Conformal / Encapsulating Coating Conductive Compounds
from Master Bond, Inc.
EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]
- Form / Shape: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
- Chemical System: Epoxy
- Type: Thermally Conductive
- Composition: Unfilled
from Master Bond, Inc.
One part, nanosilica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]
- Form / Shape: Liquid; Encapsulant or Conformal Coating
- Chemical System: UV Curing
- Type: Thermally Conductive
- Composition: Filled
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Form / Shape: Gap Filler, Foam in Place Gasket; Grease, Paste; Encapsulant or Conformal Coating
- Chemical System: Silicone
- Type: Electrically Conductive; Thermally Conductive
- Composition: Filled
from Master Bond, Inc.
EP35SP is a two component epoxy system specially formulated to resist high temperatures and aggressive chemicals. It has a paste viscosity with little to no flow when curing. [See More]
- Form / Shape: Encapsulant or Conformal Coating
- Chemical System: Epoxy
- Type: Thermally Conductive
- Composition: Unfilled
from Master Bond, Inc.
EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]
- Form / Shape: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
- Chemical System: Epoxy
- Type: Thermally Conductive
- Composition: Unfilled
from Master Bond, Inc.
EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]
- Form / Shape: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
- Chemical System: Epoxy
- Type: Thermally Conductive
- Composition: Unfilled
from Master Bond, Inc.
Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]
- Form / Shape: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Unfilled
from Master Bond, Inc.
Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]
- Form / Shape: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
- Chemical System: Epoxy
- Type: Thermally Conductive
- Composition: Unfilled
from Master Bond, Inc.
Master Bond EP30NS is a nanosilica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]
- Form / Shape: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
- Chemical System: Epoxy
- Type: Thermally Conductive
- Composition: Filled
from Master Bond, Inc.
EP42-2LV Black is a two component, room temperature curing epoxy compound featuring low viscosity and superior chemical resistance. It meets NASA low outgassing specifications, is black in color and optically opaque. [See More]
- Form / Shape: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
- Chemical System: Epoxy
- Type: Thermally Conductive
- Composition: Unfilled
from Aremco Products, Inc.
Aremco offers an expansive range of ceramic-based materials used for the assembly of high temperature, high power electrical devices, and high temperature fixtures, molds and tooling. These materials, based on aluminum oxide, aluminum nitride, magnesium oxide, silicon dioxide, silicon carbide,... [See More]
- Form / Shape: Liquid; Encapsulant or Conformal Coating
- Industry: Electronics
- Type: Thermally Conductive
- Features: Dissimilar Substrates
from OMEGA Engineering, Inc.
Air Set Cements set or cure through loss of moisture by evaporation. Atmospheric conditions therefore affect the drying rate. Air Set Cements are used mainly in thin film applications (applied in thicknesses less than 1/4")*. SELECTION CRITERIA FOR CEMENTS. 1. Type of Application Potting, sealing,... [See More]
- Form / Shape: Liquid (optional feature); Powder (optional feature); Encapsulant or Conformal Coating
- Chemical System: Ceramic
- Type: Thermally Conductive
- Cure / Technology: Two Component (optional feature); Single Component (optional feature)
from Sauereisen, Inc.
Sauereisen Electric Heater Cement No. 6 is a versatile high-temperature cement used for refractory coatings, lining furnaces, embedding electric heating elements, coating resistors, molding and insulating. No. 6 is supplied in Powder form and needs only be mixed with water to apply. [See More]
- Form / Shape: Die Bonding Adhesives; Powder; Encapsulant or Conformal Coating
- Chemical System: Ceramic
- Type: Thermally Conductive
- Composition: Unfilled
from Henkel Corporation - Electronics
With the increasing proliferation of wireless devices, designers are challenged with various electromagnetic waves from multiple sources radiating at the same spectrum of frequencies resulting in electromagnetic interference(EMI). Radio-frequency(RF) emitting devices require effective isolation to... [See More]
- Form / Shape: Liquid; Encapsulant or Conformal Coating
- Cure / Technology: Single Component
- Type: Electrically Conductive
- Industry: Electronics
from Protavic America, Inc.
PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]
- Form / Shape: Die Bonding Adhesives; Liquid; Encapsulant or Conformal Coating
- Chemical System: Silicone
- Type: Electrically Conductive; Thermally Conductive
- Composition: Unfilled
from OMEGA Engineering, Inc.
Chemical Set Cements set or cure by an internal chemical action which does not require exposure to air. Chemical Set Cements can be used in thick applications (applied in thicknesses greater than 1/4")*. SELECTION CRITERIA FOR CEMENTS. 1. Type of Application Potting, sealing, encapsulating,... [See More]
- Form / Shape: Liquid (optional feature); Powder (optional feature); Encapsulant or Conformal Coating
- Chemical System: Ceramic
- Type: Thermally Conductive
- Cure / Technology: Two Component (optional feature); Single Component (optional feature)
from Protavic America, Inc.
PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ is heat stable up to 150 °C. [See More]
- Form / Shape: Gap Filler, Foam in Place Gasket; Gel; Encapsulant or Conformal Coating
- Chemical System: Epoxy
- Type: Thermally Conductive
- Composition: Filled
from Protavic America, Inc.
ANA-97290 is a clear Ultraviolet/ Visible light curing adhesive. It has very low shrinkage during cure for alignment sensitive parts. It is recommended for small electrical/electronic casting and encapsulating applications that require a unique combination of excellent wetting, flow, good thermal... [See More]
- Form / Shape: Die Bonding Adhesives; Gel (optional feature); Liquid; Encapsulant or Conformal Coating
- Composition: Unfilled
- Type: Electrically Conductive
- Cure / Technology: Thermoset; Two Component ; UV or Radiation Cured