UL Approved Conductive Compounds

Pedigree® -- 40 VTC-40F
from ELANTAS PDG, Inc.

Mineral-filled VPI resin - semi-flexible for transformers with improved heat dissipation [See More]

  • Features: Flexible; UL Rating; Dissimilar Substrates
  • Chemical System: Alkyd
  • Type: Thermally Conductive
  • Composition: Filled
High Insulating Thermal Conductive Pad/Film -- PR27
from Shiu Li Technology Co., Ltd

LiPOLY PR27 is a very thin high insulator with a thickness of 0.15mm. It uses Polyimide Film as the reinforcement material, which can increase the tensile strength. It has great dielectric strength and can withstand 12K voltages. It ’s suitable for high power transistors, electrical equipment,... [See More]

  • Features: UL Rating
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Form / Shape: Sheet Form, Die-cut Parts
Thermally Conductive Flame Retardant Silicone -- MasterSil 156
from Master Bond, Inc.

Featuring superb electrical insulation properties, MasterSil 156 is a two component, moderate viscosity silicone system for high performance potting, encapsulation and sealing. It combines high temperature resistance, flexibility, low shrinkage upon cure and thermal conductivity exceeding 8-9 BTU... [See More]

  • Features: Flame Retardant; Non-corrosive; UL Rating; Dissimilar Substrates
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Composition: Unfilled
High Thermally Conductive and Non-Flammable Silicone Gel Sheet -- SARCON ® XR-e
from Fujipoly® America Corp.

Sarcon ® XR-e is highly conformable/thermally conductive gel materials, 11watt/m-K (No electricity conductive) in a versatile sheet form that easily fit and adhere e to most all shapes and sizes of components, and makes reliable and complete physical contact. The surface consistency of the pads... [See More]

  • Features: UL Rating
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Form / Shape: Gap Filler, Foam in Place Gasket; Gel
High Insulating Thermal Conductive Pad/Film -- SH1500/2000/3000
from Shiu Li Technology Co., Ltd

LiPOLY ’s thermal insulator SH1500/2000/3000 uses fiberglass cloth as a reinforcement material, combined with thermal conductive silicon, giving it high thermal conduction and great compression strength. The thermal conductivity is 1.5/2.0/3.0 W/m*K, the thickness is 0.23~0.35mm. Its high... [See More]

  • Features: UL Rating
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Form / Shape: Sheet Form, Die-cut Parts
UL 1203 Certified Epoxy for Explosion-Proof & Dust-Ignition-Proof Electrical Equipment -- EP41S-6
from Master Bond, Inc.

Master Bond EP41S-6 is a two part epoxy system that meets UL 1203. Meeting this standard allows EP41S-6 to be used in conjunction with electrical equipment that needs to be labeled as explosion proof and or dust ignition proof. [See More]

  • Features: Flame Retardant; Non-corrosive; UL Rating; Dissimilar Substrates
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Unfilled
Non-Silicone Thermal Conductive Pad -- N700A
from Shiu Li Technology Co., Ltd

LiPOLY Non-Silicone Thermal Compound N700A/B is made of non-silicon resin material and none low-molecular-weight siloxane. N700A/B helps avoid electrical contact problems. N700 is flexible and has great thermal conduction, making the thermal resistance as low as possible. The thermal conductivity is... [See More]

  • Features: UL Rating
  • Chemical System: Non-Silicone
  • Type: Thermally Conductive
  • Form / Shape: Sheet Form, Die-cut Parts
Thermal Conductive Absorber Pad -- DTT44-5G
from Shiu Li Technology Co., Ltd

LiPOLY DTT44 is a soft thermally conductive gel pad specifically designed for networking applications. DTT44 is designed to focus on Dk and Df to reduce interference in RF modules. DTT44 has a thermal conductivity of 3.0 W/m*K. This product can be supplied as standard sheets, custom die-cuts or... [See More]

  • Features: UL Rating
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Form / Shape: Sheet Form, Die-cut Parts
Thermal Conductive Absorber Pad -- DTT65-5G
from Shiu Li Technology Co., Ltd

LiPOLY DTT65 is a soft thermally conductive gel pad specifically designed for networking applications. DTT65 is designed to focus on Dk and Df to reduce interference in RF modules. DTT65 has a thermal conductivity of 5.0 W/m*K. This product can be supplied as standard sheets, custom die-cuts or... [See More]

  • Features: UL Rating
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Form / Shape: Sheet Form, Die-cut Parts
Thermal Conductive Absorber Pad -- TEM96B
from Shiu Li Technology Co., Ltd

LiPOLY TEM96B is a thermally conductive absorber based upon soft magnetic materials dispersed in a polymeric resin. It has a thermal conductivity of 3.0 W/m*K and dissipates electromagnetic radiation rapidly to mitigate against EMI issues. [See More]

  • Features: UL Rating
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Form / Shape: Sheet Form, Die-cut Parts
Thermal Conductive Pad -- BS75K
from Shiu Li Technology Co., Ltd

