UL Approved Conductive Compounds

31 Results
Thermally Conductive Flame Retardant Silicone -- MasterSil 156
from Master Bond, Inc.

Featuring superb electrical insulation properties, MasterSil 156 is a two component, moderate viscosity silicone system for high performance potting, encapsulation and sealing. It combines high temperature resistance, flexibility, low shrinkage upon cure and thermal conductivity exceeding 8-9 BTU... [See More]

  • Features: Flame Retardant; Non-corrosive; UL Rating; Dissimilar Substrates
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Composition: Unfilled
High Thermally Conductive and Non-Flammable Silicone Gel Sheet -- SARCON ® XR-e
from Fujipoly® America Corp.

Sarcon ® XR-e is highly conformable/thermally conductive gel materials, 11watt/m-K (No electricity conductive) in a versatile sheet form that easily fit and adhere e to most all shapes and sizes of components, and makes reliable and complete physical contact. The surface consistency of the pads... [See More]

  • Features: UL Rating
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Form / Shape: Gap Filler, Foam in Place Gasket; Gel
1-Part, Thermally Conductive, Black, RTV Silicone Adhesive, UL Listed -- AS1802-Black
from CHT USA Inc.

CHT ’s AS1802 Black is a 1-part, non-corrosive, neutral cure, thermally conductive, black RTV silicone adhesive sealant. It is one in a range of CHT ’s acetone cure products which are all solvent-free. It features a fast skin over time at 4 minutes. AS1802 Black is designed with... [See More]

  • Features: Flame Retardant; UL Rating
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Cure / Technology: Single Component; Acetone
Pedigree® -- 40 VTC-40F
from ELANTAS PDG, Inc.

Mineral-filled VPI resin - semi-flexible for transformers with improved heat dissipation [See More]

  • Features: Flexible; UL Rating; Dissimilar Substrates
  • Chemical System: Alkyd
  • Type: Thermally Conductive
  • Composition: Filled
5G mmWave Thermal Conductive Gel Pad -- DTT44-s
from Shiu Li Technology Co., Ltd

LiPOLY DTT44 is a soft thermally conductive gel pad specifically designed for networking applications. DTT44 is designed to focus on Dk and Df to reduce interference in RF modules. DTT44 has a thermal conductivity of 3.0 W/m*K. This product can be supplied as standard sheets, custom die-cuts or... [See More]

  • Features: UL Rating
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Form / Shape: Sheet Form, Die-cut Parts
UL 1203 Certified Epoxy for Explosion-Proof & Dust-Ignition-Proof Electrical Equipment -- EP41S-6
from Master Bond, Inc.

Master Bond EP41S-6 is a two part epoxy system that meets UL 1203. Meeting this standard allows EP41S-6 to be used in conjunction with electrical equipment that needs to be labeled as explosion proof and or dust ignition proof. [See More]

  • Features: Flame Retardant; Non-corrosive; UL Rating; Dissimilar Substrates
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Unfilled
1-Part, Thermally Conductive, Space-Grade Silicone Adhesive, UL Listed -- AS1707
from CHT USA Inc.

CHT's AS1707 is a 1-part, alkoxy cured, thermally conductive, low volatile, RTV silicone adhesive paste. AS1707 is formulated to meet the requirements for use as a space grade adhesive. AS1707 has low thermal outgassing properties and a wide operational temperature range. In addition to meeting... [See More]

  • Features: Flame Retardant; UL Rating
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Cure / Technology: Single Component; Alkoxy
5G mmWave Thermal Conductive Gel Pad -- DTT65-s
from Shiu Li Technology Co., Ltd

LiPOLY DTT65 is a soft thermally conductive gel pad specifically designed for networking applications. DTT65 is designed to focus on Dk and Df to reduce interference in RF modules. DTT65 has a thermal conductivity of 5.0 W/m*K. This product can be supplied as standard sheets, custom die-cuts or... [See More]

  • Features: UL Rating
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Form / Shape: Sheet Form, Die-cut Parts
2-Part, Silicone Potting Compound and Encapsulant, UL Listed -- QSil-563
from CHT USA Inc.

