Specialty / Other Conductive Compounds
from Fujipoly® America Corp.
Fujipoly ® introduces Sarcon ® PG45A its newest high-performance, putty-like thermal interface material. This extremely low modulus gap filler exhibits a thermal resistance as low as 0.02 °C •in2/W at 43.5 PSI with a thermal conductivity of 4.5 W/m °K. Sarcon ® PG45A... [See More]
- Type: Thermally Conductive
- Form / Shape: Putty; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Gap Fill: 0.0591 to 0.0984
from RS Components, Ltd.
Loctite Circuit+ el conductive paint 2ml [See More]
- Type: Thermally Conductive
- Industry: Thermal Management
- Form / Shape: Bottle
from Master Bond, Inc.
Master Bond EP17HTND-CCM is a single part, heat cured epoxy system for bonding, sealing and glob top applications. [See More]
- Type: Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Thermon, Inc
SnapTrace is a preformed flexible heat transfer compound designed for rapid, consistent installation over steam trace tubing on straight piping. SnapTrace also includes TFK channel, providing mechanical and weather protection to the installation. Thermon's heat transfer compounds provide an... [See More]
- Type: Thermally Conductive
- Use Temperature: 14 to 450
- Form / Shape: 4ft Lengths; Gap Filler, Foam in Place Gasket
- Thermal Conductivity: 34.61 to 69.23
from Quantaflex Printed Electronics Inc.
A high level of custom engineering and problem solving. Designing electrical shielding components requires a high level of custom engineering and problem solving. Nothing should be left to chance because the goal is to create a part that protects the electronic device (and your customers) from the... [See More]
- Type: Thermally Conductive
- Industry: Electronics; Semiconductors, IC's
- Form / Shape: Foam; Gap Filler, Foam in Place Gasket; Liquid
- Features: EMI/RFI Shielding
from Fujipoly® America Corp.
SARCON ® PG130A from Fujipoly ® is one of the industry ’s newest high-performance thermal interface materials that is extremely compressible. This double-sticky surface TIM is a great choice for applications that have delicate or wide-variation component heights and require extremely... [See More]
- Type: Thermally Conductive
- Gap Fill: 0.0118 to 0.0787
- Form / Shape: Putty; Gap Filler, Foam in Place Gasket
- Industry: Electronics; Semiconductors, IC's
from RS Components, Ltd.
Fact cure thermally conductive aghesive [See More]
- Type: Thermally Conductive
- Industry: Thermal Management
- Form / Shape: Dual Cartridge; Liquid
from Master Bond, Inc.
Master Bond EP36CLV is a unique one component, high performance epoxy for bonding, sealing, potting and coating featuring electrical insulation, high temperature resistance and exceptionally low viscosity. It varies appreciably from other heat resistant epoxies in that it has far more toughness and... [See More]
- Type: Electrically Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Fujipoly® America Corp.
SARCON® Extremely Compressible Gap Filler Type (Putty Type) is a highly conformable, thermally conductive, non-flammable interface materials. The surface consistency is excellent for filling small air gaps and uneven mating surface, making reliable contact with various shapes and sizes of... [See More]
- Type: Thermally Conductive
- Industry: Electronics; Semiconductors, IC's
- Form / Shape: Putty; Gap Filler, Foam in Place Gasket
- Use Temperature: -40 to 302
from RS Components, Ltd.
Fact cure thermally conductive aghesive [See More]
- Type: Thermally Conductive
- Industry: Thermal Management
- Form / Shape: Dual Cartridge; Liquid
from Master Bond, Inc.
Master Bond X21Med is a toughened one part system that can be used for bonding and priming polyolefinic surfaces. This exceptionally low viscosity ( <250 cps) solvent based system is easy to apply and process. It cures at room temperature or more rapidly with the addition of heat. X21Med passes... [See More]
- Type: Thermally Conductive
- Composition: Unfilled
- Chemical System: Polyolefin
- Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
from Fujipoly® America Corp.
SARCON ® Silicone Putty is a highly conformable, thermally conductive, non-flammable interface materials. The surface consistency is excellent for filling small air gaps and uneven mating surface, making reliable contact with various shapes and sizes of components. [See More]
- Type: Thermally Conductive
- Form / Shape: Putty; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Gap Fill: 0.0394 to 0.0787
from RS Components, Ltd.
Slow cure thermally conductive aghesive [See More]
- Type: Thermally Conductive
- Industry: Thermal Management
- Form / Shape: Dual Cartridge; Liquid
from Master Bond, Inc.
Master Bond Polymer System EP36AO is a truly unique one component high performance flexible epoxy system for electrical potting and encapsulation, baked coatings and adhesive applications. It features an outstanding combination of properties including high temperature stability up to 500 °F,... [See More]
- Type: Electrically Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Fujipoly® America Corp.