LiPOLY BS75K is a soft thermally conductive gap filler. With a thermal conductivity of 3.0 W/m*K and a low thermal impedance, BS75K is suitable for a wide range of applications. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for a wide... [See More]

  • Features: UL Rating
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
Thermal Conductive Pad -- BS87
from Shiu Li Technology Co., Ltd

LiPOLY BS87 is an ultra-soft thermally conductive gel pad with a thermal conductivity of 3.0 W/m*K. BS87 offers excellent compression under minimal force with high recovery characteristics. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for... [See More]

  • Features: UL Rating
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Form / Shape: Sheet Form, Die-cut Parts
Thermal Conductive Pad -- PK223
from Shiu Li Technology Co., Ltd

LiPOLY ’s PK223 is a material designed for gap filling. The thermal conductivity is 2.0W/m*K. The hardness is Shore 00/30 with high flexibility, high compressibility, highly insulating, great self-adhesive, which can cover the tolerance of design making it very stable. It also offers... [See More]

  • Features: UL Rating
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
Flame Retardant Polyurethane -- 50-2369 FR
from Epoxies Etc...

The 50-2369FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-2369 FR Urethane is listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low exotherm, and excellent electrical... [See More]

  • Features: Flame Retardant; UL Rating
  • Chemical System: Polyurethane
  • Type: Thermally Conductive
  • Composition: Filled
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4501
from Hapco, Inc.

Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame... [See More]

  • Features: Flame Retardant; UL Rating
  • Cure / Technology: Thermoset; Two Component  
  • Type: Thermally Conductive
  • Form / Shape: Liquid
Potting/Encapsulation Compound -- INSTAbond® 809FR
from ACCRAbond, Inc.

INSTAbond ® 809FR. INSTAbond ® 809 FR exhibits good thermal conductivity, excellent flow properties, and low exotherm characteristics in large masses. INSTAbond ® 809 FR meets the requirements for UL-94 V-0 rating for flame retardancy. [See More]

  • Features: Flame Retardant; UL Rating
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Cure / Technology: Two Component  
TECHNOMELT PA 2384 -- 8807299842049
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Features: UL Rating
  • Chemical System: Polyamide
  • Type: Thermally Conductive
  • Cure / Technology: Thermoplastic / Hot Melt; Single Component
Silicone Adhesive -- PTS-46303
from Protavic America, Inc.

PTS-46303 A/B ™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include... [See More]

  • Features: Flame Retardant; Flexible; UL Rating
  • Chemical System: Silicone
  • Type: Electrically Conductive; Thermally Conductive
  • Composition: Filled
Flame Retardant Thermally Conductive -- 50-3150 FR
from Epoxies Etc...

50-3150 FR has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-3150 FR Black Epoxy with Catalyst 190 and Catalyst 105 are listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low shrinkage, and outstanding insulation... [See More]

  • Features: Flame Retardant; UL Rating
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Unfilled
Di-Pak™ Rigid Eletrical Insulating Compound -- R-4528/7
from Hapco, Inc.

DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity). Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI-COAT R-4721 is easy to... [See More]

  • Features: Flame Retardant; UL Rating
  • Cure / Technology: Thermoset; Two Component  
  • Type: Thermally Conductive
  • Form / Shape: Liquid
TECHNOMELT PA 2692
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Features: UL Rating
  • Chemical System: Polyamide
  • Type: Thermally Conductive
  • Cure / Technology: Thermoplastic / Hot Melt
Silicone Encapsulant -- PTS-46303
from Protavic America, Inc.

PTS-46303 A/B ™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include... [See More]

  • Features: Flame Retardant; Flexible; UL Rating
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Composition: Filled
Thermally Conductive PU Potting Compound -- 20-2366FR
from Epoxies Etc...

20-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 20-2366 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical... [See More]

  • Features: Flame Retardant; Flexible; UL Rating
  • Chemical System: Polyurethane; Elastomeric
  • Type: Thermally Conductive
  • Composition: Unfilled
TECHNOMELT PA 341 -- 8802588327937
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Features: UL Rating
  • Chemical System: Polyamide
  • Type: Thermally Conductive
  • Cure / Technology: Thermoplastic / Hot Melt
TECHNOMELT PA 5375
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Features: UL Rating
  • Chemical System: Polyolefin
  • Type: Thermally Conductive
  • Cure / Technology: Thermoplastic / Hot Melt; Single Component
TECHNOMELT PA 6208 Black -- 8799566462977
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Features: UL Rating
  • Chemical System: Polyamide
  • Type: Thermally Conductive
  • Cure / Technology: Thermoplastic / Hot Melt; Single Component
TECHNOMELT PA 668 Clear
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Features: UL Rating
  • Chemical System: Polyamide
  • Type: Thermally Conductive
  • Cure / Technology: Thermoplastic / Hot Melt