Specialty / Other Conductive Compounds

Extremely Compressible Thermal Gap Filler -- SARCON® PG45A
from Fujipoly® America Corp.

Fujipoly ® introduces Sarcon ® PG45A its newest high-performance, putty-like thermal interface material. This extremely low modulus gap filler exhibits a thermal resistance as low as 0.02 °C •in2/W at 43.5 PSI with a thermal conductivity of 4.5 W/m °K. Sarcon ® PG45A... [See More]

  • Type: Thermally Conductive
  • Form / Shape: Putty; Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
  • Gap Fill: 0.0591 to 0.0984
One Component Glob Top Epoxy Meets NASA Low Outgassing Specifications -- EP17HTND-CCM
from Master Bond, Inc.

Master Bond EP17HTND-CCM is a single part, heat cured epoxy system for bonding, sealing and glob top applications. [See More]

  • Type: Thermally Conductive
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Single Component
Complex Thermal Conductive Film -- G566
from Shiu Li Technology Co., Ltd

LiPOLY G566 Graphite Sheet has great thermal conductivity on the X and Y axis. The thermal conductivity is 1700W/m*K. It is flexible, which is suitable for thin products and high capability mobile devices. [See More]

  • Type: Thermally Conductive
  • Form / Shape: Sheet Form, Die-cut Parts
  • Chemical System: Graphite
  • Gap Fill: 8.27E-4
BERGQUIST LIQUI FORM TLF 6000HG, Thermally conductive gel, Pre-cured -- BERGQUIST LIQUI FORM TLF 6000HG
from Henkel Adhesive Technologies - Aviation, Space and Rail

BERGQUIST ® LIQUI FORM TLF 6000HG thermally conductive gel interface material is designed to meet the demanding requirements in certain telecom market applications. Its unique formulation assures a balanced mix of high thermal conductivity, good dispensing efficiency and high thermal... [See More]

  • Type: Thermally Conductive
  • Form / Shape: Paste; Gel
  • Chemical System: Silicone
  • Industry: OEM or Industrial
1015621
from RS Components, Ltd.

Can be used to create a thin, smooth, flexible and adherent film which has a high electrical conductivity. For use in repairing electrical circuits on PCB track or heated rear windscreens, screening plastic housings against high frequency fields, earthing strips, connections to non-solderable... [See More]

  • Type: Electrically Conductive
  • Use Temperature: -112 to 257
  • Form / Shape: Bottle
Thermal Interface Materials -- Thermal Interface Ribbon Kit
from Indium Corporation

The Thermal Interface Ribbon Kit includes 99.99% Indium ribbon that is 1.00" wide x thicknesses of: .002"/.006"/.010" by three feet of each. Also included is the 5RMA flux. [See More]

  • Type: Thermally Conductive
  • Form / Shape: Ribbon
  • Cure / Technology: Solder
  • Industry: Semiconductors, IC's
Thermal - Adhesives, Epoxies, Greases, Pastes -- 1168-1627-ND [TG-NSP25-60 from T-Global Technology Co., Ltd.]
from Digi-Key Electronics

SILICONE FREE THERMAL PUTTY 60CC [See More]

  • Type: Thermally Conductive
  • Use Temperature: -58 to 302
  • Form / Shape: Putty
  • Thermal Conductivity: 2.5
Highly Conformable and Non-Flammable, Higher Thermal interface material -- SARCON® PG80B
from Fujipoly® America Corp.

SARCON® Extremely Compressible Gap Filler Type (Putty Type) is a highly conformable, thermally conductive, non-flammable interface materials. The surface consistency is excellent for filling small air gaps and uneven mating surface, making reliable contact with various shapes and sizes of... [See More]

  • Type: Thermally Conductive
  • Industry: Electronics; Semiconductors, IC's
  • Form / Shape: Putty; Gap Filler, Foam in Place Gasket
  • Use Temperature: -40 to 302
One Component Liquid Epoxy Resin EP36CLV -- EP36CLV
from Master Bond, Inc.