CHT's QSil 563 is a 2-part, platinum cure, 100% silicone solids elastomer designed for electronic potting and encapsulation applications. QSil 562 offers a hard, low modulus material that is readily repairable. QSil 563 is thermally conductive to aid in efficient heat dissipation. This silicone... [See More]

  • Features: Flame Retardant; UL Rating
  • Cure / Technology: Two Component  ; Addition
  • Type: Thermally Conductive
  • Industry: Automotive; Electronics
Exceptionally Soft Thermal Conductive Gel Pad -- BS75K
from Shiu Li Technology Co., Ltd

LiPOLY BS75K is a soft thermally conductive gap filler. With a thermal conductivity of 3.0 W/m*K and a low thermal impedance, BS75K is suitable for a wide range of applications. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for a wide... [See More]

  • Features: UL Rating
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
2-Part, Thermally Conductive Silicone Encapsulants, UL Listed -- SE3000
from CHT USA Inc.

CHT's SE3000 is a 2-part, platinum cure silicone elastomer designed for electronic potting and encapsulation applications. It offers good prtection against chemicals, environmental contamination, mechanical shock, vibration and impact damage. SE3000 can be used in applications where low flammability... [See More]

  • Features: Flame Retardant; UL Rating
  • Cure / Technology: Two Component  ; Addition
  • Type: Thermally Conductive
  • Industry: Electronics
Exceptionally Soft Thermal Conductive Gel Pad -- BS87
from Shiu Li Technology Co., Ltd

LiPOLY BS87 is an ultra-soft thermally conductive gel pad with a thermal conductivity of 3.0 W/m*K. BS87 offers excellent compression under minimal force with high recovery characteristics. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for... [See More]

  • Features: UL Rating
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Form / Shape: Sheet Form, Die-cut Parts
2-Part, Thermally Conductive Silicone Potting Compound and Encapsulant, UL Listed -- QSil-553
from CHT USA Inc.

CHT's QSil 553 is a 2-part, platinum cure, silicone potting compound and encapsulant designed to protect electronic components from harsh environmental conditions and shock and vibration. It features a low viscosity for convenient dispensing and will easily flow throughout components. Because of its... [See More]

  • Features: Flame Retardant; UL Rating
  • Cure / Technology: Two Component  ; Addition
  • Type: Thermally Conductive
  • Industry: Automotive; Electronics; OEM or Industrial
Exceptionally Soft Thermal Conductive Gel Pad -- S282-s
from Shiu Li Technology Co., Ltd

LiPOLY ’s S282 is a thermally conductive pad designed for gap filling. The thermal conductivity is 1.7 W/m*K. It uses fiberglass cloth as the reinforcement material with great self-adhesive that can fit closely with non-flat heat sinks to increase the contact area. The low stress damped... [See More]

  • Features: UL Rating
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
High Insulating Thermal Conductive Film -- PR27
from Shiu Li Technology Co., Ltd

LiPOLY PR27 is a very thin high insulator with a thickness of 0.15mm. It uses Polyimide Film as the reinforcement material, which can increase the tensile strength. It has great dielectric strength and can withstand 12K voltages. It ’s suitable for high power transistors, electrical equipment,... [See More]

  • Features: UL Rating
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Form / Shape: Sheet Form, Die-cut Parts
High Insulating Thermal Conductive Film -- SH1500/2000/3000
from Shiu Li Technology Co., Ltd

LiPOLY ’s thermal insulator SH1500/2000/3000 uses fiberglass cloth as a reinforcement material, combined with thermal conductive silicon, giving it high thermal conduction and great compression strength. The thermal conductivity is 1.5/2.0/3.0 W/m*K, the thickness is 0.23~0.35mm. Its high... [See More]

  • Features: UL Rating
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Form / Shape: Sheet Form, Die-cut Parts
High Thermal Conductive Gap Filler -- T-top81
from Shiu Li Technology Co., Ltd

LiPOLY T-top81 is an ultra-soft, highly conformable, non-flammable interface material. T-top81 is a high deflection material, designed to allow minimal stress on components while offering excellent thermal conductivity and low thermal resistance. With a thermal conductivity of 8.0 W/m*K, T-top81... [See More]

  • Features: UL Rating
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Form / Shape: Sheet Form, Die-cut Parts
Silicone Adhesive -- PTS-46303
from Protavic America, Inc.

