Flexible / Dampening Conductive Compounds
from Master Bond, Inc.
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]
- Features: Phase Change; Non-corrosive; Flexible; Dissimilar Substrates
- Chemical System: Silicone
- Type: Thermally Conductive
- Composition: Unfilled
from ELANTAS PDG, Inc.
Mineral-filled VPI resin - semi-flexible for transformers with improved heat dissipation [See More]
- Features: Flexible; UL Rating; Dissimilar Substrates
- Chemical System: Alkyd
- Type: Thermally Conductive
- Composition: Filled
from MacDermid Alpha Electronics Solutions
Product Description. SC4010 is a very low viscosity silicone potting and encapsulation compound for the protection of electronic components. Please note: This product has been developed for a specific territory and may not be available locally to you. Please contact your local sales manager for more... [See More]
- Features: Flexible
- Chemical System: Silicone
- Type: Thermally Conductive
- Industry: Electronics
from Master Bond, Inc.
Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]
- Features: Anti-static, ESD; EMI/RFI Shielding; Flexible; Dissimilar Substrates
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from MacDermid Alpha Electronics Solutions
Product Description. TCOR RTV Thermally Conductive Oxime is a single component, 100% solids, low odour RTV which cures upon exposure to atmospheric moisture. The product offers a high degree of thermal conductivity and is suitable for use over a very wide temperature range, making it ideal for a... [See More]
- Features: Flexible
- Chemical System: Silicone
- Type: Thermally Conductive
- Cure / Technology: Single Component; Reactive or Moisture Cured
from Master Bond, Inc.
EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]
- Features: Flame Retardant; Non-corrosive; Flexible; Dissimilar Substrates
- Chemical System: Epoxy
- Type: Thermally Conductive
- Composition: Unfilled
from MacDermid Alpha Electronics Solutions
Product Description. UR5044 flame retardant polyurethane resin is a UL94 approved two part system has been developed for potting and encapsulation of electronics. Once cured it has a dark blue finish and is soft enough that it can be dug out if required for rework and repair. Its flexibility and its... [See More]
- Features: Flame Retardant; Flexible
- Chemical System: Polyurethane
- Type: Thermally Conductive
- Cure / Technology: Two Component
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Features: Phase Change; Non-corrosive; Flexible; Dissimilar Substrates
- Chemical System: Silicone
- Type: Electrically Conductive; Thermally Conductive
- Composition: Filled
from Master Bond, Inc.
EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]
- Features: Non-corrosive; Flexible; Dissimilar Substrates
- Chemical System: Epoxy
- Type: Thermally Conductive
- Composition: Unfilled
from Master Bond, Inc.
MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]
- Features: Phase Change; Non-corrosive; Flexible; Dissimilar Substrates
- Chemical System: Silicone
- Type: Thermally Conductive
- Composition: Unfilled
from Master Bond, Inc.
Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel strength exceeding 40 pli. The service... [See More]
- Features: Anti-static, ESD; EMI/RFI Shielding; Flexible; Dissimilar Substrates
- Chemical System: Epoxy
- Type: Electrically Conductive
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer Adhesive EP33 is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond Polymer Adhesive EP33 produces high strength bonds whose... [See More]
- Features: Anti-static, ESD; EMI/RFI Shielding; Flexible; Dissimilar Substrates
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Unfilled
from Master Bond, Inc.
MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]
- Features: Non-corrosive; Flexible; Dissimilar Substrates
- Chemical System: Silicone
- Type: Thermally Conductive
- Composition: Filled
from Master Bond, Inc.
Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will form bond strengths in excess of 2,500 psi (aluminum to aluminum). It bonds well to a variety of substrates... [See More]
- Features: Anti-static, ESD; EMI/RFI Shielding; Flexible
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Unfilled
from Master Bond, Inc.
Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]
- Features: Anti-static, ESD; EMI/RFI Shielding; Flexible
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Unfilled
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-FRP ™ is a flexible version of our G6E-P ™ general purpose epoxy. G6E-FRP ™ epoxy was developed primarily for high-performance bonding, connection, sealing and coating applications requiring a flexible bond or connection of electrically conductive components or... [See More]
- Features: EMI/RFI Shielding; Flexible
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Sauereisen, Inc.
Sauereisen Aluseal Adhesive Cement No. 2 is a ceramic cement paste offering good bond strength and thermal shock. resistant properties for assembling, sealing and cementing porcelain, glass, metal and other materials. Its fine particle size. and excellent flow characteristics make No. 2 a good... [See More]
- Features: Flexible
- Chemical System: Ceramic
- Type: Thermally Conductive
- Composition: Unfilled
from ThreeBond International, Inc.
Electrically Conductive Resins. These Electrically conductive resin can connect multiple electrical contacts simultaneously and make it possible to create an electrical connection in materials that cannot be soldered. They are electro-conductive resins made up of synthetic resin and a conductive... [See More]
- Features: Flexible
- Chemical System: Elastomeric
- Type: Electrically Conductive
- Composition: Filled
from Epoxies Etc...
The 10-2055 and 10-2055 HV were developed to produce a general purpose, semi flexible polyurethane adhesive for bonding a wide variety of plastic and metal substrates. The flexibility of these adhesives allows bonding to substrates with high coefficients of thermal expansion (CTE) and substrates... [See More]
- Features: Flexible
- Chemical System: Polyurethane
- Type: Thermally Conductive
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
from Protavic America, Inc.
PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]
- Features: Flexible
- Chemical System: Silicone
- Type: Electrically Conductive; Thermally Conductive
- Composition: Unfilled
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-FXNS ™ epoxy is developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials as well as for low electrical resistivity. G6E-FXNS ™ is developed based on advanced proprietary technology that requires... [See More]
- Features: EMI/RFI Shielding; Flexible
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Epoxies Etc...
40-3920 is a one component electrically conductive ink. 40-3920 is a silver filled polymer system which exhibits outstanding adhesion to a variety of substrates, such as kapton, mylar, glass, polyester, ceramic, etc. This thick film ink provides excellent conductivity for many electronic... [See More]
- Features: Flexible
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Protavic America, Inc.
Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for production needs. One... [See More]
- Features: Flexible
- Chemical System: Epoxy
- Type: Electrically Conductive; Thermally Conductive
- Composition: Filled
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-FXSG ™ epoxy is primarily developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials requiring low electrical resistivity. G6-FXSG ™ is well suited for bonding of dissimilar materials that are... [See More]
- Features: EMI/RFI Shielding; Flexible
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Epoxies Etc...
20-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 20-2366 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical... [See More]
- Features: Flame Retardant; Flexible; UL Rating
- Chemical System: Polyurethane; Elastomeric
- Type: Thermally Conductive
- Composition: Unfilled
from Protavic America, Inc.
PTS-46303 A/B ™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include... [See More]
- Features: Flame Retardant; Flexible; UL Rating
- Chemical System: Silicone
- Type: Thermally Conductive
- Composition: Filled