Master Bond EP36CLV is a unique one component, high performance epoxy for bonding, sealing, potting and coating featuring electrical insulation, high temperature resistance and exceptionally low viscosity. It varies appreciably from other heat resistant epoxies in that it has far more toughness and... [See More]

  • Type: Electrically Conductive
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Single Component
Complex Thermal Conductive Film -- TR332CU
from Shiu Li Technology Co., Ltd

LiPOLY TR332CU has outstanding parallel thermal conduction and has high flexibility, which is suitable for thin products like mobile devices. [See More]

  • Type: Thermally Conductive
  • Form / Shape: Sheet Form, Die-cut Parts
  • Chemical System: Graphite, Copper, Acrylic
  • Gap Fill: 0.0039 to 0.0059
1181368
from RS Components, Ltd.

A heat curable, one part thixotropic adhesive for use in holding components in place during soldering operations of surface mount assemblies. High uncured green strength and fast cure cycle with medium bond strength. Thixotropic properties give high dot profile. Excellent mechanical strength. Not... [See More]

  • Type: Thermally Conductive
  • Use Temperature: -40 to 266
  • Form / Shape: Syringe
  • Thermal Conductivity: 0.2500 to 0.3000
Thermal - Adhesives, Epoxies, Greases, Pastes -- 1168-2098-ND [TG-NSP35-4OZ from T-Global Technology Co., Ltd.]
from Digi-Key Electronics

THERMAL NON-SILICONE PUTTY 4OZ [See More]

  • Type: Thermally Conductive
  • Use Temperature: -40 to 392
  • Form / Shape: Putty
  • Thermal Conductivity: 3.5
Highly Thermal Conductive and Non-Flammable Silicone Putty Sheet -- SARCON ® XR-Um
from Fujipoly® America Corp.

Sarcon ® XR-Um is the highest thermal conductive putty type silicone sheet. Putty nature greatly contributes to reduction of contact resistance and consequently to lowest thermal resistance, and it is customer friendly material due to its easy applying by printing. Putty nature enables low... [See More]

  • Type: Thermally Conductive
  • Form / Shape: Putty; Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
  • Gap Fill: 0.0087 to 0.0197
One component primer/adhesive for polyolefins, passes ISO 10993-5 test -- X21Med
from Master Bond, Inc.

Master Bond X21Med is a toughened one part system that can be used for bonding and priming polyolefinic surfaces. This exceptionally low viscosity ( <250 cps) solvent based system is easy to apply and process. It cures at room temperature or more rapidly with the addition of heat. X21Med passes... [See More]

  • Type: Thermally Conductive
  • Composition: Unfilled
  • Chemical System: Polyolefin
  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
High Insulating Thermal Conductive Pad/Film -- PR27
from Shiu Li Technology Co., Ltd

LiPOLY PR27 is a very thin high insulator with a thickness of 0.15mm. It uses Polyimide Film as the reinforcement material, which can increase the tensile strength. It has great dielectric strength and can withstand 12K voltages. It ’s suitable for high power transistors, electrical equipment,... [See More]

  • Type: Thermally Conductive
  • Form / Shape: Sheet Form, Die-cut Parts
  • Chemical System: Silicone
  • Gap Fill: 0.0059
1558320
from RS Components, Ltd.

Two part, metal oxide loaded, thermal bonding system. Can be used to bond heat sinks assemblies in piggy back arrangements, assembly of complex heat sink and as a bonding medium in surface mounting assemblies. Excellent electrical insulation properties. Solvent free system ensures that mated... [See More]

  • Type: Thermally Conductive
  • Use Temperature: -40 to 248
  • Form / Shape: Syringe
  • Thermal Conductivity: 1.1
Thermal - Adhesives, Epoxies, Greases, Pastes -- 1168-2099-ND [TG-NSP35-1LB from T-Global Technology Co., Ltd.]
from Digi-Key Electronics

THERMAL NON-SILICONE PUTTY 1LB [See More]

  • Type: Thermally Conductive
  • Use Temperature: -40 to 392
  • Form / Shape: Putty
  • Thermal Conductivity: 3.5
One Part, Thermally Conductive, Heat Resistant Epoxy -- EP36AO
from Master Bond, Inc.

