Semiconductors / IC Packaging Conductive Compounds
from Fujipoly® America Corp.
bull; CF210A is the newest Fujipoly thermal gap filler. • CF210A incorporates carbon fibers along with traditional fillers found in thermal gap filler materials. • CF210A is rated at 21 W/m •K. • Compliance is closer to a much lower conductivity gap filler (Fujipoly- Sarcon... [See More]
- Industry: Electronics; Semiconductors, IC's
- Chemical System: carbon fibers along with traditional fillers found in thermal gap filler materials
- Type: Thermally Conductive
- Form / Shape: Gap Filler, Foam in Place Gasket
from Master Bond, Inc.
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Optical; Semiconductors, IC's
- Chemical System: Silicone
- Type: Thermally Conductive
- Composition: Unfilled
from Ellsworth Adhesives
Bergquist Poly-Pad 1000 Thermally Conductive Fiberglass with a filled polyester resin, is used for high performance applications and devices that require non-silicone conformal coatings such as power supplies, semiconductors, and automotive electronics. It also offers high thermal resistance. 12 in... [See More]
- Industry: Automotive; Electronics; Semiconductors, IC's
- Cure / Technology: Single Component
- Type: Thermally Conductive
- Thermal Conductivity: 1.2
from Quantaflex Printed Electronics Inc.
A high level of custom engineering and problem solving. Designing electrical shielding components requires a high level of custom engineering and problem solving. Nothing should be left to chance because the goal is to create a part that protects the electronic device (and your customers) from the... [See More]
- Industry: Electronics; Semiconductors, IC's
- Form / Shape: Foam; Gap Filler, Foam in Place Gasket; Liquid
- Type: Thermally Conductive
- Features: EMI/RFI Shielding
from MacDermid Alpha Electronics Solutions
A silver sinter paste, providing high thermal and electrical conductivity. Product Overview. The ALPHA ® Argomax ® 2020 Paste is a high-performance silver sinter paste used in applications that require excellent thermal and electrical conductivity. This paste is particularly suited for... [See More]
- Industry: Automotive; Electronics; Semiconductors, IC's
- Form / Shape: Die Bonding Adhesives; Grease, Paste
- Type: Thermally Conductive
from Fujipoly® America Corp.
Fujipoly ® introduces Sarcon ® PG45A its newest high-performance, putty-like thermal interface material. This extremely low modulus gap filler exhibits a thermal resistance as low as 0.02 °C •in2/W at 43.5 PSI with a thermal conductivity of 4.5 W/m °K. Sarcon ® PG45A... [See More]
- Industry: Electronics; Semiconductors, IC's
- Chemical System: Silicone
- Type: Thermally Conductive
- Form / Shape: Putty; Gap Filler, Foam in Place Gasket
from Master Bond, Inc.
Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Ellsworth Adhesives
Dow DOWSIL ™ 3-6752 Thermally Conductive Adhesive Gray is a one component, heat curing silicone that is used to cool electronic applications and bond with metals, ceramics, filled plastics, epoxy laminates, and organic substrates. It is flame resistant, self leveling, flowable, thixotropic,... [See More]
- Industry: Semiconductors, IC's
- Cure / Technology: Single Component
- Type: Thermally Conductive
- Thermal Conductivity: 1.8
from Fujipoly® America Corp.
Silicone Gap Filler Pad for Absorption of Electromagnetic Wave. Features. Effective to absorb and damp a wide range of electromagnetic waves. Also effective as a high performance thermal interface material. Easily filling small gaps of IC chip surface with soft gel texture. Good workability to... [See More]
- Industry: Electronics; Semiconductors, IC's
- Chemical System: Silicone
- Type: Thermally Conductive
- Form / Shape: Gap Filler, Foam in Place Gasket
from Master Bond, Inc.
EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's; Aerospace
- Chemical System: Epoxy
- Type: Thermally Conductive
- Composition: Unfilled
from Ellsworth Adhesives
Dow DOWSIL ™ TC-5150 Blue is a one component, high performance, non-curable, thermally conductive gap filler designed to dissipate heat from electronics to a heat sink providing a reliable cooling solution for a wide variety of substrates. It is reworkable, easy to dispense, has low thermal... [See More]
- Industry: Automotive; Electronics; Semiconductors, IC's
- Cure / Technology: Single Component
- Type: Thermally Conductive
- Form / Shape: Gap Filler, Foam in Place Gasket
from Fujipoly® America Corp.
Highly Conformable and High Heat Conducting gel materials. SARCON ® Thermal Gap Filler Pads are highly conformable and high heat conducting gel materials in a versatile sheet form. They easily fit and adhere to most all shapes and sizes of components, including protrusions and recessed areas. [See More]
- Industry: Electronics; Semiconductors, IC's
- Chemical System: Silicone
- Type: Thermally Conductive
- Form / Shape: Gap Filler, Foam in Place Gasket; Gel
from Master Bond, Inc.
EP3HTND-2Med Black is a one part system that combines easy processing with excellent bonding properties. It cures in 20-30 minutes at 250°F or 5-10 minutes at 300°F and adheres well to a wide variety of substrates including glass, metals, ceramics and most plastics. This paste compound meets USP... [See More]
- Industry: Aerospace; Electronics; Electric Power; Photonics; Semiconductors, IC's
- Chemical System: Epoxy
- Type: Thermally Conductive
- Composition: Unfilled
from Fujipoly® America Corp.
Fujipoly ® recently released Sarcon ® GR130A, its newest high-performance, thermal gap filler pad. The highly conformable, gel-like sheets exhibit a thermal resistance as low as 0.02 °C •in2/W at 43.5 PSI with a thermal conductivity of 13 W/m °K. Sarcon ® GR130A is available... [See More]
- Industry: Electronics; Semiconductors, IC's
- Chemical System: Silicone
- Type: Thermally Conductive
- Form / Shape: Gap Filler, Foam in Place Gasket
from Master Bond, Inc.
One part, nano silica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: UV Curing
- Type: Thermally Conductive
- Composition: Filled
from Fujipoly® America Corp.
SARCON ® PG130A from Fujipoly ® is one of the industry ’s newest high-performance thermal interface materials that is extremely compressible. This double-sticky surface TIM is a great choice for applications that have delicate or wide-variation component heights and require extremely... [See More]
- Industry: Electronics; Semiconductors, IC's
- Form / Shape: Putty; Gap Filler, Foam in Place Gasket
- Type: Thermally Conductive
- Gap Fill: 0.0118 to 0.0787
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Silicone
- Type: Electrically Conductive; Thermally Conductive
- Composition: Filled
from Fujipoly® America Corp.
SARCON® Extremely Compressible Gap Filler Type (Putty Type) is a highly conformable, thermally conductive, non-flammable interface materials. The surface consistency is excellent for filling small air gaps and uneven mating surface, making reliable contact with various shapes and sizes of... [See More]
- Industry: Electronics; Semiconductors, IC's
- Form / Shape: Putty; Gap Filler, Foam in Place Gasket
- Type: Thermally Conductive
- Use Temperature: -40 to 302
from Master Bond, Inc.
EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Epoxy
- Type: Thermally Conductive
- Composition: Unfilled
from Fujipoly® America Corp.
Fujipoly ® recently introduced a comprehensive engineering kit that includes free samples of (20) different Sarcon ® Thermal Interface Materials. The sample kit gives engineers the flexibility to test the performance properties of multiple Sarcon ® materials in order to find the perfect... [See More]
- Industry: Electronics; Semiconductors, IC's
- Type: Thermally Conductive
from Master Bond, Inc.
Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Polyphenylene Sulfide; Epoxy
- Type: Electrically Conductive; Thermally Conductive
- Composition: Filled
from Fujipoly® America Corp.
The SARCON® LG Series is the perfect solution for filling large, complex and uneven gaps between heat generating components that depend on reliable contact with a heat spreader to maintain optimal performance. SARCON® LG23A and LG30A easily dispense in a liquid form that will cure at room... [See More]
- Industry: Electronics; Semiconductors, IC's
- Chemical System: Silicone
- Type: Thermally Conductive
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
EP35SP is a two component epoxy system specially formulated to resist high temperatures and aggressive chemicals. It has a paste viscosity with little to no flow when curing. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's; Downhole
- Chemical System: Epoxy
- Type: Thermally Conductive
- Composition: Unfilled
from Master Bond, Inc.
EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Epoxy
- Type: Thermally Conductive
- Composition: Unfilled
from Master Bond, Inc.
MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]
- Industry: Aerospace; Electronics; Photonics; OEM or Industrial; Optical; Semiconductors, IC's
- Chemical System: Silicone
- Type: Thermally Conductive
- Composition: Unfilled
from Master Bond, Inc.
Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature. The... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Unfilled
from Master Bond, Inc.
Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel strength exceeding 40 pli. The service... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Chemical System: Epoxy
- Type: Electrically Conductive
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer Adhesive EP33 is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond Polymer Adhesive EP33 produces high strength bonds whose... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Unfilled
from Master Bond, Inc.
MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Silicone
- Type: Thermally Conductive
- Composition: Filled
from Master Bond, Inc.
Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will form bond strengths in excess of 2,500 psi (aluminum to aluminum). It bonds well to a variety of substrates... [See More]
- Industry: Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Unfilled
from Master Bond, Inc.
Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]
- Industry: Aerospace; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Unfilled
from Master Bond, Inc.
Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Optical; Semiconductors, IC's
- Chemical System: Epoxy
- Type: Thermally Conductive
- Composition: Unfilled
from Master Bond, Inc.
Master Bond EP30NS is a nano silica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Optical; Semiconductors, IC's
- Chemical System: Epoxy
- Type: Thermally Conductive
- Composition: Filled
from Master Bond, Inc.
EP42-2LV Black is a two component, room temperature curing epoxy compound featuring low viscosity and superior chemical resistance. It meets NASA low outgassing specifications, is black in color and optically opaque. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Epoxy
- Type: Thermally Conductive
- Composition: Unfilled
from Master Bond, Inc.
Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part nickel conductive systems, EP76M... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Chemical System: Epoxy
- Type: Electrically Conductive; Thermally Conductive
- Composition: Filled
from Master Bond, Inc.
Master Bond X21Med is a toughened one part system that can be used for bonding and priming polyolefinic surfaces. This exceptionally low viscosity ( <250 cps) solvent based system is easy to apply and process. It cures at room temperature or more rapidly with the addition of heat. X21Med passes... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Polyolefin
- Type: Thermally Conductive
- Composition: Unfilled
from Master Bond, Inc.
Master Bond Polymer System FL901AO is a one component high performance, thermally conductive, electrically insulative epoxy resin based adhesive film with outstanding performance characteristics. Unlike many other such epoxy film products, it does not require refrigerated storage although this is... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Chemical System: Epoxy
- Type: Thermally Conductive
- Composition: Unfilled
from Protavic America, Inc.
PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]
- Industry: Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Chemical System: Silicone
- Type: Electrically Conductive; Thermally Conductive
- Composition: Unfilled
from Epoxy Technology
EPO-TEK ® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical, and... [See More]
- Industry: Electronics; Semiconductors, IC's
- Chemical System: Epoxy
- Type: Electrically Conductive; Thermally Conductive
- Composition: Filled
from Nordson EFD
Our innovative, non-silicone thermal compounds provide an ideal thermal solution by ensuring reliable heat transfer over a longer time than most industrial thermal interface materials. Conventional, silicone-based heat sink compounds and thermal greases tend to spread after a number of heating and... [See More]
- Industry: Electronics; Semiconductors, IC's
- Chemical System: Synthetic Based
- Type: Thermally Conductive
- Composition: Unfilled
from Shenzhen DeepMaterial Technologies Co., Ltd
Mainly used in IC chip bonding. The sticking time is extremely short, and there will be no tailing or wire drawing problems. The bonding work can be completed with the smallest dose of adhesive, which greatly saves production costs and waste. It is suitable for automatic adhesive dispensing, has a... [See More]
- Industry: Semiconductors, IC's
- Chemical System: Silicone; Epoxy
- Type: Electrically Conductive
- Cure / Technology: Heat curing
from Shiu Li Technology Co., Ltd
LiPOLY S393 is a product with high ductile thermal conductivity. Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material. It won't easy to break and deformwhether stamped, punched, strip type, or custom cutting. Your best choice... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Silicone
- Type: Thermally Conductive
- Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
from Bluestar Silicones USA Corp.
Metal Oxide Thickened Dimethyl Silicone Compound. Description. Bluesil V-740 is a metal oxide thickened dimethyl silicone compound. It is a white, heavy paste used for heat dissipation applications where high thermal conductivity is required. [See More]
- Industry: Electronics; Electric Power; Semiconductors, IC's
- Chemical System: Silicone
- Type: Thermally Conductive
- Cure / Technology: Two Component
from Indium Corporation
NanoFoil ® Bundle Kits are small quantities of NanoFoil ® in pre-made forms on tape & reel. The kit consists of small preforms, including 0.5", 1", and 2" squares available in thicknesses of 40 microns or 60 microns. The bundle kits are available in standard NanoFoil only; however,... [See More]
- Industry: Semiconductors, IC's
- Chemical System: Metal
- Type: Thermally Conductive
from Epoxies Etc...
The 50-2369FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-2369 FR Urethane is listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low exotherm, and excellent electrical... [See More]
- Industry: Electronics; OEM or Industrial; Semiconductors, IC's; Surface Mount Components
- Chemical System: Polyurethane
- Type: Thermally Conductive
- Composition: Filled
from Protavic America, Inc.
ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued shrinkage and movement. Bond lines are clear, colorless and exhibit low shrinkage during the curing process. [See More]
- Industry: Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Composition: Unfilled
- Type: Electrically Conductive
- Cure / Technology: Thermoset; Two Component ; UV or Radiation Cured
from Shiu Li Technology Co., Ltd
LiPOLY S818 is a product with high ductile thermal conductivity.Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material.It won't easy to break and deform whether stamped, punched, strip type, or custom cutting. Your best choice... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Silicone
- Type: Thermally Conductive
- Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
from Indium Corporation
Thickness of NanoFoil ®: 40 microns. Size of NanoFoil ®: .5 inch squares. Qty Per Bundle: 100 each. NanoFoil ® Bundle Kits are small quantities of NanoFoil ® in pre-made forms on tape & reel. The kit consists of small preforms, including 0.5", 1", and 2" squares available in... [See More]
- Industry: Semiconductors, IC's
- Chemical System: Metal
- Type: Thermally Conductive
from Protavic America, Inc.
Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for production needs. One... [See More]
- Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Chemical System: Epoxy
- Type: Electrically Conductive; Thermally Conductive
- Composition: Filled
from Shiu Li Technology Co., Ltd
LiPOLY DCTP140-s is a thermal insulator uses fiberglass cloth as a reinforcement material, combined with thermal conductive silicon, giving it high thermal conduction and great compression strength. The thermal conductivity is 4.5 W/m*K, the thickness is 0.25~0.45mm. Its high insulation and... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Silicone
- Type: Thermally Conductive
- Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
from Indium Corporation
Several low melting point Indalloy ® alloys are liquid at room temperature. These gallium-based alloys are non-toxic replacements for mercury. The gallium-based alloys have far lower vapor pressure than mercury, reducing both the amount and toxicity of metal vapor exposure. Excellent Thermal and... [See More]
- Industry: Semiconductors, IC's
- Chemical System: Metal
- Type: Thermally Conductive
- Form / Shape: Liquid
from Protavic America, Inc.
Epoxy system designed for underfill applications. This material is fast flowing and provides excellent properties for common device packaging. [See More]
- Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Chemical System: Epoxy
- Type: Thermally Conductive
- Cure / Technology: Thermoset; Single Component
from Shiu Li Technology Co., Ltd
LiPOLY T-top99-s offers outstanding thermal conductivity at 24.0 W/m*K and extremely low thermal resistance under minimal force.T-top99-s offers excellent compression, filling small air gaps on uneven surfaces, ensuring an efficient and consistent transfer of heat. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Silicone
- Type: Thermally Conductive
- Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
from Indium Corporation
Thermal interface materials are useful for a variety of applications, but solder thermal interface materials (sTIM) are especially suited to high-end device cooling. To improve package reliability, it is especially important to choose the right alloy. Indium, in particular, should be considered as a... [See More]
- Industry: Semiconductors, IC's
- Chemical System: Metal
- Type: Thermally Conductive
- Thermal Conductivity: 15 to 28.1
from Protavic America, Inc.
PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ is heat stable up to 150 °C. [See More]
- Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Chemical System: Epoxy
- Type: Thermally Conductive
- Composition: Filled
from Shiu Li Technology Co., Ltd
LiPOLY TEM96D is a thermally conductive absorber based upon soft magnetic materials dispersed in a polymeric resin. It has a thermalconductivity of 5.0 W/m*K and dissipates electromagnetic radiation rapidly to mitigate against EMI issues. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Silicone
- Type: Thermally Conductive
- Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
from Indium Corporation
Several very low melting point Indalloy ® alloys are liquid at room temperature. These gallium-based alloys are finding increased use in various applications as a replacement for toxic mercury, which has a high vapor pressure at room temperature. These alloys have reduced toxicity and lower... [See More]
- Industry: Semiconductors, IC's
- Chemical System: Metal
- Type: Thermally Conductive
- Form / Shape: Liquid
from Shiu Li Technology Co., Ltd
LiPOLY HC-93 is a stereoscopic thermal conductive silicone rubber cap as substrate through a special production process. Due to its excellent characteristic of high thermal conductivity, insulation, shockproof and convenient assembly, it is widely used in heat transistor refer to TO220 / TO3P,... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Silicone
- Type: Thermally Conductive
- Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
from Indium Corporation
Indium Corporation ’s Solder Thermal Interface Materials radically improve: Heat dissipation efficiency in electronic devices. Thermal conductance for high power devices – with densities in excess of 1000 watts. End-of-life performance at the thermal interface – to avoid failures... [See More]
- Industry: Semiconductors, IC's
- Chemical System: Metal
- Type: Thermally Conductive
from Shiu Li Technology Co., Ltd
LiPOLY SP is a stereoscopic thermal conductive silicone rubber cap as substrate through a special production process. Due to its excellent characteristic of high thermal conductivity, insulation, shockproof and convenient assembly, it is widely used in heat transistor refer to TO220 / TO3P, diode,... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Silicone
- Type: Thermally Conductive
- Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
from Indium Corporation
Packaged in tape & reel bundle packs and vacuum packed in a metallized bag. [See More]
- Industry: Semiconductors, IC's
- Chemical System: Metal
- Type: Thermally Conductive
from Shiu Li Technology Co., Ltd
LiPOLY TP200 is a stereoscopic thermal conductive silicone rubber cap as substrate through a special production process. Due to its excellent characteristic of high thermal conductivity, insulation, shockproof and convenient assembly, it is widely used in heat transistor refer to TO220 / TO3P,... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Silicone
- Type: Thermally Conductive
- Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
from Indium Corporation
Packaged in tape & reel bundle packs and vacuum packed in a metallized bag. [See More]
- Industry: Semiconductors, IC's
- Chemical System: Metal
- Type: Thermally Conductive
from Shiu Li Technology Co., Ltd
LiPOLY AS02-s is a material with double sided inherent tack, low thermal resistance and high thermal conductivity. It has excellent compressive strength characteristics and good electrical isolation function for high-power electronic components, making it the best choice for thin design... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Silicone
- Type: Thermally Conductive
- Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
from Indium Corporation
Packaged in tape & reel bundle packs and vacuum packed in a metallized bag. [See More]
- Industry: Semiconductors, IC's
- Chemical System: Metal
- Type: Thermally Conductive
from Indium Corporation
Packaged in tape & reel bundle packs and vacuum packed in a metallized bag. [See More]
- Industry: Semiconductors, IC's
- Chemical System: Metal
- Type: Thermally Conductive
from Indium Corporation
The Thermal Interface Ribbon Kit includes 99.99% Indium ribbon that is 1.00" wide x thicknesses of: .002"/.006"/.010" by three feet of each. Also included is the 5RMA flux. [See More]
- Industry: Semiconductors, IC's
- Cure / Technology: Solder
- Type: Thermally Conductive
- Form / Shape: Ribbon