SARCON ® PG65A from Fujipoly ® is one of the industry ’s newest high-performance thermal interface materials that is extremely compressible. This double-sticky surface TIM is a great choice for applications that have delicate or wide-variation component heights and require extremely... [See More]
- Type: Thermally Conductive
- Form / Shape: Putty; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Industry: Aerospace; Automotive; Electronics; OEM or Industrial
from RS Components, Ltd.
Slow cure thermally conductive aghesive [See More]
- Type: Thermally Conductive
- Industry: Thermal Management
- Form / Shape: Dual Cartridge; Liquid
from RS Components, Ltd.
Silver loaded epoxy adhesive,10gm 2 vial [See More]
- Type: Thermally Conductive
- Industry: Thermal Management
- Form / Shape: Can; Liquid
- Use Temperature: 302
from RS Components, Ltd.
DP810 LWODR ACR ADH GN 400 mL CAR 6 /CV [See More]
- Type: Thermally Conductive
- Industry: OEM or Industrial; Industrial, Thermal Management
- Form / Shape: Dual Cartridge; Liquid
from RS Components, Ltd.
Silicone heat transfer compound HTSP 50T [See More]
- Type: Thermally Conductive
- Form / Shape: Tube
- Chemical System: Silicone
- Industry: Thermal Management
from RS Components, Ltd.
TECBOND 280 Trans Yellow glue stick 5kg [See More]
- Type: Thermally Conductive
- Industry: Bonding
- Form / Shape: Stick
from RS Components, Ltd.
TECBOND LM41 White glue sticks [See More]
- Type: Thermally Conductive
- Form / Shape: Stick
from RS Components, Ltd.
DP760 high temp epoxy adhesive,50ml [See More]
- Type: Thermally Conductive
- Industry: Thermal Management
- Form / Shape: Dual Cartridge; Liquid
from RS Components, Ltd.
AS1803 Silicone Adhesive 310 ml Cart [See More]
- Type: Thermally Conductive
- Industry: Thermal Management
- Form / Shape: Cartridge
- Use Temperature: 428
from Shiu Li Technology Co., Ltd
LiPOLY DTT44 is a soft thermally conductive gel pad specifically designed for networking applications. DTT44 is designed to focus on Dk and Df to reduce interference in RF modules. DTT44 has a thermal conductivity of 3.0 W/m*K. This product can be supplied as standard sheets, custom die-cuts or... [See More]
- Type: Thermally Conductive
- Form / Shape: Sheet Form, Die-cut Parts
- Chemical System: Silicone
- Gap Fill: 0.0197 to 0.1969
from Indium Corporation
The Thermal Interface Ribbon Kit includes 99.99% Indium ribbon that is 1.00" wide x thicknesses of: .002"/.006"/.010" by three feet of each. Also included is the 5RMA flux. [See More]
- Type: Thermally Conductive
- Form / Shape: Ribbon
- Cure / Technology: Solder
- Industry: Semiconductors, IC's
from Materion Corporation
Materion Advanced Chemicals silver-filled epoxy cement contains the optimum ratio of silver powder to epoxy resin. This silver-colored thick paste offers maximum thermal and electrical conductivity and mechanical strength. [See More]
- Type: Electrically Conductive
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Form / Shape: Resin; Die Bonding Adhesives; Powder
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 84-1LMIT, Epoxy, Component assembly, Electrically Conductive Adhesive. LOCTITE ® ABLESTIK 84-1LMIT adhesive is designed for medium die attach applications. This adhesive is ideal for application by syringe dispensing or screen printing. Electrically conductive. High thermal... [See More]
- Type: Thermally Conductive
- Cure / Technology: Single Component
- Chemical System: Epoxy
- Form / Shape: Paste
from Henkel Corporation - Electronics
ACHESON ELECTRODAG 5915 is a one component, fast cure, electrically conductive isotropic ink designed for bonding surface mount devices to flexible or rigid printed circuits. [See More]
- Type: Electrically Conductive
- Viscosity: 120000
- Industry: Electronics
from Henkel Adhesive Technologies - Aviation, Space and Rail
BERGQUIST ® LIQUI FORM TLF 6000HG thermally conductive gel interface material is designed to meet the demanding requirements in certain telecom market applications. Its unique formulation assures a balanced mix of high thermal conductivity, good dispensing efficiency and high thermal... [See More]
- Type: Thermally Conductive
- Form / Shape: Paste; Gel
- Chemical System: Silicone
- Industry: OEM or Industrial
from Shiu Li Technology Co., Ltd
LiPOLY DTT65 is a soft thermally conductive gel pad specifically designed for networking applications. DTT65 is designed to focus on Dk and Df to reduce interference in RF modules. DTT65 has a thermal conductivity of 5.0 W/m*K. This product can be supplied as standard sheets, custom die-cuts or... [See More]
- Type: Thermally Conductive
- Form / Shape: Sheet Form, Die-cut Parts
- Chemical System: Silicone
- Gap Fill: 0.0197 to 0.1969