Master Bond Polymer System EP36AO is a truly unique one component high performance flexibilized epoxy system for electrical potting and encapsulation, baked coatings and adhesive applications. It features an outstanding combination of properties including high temperature stability up to 500 °F,... [See More]

  • Type: Electrically Conductive
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Single Component
High Insulating Thermal Conductive Pad/Film -- SH1500/2000/3000
from Shiu Li Technology Co., Ltd

LiPOLY ’s thermal insulator SH1500/2000/3000 uses fiberglass cloth as a reinforcement material, combined with thermal conductive silicon, giving it high thermal conduction and great compression strength. The thermal conductivity is 1.5/2.0/3.0 W/m*K, the thickness is 0.23~0.35mm. Its high... [See More]

  • Type: Thermally Conductive
  • Form / Shape: Sheet Form, Die-cut Parts
  • Chemical System: Silicone
  • Gap Fill: 0.0091 to 0.0138
1863593
from RS Components, Ltd.

A silver-loaded conductive paint, which can be used for producing or repairing PCB track. The paint can be used for various applications including to paint-on an electrical screen, or to make electrical connections to non-solder able surfaces. This conductive adhesive is simple to apply with a brush... [See More]

  • Type: Electrically Conductive
  • Form / Shape: Bottle
Thermal - Adhesives, Epoxies, Greases, Pastes -- 1168-2114-ND [TG-NSP-60 1OZ from T-Global Technology Co., Ltd.]
from Digi-Key Electronics

NON-SILICONE PUTTY 6 W/MK 1OZ [See More]

  • Type: Thermally Conductive
  • Use Temperature: -67 to 392
  • Form / Shape: Putty
  • Thermal Conductivity: 5.9
Non-Silicone Thermal Conductive Pad -- N700A
from Shiu Li Technology Co., Ltd

LiPOLY Non-Silicone Thermal Compound N700A/B is made of non-silicon resin material and none low-molecular-weight siloxane. N700A/B helps avoid electrical contact problems. N700 is flexible and has great thermal conduction, making the thermal resistance as low as possible. The thermal conductivity is... [See More]

  • Type: Thermally Conductive
  • Form / Shape: Sheet Form, Die-cut Parts
  • Chemical System: Non-Silicone
  • Gap Fill: 0.0197 to 0.1969
1863600
from RS Components, Ltd.

A silver-loaded conductive paint, which can be used for producing or repairing PCB track. The paint can be used for various applications including to paint-on an electrical screen, or to make electrical connections to non-solder able surfaces. This conductive adhesive is simple to apply with a brush... [See More]

  • Type: Electrically Conductive
  • Form / Shape: Bottle
Thermal - Adhesives, Epoxies, Greases, Pastes -- 1168-2115-ND [TG-NSP-60 4OZ from T-Global Technology Co., Ltd.]
from Digi-Key Electronics

NON-SILICONE PUTTY 6 W/MK 4OZ [See More]

  • Type: Thermally Conductive
  • Use Temperature: -67 to 392
  • Form / Shape: Putty
  • Thermal Conductivity: 5.9
Thermal Conductive Absorber Pad -- AEM83A/B
from Shiu Li Technology Co., Ltd

LiPOLY AEM83 is an absorber pad, which is made of soft magnetic material and polymer resin. It can transfer electromagnetic radiation to thermal energy and lose it quickly. [See More]

  • Type: Thermally Conductive
  • Form / Shape: Sheet Form, Die-cut Parts
  • Chemical System: Silicone
  • Gap Fill: 0.0031 to 0.0197
1863616
from RS Components, Ltd.

The silver loaded epoxy is a 2 part thermosetting material with an epoxy resin adhesive base which contains silver flakes. All models are highly reliable and excellent quality. Suitable for use with most plastics, ceramics, wood, metal, glass and graphite. Typical applications: as a replacement for... [See More]

  • Type: Electrically Conductive
  • Use Temperature: -67 to 302
  • Form / Shape: Vial
  • Thermal Conductivity: 11
Thermal - Adhesives, Epoxies, Greases, Pastes -- 1168-2116-ND [TG-NSP-60 1LB from T-Global Technology Co., Ltd.]
from Digi-Key Electronics

NON-SILICONE PUTTY 6 W/MK 1LB [See More]

