Unfilled Conductive Compounds
from Acrolab Ltd.
Isopaste is a high-temperature thermal bridging compound used in Acrolab's Isoplatens and Heat Transfer Tools to act as a heat conductor in the Isobar ® Heat Pipe channels. It comes in three stock sizes: 4oz., 8oz., and 16oz. cans. [See More]
- Composition: Unfilled
- Cure / Technology: Thermoset; Single Component
- Type: Thermally Conductive
- Form / Shape: Grease, Paste
from Master Bond, Inc.
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]
- Composition: Unfilled
- Chemical System: Silicone
- Type: Thermally Conductive
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing; Addition Cure
from Master Bond, Inc.
EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]
- Composition: Unfilled
- Chemical System: Epoxy
- Type: Thermally Conductive
- Cure / Technology: Thermoset; Single Component
from Master Bond, Inc.
EP3HTND-2Med Black is a one part system that combines easy processing with excellent bonding properties. It cures in 20-30 minutes at 250°F or 5-10 minutes at 300°F and adheres well to a wide variety of substrates including glass, metals, ceramics and most plastics. This paste compound meets USP... [See More]
- Composition: Unfilled
- Chemical System: Epoxy
- Type: Thermally Conductive
- Cure / Technology: Thermoset; Single Component
from Master Bond, Inc.
Master Bond EP126 withstands very high temperatures, up to +600 °F, and has a glass transistion temperature of +240 °C. This two component product features unique handling properties as Part A is a moderate viscosity liquid and Part B is a powder. It can be easily mixed using a forgiving 100... [See More]
- Composition: Unfilled
- Chemical System: Epoxy
- Type: Thermally Conductive
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]
- Composition: Unfilled
- Chemical System: Epoxy
- Type: Thermally Conductive
- Cure / Technology: Thermoset; Single Component
from Master Bond, Inc.
EP35SP is a two component epoxy system specially formulated to resist high temperatures and aggressive chemicals. It has a paste viscosity with little to no flow when curing. [See More]
- Composition: Unfilled
- Chemical System: Epoxy
- Type: Thermally Conductive
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]
- Composition: Unfilled
- Chemical System: Epoxy
- Type: Thermally Conductive
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]
- Composition: Unfilled
- Chemical System: Epoxy
- Type: Thermally Conductive
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]
- Composition: Unfilled
- Chemical System: Silicone
- Type: Thermally Conductive
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature. The... [See More]
- Composition: Unfilled
- Chemical System: Epoxy
- Type: Electrically Conductive
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer Adhesive EP33 is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond Polymer Adhesive EP33 produces high strength bonds whose... [See More]
- Composition: Unfilled
- Chemical System: Epoxy
- Type: Electrically Conductive
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will form bond strengths in excess of 2,500 psi (aluminum to aluminum). It bonds well to a variety of substrates... [See More]
- Composition: Unfilled
- Chemical System: Epoxy
- Type: Electrically Conductive
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]
- Composition: Unfilled
- Chemical System: Epoxy
- Type: Electrically Conductive
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]
- Composition: Unfilled
- Chemical System: Epoxy
- Type: Thermally Conductive
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
EP42-2LV Black is a two component, room temperature curing epoxy compound featuring low viscosity and superior chemical resistance. It meets NASA low outgassing specifications, is black in color and optically opaque. [See More]
- Composition: Unfilled
- Chemical System: Epoxy
- Type: Thermally Conductive
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Offering impressive physical strength characteristics, EP41S-F is an electrically insulative two component epoxy that cures rapidly at ambient and elevated temperatures. Typically faster curing epoxies are somewhat less chemically resistant than other types of systems, but EP41S-F is one of the few... [See More]
- Composition: Unfilled
- Chemical System: Epoxy
- Type: Thermally Conductive
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Elastomeric adhesive system, X5TC delivers thermal conductivity of 10-12 BTU •in/ft2 •hr • °F [1.44-1.73 W/m •K] while maintaining excellent electrical insulation properties. It is well suited for bonding dissimilar substrates and performs well when subjected to thermal... [See More]
