Thermally Conductive Conductive Compounds

Heatsink compound DC340 [See More]

• Type: Thermally Conductive
• Industry: Thermal Management

• Chemical System: Silicone
• Use Temperature: 392

3M TC-2707 Thermally Conductive Epoxy Adhesive Gray is a two component epoxy that uses aluminum metal filler. It offers high adhesive strength, good gap filling, low viscosity for potting applications, and good surface wet out. 50 mL Duo-Pak Cartridge. [See More]

• Type: Thermally Conductive
• Cure / Technology: Two Component  

• Chemical System: Epoxy
• Thermal Conductivity: 0.7200

A silver sinter paste, providing high thermal and electrical conductivity. Product Overview. The ALPHA ® Argomax ® 2020 Paste is a high-performance silver sinter paste used in applications that require excellent thermal and electrical conductivity. This paste is particularly suited for... [See More]

• Type: Thermally Conductive
• Industry: Automotive; Electronics; Semiconductors, IC's

• Form / Shape: Die Bonding Adhesives; Grease, Paste

SILICON GREASE 2 OZ JAR [See More]

• Type: Thermally Conductive

MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]

• Type: Thermally Conductive
• Composition: Unfilled

• Chemical System: Silicone
• Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing; Addition Cure

CHT's AS1707 is a 1-part, alkoxy cured, thermally conductive, low volatile, RTV silicone adhesive paste. AS1707 is formulated to meet the requirements for use as a space grade adhesive. AS1707 has low thermal outgassing properties and a wide operational temperature range. In addition to meeting... [See More]

• Type: Thermally Conductive
• Cure / Technology: Single Component; Alkoxy

• Chemical System: Silicone
• Industry: Automotive; Electronics

Dissipator ® 745 is a thermally conductive room temperature cure adhesive that is designed for bonding electrical components to heat sink with a controlled gap. Dissipator ® 745, through a special shimming property, insulates the component electrically while allowing thermal conductivity. [See More]

• Type: Thermally Conductive
• Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial

• Cure / Technology: Room Temperature Vulcanizing or Curing

A high level of custom engineering and problem solving. Designing electrical shielding components requires a high level of custom engineering and problem solving. Nothing should be left to chance because the goal is to create a part that protects the electronic device (and your customers) from the... [See More]

• Type: Thermally Conductive
• Industry: Electronics; Semiconductors, IC's

• Form / Shape: Foam; Gap Filler, Foam in Place Gasket; Liquid
• Features: EMI/RFI Shielding

bull; CF210A is the newest Fujipoly thermal gap filler. • CF210A incorporates carbon fibers along with traditional fillers found in thermal gap filler materials. • CF210A is rated at 21 W/m •K. • Compliance is closer to a much lower conductivity gap filler (Fujipoly- Sarcon... [See More]

• Type: Thermally Conductive
• Form / Shape: Gap Filler, Foam in Place Gasket

• Chemical System: carbon fibers along with traditional fillers found in thermal gap filler materials
• Industry: Electronics; Semiconductors, IC's

NH nonhardening heat transfer compound is used where thermal expansion and contraction could break the bond of a hardened compound. Typically installed between plate-type heating coils or with systems that require periodic disassembly, NH remains pliable indefinitely, allowing the compound to expand... [See More]

• Type: Thermally Conductive
• Form / Shape: Gap Filler, Foam in Place Gasket; Liquid

• Cure / Technology: Single Component
• Use Temperature: 32 to 410

Win Source Part Number: 1349352-30MM-30MM-25-8810. Category: Fans, Thermal Management - Thermal - Pads, Sheets. Series: 8810. Type: Transfer Tape. Color: White. Package: Bulk. Standard Package: 1. Thickness: 0.0098" (0.250mm). Outline: 30.00mm x 30.00mm. Material: Acrylic. Shape: Square. Adhesive:... [See More]

• Type: Thermally Conductive

• Thermal Conductivity: 0.6000

Mineral-filled VPI resin - semi-flexible for transformers with improved heat dissipation [See More]

• Type: Thermally Conductive
• Composition: Filled

• Chemical System: Alkyd
• Cure / Technology: Thermoset; Single Component

CSF series Carbon Fiber Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Exceptional thermal conductivity options ranging from 15 to 45 W/mK. ◆ Available in various thicknesses from 0.3 to 12.0 mm. ◆ Features natural tackiness for easy application... [See More]

• Type: Thermally Conductive
• Use Temperature: ? to 320

• Industry: Electronics
• Thermal Conductivity: 15

Loctite Circuit+ el conductive paint 2ml [See More]

• Type: Thermally Conductive
• Industry: Thermal Management

• Form / Shape: Bottle

3M Thermally Conductive Epoxy Adhesive TC-2810 Cream is a two component, boron nitride filled adhesive that offers low outgassing, good thermal conductivity, and low chloride ion content. 50 mL Duo-Pak Cartridge. [See More]

• Type: Thermally Conductive
• Cure / Technology: Two Component  

• Chemical System: Epoxy
• Thermal Conductivity: 0.8000 to 1.4

The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal resistance of only 0.05 °C/W for a 0.001 in film with an area of one square... [See More]

• Type: Thermally Conductive

EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]

• Type: Thermally Conductive
• Composition: Unfilled

• Chemical System: Epoxy
• Cure / Technology: Thermoset; Single Component

CHT's QSil 563 is a 2-part, platinum cure, 100% silicone solids elastomer designed for electronic potting and encapsulation applications. QSil 562 offers a hard, low modulus material that is readily repairable. QSil 563 is thermally conductive to aid in efficient heat dissipation. This silicone... [See More]

• Type: Thermally Conductive
• Industry: Automotive; Electronics

• Cure / Technology: Two Component  ; Addition
• Features: Flame Retardant; UL Rating

Hernon Dissipator 745D is a thermally conductive room temperature cure adhesive that is designed for bonding electrical components to heat sink with a controlled gap. Dissipator  745D, through a special shimming property, insulates the component electrically while allowing thermal... [See More]

• Type: Thermally Conductive
• Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial

• Cure / Technology: Room Temperature Vulcanizing or Curing

Fujipoly ® introduces Sarcon ® PG45A its newest high-performance, putty-like thermal interface material. This extremely low modulus gap filler exhibits a thermal resistance as low as 0.02 °C •in2/W at 43.5 PSI with a thermal conductivity of 4.5 W/m °K. Sarcon ® PG45A... [See More]

• Type: Thermally Conductive
• Form / Shape: Putty; Gap Filler, Foam in Place Gasket

• Chemical System: Silicone
• Gap Fill: 0.0591 to 0.0984

SnapTrace is a preformed flexible heat transfer compound designed for rapid, consistent installation over steam trace tubing on straight piping. SnapTrace also includes TFK channel, providing mechanical and weather protection to the installation. Thermon's heat transfer compounds provide an... [See More]

