Single Component System Conductive Compounds

Pedigree® -- 40 VTC-40F
from ELANTAS PDG, Inc.

Mineral-filled VPI resin - semi-flexible for transformers with improved heat dissipation [See More]

  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Alkyd
  • Type: Thermally Conductive
  • Composition: Filled
Isopaste Thermally Conductive Paste
from Acrolab Ltd.

Isopaste is a high-temperature thermal bridging compound used in Acrolab's Isoplatens and Heat Transfer Tools to act as a heat conductor in the Isobar ® Heat Pipe channels. It comes in three stock sizes: 4oz., 8oz., and 16oz. cans. [See More]

  • Cure / Technology: Thermoset; Single Component
  • Composition: Unfilled
  • Type: Thermally Conductive
  • Form / Shape: Grease, Paste
Electrically and Thermally Conductive Epoxy Adhesive -- EPO-TEK® EK1000-1-D
from Epoxy Technology

EPO-TEK ® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical, and... [See More]

  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Epoxy
  • Type: Electrically Conductive; Thermally Conductive
  • Composition: Filled
B-Staged Epoxy Meets Airbus Standards for Flame Retardancy & Toxicity -- EP36FR
from Master Bond, Inc.

EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]

  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Unfilled
Dow DOWSIL™ 1-4173 TC Thermally Conductive Adhesive Gray 1.5 kg Cartridge -- 1-4173 TC ADHESIVE 1.5KG [2852497 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™ 1-4173 Thermally Conductive Adhesive Gray is a one component, solvent free adhesive that is used for bonding electronic components, housings, lids, base plates, and dispensing equipment. It is heat curing, self-leveling, flowable, good thermal conductivity, and has high tensile... [See More]

  • Cure / Technology: Single Component
  • Thermal Conductivity: 1.8
  • Type: Thermally Conductive
  • Viscosity: 61000
Biocompatible, Non-Drip Epoxy Resists Repeated Sterilizations -- EP3HTND-2Med Black
from Master Bond, Inc.

EP3HTND-2Med Black is a one part system that combines easy processing with excellent bonding properties. It cures in 20-30 minutes at 250°F or 5-10 minutes at 300°F and adheres well to a wide variety of substrates including glass, metals, ceramics and most plastics. This paste compound meets USP... [See More]

  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Unfilled
Dow DOWSIL™ 1-4173 TC Thermally Conductive Adhesive Gray 10 kg Pail -- 1-4173 TC ADHESIVE 10KG [4025029 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™ 1-4173 Thermally Conductive Adhesive Gray is a one component, heat curing silicone that is used for bonding heat sinks, housings, base plates, lids, and circuit applications. It provides flowability, chemical stability, and resistance to shock, ozone, stress, and environmental... [See More]

  • Cure / Technology: Single Component
  • Thermal Conductivity: 1.9
  • Type: Thermally Conductive
  • Tensile (Break): 900
Dual Curing, Thixotropic Adhesive -- UV22DC80-10F
from Master Bond, Inc.

One part, nanosilica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]

  • Cure / Technology: UV or Radiation Cured; Single Component; Dual Curing
  • Chemical System: UV Curing
  • Type: Thermally Conductive
  • Composition: Filled
Dow DOWSIL™ 1-4174 TC Thermally Conductive Adhesive Gray 1.5 kg Cartridge -- 1-4174 TC ADHESIVE 1.5KG [3135641 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™ 1-4174 Thermally Conductive Adhesive Gray is a one component, solvent free, silicone polymer that is used for bonding electronic components, housings, lids, base plates, and heat sinks. It is heat curing, self-leveling, flowable, high tensile strength, and allows controlled bond... [See More]

  • Cure / Technology: Single Component
  • Thermal Conductivity: 1.9
  • Type: Thermally Conductive
  • Tensile (Break): 900
Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity -- EP3HTSDA-1
from Master Bond, Inc.

EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]

  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Unfilled
Dow DOWSIL™ 3-6752 Thermally Conductive Adhesive Gray 30 cc Syringe -- 3-6752 TC ADHESIVE 75G [4121539 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™ 3-6752 Thermally Conductive Adhesive Gray is a one component, heat curing silicone that is used to cool electronic applications and bond with metals, ceramics, filled plastics, epoxy laminates, and organic substrates. It is flame resistant, self leveling, flowable, thixotropic,... [See More]

  • Cure / Technology: Single Component
  • Industry: Semiconductors, IC's
  • Type: Thermally Conductive
  • Thermal Conductivity: 1.8
Electrically Conductive Die Attach Epoxy With High Glass Transition Temperature -- EP17HTS-DA
from Master Bond, Inc.

Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]

  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Polyphenylene Sulfide; Epoxy
  • Type: Electrically Conductive; Thermally Conductive
  • Composition: Filled
Dow DOWSIL™ 340 Heat Sink Compound Lubricant/Grease White 142 g Tube -- 340 CMPD 142G TUBE [1446622 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™ 340 Heat Sink Compound White is a one component, grease like silicone that is used for thermal coupling of electrical components to heat sinks. It is non-flowing, non-curing, thermally conductive, low bleed, and has high temperature stability. 142 g Tube. [See More]

  • Cure / Technology: Single Component
  • Thermal Conductivity: 0.6700
  • Type: Thermally Conductive
  • Dielectric Strength: 210
One Component Elastomeric System Features Excellent Thermal Conductivity -- X5TC
from Master Bond, Inc.

Elastomeric adhesive system, X5TC delivers thermal conductivity of 10-12 BTU •in/ft2 •hr • °F [1.44-1.73 W/m •K] while maintaining excellent electrical insulation properties. It is well suited for bonding dissimilar substrates and performs well when subjected to thermal... [See More]

  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
  • Chemical System: Elastomeric
  • Type: Thermally Conductive
  • Composition: Unfilled
Dow DOWSIL™ 340 Heat Sink Compound Lubricant/Grease White 382 g Cartridge -- 340 CMPD 382G CART [2653338 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™ 340 Heat Sink Compound White is a one component, non-curing, grease like silicone that is used for thermal coupling of electrical components to heat sinks. It is non-flowing, low bleed, thermally conductive, and has high temperature stability. 382 g Cartridge. [See More]

  • Cure / Technology: Single Component
  • Thermal Conductivity: 0.6700
  • Type: Thermally Conductive
  • Viscosity: 542000
One component primer/adhesive for polyolefins, passes ISO 10993-5 test -- X21Med
from Master Bond, Inc.

Master Bond X21Med is a toughened one part system that can be used for bonding and priming polyolefinic surfaces. This exceptionally low viscosity ( <250 cps) solvent based system is easy to apply and process. It cures at room temperature or more rapidly with the addition of heat. X21Med passes... [See More]

  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
  • Chemical System: Polyolefin
  • Type: Thermally Conductive
  • Composition: Unfilled
Dow DOWSIL™ 340 Heat Sink Compound Lubricant/Grease White 9 kg Pail -- 340 CMPD 9KG PAIL [1608410 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™ 340 Heat Sink Compound White is a one component, grease like silicone that is used for thermal coupling of electrical components to heat sinks. It is non-flowing, non-curing, thermally conductive, low bleed, and has high temperature stability. 9 kg Pail. [See More]

  • Cure / Technology: Single Component
  • Thermal Conductivity: 0.6700
  • Type: Thermally Conductive
  • Dielectric Strength: 210
One Component Thermally Conductive Epoxy Film -- FL901AO
from Master Bond, Inc.

Master Bond Polymer System FL901AO is a one component high performance, thermally conductive, electrically insulative epoxy resin based adhesive film with outstanding performance characteristics. Unlike many other such epoxy film products, it does not require refrigerated storage although this is... [See More]

  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Unfilled
Dow DOWSIL™ SC 102 Thermally Conductive Compound White 1 kg Can -- SC 102 COMP 1KG [2535980 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™ SC 102 Thermally Conductive Compound White is a one component, non-curing, silicone paste that is used to gap fill material between heat sinks and electronic heat sources. It offers low bleed, high temperature stability and thermal conductivity. 1 kg Can. [See More]

  • Cure / Technology: Single Component
  • Thermal Conductivity: 0.8000
  • Type: Thermally Conductive
  • Dielectric Strength: 210
One Component Toughened Epoxy System For Bonding And Sealing -- Supreme 17HT
from Master Bond, Inc.

Master Bond Supreme 17HT is a one component toughened epoxy for bonding and sealing. It has a moderate viscosity system with good flow properties. [See More]

  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Unfilled
Dow DOWSIL™ SE 4486 CV Thermally Conductive Adhesive White 330 mL Cartridge -- SE 4486-USA 330ML CART [4014354 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™ SE 4486 Thermally Conductive Adhesive is a one component, moisture and heat curing, silicone elastomer that is used for potting power supplies, attaching base plates and heat sinks. It offers good dielectric properties, stress relief, wide temperature range, and resistance to... [See More]

  • Cure / Technology: Single Component
  • Thermal Conductivity: 1.53
  • Type: Thermally Conductive
  • Tensile (Break): 551
One Component, High Temperature Resistant Epoxy -- EP36
from Master Bond, Inc.

Master Bond Polymer System EP36 is a unique one component high performance toughened epoxy system for electrical potting, casting, encapsulation, baked coatings and adhesive applications. It features an outstanding combination of properties including high temperature stability up to 500 °F,... [See More]

  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Unfilled
Dow DOWSIL™ SE 9184 Thermally Conductive Adhesive White 75 mL Cartridge -- SE 9184 WHITE RTV 75ML [4026248 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™ SE 9184 White RTV Adhesive is a one component, room temperature curing, silicone adhesive that is used for bonding and thermal transfer for cooling electrical applications. It is non-flowing, tack free, flame resistant, thermally conductive, and has a controlled silicone... [See More]

  • Cure / Technology: Single Component
  • Tensile (Break): 425
  • Type: Thermally Conductive
  • Elongation: 300.0
One component, high temperature resistant epoxy system for bonding and sealing -- EP17HTDA-1
from Master Bond, Inc.

Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for conventional bonding and sealing. This system features an excellent die shear strength of 24-27 kg-f and can be used in a typical die size ranging from 4-400 mm2. EP17HTDA-1 can also be... [See More]

  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Unfilled
Dow DOWSIL™ TC-5622 Thermally Conductive Compound 1 kg -- TC-5622 TC COMPOUND 1KG [4098289 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™ TC-5622 Thermally Conductive Compound Gray is a one component, silicone grease like material with low bleed and high temperature stability. It offers low thermal resistance, solventless formulation, and can be easily applied. 1 kg. [See More]

  • Cure / Technology: Single Component
  • Thermal Conductivity: 4.3
  • Type: Thermally Conductive
  • Viscosity: 95000
Flexible Heat Transfer Compound -- EFS-1
from Thermon, Inc

EFS-1 is a preformed flexible heat transfer compound designed for use between plate-type external heating/ cooling coils and process vessels. Thermon ’s heat transfer compounds provide an efficient thermal connection between the coils and the process equipment. By eliminating the air voids... [See More]

  • Cure / Technology: Single Component
  • Industry: Electric Power; Heating Coil Systems
  • Type: Thermally Conductive
  • Features: Flexible
Aluminum filled epoxy system -- 70-3800R
from Epoxies Etc...

70-3800 is a low viscosity, aluminum filled, epoxy tooling resin. This system is used for making heat resistant cast tools or parts that require very good thermal conductivity. 70-3800 is easily machined, drilled, tapped, or polished, and is ideal for vacuum form molds, dies, drill jigs, injection... [See More]

  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Filled
Electrically Conductive Silicone Adhesive -- SEMICOSIL® 979 EC
from Wacker Chemical Corp.

SEMICOSIL ® 979 EC is a RTV-1 amine cure silicone rubber that cures on contact with moisture in the air. Special features. Low volume resistivity. Thixotropic paste. Solvated. Excellent adhesion to many substrates. Application. SEMICOSIL ® 979 EC is an electrically conductive adhesive for... [See More]

  • Cure / Technology: Thermoset; Single Component; Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing
  • Chemical System: Silicone; Elastomeric
  • Type: Electrically Conductive
  • Form / Shape: Grease, Paste
Thermal Compound -- TC70
from Nordson EFD

Our innovative, non-silicone thermal compounds provide an ideal thermal solution by ensuring reliable heat transfer over a longer time than most industrial thermal interface materials. Conventional, silicone-based heat sink compounds and thermal greases tend to spread after a number of heating and... [See More]

  • Cure / Technology: Single Component
  • Chemical System: Synthetic Based
  • Type: Thermally Conductive
  • Composition: Unfilled
Die Attach Adhesives -- LOCTITE ABLESTIK 84-1LMIT
from Henkel Corporation - Industrial

LOCTITE ABLESTIK 84-1LMIT, Epoxy, Component assembly, Electrically Conductive Adhesive. LOCTITE ® ABLESTIK 84-1LMIT adhesive is designed for medium die attach applications. This adhesive is ideal for application by syringe dispensing or screen printing. Electrically conductive. High thermal... [See More]

  • Cure / Technology: Single Component
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Form / Shape: Paste
Conformal EMI Shielding Material -- LOCTITE ABLESTIK EMI 8660S
from Henkel Corporation - Electronics

With the increasing proliferation of wireless devices, designers are challenged with various electromagnetic waves from multiple sources radiating at the same spectrum of frequencies resulting in electromagnetic interference(EMI). Radio-frequency(RF) emitting devices require effective isolation to... [See More]

  • Cure / Technology: Single Component
  • Form / Shape: Liquid; Encapsulant or Conformal Coating
  • Type: Electrically Conductive
  • Industry: Electronics
CoroBond™ Conductive Vinyl Ester Primer
from Sherwin-Williams Protective & Marine Coatings

CoroBond ™ CONDUCTIVE VINYL ESTER PRIMER is a conductive, elastomer modified epoxy vinyl ester. It is designed to provide superior adhesion to concrete and metal substrates, and resist mechanical stresses such as impact, abrasion, tensile and flexural stress. Excellent chemical resistance. [See More]

  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Elastomer-Modified Epoxy; Epoxy; Alkyd; Vinyl
  • Type: Electrically Conductive
  • Composition: Unfilled
Electro-Conductive Epoxy Adhesive -- ACE-10131
from Protavic America, Inc.

Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for production needs. One... [See More]

  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Epoxy
  • Type: Electrically Conductive; Thermally Conductive
  • Composition: Filled
Adhesive Paste -- No. 19
from Sauereisen, Inc.

Sauereisen Adhesive Paste No. 19 is an inorganic, odorless, nontoxic cement used for bonding glass, porcelain, wood, felt, cork, metals and ceramic fiber. Some typical applications include protection of exposed metal surfaces during heat treating, bonding wallboard to brick or concrete and cementing... [See More]

  • Cure / Technology: Single Component
  • Chemical System: Ceramic
  • Type: Thermally Conductive
  • Composition: Unfilled
High Thermally Conductive Paste -- OMEGATHERM® OT-201 Series
from OMEGA Engineering, Inc.

OMEGATHERM thermal conducting paste is a high temperature and high thermally conductive paste product. They are specially formulated for permanent and temporary bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics,... [See More]

  • Cure / Technology: Single Component
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Form / Shape: Grease, Paste
Heat Transfer Compound -- NH Nonhardening
from Thermon, Inc

NH nonhardening heat transfer compound is used where thermal expansion and contraction could break the bond of a hardened compound. Thermon ’s heat transfer compounds provide an efficient thermal connection between the external heating source and the process equipment. Thermon ’s NH... [See More]

  • Cure / Technology: Single Component
  • Form / Shape: Grease, Paste
  • Type: Thermally Conductive
  • Industry: Electric Power; Heating Coil Systems
Electrically Conductive Flexible Ink -- 40-3920
from Epoxies Etc...

40-3920 is a one component electrically conductive ink. 40-3920 is a silver filled polymer system which exhibits outstanding adhesion to a variety of substrates, such as kapton, mylar, glass, polyester, ceramic, etc. This thick film ink provides excellent conductivity for many electronic... [See More]

  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Filled
Electrically Non-Conductive Adhesives -- LOCTITE ABLESTIK 12-2
from Henkel Corporation - Industrial

LOCTITE ABLESTIK 12-2, Silicone, General Assembly LOCTITE ® ABLESTIK 12-2 adhesive is the lower viscosity version of ABLETHERM 12-1 adhesive. It is designed for bonding applications which require high thermal conductivity and reworkability. Thermally conductive. Reworkable. Unfilled [See More]

  • Cure / Technology: Single Component
  • Chemical System: Silicone
  • Type: Thermally Conductive
Hysol ECCOBOND CE3535 -- 8799539298305
from Henkel Corporation - Electronics

One component epoxy adhesive paste providing high mechanical strength and stable contact resistance on Cu and 100% Sn. [See More]

  • Cure / Technology: Single Component
  • Industry: Electronics
  • Type: Electrically Conductive
  • Viscosity: 50000
Epoxy Adhesive -- ANE-20904
from Protavic America, Inc.

Epoxy system designed for underfill applications. This material is fast flowing and provides excellent properties for common device packaging. [See More]

  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Form / Shape: Die Bonding Adhesives; Liquid
Thermally Conductive Grease -- OT-201 Series
from OMEGA Engineering, Inc.

OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper products. [See More]

  • Cure / Technology: Single Component
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Form / Shape: Grease, Paste
Heat Transfer Compound -- T-85-1
from Thermon, Inc

T-80 and T-85 are low to medium temperature heat transfer compounds for use in moist and corrosive environments. Thermon ’s heat transfer compounds provide an efficient thermal connection between the tracer and the process equipment. By eliminating the air voids that would ordinarily exist,... [See More]

  • Cure / Technology: Single Component
  • Form / Shape: Grease, Paste
  • Type: Thermally Conductive
  • Industry: Corrosive / Moist Environments
Electrically Non-Conductive Adhesives -- LOCTITE ABLESTIK 8-2
from Henkel Corporation - Industrial

LOCTITE ABLESTIK 8-2, Epoxy, Non-conductive Die Attach Adhesive LOCTITE ® ABLESTIK 8-2 non-conductive die attach adhesive is designed for MEMs package applications. Designed as an instrument adhesive, LOCTITE ABLESTIK 8-2 adhesive offers eight times the thermal conductivity of unfilled epoxies. [See More]

  • Cure / Technology: Single Component
  • Chemical System: Epoxy
  • Type: Thermally Conductive
TECHNOMELT PA 2384 -- 8807299842049
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Cure / Technology: Thermoplastic / Hot Melt; Single Component
  • Chemical System: Polyamide
  • Type: Thermally Conductive
  • Form / Shape: Pellets
Epoxy Adhesive -- PNE-30270
from Protavic America, Inc.

A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals. [See More]

  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Epoxy
  • Type: Electrically Conductive; Thermally Conductive
  • Composition: Filled
Thermcoat Cement & Lacquer Kit -- THERMCOAT Series
from OMEGA Engineering, Inc.

OMEGA's THERMCOAT KIT is used for cementing fine-gage thermocouples in place on metal, plastic and ceramic surfaces and for assembling and installing thermopiles, temperature probes and thermocouple bolometers. THERMCOAT CO and THERMCOAT COL This is a fast-setting two-part cement which should be... [See More]

  • Cure / Technology: Thermoset (optional feature); Single Component
  • Chemical System: Ceramic
  • Type: Thermally Conductive
  • Form / Shape: Liquid (optional feature); Powder (optional feature)
Heat Transfer Compound -- TFK-4 SS
from Thermon, Inc

T-99 is a specialty heat transfer compound formulated to provide exceptional thermal stability and superior bonding strength up to 1832 °F (1000 °C). Maximum exposure temperature 1832 °F (1000 °C) [See More]

  • Cure / Technology: Single Component
  • Form / Shape: Grease, Paste
  • Type: Thermally Conductive
  • Industry: Electric Power
Electrically Non-Conductive Adhesives -- LOCTITE ABLESTIK 813J01 BIPAX
from Henkel Corporation - Industrial

LOCTITE ABLESTIK 813J01 BIPAX, Silicone, Non-corrosive, Encapsulant LOCTITE ® ABLESTIK 813J01 BIPAX exhibits very low stress upon cure thus preventing component cracking and other stress-related problems. This adhesive can be cured at room temperature in thick or thin sections. It is... [See More]

  • Cure / Technology: Single Component
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Viscosity: 40000
TECHNOMELT PA 5375
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Cure / Technology: Thermoplastic / Hot Melt; Single Component
  • Chemical System: Polyolefin
  • Type: Thermally Conductive
  • Form / Shape: Pellets
Filled Epoxy Cast -- PNE-20262
from Protavic America, Inc.

Single component resin with very low linear expansion of 10 ppm per degree and high ionic purity for protecting semi-conductor silicon crystals, in particularly BGA. [See More]

  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Filled
SnapTrace® Heat Transfer Compound -- ST-1
from Thermon, Inc

SnapTrace is a preformed flexible heat transfer compound designed for rapid, consistent installation on straight piping runs 1-1/2 inches (38 mm) and larger. Thermon ’s heat transfer compounds provide an efficient thermal connection between the tracer and the process equipment. By eliminating... [See More]

  • Cure / Technology: Single Component
  • Form / Shape: Grease, Paste
  • Type: Electrically Conductive
  • Industry: Electric Power
Encapsulants -- LOCTITE STYCAST 2851FT
from Henkel Corporation - Industrial

LOCTITE STYCAST 2851FT, Epoxy, Encapsulant LOCTITE ® STYCAST 2851FT is recommended for encapsulation of components that require heat dissipation and thermal shock properties . It has a low coefficient of thermal expansion and exhibits excellent resistance to a wide variety of industrial... [See More]

  • Cure / Technology: Single Component
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Thermal Conductivity: 1.36
TECHNOMELT PA 6208 -- 8807692926977
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Cure / Technology: Thermoplastic / Hot Melt; Single Component
  • Chemical System: Polyamide
  • Type: Thermally Conductive
  • Form / Shape: Pellets
Industrial Adhesives -- LOCTITE ABLESTIK ABP 8037TI
from Henkel Corporation - Industrial

LOCTITE ABLESTIK ABP 8037TI, Acrylate, Die Attach, Silver Filled Conductive Adhesive LOCTITE ® ABLESTIK ABP 8037TI silver filled conductive adhesive is recommended for use in the attachment of integrated circuits and components onto metal leadframes and advanced substrates. Excellent electrical... [See More]

  • Cure / Technology: Single Component
  • Form / Shape: Paste
  • Type: Thermally Conductive
  • CTE: 34
TECHNOMELT PA 6208 Black -- 8799566462977
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Cure / Technology: Thermoplastic / Hot Melt; Single Component
  • Chemical System: Polyamide
  • Type: Thermally Conductive
  • Form / Shape: Pellets