PTS-46303 A/B ™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include... [See More]

  • Features: Flame Retardant; Flexible; UL Rating
  • Chemical System: Silicone
  • Type: Electrically Conductive; Thermally Conductive
  • Composition: Filled
Potting/Encapsulation Compound -- INSTAbond® 809FR
from ACCRAbond, Inc.

INSTAbond ® 809FR. INSTAbond ® 809 FR exhibits good thermal conductivity, excellent flow properties, and low exotherm characteristics in large masses. INSTAbond ® 809 FR meets the requirements for UL-94 V-0 rating for flame retardancy. [See More]

  • Features: Flame Retardant; UL Rating
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Cure / Technology: Two Component  
TECHNOMELT PA 2384 -- 8807299842049
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Features: UL Rating
  • Chemical System: Polyamide
  • Type: Thermally Conductive
  • Cure / Technology: Thermoplastic / Hot Melt; Single Component
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4501
from Hapco, Inc.

Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame... [See More]

  • Features: Flame Retardant; UL Rating
  • Cure / Technology: Thermoset; Two Component  
  • Type: Thermally Conductive
  • Form / Shape: Liquid
Flame Retardant Polyurethane -- 50-2369 FR
from Epoxies Etc...

The 50-2369FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-2369 FR Urethane is listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low exotherm, and excellent electrical... [See More]

  • Features: Flame Retardant; UL Rating
  • Chemical System: Polyurethane
  • Type: Thermally Conductive
  • Composition: Filled
Silicone Encapsulant -- PTS-46303
from Protavic America, Inc.

PTS-46303 A/B ™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include... [See More]

  • Features: Flame Retardant; Flexible; UL Rating
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Composition: Filled
TECHNOMELT PA 2692
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Features: UL Rating
  • Chemical System: Polyamide
  • Type: Thermally Conductive
  • Cure / Technology: Thermoplastic / Hot Melt
Di-Pak™ Rigid Eletrical Insulating Compound -- R-4528/7
from Hapco, Inc.

DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity). Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI-COAT R-4721 is easy to... [See More]

  • Features: Flame Retardant; UL Rating
  • Cure / Technology: Thermoset; Two Component  
  • Type: Thermally Conductive
  • Form / Shape: Liquid
Flame Retardant Thermally Conductive -- 50-3150 FR
from Epoxies Etc...

50-3150 FR has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-3150 FR Black Epoxy with Catalyst 190 and Catalyst 105 are listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low shrinkage, and outstanding insulation... [See More]

  • Features: Flame Retardant; UL Rating
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Unfilled
TECHNOMELT PA 341 -- 8802588327937
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Features: UL Rating
  • Chemical System: Polyamide
  • Type: Thermally Conductive
  • Cure / Technology: Thermoplastic / Hot Melt
Thermally Conductive PU Potting Compound -- 20-2366FR
from Epoxies Etc...

20-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 20-2366 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical... [See More]

  • Features: Flame Retardant; Flexible; UL Rating
  • Chemical System: Polyurethane; Elastomeric
  • Type: Thermally Conductive
  • Composition: Unfilled
TECHNOMELT PA 5375
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Features: UL Rating
  • Chemical System: Polyolefin
  • Type: Thermally Conductive
  • Cure / Technology: Thermoplastic / Hot Melt; Single Component
TECHNOMELT PA 6208 Black -- 8799566462977
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Features: UL Rating
  • Chemical System: Polyamide
  • Type: Thermally Conductive
  • Cure / Technology: Thermoplastic / Hot Melt; Single Component
TECHNOMELT PA 668 Clear
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Features: UL Rating
  • Chemical System: Polyamide
  • Type: Thermally Conductive
  • Cure / Technology: Thermoplastic / Hot Melt