• Type: Thermally Conductive
• Use Temperature: 14 to 450

• Form / Shape: 4ft Lengths; Gap Filler, Foam in Place Gasket
• Thermal Conductivity: 34.61 to 69.23

Win Source Part Number: 1338408-EYG-E0912XD9D. Category: Fans, Thermal Management - Thermal - Pads, Sheets. Series: SSM. Type: Graphite-Pad, Sheet. Color: Gray. Package: Bulk. Usage: Heat Dispersion and Transfer. Standard Package: 10. Thickness: 0.118" (3.00mm). Outline: 115.00mm x 90.00mm. [See More]

• Type: Thermally Conductive

• Thermal Conductivity: 1.6

CSF series Carbon Fiber Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Exceptional thermal conductivity options ranging from 15 to 45 W/mK. ◆ Available in various thicknesses from 0.3 to 12.0 mm. ◆ Features natural tackiness for easy application... [See More]

• Type: Thermally Conductive
• Use Temperature: ? to 320

• Industry: Electronics
• Thermal Conductivity: 35

Fact cure thermally conductive aghesive [See More]

• Type: Thermally Conductive
• Industry: Thermal Management

• Form / Shape: Dual Cartridge; Liquid

Bergquist Gap Filler 1500 Thermally Conductive Adhesive is a two component, liquid gap filling material that is designed as a form-in-place elastomer for fragile electronic assemblies and filling difficult air voids and gaps. It offers excellent shear thinning characteristics, slump resistance,... [See More]

• Type: Thermally Conductive
• Form / Shape: Gap Filler, Foam in Place Gasket

• Cure / Technology: Two Component  
• Thermal Conductivity: 1.8

SILICON GREASE 5 OZ TUBE [See More]

• Type: Thermally Conductive

EP3HTND-2Med Black is a one part system that combines easy processing with excellent bonding properties. It cures in 20-30 minutes at 250°F or 5-10 minutes at 300°F and adheres well to a wide variety of substrates including glass, metals, ceramics and most plastics. This paste compound meets USP... [See More]

• Type: Thermally Conductive
• Composition: Unfilled

• Chemical System: Epoxy
• Cure / Technology: Thermoset; Single Component

CHT's SE3000 is a 2-part, platinum cure silicone elastomer designed for electronic potting and encapsulation applications. It offers good prtection against chemicals, environmental contamination, mechanical shock, vibration and impact damage. SE3000 can be used in applications where low flammability... [See More]

• Type: Thermally Conductive
• Industry: Electronics

• Cure / Technology: Two Component  ; Addition
• Features: Flame Retardant; UL Rating

Hernon Dissipator 746D is a thermally conductive adhesive formulated for bonding electrical components to heat sinks or printed circuit boards. Fast room temperature cure combined with excellent heat dissipation for thermally sensitive components and controlled strength for service repair provide... [See More]

• Type: Thermally Conductive
• Cure / Technology: Room Temperature Vulcanizing or Curing

• Chemical System: Silicone
• Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial

Fujipoly ® America announces the release of its new SARCON ® SPG-70A. It is a high flow rate, high heat transferring compound that exhibits a thermal conductivity of 7.0 W/m °K and has the lowest thermal resistance among our dispensable SPG products. When applied between heat-generating... [See More]

• Type: Thermally Conductive
• Form / Shape: Gap Filler, Foam in Place Gasket; Grease, Paste

• Chemical System: Silicone
• Industry: Electronics

T-3 heat transfer compound now has higher temperature ratings than ever before while still creating an efficient thermal bond between a steam or electric heater and process pipes or equipment. A single "Thermonized ™"steam tracer utilizing Thermon's heat transfer compound is more cost... [See More]

• Type: Thermally Conductive
• Form / Shape: Gap Filler, Foam in Place Gasket; Grease, Paste

• Cure / Technology: Single Component
• Use Temperature: 32 to 850

Win Source Part Number: 1351385-EYG-T7070A20A. Category: Fans, Thermal Management - Thermal - Pads, Sheets. Series: Graphite-PAD. Type: Graphite-Pad, Sheet. Color: Black. Package: Bulk. Usage: Through-Plane Heat Transfer. Standard Package: 4. Thickness: 0.0790" (2.000mm). Outline: 70.00mm x 70.00mm. [See More]

• Type: Thermally Conductive

• Thermal Conductivity: 13

The SHEEN's SP Series Phase Change Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.8 to 6.0 W/m ·K. ◆ Low thermal impedance, reaching as low as 0.015 ℃*in ²/W at 50psi, ensuring... [See More]

• Type: Thermally Conductive
• Use Temperature: -40 to 257

• Industry: Electronics
• Thermal Conductivity: 6

Fact cure thermally conductive aghesive [See More]

• Type: Thermally Conductive
• Industry: Thermal Management

• Form / Shape: Dual Cartridge; Liquid

Bergquist Gap Filler 2000 Thermally Conductive Adhesive is a two component, liquid gap filling material that is designed as a form-in-place elastomer for coupling hot electronic components. It cures at room or elevated temperatures and offers mechanical and chemical stability. 50 cc Cartridge. [See More]

• Type: Thermally Conductive
• Form / Shape: Gap Filler, Foam in Place Gasket

• Cure / Technology: Two Component  
• Thermal Conductivity: 2

SILICON GREASE 8 OZ JAR [See More]

• Type: Thermally Conductive

One part, nano silica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]

• Type: Thermally Conductive
• Composition: Filled

• Chemical System: UV Curing
• Cure / Technology: UV or Radiation Cured; Single Component; Dual Curing

CHT's QSil 553 is a 2-part, platinum cure, silicone potting compound and encapsulant designed to protect electronic components from harsh environmental conditions and shock and vibration. It features a low viscosity for convenient dispensing and will easily flow throughout components. Because of its... [See More]

• Type: Thermally Conductive
• Industry: Automotive; Electronics; OEM or Industrial

• Cure / Technology: Two Component  ; Addition
• Features: Flame Retardant; UL Rating

Silicone Gap Filler Pad for Absorption of Electromagnetic Wave. Features. Effective to absorb and damp a wide range of electromagnetic waves. Also effective as a high performance thermal interface material. Easily filling small gaps of IC chip surface with soft gel texture. Good workability to... [See More]

• Type: Thermally Conductive
• Form / Shape: Gap Filler, Foam in Place Gasket

• Chemical System: Silicone
• Gap Fill: 0.0197 to 0.0984

The New & Improved T-85 is a pre-mixed epoxy-based heat transfer compound with higher temperature ratings and the highest possible bond strength for use in moist and corrosive environments. T-85 is typically utilized on pumps, valves and equipment where maximum bond strength for tracing installation... [See More]

