Type: Electrically Conductive
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer Adhesive EP33 is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond Polymer Adhesive EP33 produces high strength bonds whose... [See More]
- Features: Anti-static, ESD; EMI/RFI Shielding; Flexible; Dissimilar Substrates
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Unfilled
from Master Bond, Inc.
Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will form bond strengths in excess of 2,500 psi (aluminum to aluminum). It bonds well to a variety of substrates... [See More]
- Features: Anti-static, ESD; EMI/RFI Shielding; Flexible
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Unfilled
from Master Bond, Inc.
Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]
- Features: Anti-static, ESD; EMI/RFI Shielding; Flexible
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Unfilled
from Master Bond, Inc.
Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part nickel conductive systems, EP76M... [See More]
- Features: Anti-static, ESD; EMI/RFI Shielding
- Chemical System: Epoxy
- Type: Electrically Conductive; Thermally Conductive
- Composition: Filled
from Master Bond, Inc.
Master Bond Polymer System EP36 is a unique one component high performance toughened epoxy system for electrical potting, casting, encapsulation, baked coatings and adhesive applications. It features an outstanding combination of properties including high temperature stability up to 500 °F,... [See More]
- Features: Anti-static, ESD; EMI/RFI Shielding; Flexible; Dissimilar Substrates
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Unfilled
from Master Bond, Inc.
Master Bond Polymer Adhesive EP65 represents a breakthrough in epoxy adhesive technology featuring hitherto unattainable balance of processing strengths. This two component adhesive system is formulated to cure exceptionally quickly at ambient temperatures e.g. 8-10 minutes, shorter lives at higher... [See More]
- Features: Anti-static, ESD; EMI/RFI Shielding
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Unfilled
from Master Bond, Inc.
Master Bond Polymer System EP79 is a two component, silver coated nickel filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. EP79 offers a convenient one-to-one mix ratio by weight or... [See More]
- Features: Anti-static, ESD; EMI/RFI Shielding
- Chemical System: Epoxy
- Type: Electrically Conductive; Thermally Conductive
- Composition: Filled
from Master Bond, Inc.
Featuring a low volume resistivity of 5-10 ohm-cm, EP21TDCN-LO is a nickel conductive system for high performance bonding and sealing applications. This smooth paste formulation is easy to handle and has a one to one mix ratio by weight or volume. It is a toughened system, formulated to withstand... [See More]
- Features: EMI/RFI Shielding; Non-corrosive; Flexible; Dissimilar Substrates
- Chemical System: Epoxy
- Type: Electrically Conductive; Thermally Conductive
- Composition: Filled
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-NS10 ™ epoxy is developed for general purpose applications requiring high performance bond or connection of electrically conductive components/materials for enhanced electrical conductivity. G6E-NS10 ™ has been developed based on advanced proprietary technology that... [See More]
- Features: EMI/RFI Shielding
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Henkel Corporation - Electronics
With the increasing proliferation of wireless devices, designers are challenged with various electromagnetic waves from multiple sources radiating at the same spectrum of frequencies resulting in electromagnetic interference(EMI). Radio-frequency(RF) emitting devices require effective isolation to... [See More]
- Features: EMI/RFI Shielding
- Cure / Technology: Single Component
- Type: Electrically Conductive
- Form / Shape: Liquid; Encapsulant or Conformal Coating
from Epoxy Technology
EPO-TEK ® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical, and... [See More]
- Features: EMI/RFI Shielding
- Chemical System: Epoxy
- Type: Electrically Conductive; Thermally Conductive
- Composition: Filled
from Shiu Li Technology Co., Ltd
LiPOLY TEM96D is a thermally conductive absorber based upon soft magnetic materials dispersed in a polymeric resin. It has a thermalconductivity of 5.0 W/m*K and dissipates electromagnetic radiation rapidly to mitigate against EMI issues. [See More]
- Features: EMI/RFI Shielding; UL Rating
- Chemical System: Silicone
- Type: Thermally Conductive
- Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
from Graphene Laboratories, Inc.
DESCRIPTION: Traditional silver-based adhesives require up to 80% weight load of silver fillers and as a result tend to be costly, brittle and prone to mechanical failure. G6E-NS11 ™ has been developed based on advanced proprietary technology that requires 15% or less silver content to be at... [See More]
- Features: EMI/RFI Shielding
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-FRP ™ is a flexible version of our G6E-P ™ general purpose epoxy. G6E-FRP ™ epoxy was developed primarily for high-performance bonding, connection, sealing and coating applications requiring a flexible bond or connection of electrically conductive components or... [See More]
- Features: EMI/RFI Shielding; Flexible
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-FXNS ™ epoxy is developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials as well as for low electrical resistivity. G6E-FXNS ™ is developed based on advanced proprietary technology that requires... [See More]
- Features: EMI/RFI Shielding; Flexible
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-FXSG ™ epoxy is primarily developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials requiring low electrical resistivity. G6-FXSG ™ is well suited for bonding of dissimilar materials that are... [See More]
- Features: EMI/RFI Shielding; Flexible
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-P ™ epoxy is primarily developed for general purpose applications requiring high-performance bond or connection of electrically conductive components/materials. G6E-P ™ is formulated with proprietary nanomaterials and fillers. G6E-P ™ epoxy can be cured at room... [See More]
- Features: EMI/RFI Shielding
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-HTC ™ epoxy is developed primarily for applications requiring a high-performance bond or connection of electrically conductive components/materials that operate at higher temperatures. G6E-HTC ™ epoxy ’s properties result from being formulated with proprietary... [See More]
- Features: EMI/RFI Shielding
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-HTNS ™ epoxy is developed primarily for applications requiring a high-performance bond or connection of electrically conductive components/materials which operate at higher temperatures requiring low electrical resistivity. G6E-HTNS ™ is developed based on advanced... [See More]
- Features: EMI/RFI Shielding
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-HTSG ™ epoxy is primarily developed for applications requiring a high-performance bond or connection of electrically conductive components/materials which operate at higher temperatures and which require low electrical resistivity. G6E-HTSG ™ epoxy is formulated with... [See More]
- Features: EMI/RFI Shielding
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-RTC ™ Room Temperature Curable Carbon Filled Electrically Conductive epoxy is developed primarily for applications requiring curing at room temperature. G6E-RTC ™ epoxy is formulated with proprietary nanomaterials and fillers to provide its performance characteristics. [See More]
- Features: EMI/RFI Shielding
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-RTSG ™ epoxy is developed primarily for applications that require curing at room temperature. Room temperature curing eliminates the necessity for a heating oven. This allows easier and safer bond/connection of conductive components or materials. G6E-RTSG ™ epoxy is also... [See More]
- Features: EMI/RFI Shielding
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-SG ™ epoxy is developed for general purpose applications requiring high-performance bond or connection of electrically conductive components/materials that require low electrical resistivity. G6E-SG ™ is formulated with proprietary nanomaterials and fillers. G6E-SG... [See More]
- Features: EMI/RFI Shielding
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled