Semiconductors / IC Packaging Conductive Compounds

Electrically and Thermally Conductive Epoxy Adhesive -- EPO-TEK® EK1000-1-D
from Epoxy Technology

EPO-TEK ® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical, and... [See More]

  • Industry: Electronics; Semiconductors, IC's
  • Chemical System: Epoxy
  • Type: Electrically Conductive; Thermally Conductive
  • Composition: Filled
4.0 x 5.0 Micron Foil -- NanoFoil®
from Indium Corporation

NanoFoil ® Bundle Kits are small quantities of NanoFoil ® in pre-made forms on tape & reel. The kit consists of small preforms, including 0.5", 1", and 2" squares available in thicknesses of 40 microns or 60 microns. The bundle kits are available in standard NanoFoil only; however,... [See More]

  • Industry: Semiconductors, IC's
  • Chemical System: Metal
  • Type: Thermally Conductive
Electrically and Highly Thermally Conductive Die Attach Adhesive -- ALPHA® ATROX® HT900-1
from MacDermid Alpha Electronics Solutions

ATROX ® HT900-1 is a thermosetting conductive die attach adhesive designed for LED packages. The unique chemistry of the ATROX ® HT900-1 allows the material to be cured at lower temperatures compared to standard die attach adhesives, while maintaining its material properties. ATROX ®... [See More]

  • Industry: Electronics; Semiconductors, IC's
  • Cure / Technology: Thermoset; Cured by Thermal Processing in Standard IR, Full Convection, Conduction or Vapor Phase Oven Equipment
  • Type: Electrically Conductive
  • Form / Shape: Die Bonding Adhesives
Dow DOWSIL™ 3-6752 Thermally Conductive Adhesive Gray 30 cc Syringe -- 3-6752 TC ADHESIVE 75G [4121539 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™ 3-6752 Thermally Conductive Adhesive Gray is a one component, heat curing silicone that is used to cool electronic applications and bond with metals, ceramics, filled plastics, epoxy laminates, and organic substrates. It is flame resistant, self leveling, flowable, thixotropic,... [See More]

  • Industry: Semiconductors, IC's
  • Cure / Technology: Single Component
  • Type: Thermally Conductive
  • Thermal Conductivity: 1.8
Extremely Compressible Thermal Gap Filler -- SARCON® PG45A
from Fujipoly® America Corp.

Fujipoly ® introduces Sarcon ® PG45A its newest high-performance, putty-like thermal interface material. This extremely low modulus gap filler exhibits a thermal resistance as low as 0.02 °C •in2/W at 43.5 PSI with a thermal conductivity of 4.5 W/m °K. Sarcon ® PG45A... [See More]

  • Industry: Electronics; Semiconductors, IC's
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Form / Shape: Putty; Gap Filler, Foam in Place Gasket
Addition Cured Silicone is Optically Clear with Enhanced Low Temperature Serviceability -- MasterSil 157
from Master Bond, Inc.

MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Optical; Semiconductors, IC's
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Composition: Unfilled
Bundle Kit 40 Microns x .5 Inch Squares -- NanoFoil®
from Indium Corporation

Thickness of NanoFoil ®: 40 microns. Size of NanoFoil ®: .5 inch squares. Qty Per Bundle: 100 each. NanoFoil ® Bundle Kits are small quantities of NanoFoil ® in pre-made forms on tape & reel. The kit consists of small preforms, including 0.5", 1", and 2" squares available in... [See More]

  • Industry: Semiconductors, IC's
  • Chemical System: Metal
  • Type: Thermally Conductive
High Performance Gap Filler -- SARCON ® GR80A
from Fujipoly® America Corp.

Highly Conformable and High Heat Conducting gel materials. SARCON ® Thermal Gap Filler Pads are highly conformable and high heat conducting gel materials in a versatile sheet form. They easily fit and adhere to most all shapes and sizes of components, including protrusions and recessed areas. [See More]

  • Industry: Electronics; Semiconductors, IC's
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Form / Shape: Gap Filler, Foam in Place Gasket; Gel
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22
from Master Bond, Inc.

Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Filled
Engineered Solder Materials -- Indalloy® Alloys Liquid at Room Temperature
from Indium Corporation

Several low melting point Indalloy ® alloys are liquid at room temperature. These gallium-based alloys are non-toxic replacements for mercury. The gallium-based alloys have far lower vapor pressure than mercury, reducing both the amount and toxicity of metal vapor exposure. Excellent Thermal and... [See More]

  • Industry: Semiconductors, IC's
  • Chemical System: Metal
  • Type: Thermally Conductive
  • Form / Shape: Liquid
High Performance Thermal Gap Filler -- SARCON® GR130A
from Fujipoly® America Corp.

Fujipoly ® recently released Sarcon ® GR130A, its newest high-performance, thermal gap filler pad. The highly conformable, gel-like sheets exhibit a thermal resistance as low as 0.02 °C •in2/W at 43.5 PSI with a thermal conductivity of 13 W/m °K. Sarcon ® GR130A is available... [See More]

  • Industry: Electronics; Semiconductors, IC's
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Form / Shape: Gap Filler, Foam in Place Gasket
B-Staged Epoxy Meets Airbus Standards for Flame Retardancy & Toxicity -- EP36FR
from Master Bond, Inc.

EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's; Aerospace
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Unfilled
Indium Thermal Interface Materials (TIM)
from Indium Corporation

Thermal interface materials are useful for a variety of applications, but solder thermal interface materials (sTIM) are especially suited to high-end device cooling. To improve package reliability, it is especially important to choose the right alloy. Indium, in particular, should be considered as a... [See More]

  • Industry: Semiconductors, IC's
  • Chemical System: Metal
  • Type: Thermally Conductive
  • Thermal Conductivity: 15 to 28.1
Highly Conformable and Non-Flammable, Higher Thermal interface material -- SARCON® PG80B
from Fujipoly® America Corp.

SARCON® Extremely Compressible Gap Filler Type (Putty Type) is a highly conformable, thermally conductive, non-flammable interface materials. The surface consistency is excellent for filling small air gaps and uneven mating surface, making reliable contact with various shapes and sizes of... [See More]

  • Industry: Electronics; Semiconductors, IC's
  • Form / Shape: Putty; Gap Filler, Foam in Place Gasket
  • Type: Thermally Conductive
  • Use Temperature: -40 to 302
Biocompatible, Non-Drip Epoxy Resists Repeated Sterilizations -- EP3HTND-2Med Black
from Master Bond, Inc.

EP3HTND-2Med Black is a one part system that combines easy processing with excellent bonding properties. It cures in 20-30 minutes at 250°F or 5-10 minutes at 300°F and adheres well to a wide variety of substrates including glass, metals, ceramics and most plastics. This paste compound meets USP... [See More]

  • Industry: Aerospace; Electronics; Electric Power; Photonics; Semiconductors, IC's
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Unfilled
Liquid Metal Thermal Interface Material
from Indium Corporation

Several very low melting point Indalloy ® alloys are liquid at room temperature. These gallium-based alloys are finding increased use in various applications as a replacement for toxic mercury, which has a high vapor pressure at room temperature. These alloys have reduced toxicity and lower... [See More]

  • Industry: Semiconductors, IC's
  • Chemical System: Metal
  • Type: Thermally Conductive
  • Form / Shape: Liquid
Thermal Interface Material Sample Kit -- SARCON®
from Fujipoly® America Corp.

Fujipoly ® recently introduced a comprehensive engineering kit that includes free samples of (20) different Sarcon ® Thermal Interface Materials. The sample kit gives engineers the flexibility to test the performance properties of multiple Sarcon ® materials in order to find the perfect... [See More]

  • Industry: Electronics; Semiconductors, IC's
  • Type: Thermally Conductive
Chemical Resistant, Two Part Epoxy Features Glass Transition Temperature of +240°C -- EP126
from Master Bond, Inc.

Master Bond EP126 withstands very high temperatures, up to +600 °F, and has a glass transistion temperature of +240 °C. This two component product features unique handling properties as Part A is a moderate viscosity liquid and Part B is a powder. It can be easily mixed using a forgiving 100... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Unfilled
Solder Thermal Interface Materials
from Indium Corporation

Indium Corporation ’s Solder Thermal Interface Materials radically improve: Heat dissipation efficiency in electronic devices. Thermal conductance for high power devices – with densities in excess of 1000 watts. End-of-life performance at the thermal interface – to avoid failures... [See More]

  • Industry: Semiconductors, IC's
  • Chemical System: Metal
  • Type: Thermally Conductive
Two-Part Thermal Gap Filler -- SARCON® LG23A and LG30A
from Fujipoly® America Corp.

The SARCON® LG Series is the perfect solution for filling large, complex and uneven gaps between heat generating components that depend on reliable contact with a heat spreader to maintain optimal performance. SARCON® LG23A and LG30A easily dispense in a liquid form that will cure at room... [See More]

  • Industry: Electronics; Semiconductors, IC's
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
Dual Curing, Thixotropic Adhesive -- UV22DC80-10F
from Master Bond, Inc.

One part, nanosilica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
  • Chemical System: UV Curing
  • Type: Thermally Conductive
  • Composition: Filled
Thermal Interface Materials -- Heat-Spring® Bundle Pack: Squares: .5 Inch Squares - Qty 100 Pieces
from Indium Corporation

Packaged in tape & reel bundle packs and vacuum packed in a metallized bag. [See More]

  • Industry: Semiconductors, IC's
  • Chemical System: Metal
  • Type: Thermally Conductive
Electrically and Thermally Conductive, Two Part Silicone Meets NASA Low Outgassing Specifications -- MasterSil 973S-LO
from Master Bond, Inc.

MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Silicone
  • Type: Electrically Conductive; Thermally Conductive
  • Composition: Filled
Thermal Interface Materials -- Heat-Spring® Bundle Pack: Squares: 1 Inch Squares: Qty 50 Pieces
from Indium Corporation

Packaged in tape & reel bundle packs and vacuum packed in a metallized bag. [See More]

  • Industry: Semiconductors, IC's
  • Chemical System: Metal
  • Type: Thermally Conductive
Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity -- EP3HTSDA-1
from Master Bond, Inc.

EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Unfilled
Thermal Interface Materials -- Heat-Spring® Bundle Pack: Squares: 1.5 Inch Squares - Qty 20 Pieces
from Indium Corporation

Packaged in tape & reel bundle packs and vacuum packed in a metallized bag. [See More]

  • Industry: Semiconductors, IC's
  • Chemical System: Metal
  • Type: Thermally Conductive
Electrically Conductive Die Attach Epoxy With High Glass Transition Temperature -- EP17HTS-DA
from Master Bond, Inc.

Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Polyphenylene Sulfide; Epoxy
  • Type: Electrically Conductive; Thermally Conductive
  • Composition: Filled
Thermal Interface Materials -- Heat-Spring® Bundle Pack: Squares: 2 Inch Squares: Qty 20 Pieces
from Indium Corporation

Packaged in tape & reel bundle packs and vacuum packed in a metallized bag. [See More]

  • Industry: Semiconductors, IC's
  • Chemical System: Metal
  • Type: Thermally Conductive
Epoxy Features Exceptional Chemical and Heat Resistance -- EP35SP
from Master Bond, Inc.

EP35SP is a two component epoxy system specially formulated to resist high temperatures and aggressive chemicals. It has a paste viscosity with little to no flow when curing. [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's; Downhole
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Unfilled
Thermal Interface Materials -- Thermal Interface Ribbon Kit
from Indium Corporation

The Thermal Interface Ribbon Kit includes 99.99% Indium ribbon that is 1.00" wide x thicknesses of: .002"/.006"/.010" by three feet of each. Also included is the 5RMA flux. [See More]

  • Industry: Semiconductors, IC's
  • Cure / Technology: Solder
  • Type: Thermally Conductive
  • Form / Shape: Ribbon
Epoxy Meets Airbus Standards for Flame Retardancy, Smoke and Gas Emissions -- EP93FRHT
from Master Bond, Inc.

EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Unfilled
Extremely Soft MasterSil 170 Gel Encapsulant Offers Removability and Optical Clarity -- MasterSil 170 Gel
from Master Bond, Inc.

MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]

  • Industry: Aerospace; Electronics; Photonics; OEM or Industrial; Optical; Semiconductors, IC's
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Composition: Unfilled
Fast Curing, High Bond Strength Epoxy Adhesive -- EP51
from Master Bond, Inc.

Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature. The... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Unfilled
High Shear/Peel Strength, Room Temperature Curing Epoxy -- EP31
from Master Bond, Inc.

Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel strength exceeding 40 pli. The service... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Cure / Technology: Thermoset; Two Component  
High Tempreature and Thermal Cycling Resistant Epoxy -- EP33
from Master Bond, Inc.

Master Bond Polymer Adhesive EP33 is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond Polymer Adhesive EP33 produces high strength bonds whose... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Unfilled
Highly Flexible Addition Cured Silicone Offers Low Thermal Resistance -- MasterSil 151TC
from Master Bond, Inc.

MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Composition: Filled
Low Exotherm, Two Component Epoxy -- EP29LP
from Master Bond, Inc.

Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will form bond strengths in excess of 2,500 psi (aluminum to aluminum). It bonds well to a variety of substrates... [See More]

  • Industry: Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Unfilled
Low Outgassing, Optically Clear Two Component Epoxy -- EP29LPSP
from Master Bond, Inc.

Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]

  • Industry: Aerospace; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Unfilled
Low Viscosity, Electrically Insulating Epoxy Features Excellent Optical Clarity -- EP30LP-2
from Master Bond, Inc.

Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Optical; Semiconductors, IC's
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Unfilled
Moderate Viscosity Thermally Conductive Epoxy -- EP112AO
from Master Bond, Inc.

Master Bond Polymer System EP112AO is a solventless, moderate viscosity two component epoxy resin system which is specifically designed for high performance outdoor and indoor electrical and electronic applications where good thermal conductivity and electrial isolation is required. The two... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Filled
Nanosilica Filled Optically Clear Epoxy with High Abrasion Resistance -- EP30NS
from Master Bond, Inc.

Master Bond EP30NS is a nanosilica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Optical; Semiconductors, IC's
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Filled
NASA Low Outgassing Rated Epoxy Features Enhanced Chemical Resistance -- EP42-2LV Black
from Master Bond, Inc.

EP42-2LV Black is a two component, room temperature curing epoxy compound featuring low viscosity and superior chemical resistance. It meets NASA low outgassing specifications, is black in color and optically opaque. [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Unfilled
New Epoxy Offers Rapid Cures and Chemical Resistance -- EP41S-F
from Master Bond, Inc.

Offering impressive physical strength characteristics, EP41S-F is an electrically insulative two component epoxy that cures rapidly at ambient and elevated temperatures. Typically faster curing epoxies are somewhat less chemically resistant than other types of systems, but EP41S-F is one of the few... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Unfilled
Nickel Filled Electrically Conductive Epoxy System -- EP76M
from Master Bond, Inc.

Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part nickel conductive systems, EP76M... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Epoxy
  • Type: Electrically Conductive; Thermally Conductive
  • Composition: Filled
One Component Elastomeric System Features Excellent Thermal Conductivity -- X5TC
from Master Bond, Inc.

Elastomeric adhesive system, X5TC delivers thermal conductivity of 10-12 BTU •in/ft2 •hr • °F [1.44-1.73 W/m •K] while maintaining excellent electrical insulation properties. It is well suited for bonding dissimilar substrates and performs well when subjected to thermal... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Elastomeric
  • Type: Thermally Conductive
  • Composition: Unfilled
Flame Retardant Polyurethane -- 50-2369 FR
from Epoxies Etc...

The 50-2369FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-2369 FR Urethane is listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low exotherm, and excellent electrical... [See More]

  • Industry: Electronics; OEM or Industrial; Semiconductors, IC's; Surface Mount Components
  • Chemical System: Polyurethane
  • Type: Thermally Conductive
  • Composition: Filled
Metal Oxide Thickened Dimethyl Silicone Compound -- Bluesil™ V-740
from Bluestar Silicones USA Corp.

Metal Oxide Thickened Dimethyl Silicone Compound. Description. Bluesil V-740 is a metal oxide thickened dimethyl silicone compound. It is a white, heavy paste used for heat dissipation applications where high thermal conductivity is required. [See More]

  • Industry: Electronics; Electric Power; Semiconductors, IC's
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Cure / Technology: Two Component  
Clear Non-Yellowing Silicone Encapsulant -- PNS-56225
from Protavic America, Inc.

PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]

  • Industry: Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Silicone
  • Type: Electrically Conductive; Thermally Conductive
  • Composition: Unfilled
Thermal Compound -- TC70
from Nordson EFD

Our innovative, non-silicone thermal compounds provide an ideal thermal solution by ensuring reliable heat transfer over a longer time than most industrial thermal interface materials. Conventional, silicone-based heat sink compounds and thermal greases tend to spread after a number of heating and... [See More]

  • Industry: Electronics; Semiconductors, IC's
  • Chemical System: Synthetic Based
  • Type: Thermally Conductive
  • Composition: Unfilled
Clear UV Adhesive -- ANA-97773
from Protavic America, Inc.

ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued shrinkage and movement. Bond lines are clear, colorless and exhibit low shrinkage during the curing process. [See More]

  • Industry: Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Composition: Unfilled
  • Type: Electrically Conductive
  • Cure / Technology: Thermoset; Two Component  ; UV or Radiation Cured
Electro-Conductive Epoxy Adhesive -- ACE-10131
from Protavic America, Inc.

Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for production needs. One... [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Epoxy
  • Type: Electrically Conductive; Thermally Conductive
  • Composition: Filled
Epoxy Adhesive -- ANE-20904
from Protavic America, Inc.

Epoxy system designed for underfill applications. This material is fast flowing and provides excellent properties for common device packaging. [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Cure / Technology: Thermoset; Single Component
Epoxy Cast -- PTE-36977
from Protavic America, Inc.

PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ is heat stable up to 150 °C. [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Filled