• Type: Thermally Conductive
• Form / Shape: Die Bonding Adhesives; Grease, Paste

• Cure / Technology: Single Component
• Use Temperature: 32 to 450

Win Source Part Number: 1351452-HF115AC-0.0055-AC-90. Category: Fans, Thermal Management - Thermal - Pads, Sheets. Series: Hi-Flow ® 115-AC. Type: Pad, Sheet. Color: Gray. Package: Bulk. Usage: TO-218, TO-220, TO-247. Standard Package: 100. Thickness: 0.0055" (0.140mm). Outline: 21.84mm x... [See More]

• Type: Thermally Conductive

• Thermal Conductivity: 0.8000

The SHEEN's SF Series Silicone Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.5 to 15.0 W/m ·K. ◆ Available in various thicknesses from 0.3 to 10.0 mm. ◆ Highly compressible, soft,... [See More]

• Type: Thermally Conductive
• Use Temperature: -58 to 392

• Industry: Electronics
• Thermal Conductivity: 4

Slow cure thermally conductive aghesive [See More]

• Type: Thermally Conductive
• Industry: Thermal Management

• Form / Shape: Dual Cartridge; Liquid

Bergquist Liqui-Bond SA 2000 is a one component, thermally conductive silicone adhesive that is used for structural bonding applications that are exposed to extreme environments. It cures at elevated temperatures and has excellent mechanical and chemical stability. 600 cc Cartridge. [See More]

• Type: Thermally Conductive
• Cure / Technology: Single Component

• Chemical System: Silicone
• Thermal Conductivity: 2

SILICON GREASE 5 LB CAN [See More]

• Type: Thermally Conductive

MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]

• Type: Electrically Conductive; Thermally Conductive
• Composition: Filled

• Chemical System: Silicone
• Cure / Technology: Thermoset; Two Component  ; Addition Cure

FEATURES: • Highly Conformable and High Heat Conducting Gel materials. • SARCON Thermal Gap Filler Pads are highly conformable and high heat conducting gel materials in a versatile sheet form. • Easily fit and adhere to most all shapes and sizes of components, including protrusions... [See More]

• Type: Thermally Conductive
• Form / Shape: Gap Filler, Foam in Place Gasket

• Chemical System: Silicone
• Gap Fill: 0.0118 to 0.0787

T-99 is a specialty high temperature heat transfer compound formulated to provide high thermal stability and bond strength up to 1204°C (2200°F). Unlike other grades of heat transfer compounds, it is also electrically non-conductive (when cured). It is supplied ready to use and may be applied by... [See More]

• Type: Thermally Conductive
• Form / Shape: Die Bonding Adhesives; Grease, Paste

• Cure / Technology: Single Component
• Use Temperature: 32 to 2200

Manufacturer: AMIS. Category: Fans, Thermal Management - Thermal - Pads, Sheets. Packaging: Bulk. Part Status: Obsolete. Capacitance: 0.22 μF. Tolerance: ±20%. Voltage - Rated: 160 V. Type: Header, Male Pins, Shrouded (4 Side). ESR (Equivalent Series Resistance): 100mOhm @ 100kHz. [See More]

• Type: Thermally Conductive

The SHEEN's SE Series two-component Thermal Gel are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, available in options ranging from 2.0 to 8.0 W/m ·K. ◆ Soft and elastic after curing, maintaining the required thickness and providing... [See More]

• Type: Thermally Conductive
• Form / Shape: Gel

• Chemical System: Silicone
• Industry: Electronics

Slow cure thermally conductive aghesive [See More]

• Type: Thermally Conductive
• Industry: Thermal Management

• Form / Shape: Dual Cartridge; Liquid

Dow DOWSIL ™ 1-4173 Thermally Conductive Adhesive Gray is a one component, solvent free adhesive that is used for bonding electronic components, housings, lids, base plates, and dispensing equipment. It is heat curing, self-leveling, flowable, good thermal conductivity, and has high tensile... [See More]

• Type: Thermally Conductive
• Thermal Conductivity: 1.8

• Cure / Technology: Single Component
• Viscosity: 61000

The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal resistance of only 0.05 °C/W for a 0.001 in film with an area of one square... [See More]

• Type: Thermally Conductive

EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]

• Type: Thermally Conductive
• Composition: Unfilled

• Chemical System: Epoxy
• Cure / Technology: Thermoset; Single Component

Highly Conformable and High Heat Conducting gel materials. SARCON ® Thermal Gap Filler Pads are highly conformable and high heat conducting gel materials in a versatile sheet form. They easily fit and adhere to most all shapes and sizes of components, including protrusions and recessed areas. [See More]

• Type: Thermally Conductive
• Form / Shape: Gap Filler, Foam in Place Gasket; Gel

• Chemical System: Silicone
• Gap Fill: 0.0394 to 0.1181

Win Source Part Number: 1349626-TG-A1250-150-150-1.0. Category: Fans, Thermal Management - Thermal - Pads, Sheets. Series: TG-A1250. Type: Gap Filler Pad, Sheet. Color: Green. Package: Bulk. Usage: Multi. Standard Package: 1. Thickness: 0.0394" (1.000mm). Outline: 150.00mm x 150.00mm. Material:... [See More]

• Type: Thermally Conductive

• Thermal Conductivity: 12.5

The SHEEN's TIV800 Series RTV Thermal Conductive Adhesive are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, available in options ranging from 1.0 to 2.0 W/m ·K. ◆ High bonding performance. ◆ Good stability, long-term high... [See More]

• Type: Thermally Conductive
• Industry: Electronics

• Chemical System: Silicone
• Use Temperature: -58 to 392

Silver loaded epoxy adhesive,10gm 2 vial [See More]

• Type: Thermally Conductive
• Industry: Thermal Management

• Form / Shape: Can; Liquid
• Use Temperature: 302

Dow DOWSIL ™ 1-4173 Thermally Conductive Adhesive Gray is a one component, heat curing silicone that is used for bonding heat sinks, housings, base plates, lids, and circuit applications. It provides flowability, chemical stability, and resistance to shock, ozone, stress, and environmental... [See More]

• Type: Thermally Conductive
• Thermal Conductivity: 1.9

• Cure / Technology: Single Component
• Tensile (Break): 900

The 126 Series is a nontoxic, synthetic, ester-based (nonsilicone) Thermal Joint Compound with metal oxide fillers designed to enhance thermal performance characteristics of plastic and metal package devices exceeding that of silicone-based compounds. Solved are problems associated with... [See More]

• Type: Thermally Conductive

Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]

• Type: Electrically Conductive; Thermally Conductive
• Composition: Filled

• Chemical System: Polyphenylene Sulfide; Epoxy
• Cure / Technology: Thermoset; Single Component

Fujipoly ® recently released Sarcon ® GR130A, its newest high-performance, thermal gap filler pad. The highly conformable, gel-like sheets exhibit a thermal resistance as low as 0.02 °C •in2/W at 43.5 PSI with a thermal conductivity of 13 W/m °K. Sarcon ® GR130A is available... [See More]

• Type: Thermally Conductive
• Form / Shape: Gap Filler, Foam in Place Gasket

• Chemical System: Silicone
• Gap Fill: 0.0118 to 0.0787

Win Source Part Number: 1350281-TG-A2030-24-21.01-3.0. Category: Fans, Thermal Management - Thermal - Pads, Sheets. Series: TG2030. Type: Conductive Pad, Sheet. Color: White. Package: Box. Standard Package: 1. Thickness: 0.118" (3.00mm). Outline: 24.00mm x 21.01mm. Material: Silicone Elastomer. [See More]

• Type: Thermally Conductive

• Thermal Conductivity: 2

The SHEEN's SC Series Thermal Films are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 0.8 to 5.0 W/m ·K. ◆ Optional fiberglass or polyimide film can be used as the reinforcement carrier. ◆ High mechanical... [See More]

• Type: Thermally Conductive
• Industry: Electronics

• Chemical System: Silicone
• Use Temperature: -58 to 392

DP810 LWODR ACR ADH GN 400 mL CAR 6 /CV [See More]

• Type: Thermally Conductive
• Industry: OEM or Industrial; Industrial, Thermal Management

• Form / Shape: Dual Cartridge; Liquid

Dow DOWSIL ™ 1-4174 Thermally Conductive Adhesive Gray is a one component, solvent free, silicone polymer that is used for bonding electronic components, housings, lids, base plates, and heat sinks. It is heat curing, self-leveling, flowable, high tensile strength, and allows controlled bond... [See More]

• Type: Thermally Conductive
• Thermal Conductivity: 1.9

• Cure / Technology: Single Component
• Tensile (Break): 900

THERMAL COMPOUND SYNTHETIC 4 OZ TUBE [See More]

• Type: Thermally Conductive

EP35SP is a two component epoxy system specially formulated to resist high temperatures and aggressive chemicals. It has a paste viscosity with little to no flow when curing. [See More]

• Type: Thermally Conductive
• Composition: Unfilled

• Chemical System: Epoxy
• Cure / Technology: Thermoset; Two Component  

Fujipoly ® USA introduces new 5 and 6W/m-K SARCON ® thermally conductive greases to the North American market. SARCON ® SG-50NS and SG-60NS greases offer excellent stability over wide temperature ranges with low thermal resistance. They feature exceptionally low bleed and evaporation as... [See More]

• Type: Thermally Conductive
• Industry: Electronics

• Form / Shape: Grease, Paste
• Thermal Conductivity: 5 to 6

Win Source Part Number: 1340483-TG-A20KF-190-140-1.5. Category: Fans, Thermal Management - Thermal - Pads, Sheets. Series: TG-A20KF. Type: Pad, Sheet. Color: Gray. Package: Bulk. Usage: Multi. Standard Package: 1. Thickness: 0.0591" (1.500mm). Outline: 190.00mm x 140.00mm. Material: Silicone. Shape:... [See More]

• Type: Thermally Conductive

• Thermal Conductivity: 1.8

The SHEEN's SC Series Thermal Films are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 0.8 to 5.0 W/m ·K. ◆ Optional fiberglass or polyimide film can be used as the reinforcement carrier. ◆ High mechanical... [See More]

• Type: Thermally Conductive
• Industry: Electronics

• Chemical System: Silicone
• Use Temperature: -58 to 392

Loctite 3875 pt A [See More]

• Type: Thermally Conductive
• Industry: Thermal Management

• Chemical System: Acrylic

Dow DOWSIL ™ 3-1818 Thermally Conductive Adhesive Gray is a one component, thixotropic adhesive that is used for bonding with common materials in the electronics industry. It has a fast heat cure, glass beads for controlling bond line thickness, self priming, good dielectric properties, and... [See More]

• Type: Thermally Conductive
• Industry: Electronics

• Cure / Technology: Single Component
• Thermal Conductivity: 1.8

The 126 Series is a nontoxic, synthetic, ester-based (nonsilicone) Thermal Joint Compound with metal oxide fillers designed to enhance thermal performance characteristics of plastic and metal package devices exceeding that of silicone-based compounds. Solved are problems associated with... [See More]

• Type: Thermally Conductive

EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]

• Type: Thermally Conductive
• Composition: Unfilled

• Chemical System: Epoxy
• Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing

SARCON ® PG130A from Fujipoly ® is one of the industry ’s newest high-performance thermal interface materials that is extremely compressible. This double-sticky surface TIM is a great choice for applications that have delicate or wide-variation component heights and require extremely... [See More]

• Type: Thermally Conductive
• Gap Fill: 0.0118 to 0.0787

• Form / Shape: Putty; Gap Filler, Foam in Place Gasket
• Industry: Electronics; Semiconductors, IC's

Win Source Part Number: 1352186-TG-T1000-151.5-148-0.25-5PT. Category: Fans, Thermal Management - Thermal - Pads, Sheets. Series: TG-T1000. Type: Tape. Color: White. Package: Bulk. Usage: Multi. Standard Package: 100. Thickness: 0.0100" (0.254mm). Outline: 151.50mm x 148.00mm. Material: Acrylic... [See More]

• Type: Thermally Conductive

• Thermal Conductivity: 1

The SHEEN's SF Series Silicone Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.5 to 15.0 W/m ·K. ◆ Available in various thicknesses from 0.3 to 10.0 mm. ◆ Highly compressible, soft,... [See More]

• Type: Thermally Conductive
• Use Temperature: -40 to 248

• Industry: Electronics
• Thermal Conductivity: 15

Silicone heat transfer compound HTSP 50T [See More]

• Type: Thermally Conductive
• Form / Shape: Tube

• Chemical System: Silicone
• Industry: Thermal Management

Dow DOWSIL ™ 3-6752 Thermally Conductive Adhesive Gray is a one component, heat curing silicone that is used to cool electronic applications and bond with metals, ceramics, filled plastics, epoxy laminates, and organic substrates. It is flame resistant, self leveling, flowable, thixotropic,... [See More]

• Type: Thermally Conductive
• Industry: Semiconductors, IC's

• Cure / Technology: Single Component
• Thermal Conductivity: 1.8

NONSILICONE GREASE 5LB CAN [See More]

• Type: Thermally Conductive

EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]

• Type: Thermally Conductive
• Composition: Unfilled

• Chemical System: Epoxy
• Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing

SARCON® Extremely Compressible Gap Filler Type (Putty Type) is a highly conformable, thermally conductive, non-flammable interface materials. The surface consistency is excellent for filling small air gaps and uneven mating surface, making reliable contact with various shapes and sizes of... [See More]

• Type: Thermally Conductive
• Industry: Electronics; Semiconductors, IC's

• Form / Shape: Putty; Gap Filler, Foam in Place Gasket
• Use Temperature: -40 to 302

Win Source Part Number: 1338803-THJP0805AST1. Category: Fans, Thermal Management - Thermal - Pads, Sheets. Series: ThermaWick ™. Type: Thermal Bridge Jumper. Package: Tape & Reel. Usage: Heat Transfer. Standard Package: 1,000. Thickness: 0.0030" (0.076mm). Outline: 2.01mm x 0.84mm. [See More]

• Type: Thermally Conductive

• Thermal Conductivity: 77

The SHEEN's SG560 Series Thermal Grease are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, available in options ranging from 1.0 to 5.0 W/m ·K. ◆ Low thermal impedance, with a minimum of 0.015 ℃*in ²/W at 30psi. ◆ Minimum... [See More]

• Type: Thermally Conductive
• Industry: Electronics

• Form / Shape: Grease, Paste
• Use Temperature: ? to 302

TECBOND 280 Trans Yellow glue stick 5kg [See More]

• Type: Thermally Conductive
• Industry: Bonding

• Form / Shape: Stick

Dow DOWSIL ™ 340 Heat Sink Compound White is a one component, grease like silicone that is used for thermal coupling of electrical components to heat sinks. It is non-flowing, non-curing, thermally conductive, low bleed, and has high temperature stability. 142 g Tube. [See More]

• Type: Thermally Conductive
• Thermal Conductivity: 0.6700

• Cure / Technology: Single Component
• Dielectric Strength: 210

DeltaBond ™ 152 adhesive is ideal for general cementing; thermally bonding semiconductors and components to chassis or heat sinks, while electrically isolating one from the other; fabricating heat sinks or thermal links; and for all permanent bonding of assemblies which require high thermally... [See More]

• Type: Thermally Conductive

MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]

• Type: Thermally Conductive
• Composition: Unfilled

• Chemical System: Silicone
• Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing

SARCON ® SPG-25B-NS from Fujipoly ® is an easy to dispense, low- viscosity, silicone free compound that exhibits a thermal conductivity of 2.5 W/m °K and a thermal resistance of only 2.1 °K •cm2/W. When applied between heat-generating components and a nearby heat sink or... [See More]

• Type: Thermally Conductive
• Industry: Electronics

• Form / Shape: Gap Filler, Foam in Place Gasket; Grease, Paste
• Use Temperature: -40 to 248

Win Source Part Number: 1338252-THJP1206ABT1. Category: Fans, Thermal Management - Thermal - Pads, Sheets. Series: ThermaWick ™. Type: Thermal Bridge Jumper. Package: Tape & Reel. Usage: Heat Transfer. Standard Package: 1,000. Thickness: 0.0030" (0.076mm). Outline: 3.20mm x 1.60mm. [See More]

• Type: Thermally Conductive

• Thermal Conductivity: 65

The SHEEN's AF Series Silicone-free Thermal Pads (Non-silicone Thermal Pads) are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.0 to 8.0 W/m ·K. ◆ Available in various thicknesses from 0.5 to 5.0 mm. ◆... [See More]

• Type: Thermally Conductive
• Industry: Electronics

• Chemical System: Silicone
• Use Temperature: -40 to 248

TECBOND LM41 White glue sticks [See More]

• Type: Thermally Conductive

• Form / Shape: Stick

Dow DOWSIL ™ 340 Heat Sink Compound White is a one component, grease like silicone that is used for thermal coupling of electrical components to heat sinks. It is non-flowing, non-curing, thermally conductive, low bleed, and has high temperature stability. 9 kg Pail. [See More]

• Type: Thermally Conductive
• Thermal Conductivity: 0.6700

• Cure / Technology: Single Component
• Dielectric Strength: 210

Richardson RFPD, an Arrow Company, is a specialized electronic component distributor providing design engineers with deep technical expertise and localized global design support for the latest new products from the world's leading suppliers of RF, Wireless, Energy and Power Technologies. [See More]

• Type: Thermally Conductive

MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]

• Type: Thermally Conductive
• Composition: Filled

• Chemical System: Silicone
• Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing

Fujipoly ® recently introduced a comprehensive engineering kit that includes free samples of (20) different Sarcon ® Thermal Interface Materials. The sample kit gives engineers the flexibility to test the performance properties of multiple Sarcon ® materials in order to find the perfect... [See More]

• Type: Thermally Conductive

• Industry: Electronics; Semiconductors, IC's

Manufacturer: Panasonic Electronic Components. Win Source Part Number: 1093166-EYG-S0918ZLX2. Color: Gray. Usage: Sheet. Thickness: 0.0079" (0.200mm). Outline: 90.00mm x 180.00mm. Material: Graphite. Shape: Rectangle. Thermal Conductivity: 20 W/m-K. Categories: Fans, Thermal Management. Status:... [See More]

• Type: Thermally Conductive

• Thermal Conductivity: 20

BERGQUIST ® GAP FILLER TGF 3500LVO is a silicone, two-component, high thermal conductivity, liquid gap filler. This product offers the mechanical property benefits of a silicone material with the additional feature of low outgassing. It can be used in industries ranging from automotive to... [See More]

• Type: Thermally Conductive
• Cure / Technology: Thermoset

• Chemical System: Silicone
• Form / Shape: Gap Filler, Foam in Place Gasket; Liquid

Our innovative, non-silicone thermal compounds provide an ideal thermal solution by ensuring reliable heat transfer over a longer time than most industrial thermal interface materials. Conventional, silicone-based heat sink compounds and thermal greases tend to spread after a number of heating and... [See More]

• Type: Thermally Conductive
• Composition: Unfilled

• Chemical System: Synthetic Based
• Cure / Technology: Single Component

Sauereisen Adhesive Paste No. 19 is an inorganic, odorless, nontoxic cement used for bonding glass, porcelain, wood, felt, cork, metals and ceramic fiber. Some typical applications include protection of exposed metal surfaces during heat treating, bonding wallboard to brick or concrete and cementing... [See More]

• Type: Thermally Conductive
• Composition: Unfilled

• Chemical System: Ceramic
• Cure / Technology: Single Component

Ohmite thermal interface materials (TIMs) are designed for use in applications requiring reliable performance, low contact resistance, long life, low maintenance and high thermal conductivity. The flexible graphite materials are die-cut to ensure exact fit and reduce module-to-module variation... [See More]

• Type: Thermally Conductive
• Industry: Electronics; Electric Power; OEM or Industrial

• Chemical System: Flexible Graphite Material
• Use Temperature: -40 to 752

The 10-2055 and 10-2055 HV were developed to produce a general purpose, semi flexible polyurethane adhesive for bonding a wide variety of plastic and metal substrates. The flexibility of these adhesives allows bonding to substrates with high coefficients of thermal expansion (CTE) and substrates... [See More]

• Type: Thermally Conductive
• Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing

• Chemical System: Polyurethane
• Form / Shape: Die Bonding Adhesives; Grease, Paste

Elecolit ® 6603 is a thermally conductive epoxy with very good metal adhesion and slight flexibility. This grade has very good flow behavior and can easily be processed using a dispenser, spreading knife or spatula. Although designed for bonding applications, 6603 can also be used as a potting... [See More]

• Type: Electrically Conductive; Thermally Conductive
• Cure / Technology: Thermoset

• Chemical System: Epoxy
• Industry: Electronics

EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries.  Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]

• Type: Thermally Conductive
• Cure / Technology: Thermoset; Two Component  

• Chemical System: Epoxy
• Form / Shape: Grease, Paste

HERNON ® offers a complete line of structural acrylic adhesives. These systems are two-part, no mix, and reactive adhesives. Each acrylic adhesive has two components: the adhesive base or resin, and the Activator. Structural acrylic adhesives are termed “reactive ” cure systems. The... [See More]

• Type: Thermally Conductive
• Cure / Technology: Two Component  ; Reactive or Moisture Cured

• Chemical System: Acrylic
• Form / Shape: Grease, Paste

Gap Pad ® 1000HD was designed to with-stand applications requiring high durability. The coated polyimide carrier on one side of the material allows easy rework, excellent handling characteristics and puncture resistance. The conformable and elastic nature of Gap Pad ® 1000HD allows excellent... [See More]

• Type: Thermally Conductive

• Industry: Electronics

WACKER ’s silicone adhesives and sealants are based on many years of experience, innovative research and comprehensive technological expertise. In a wide variety of industries, especially in lighting technology, flowable or non-sag silicone products offer decisive advantages in performance and... [See More]

• Type: Thermally Conductive
• Industry: Electronics

• Chemical System: Silicone; Elastomeric

NanoFoil ® Bundle Kits are small quantities of NanoFoil ® in pre-made forms on tape & reel. The kit consists of small preforms, including 0.5", 1", and 2" squares available in thicknesses of 40 microns or 60 microns. The bundle kits are available in standard NanoFoil only; however,... [See More]

• Type: Thermally Conductive
• Industry: Semiconductors, IC's

• Chemical System: Metal

Metal Oxide Thickened Dimethyl Silicone Compound. Description. Bluesil V-740 is a metal oxide thickened dimethyl silicone compound. It is a white, heavy paste used for heat dissipation applications where high thermal conductivity is required. [See More]

• Type: Thermally Conductive
• Cure / Technology: Two Component  

• Chemical System: Silicone
• Form / Shape: Grease, Paste

PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]

• Type: Electrically Conductive; Thermally Conductive
• Composition: Unfilled

• Chemical System: Silicone
• Cure / Technology: Thermoset; Two Component  

Introducing Arctic Alumina Thermal Compound, the first ceramic-based, polysynthetic thermal compound for use between modern high-power CPUs and high performance heatsinks or water-cooling solutions. Features: Made with micronized aluminum oxide and boron nitride: Arctic Alumina uses a layered... [See More]

• Type: Thermally Conductive

INSTAbond ® 809FR. INSTAbond ® 809 FR exhibits good thermal conductivity, excellent flow properties, and low exotherm characteristics in large masses. INSTAbond ® 809 FR meets the requirements for UL-94 V-0 rating for flame retardancy. [See More]

• Type: Thermally Conductive
• Cure / Technology: Two Component  

• Chemical System: Epoxy
• Features: Flame Retardant; UL Rating

LiPOLY DTT44 is a soft thermally conductive gel pad specifically designed for networking applications. DTT44 is designed to focus on Dk and Df to reduce interference in RF modules. DTT44 has a thermal conductivity of 3.0 W/m*K. This product can be supplied as standard sheets, custom die-cuts or... [See More]

• Type: Thermally Conductive
• Form / Shape: Sheet Form, Die-cut Parts

• Chemical System: Silicone
• Gap Fill: 0.0197 to 0.1969

Aremco offers an expansive range of ceramic-based materials used for the assembly of high temperature, high power electrical devices, and high temperature fixtures, molds and tooling. These materials, based on aluminum oxide, aluminum nitride, magnesium oxide, silicon dioxide, silicon carbide,... [See More]

• Type: Thermally Conductive
• Industry: Electronics

• Form / Shape: Liquid; Encapsulant or Conformal Coating
• Features: Dissimilar Substrates

About Us. ArKco Sales, Inc was founded in 1977 as an electro-mechanical manufacturer ’s representative, with heavy emphasis on the engineering community, serving customers, distributors, and principals. ArKco Sales facilitates synergistic, innovative, global product solutions for current and... [See More]

• Type: Thermally Conductive

BERGQUIST GAP PAD TGP 1350, Highly Conformable, Thermally Conductive, Reworkable Gap Filling Material. BERGQUIST ® GAP PAD TGP 1350 is a highly compliant Gap Pad material that is ideal for fragile component leads. The material includes a PEN film, which facilitates rework and improves puncture... [See More]

• Type: Thermally Conductive
• Form / Shape: Gap Filler, Foam in Place Gasket

• Chemical System: Silicone

Air Set Cements set or cure through loss of moisture by evaporation. Atmospheric conditions therefore affect the drying rate. Air Set Cements are used mainly in thin film applications (applied in thicknesses less than 1/4")*. SELECTION CRITERIA FOR CEMENTS. 1. Type of Application Potting, sealing,... [See More]

• Type: Thermally Conductive
• Cure / Technology: Two Component   (optional feature); Single Component (optional feature)

• Chemical System: Ceramic
• Form / Shape: Liquid (optional feature); Powder (optional feature); Encapsulant or Conformal Coating

Thermal Interface Materials - Gap Fillers and Pads, Films, Tapes, Hardware. Electronic devices continue to become faster, smaller, and more powerful every day, enabling technological advancements across all industries. The Internet of Things, powered by embedded electronics and its complex... [See More]

• Type: Thermally Conductive

• Form / Shape: Gap Filler, Foam in Place Gasket

Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame... [See More]

• Type: Thermally Conductive
• Form / Shape: Liquid

• Cure / Technology: Thermoset; Two Component  
• Industry: Electronics

BERGQUIST ® GAP PAD TGP 10000ULM is an extremely soft gap filling material rated at a thermal conductivity of 10.0 W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the... [See More]

• Type: Thermally Conductive
• Industry: OEM or Industrial

• Chemical System: Silicone
• Use Temperature: -76 to 392

Sauereisen Cement No. 31 is a white, porcelain-like cement that is widely used throughout industry in a variety of applications. including assembling, sealing, insulating and cementing of ceramics, porcelain, metal, and glass. [See More]

• Type: Thermally Conductive
• Composition: Unfilled

• Chemical System: Ceramic
• Cure / Technology: Two Component  ; Chemically Set

50-3150 FR has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-3150 FR Black Epoxy with Catalyst 190 and Catalyst 105 are listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low shrinkage, and outstanding insulation... [See More]

• Type: Thermally Conductive
• Composition: Unfilled

• Chemical System: Epoxy
• Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing

MG Chemicals 8331 is a Silver Conductive Epoxy with a moderate cure time and high conductivity. This is an economical electronic epoxy with good electrical and thermal conductivities. The adhesive bonds very well to a variety of surfaces, it resists thermal and mechanical shocks and provides the low... [See More]

• Type: Electrically Conductive; Thermally Conductive
• Cure / Technology: Thermoset

• Chemical System: Epoxy
• Industry: Electronics

The new Gap Pad 1000SF is a thermally conductive, electrically insulating, silicone-free polymer specially designed for silicone-sensative applications. The material is ideal for applications with high standoff and flatness tolerances. Gap Pad 1000SF is reinforced for easy material handling and... [See More]

• Type: Thermally Conductive

• Industry: Electronics

ELASTOSIL ® RT 675 A/B is a pourable, addition-curing RTV-2 silicone rubber. [See More]

• Type: Thermally Conductive
• Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing

• Chemical System: Silicone; Elastomeric
• Form / Shape: Liquid

Thickness of NanoFoil ®: 40 microns. Size of NanoFoil ®: .5 inch squares. Qty Per Bundle: 100 each. NanoFoil ® Bundle Kits are small quantities of NanoFoil ® in pre-made forms on tape & reel. The kit consists of small preforms, including 0.5", 1", and 2" squares available in... [See More]

• Type: Thermally Conductive
• Industry: Semiconductors, IC's

• Chemical System: Metal

Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for production needs. One... [See More]

• Type: Electrically Conductive; Thermally Conductive
• Composition: Filled

• Chemical System: Epoxy
• Cure / Technology: Thermoset; Single Component

Introducing Arctic Alumina Thermal Compound, the first ceramic-based, polysynthetic thermal compound for use between modern high-power CPUs and high performance heatsinks or water-cooling solutions. Features: Made with micronized aluminum oxide and boron nitride: Arctic Alumina uses a layered... [See More]

• Type: Thermally Conductive

LiPOLY DTT65 is a soft thermally conductive gel pad specifically designed for networking applications. DTT65 is designed to focus on Dk and Df to reduce interference in RF modules. DTT65 has a thermal conductivity of 5.0 W/m*K. This product can be supplied as standard sheets, custom die-cuts or... [See More]

• Type: Thermally Conductive
• Form / Shape: Sheet Form, Die-cut Parts

• Chemical System: Silicone
• Gap Fill: 0.0197 to 0.1969

High fired strength, dense ceramics [See More]

• Type: Thermally Conductive
• Composition: Filled

• Chemical System: Ceramic
• Cure / Technology: Thermoset

LOCTITE ABLESTIK 2000T, Proprietary Hybrid Chemistry, Die Attach, Electrically Conductive Adhesive LOCTITE ® ABLESTIK 2000T electrically conductive adhesive is designed for die attach applications. It features high thermal conductivity and high adhesion to a variety of substrates. High thermal... [See More]

• Type: Thermally Conductive

• CTE: 27

Chemical Set Cements set or cure by an internal chemical action which does not require exposure to air. Chemical Set Cements can be used in thick applications (applied in thicknesses greater than 1/4")*. SELECTION CRITERIA FOR CEMENTS. 1. Type of Application Potting, sealing, encapsulating,... [See More]

• Type: Thermally Conductive
• Cure / Technology: Two Component   (optional feature); Single Component (optional feature)

• Chemical System: Ceramic
• Form / Shape: Liquid (optional feature); Powder (optional feature); Encapsulant or Conformal Coating

DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity). Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI-COAT R-4721 is easy to... [See More]

• Type: Thermally Conductive
• Form / Shape: Liquid

• Cure / Technology: Thermoset; Two Component  
• Industry: Electronics

BERGQUIST ® GAP PAD TGP 5000 is a silicone based, thermally conductive, fiberglass reinforced and S-class soft gap pad. Its highly conformable nature and S-class softness ensures that it conforms to demanding contours and maintains structural integrity. Fiberglass reinforcement provides... [See More]

• Type: Thermally Conductive
• Industry: OEM or Industrial

• Chemical System: Silicone
• Use Temperature: -76 to 392

20-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 20-2366 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical... [See More]

• Type: Thermally Conductive
• Composition: Unfilled

• Chemical System: Polyurethane; Elastomeric
• Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing

MG Chemicals 8329TCM is a medium cure thermally conductive epoxy adhesive which has a convenient 1:1 mix ratio and a 45 minute work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to mechanical shocks and... [See More]

• Type: Thermally Conductive
• Cure / Technology: Thermoset

• Chemical System: Epoxy
• Industry: Electronics

Gap Pad ® 1450 is a highly compliant Gap Pad material that is ideal for fragile component leads. The material includes a permanent liner, which facilitates rework and improves puncture resistance and handling characteristics. The un-lined side of Gap Pad ® 1450 maintains a conformable, yet... [See More]

• Type: Thermally Conductive

• Industry: Electronics

Several low melting point Indalloy ® alloys are liquid at room temperature. These gallium-based alloys are non-toxic replacements for mercury. The gallium-based alloys have far lower vapor pressure than mercury, reducing both the amount and toxicity of metal vapor exposure. Excellent Thermal and... [See More]

• Type: Thermally Conductive
• Form / Shape: Liquid

• Chemical System: Metal
• Industry: Semiconductors, IC's

Epoxy system designed for underfill applications. This material is fast flowing and provides excellent properties for common device packaging. [See More]

• Type: Thermally Conductive
• Cure / Technology: Thermoset; Single Component

• Chemical System: Epoxy
• Form / Shape: Die Bonding Adhesives; Liquid

Introducing Arctic Silver 5 With its unique high-density filling of micronized silver and enhanced thermally conductive ceramic particles, Arctic Silver 5 provides a new level of performance and stability. Arctic Silver 5 is optimized for use between modern high-power CPUs and high performance... [See More]

• Type: Thermally Conductive

LiPOLY G566 Graphite Sheet has great thermal conductivity on the X and Y axis. The thermal conductivity is 1700W/m*K. It is flexible, which is suitable for thin products and high capability mobile devices. [See More]