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 872-7TN1, Epoxy, Non-conductive adhesive LOCTITE ® ABLESTIK 872-7TN1 is ideal for electronic applications requiring stress relief. Flexible. Thixotropic. High viscosity. Long work life. Easy handling. High thermal conductivity. Reduced stress [See More]
- Type: Thermally Conductive
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Form / Shape: Paste
from Shiu Li Technology Co., Ltd
LiPOLY G566 Graphite Sheet has great thermal conductivity on the X and Y axis. The thermal conductivity is 1700W/m*K. It is flexible, which is suitable for thin products and high capability mobile devices. [See More]
- Type: Thermally Conductive
- Form / Shape: Sheet Form, Die-cut Parts
- Chemical System: Graphite
- Gap Fill: 8.27E-4
from Henkel Corporation - Industrial
LOCTITE ABLESTIK ABP 8037TI, Acrylate, Die Attach, Silver Filled Conductive Adhesive LOCTITE ® ABLESTIK ABP 8037TI silver filled conductive adhesive is recommended for use in the attachment of integrated circuits and components onto metal leadframes and advanced substrates. Excellent electrical... [See More]
- Type: Thermally Conductive
- Form / Shape: Paste
- Cure / Technology: Single Component
- CTE: 34
from Shiu Li Technology Co., Ltd
LiPOLY TR332CU has outstanding parallel thermal conduction and has high flexibility, which is suitable for thin products like mobile devices. [See More]
- Type: Thermally Conductive
- Form / Shape: Sheet Form, Die-cut Parts
- Chemical System: Graphite, Copper, Acrylic
- Gap Fill: 0.0039 to 0.0059
from Shiu Li Technology Co., Ltd
LiPOLY BS75K is a soft thermally conductive gap filler. With a thermal conductivity of 3.0 W/m*K and a low thermal impedance, BS75K is suitable for a wide range of applications. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for a wide... [See More]
- Type: Thermally Conductive
- Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Gap Fill: 0.0197 to 0.1969
from Shiu Li Technology Co., Ltd
LiPOLY BS87 is an ultra-soft thermally conductive gel pad with a thermal conductivity of 3.0 W/m*K. BS87 offers excellent compression under minimal force with high recovery characteristics. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for... [See More]
- Type: Thermally Conductive
- Form / Shape: Sheet Form, Die-cut Parts
- Chemical System: Silicone
- Gap Fill: 0.0197 to 0.1969
from Shiu Li Technology Co., Ltd
LiPOLY ’s S282 is a thermally conductive pad designed for gap filling. The thermal conductivity is 1.7 W/m*K. It uses fiberglass cloth as the reinforcement material with great self-adhesive that can fit closely with non-flat heat sinks to increase the contact area. The low stress damped... [See More]
- Type: Thermally Conductive
- Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Gap Fill: 0.0197 to 0.1969
from Shiu Li Technology Co., Ltd
LiPOLY S393 is a product with high ductile thermal conductivity. Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material. It won't easy to break and deformwhether stamped, punched, strip type, or custom cutting. Your best choice... [See More]
- Type: Thermally Conductive
- Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Gap Fill: 0.0197 to 0.3937
from Shiu Li Technology Co., Ltd
LiPOLY S818 is a product with high ductile thermal conductivity.Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material.It won't easy to break and deform whether stamped, punched, strip type, or custom cutting. Your best choice... [See More]
- Type: Thermally Conductive
- Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Gap Fill: 0.0197 to 0.3937
from Shiu Li Technology Co., Ltd
LiPOLY DCTP140-s is a thermal insulator uses fiberglass cloth as a reinforcement material, combined with thermal conductive silicon, giving it high thermal conduction and great compression strength. The thermal conductivity is 4.5 W/m*K, the thickness is 0.25~0.45mm. Its high insulation and... [See More]
- Type: Thermally Conductive
- Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Gap Fill: 0.0098 to 0.0177
from Shiu Li Technology Co., Ltd
LiPOLY PR27 is a very thin high insulator with a thickness of 0.15mm. It uses Polyimide Film as the reinforcement material, which can increase the tensile strength. It has great dielectric strength and can withstand 12K voltages. It ’s suitable for high power transistors, electrical equipment,... [See More]
- Type: Thermally Conductive
- Form / Shape: Sheet Form, Die-cut Parts
- Chemical System: Silicone
- Gap Fill: 0.0059
from Shiu Li Technology Co., Ltd
LiPOLY ’s thermal insulator SH1500/2000/3000 uses fiberglass cloth as a reinforcement material, combined with thermal conductive silicon, giving it high thermal conduction and great compression strength. The thermal conductivity is 1.5/2.0/3.0 W/m*K, the thickness is 0.23~0.35mm. Its high... [See More]
- Type: Thermally Conductive
- Form / Shape: Sheet Form, Die-cut Parts
- Chemical System: Silicone
- Gap Fill: 0.0091 to 0.0138