- Composition: Unfilled
- Chemical System: Elastomeric
- Type: Thermally Conductive
- Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Master Bond X21Med is a toughened one part system that can be used for bonding and priming polyolefinic surfaces. This exceptionally low viscosity ( <250 cps) solvent based system is easy to apply and process. It cures at room temperature or more rapidly with the addition of heat. X21Med passes... [See More]
- Composition: Unfilled
- Chemical System: Polyolefin
- Type: Thermally Conductive
- Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
from Nordson EFD
Our innovative, non-silicone thermal compounds provide an ideal thermal solution by ensuring reliable heat transfer over a longer time than most industrial thermal interface materials. Conventional, silicone-based heat sink compounds and thermal greases tend to spread after a number of heating and... [See More]
- Composition: Unfilled
- Chemical System: Synthetic Based
- Type: Thermally Conductive
- Cure / Technology: Single Component
from Sherwin-Williams Protective & Marine Coatings
CoroBond ™ CONDUCTIVE VINYL ESTER PRIMER is a conductive, elastomer modified epoxy vinyl ester. It is designed to provide superior adhesion to concrete and metal substrates, and resist mechanical stresses such as impact, abrasion, tensile and flexural stress. Excellent chemical resistance. [See More]
- Composition: Unfilled
- Chemical System: Elastomer-Modified Epoxy; Epoxy; Alkyd; Vinyl
- Type: Electrically Conductive
- Cure / Technology: Thermoset; Single Component
from Sauereisen, Inc.
Sauereisen Adhesive Paste No. 19 is an inorganic, odorless, nontoxic cement used for bonding glass, porcelain, wood, felt, cork, metals and ceramic fiber. Some typical applications include protection of exposed metal surfaces during heat treating, bonding wallboard to brick or concrete and cementing... [See More]
- Composition: Unfilled
- Chemical System: Ceramic
- Type: Thermally Conductive
- Cure / Technology: Single Component
from Epoxies Etc...
Epoxies, Etc... has engineered these materials to satisfy the requirements of many demanding coating and bonding applications that require electrical conductivity. [See More]
- Composition: Unfilled
- Chemical System: Epoxy
- Type: Electrically Conductive
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Protavic America, Inc.
PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]
- Composition: Unfilled
- Chemical System: Silicone
- Type: Electrically Conductive; Thermally Conductive
- Cure / Technology: Thermoset; Two Component
from Sauereisen, Inc.
Sauereisen Cement No. 31 is a white, porcelain-like cement that is widely used throughout industry in a variety of applications. including assembling, sealing, insulating and cementing of ceramics, porcelain, metal, and glass. [See More]
- Composition: Unfilled
- Chemical System: Ceramic
- Type: Thermally Conductive
- Cure / Technology: Two Component ; Chemically Set
from Epoxies Etc...
20-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 20-2366 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical... [See More]
- Composition: Unfilled
- Chemical System: Polyurethane; Elastomeric
- Type: Thermally Conductive
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Protavic America, Inc.
ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued shrinkage and movement. Bond lines are clear, colorless and exhibit low shrinkage during the curing process. [See More]
- Composition: Unfilled
- Cure / Technology: Thermoset; Two Component ; UV or Radiation Cured
- Type: Electrically Conductive
- Form / Shape: Die Bonding Adhesives; Liquid
from Protavic America, Inc.
The electrically conductive PROTAVIC ACH 20120 adhesive is designed for BGA packages and LED dies PROTAVIC ACH 20120 presents excellent properties of flexibility, good adhesion and moisture resistance, no voids which allow package 10 withstand 260C Pb-free reflow temperature. More over PROTAVIC ACH... [See More]
- Composition: Unfilled
- Chemical System: Hybrid
- Type: Electrically Conductive; Thermally Conductive
- Cure / Technology: Thermoset; Single Component
from Protavic America, Inc.
A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals. [See More]
- Composition: Unfilled
- Chemical System: Epoxy
- Type: Thermally Conductive
- Cure / Technology: Thermoset; Single Component
from Protavic America, Inc.
Non-Conductive Coating for Bonding of Stacked Wafers. This material is perfectly adapted for high reliable ceramic attaching applications. Ideal for screen printing. [See More]
- Composition: Unfilled
- Chemical System: Epoxy
- Type: Thermally Conductive
- Cure / Technology: Thermoset; Single Component