  • Type: Thermally Conductive
  • Use Temperature: -67 to 392
  • Form / Shape: Putty
  • Thermal Conductivity: 5.9
Thermal Conductive Absorber Pad -- DTT44-5G
from Shiu Li Technology Co., Ltd

LiPOLY DTT44 is a soft thermally conductive gel pad specifically designed for networking applications. DTT44 is designed to focus on Dk and Df to reduce interference in RF modules. DTT44 has a thermal conductivity of 3.0 W/m*K. This product can be supplied as standard sheets, custom die-cuts or... [See More]

  • Type: Thermally Conductive
  • Form / Shape: Sheet Form, Die-cut Parts
  • Chemical System: Silicone
  • Gap Fill: 0.0197 to 0.1969
3217295 [CW2200STP from ITW Chemtronics]
from RS Components, Ltd.

The pen contains a silver loaded polymer which can be used to repair faulty tracks, link components, make smooth jumpers and shield delicate electronics. Easy to make instant conductive silver traces. Can be used on both rigid and flexible materials, including key pads, circuit film, glass and... [See More]

  • Type: Electrically Conductive
  • Form / Shape: Pen
Thermal - Adhesives, Epoxies, Greases, Pastes -- 1168-TG-A4040-60-60-0.0-ND [TG-A4040-60-60-0.0 from T-Global Technology Co., Ltd.]
from Digi-Key Electronics

SILICONE THERMAL PUTTY 60CC [See More]

  • Type: Thermally Conductive
  • Use Temperature: -58 to 356
  • Form / Shape: Putty
  • Thermal Conductivity: 3
Thermal Conductive Absorber Pad -- DTT65-5G
from Shiu Li Technology Co., Ltd

LiPOLY DTT65 is a soft thermally conductive gel pad specifically designed for networking applications. DTT65 is designed to focus on Dk and Df to reduce interference in RF modules. DTT65 has a thermal conductivity of 5.0 W/m*K. This product can be supplied as standard sheets, custom die-cuts or... [See More]

  • Type: Thermally Conductive
  • Form / Shape: Sheet Form, Die-cut Parts
  • Chemical System: Silicone
  • Gap Fill: 0.0197 to 0.1969
3888673 [CW2605 from ITW Chemtronics]
from RS Components, Ltd.

Permanent conductive silver/carbon coating for use in the repair of flexible rubber keypads, restores electrical conductivity to the worn carbon contacts,Can be used on virtually any rubber keypad, ideal for telephone keypads,Provides wear resistant coating which in tests has withstood over 500000... [See More]

  • Type: Electrically Conductive
  • Form / Shape: Kit
Thermal - Adhesives, Epoxies, Greases, Pastes -- 1168-TG-NSP35-30CC-ND [TG-NSP35-30CC from T-Global Technology Co., Ltd.]
from Digi-Key Electronics

NON-SILICONE PUTTY 30CC GREY [See More]

  • Type: Thermally Conductive
  • Use Temperature: -40 to 392
  • Form / Shape: Putty
  • Thermal Conductivity: 3.5
Thermal Conductive Absorber Pad -- TEM96B
from Shiu Li Technology Co., Ltd

LiPOLY TEM96B is a thermally conductive absorber based upon soft magnetic materials dispersed in a polymeric resin. It has a thermal conductivity of 3.0 W/m*K and dissipates electromagnetic radiation rapidly to mitigate against EMI issues. [See More]

  • Type: Thermally Conductive
  • Form / Shape: Sheet Form, Die-cut Parts
  • Chemical System: Silicone
  • Gap Fill: 0.0197 to 0.1969
458783
from RS Components, Ltd.

These non-corrosive, 1-part, room temperature vulcanising (RTV) silicone rubbers are part of a new family of acetone cure sealants that are solvent free. They are suitable for a wide range of bonding and sealing applications particularly in the electronics industries. They exhibit excellent... [See More]

  • Type: Thermally Conductive
  • Use Temperature: -58 to 428
  • Form / Shape: Cartridge
  • Thermal Conductivity: 1.55
Thermal - Adhesives, Epoxies, Greases, Pastes -- 1168-TG-NSP35LV-1LB-ND [TG-NSP35LV-1LB from T-Global Technology Co., Ltd.]
from Digi-Key Electronics

NON-SILICONE THERMAL PUTTY 1LB L [See More]

  • Type: Thermally Conductive
  • Use Temperature: -40 to 392
  • Form / Shape: Putty
  • Thermal Conductivity: 3.5
Thermal Conductive Pad -- BS75K
from Shiu Li Technology Co., Ltd

LiPOLY BS75K is a soft thermally conductive gap filler. With a thermal conductivity of 3.0 W/m*K and a low thermal impedance, BS75K is suitable for a wide range of applications. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for a wide... [See More]

  • Type: Thermally Conductive
  • Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
  • Gap Fill: 0.0197 to 0.1969
495228 [142501 from Henkel Corporation - Industrial]
from RS Components, Ltd.

Thermally conductive adhesive for bonding transistors to heat sinks and heat sinks to boards. Kit includes 25ml syringe and 18ml activator. Type = Thermal Conductive Adhesive. Product Material = Acrylic. Package Type = Bottle, Syringe. Package Size = 18 ml, 25 ml. Thermal Conductivity = 0.815W/mK. [See More]

  • Type: Thermally Conductive
  • Use Temperature: -67 to 302
  • Form / Shape: Bottle, Syringe
  • Thermal Conductivity: 0.8150
Thermal - Adhesives, Epoxies, Greases, Pastes -- 1168-TG-NSP35LV-30CC-ND [TG-NSP35LV-30CC from T-Global Technology Co., Ltd.]
from Digi-Key Electronics

NON-SILICONE THERMAL PUTTY 30CC [See More]

  • Type: Thermally Conductive
  • Use Temperature: -40 to 392
  • Form / Shape: Putty
  • Thermal Conductivity: 3.5
Thermal Conductive Pad -- BS87
from Shiu Li Technology Co., Ltd

LiPOLY BS87 is an ultra-soft thermally conductive gel pad with a thermal conductivity of 3.0 W/m*K. BS87 offers excellent compression under minimal force with high recovery characteristics. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for... [See More]

  • Type: Thermally Conductive
  • Form / Shape: Sheet Form, Die-cut Parts
  • Chemical System: Silicone
  • Gap Fill: 0.0197 to 0.1969
496243 [CW2200MTP from ITW Chemtronics]
from RS Components, Ltd.

The pen contains a silver loaded polymer which can be used to repair faulty tracks, link components, make smooth jumpers and shield delicate electronics. Easy to make instant conductive silver traces. Can be used on both rigid and flexible materials, including key pads, circuit film, glass and... [See More]

  • Type: Electrically Conductive
  • Form / Shape: Pen
Thermal - Adhesives, Epoxies, Greases, Pastes -- 1168-TG-NSP35LV-4OZ-ND [TG-NSP35LV-4OZ from T-Global Technology Co., Ltd.]
from Digi-Key Electronics

NON-SILICONE THERMAL PUTTY 4OZ L [See More]

  • Type: Thermally Conductive
  • Use Temperature: -40 to 392
  • Form / Shape: Putty
  • Thermal Conductivity: 3.5
Thermal Conductive Pad -- PK223
from Shiu Li Technology Co., Ltd

LiPOLY ’s PK223 is a material designed for gap filling. The thermal conductivity is 2.0W/m*K. The hardness is Shore 00/30 with high flexibility, high compressibility, highly insulating, great self-adhesive, which can cover the tolerance of design making it very stable. It also offers... [See More]

  • Type: Thermally Conductive
  • Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
  • Gap Fill: 0.0197 to 0.3937
496265 [CW2400 from ITW Chemtronics]
from RS Components, Ltd.

A 2 part electrically conductive silver epoxy for general purpose prototype, repair and rework applications. This epoxy resin adhesive is incredibly strong and quick to cure, saving you time when you need a secure bond that is quick to set. With excellent electrical conductivity, it makes a great... [See More]

  • Type: Electrically Conductive
  • Form / Shape: Tube
Thermal - Adhesives, Epoxies, Greases, Pastes -- 1168-TG-NSP50-1LB-ND [TG-NSP50-1LB from T-Global Technology Co., Ltd.]
from Digi-Key Electronics

NON-SILICONE THERMAL PUTTY 1LB D [See More]

  • Type: Thermally Conductive
  • Use Temperature: -40 to 392
  • Form / Shape: Putty
  • Thermal Conductivity: 5.4
Thermal Conductive Pad -- PK404
from Shiu Li Technology Co., Ltd

LiPOLY ’s PK404 is a material designed for gap filling. The thermal conductivity is 4.0W/m*K. The hardness is Shore 00/40 with high flexibility, high compressibility, highly insulating, great self-adhesive, which can cover the tolerance of design making it very stable. It also offers... [See More]

  • Type: Thermally Conductive
  • Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
  • Gap Fill: 0.0197 to 0.3937
503357
from RS Components, Ltd.

Two metal oxide filled pastes combining the properties of high thermal conductivity and high insulation resistance. This thermal grease adhesive provides an excellent heat transfer between semiconductor devices and heat sinks. Both improve electrical isolation when used in the normal way with... [See More]

  • Type: Thermally Conductive
  • Use Temperature: -40 to 266
  • Form / Shape: Syringe
  • Thermal Conductivity: 0.6500
Thermal - Adhesives, Epoxies, Greases, Pastes -- 1168-TG-NSP50-4OZ-ND [TG-NSP50-4OZ from T-Global Technology Co., Ltd.]
from Digi-Key Electronics

NON-SILICONE THERMAL PUTTY 4OZ D [See More]

  • Type: Thermally Conductive
  • Use Temperature: -40 to 392
  • Form / Shape: Putty
  • Thermal Conductivity: 5.4
Sputtering Targets -- Silver Epoxy Bonding Cement
from Materion Corporation

Materion Advanced Chemicals silver-filled epoxy cement contains the optimum ratio of silver powder to epoxy resin. This silver-colored thick paste offers maximum thermal and electrical conductivity and mechanical strength. [See More]

  • Type: Electrically Conductive
  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Form / Shape: Resin; Die Bonding Adhesives; Powder
Die Attach Adhesives -- LOCTITE ABLESTIK 84-1LMIT
from Henkel Corporation - Industrial

LOCTITE ABLESTIK 84-1LMIT, Epoxy, Component assembly, Electrically Conductive Adhesive. LOCTITE ® ABLESTIK 84-1LMIT adhesive is designed for medium die attach applications. This adhesive is ideal for application by syringe dispensing or screen printing. Electrically conductive. High thermal... [See More]

  • Type: Thermally Conductive
  • Cure / Technology: Single Component
  • Chemical System: Epoxy
  • Form / Shape: Paste
ACHESON ELECTRODAG 5915 -- 8799582519297
from Henkel Corporation - Electronics

ACHESON ELECTRODAG 5915 is a one component, fast cure, electrically conductive isotropic ink designed for bonding surface mount devices to flexible or rigid printed circuits. [See More]

  • Type: Electrically Conductive
  • Viscosity: 120000
  • Industry: Electronics
Electrically Non-Conductive Adhesives -- LOCTITE ABLESTIK 872-7TN1
from Henkel Corporation - Industrial

LOCTITE ABLESTIK 872-7TN1, Epoxy, Non-conductive adhesive LOCTITE ® ABLESTIK 872-7TN1 is ideal for electronic applications requiring stress relief. Flexible. Thixotropic. High viscosity. Long work life. Easy handling. High thermal conductivity. Reduced stress [See More]

  • Type: Thermally Conductive
  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Form / Shape: Paste
Industrial Adhesives -- LOCTITE ABLESTIK ABP 8037TI
from Henkel Corporation - Industrial

LOCTITE ABLESTIK ABP 8037TI, Acrylate, Die Attach, Silver Filled Conductive Adhesive LOCTITE ® ABLESTIK ABP 8037TI silver filled conductive adhesive is recommended for use in the attachment of integrated circuits and components onto metal leadframes and advanced substrates. Excellent electrical... [See More]

  • Type: Thermally Conductive
  • Form / Shape: Paste
  • Cure / Technology: Single Component
  • CTE: 34