• Type: Thermally Conductive
• Form / Shape: Sheet Form, Die-cut Parts

• Chemical System: Graphite
• Gap Fill: 8.27E-4

Aremco ’s high temperature ceramic adhesives are unique inorganic formulations for bonding and sealing ceramics, metals, quartz, graphites, textiles, and composite materials used in design, process and maintenance applications to 3200 °F. These advanced materials, which exhibit high... [See More]

• Type: Electrically Conductive; Thermally Conductive
• Form / Shape: Grease, Paste

• Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
• Industry: Electronics

LOCTITE ABLESTIK 84-1LMIT, Epoxy, Component assembly, Electrically Conductive Adhesive. LOCTITE ® ABLESTIK 84-1LMIT adhesive is designed for medium die attach applications. This adhesive is ideal for application by syringe dispensing or screen printing. Electrically conductive. High thermal... [See More]

• Type: Thermally Conductive
• Cure / Technology: Single Component

• Chemical System: Epoxy
• Form / Shape: Paste

OMEGATHERM thermal conducting paste is a high temperature and high thermally conductive paste product. They are specially formulated for permanent and temporary bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics,... [See More]

• Type: Thermally Conductive
• Cure / Technology: Single Component

• Chemical System: Silicone
• Form / Shape: Grease, Paste

BERGQUIST GAP PAD TGP 7000ULM is an extremely soft gap filling material rated at a thermal conductivity of 7.0 W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique... [See More]

• Type: Thermally Conductive
• Form / Shape: Gap Filler, Foam in Place Gasket

• Chemical System: Silicone
• Industry: OEM or Industrial

MG Chemicals 8331 is a Silver Conductive Epoxy with a moderate cure time and high conductivity. This is an economical electronic epoxy with good electrical and thermal conductivities. The adhesive bonds very well to a variety of surfaces, it resists thermal and mechanical shocks and provides the low... [See More]

• Type: Electrically Conductive; Thermally Conductive
• Cure / Technology: Thermoset

• Chemical System: Epoxy
• Industry: Electronics

Gap Pad 1500 has an ideal filler blend that gives it a low modulus characteristic that maintains optimal thermal performance yet still allows for easy handling. The natural tack on both sides of the material allows for good compliance to adjacent surfaces of components, minimizing interfacial... [See More]

• Type: Thermally Conductive

• Industry: Electronics

Thermal interface materials are useful for a variety of applications, but solder thermal interface materials (sTIM) are especially suited to high-end device cooling. To improve package reliability, it is especially important to choose the right alloy. Indium, in particular, should be considered as a... [See More]

• Type: Thermally Conductive
• Industry: Semiconductors, IC's

• Chemical System: Metal
• Thermal Conductivity: 15 to 28.1

PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ is heat stable up to 150 °C. [See More]

• Type: Thermally Conductive
• Composition: Filled

• Chemical System: Epoxy
• Cure / Technology: Thermoset; Two Component  

Introducing Arctic Silver 5 - With its unique high-density filling of micronized silver and enhanced thermally conductive ceramic particles, Arctic Silver 5 provides a new level of performance and stability. Arctic Silver 5 is optimized for use between modern high-power CPUs and high performance... [See More]

• Type: Thermally Conductive

LiPOLY TR332CU has outstanding parallel thermal conduction and has high flexibility, which is suitable for thin products like mobile devices. [See More]

• Type: Thermally Conductive
• Form / Shape: Sheet Form, Die-cut Parts

• Chemical System: Graphite, Copper, Acrylic
• Gap Fill: 0.0039 to 0.0059

Used for repairing metal components, pinholes, cracks, and filling seams. [See More]

• Type: Thermally Conductive
• Composition: Filled

• Chemical System: Ceramic
• Cure / Technology: Thermoset

LOCTITE ABLESTIK ABP 8065T, BMI Acrylate, Die Attach, Highly filled, Conductive Adhesive LOCTITE ® ABLESTIK ABP 8065T highly filled, conductive die-attach adhesive is designed for bonding mini dies in high reliability package applications. It is formulated to provide high heat transfer... [See More]

• Type: Thermally Conductive
• CTE: 22

• Thermal Conductivity: 10
• Viscosity: 9000

OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper products. [See More]

• Type: Thermally Conductive
• Cure / Technology: Two Component  

• Chemical System: Epoxy
• Form / Shape: Liquid

BERGQUIST ® LIQUI FORM TLF 6000HG thermally conductive gel interface material is designed to meet the demanding requirements in certain telecom market applications. Its unique formulation assures a balanced mix of high thermal conductivity, good dispensing efficiency and high thermal... [See More]

• Type: Thermally Conductive
• Form / Shape: Paste; Gel

• Chemical System: Silicone
• Industry: OEM or Industrial

MG Chemicals 8330 Silver Conductive Epoxy is a higher conductivity version of the 8331 Silver Conductive Epoxy. It is an electronic grade epoxy which combines a moderate curing rate and a high conductivity. It bonds very well to most substrates used in electronic assemblies; resists thermal and... [See More]

• Type: Electrically Conductive; Thermally Conductive
• Cure / Technology: Thermoset

• Chemical System: Epoxy
• Industry: Electronics

Gap Pad 1500R has the same highly conformable, low modulus polymer as the standard Gap Pad 1500. The fiberglass reinforcement allows for easy material handling and enhances puncture, shear and tear resistance. The natural tack on both sides of the material allows for good compliance to mating... [See More]

• Type: Thermally Conductive

• Industry: Electronics

Several very low melting point Indalloy ® alloys are liquid at room temperature. These gallium-based alloys are finding increased use in various applications as a replacement for toxic mercury, which has a high vapor pressure at room temperature. These alloys have reduced toxicity and lower... [See More]

• Type: Thermally Conductive
• Form / Shape: Liquid

• Chemical System: Metal
• Industry: Semiconductors, IC's

The high-density, ceramic-based thermal compound specifically designed for modern high-power CPUs and high-performance heatsinks or water-cooling solutions. Features: Tri-Linear Ceramic Content: Like the original C éramique, C éramique 2 uses only ceramic fillers so it is neither... [See More]

• Type: Thermally Conductive

LiPOLY BS75K is a soft thermally conductive gap filler. With a thermal conductivity of 3.0 W/m*K and a low thermal impedance, BS75K is suitable for a wide range of applications. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for a wide... [See More]

• Type: Thermally Conductive
• Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket

• Chemical System: Silicone
• Gap Fill: 0.0197 to 0.1969

LOCTITE ABLESTIK 12-2, Silicone, General Assembly LOCTITE ® ABLESTIK 12-2 adhesive is the lower viscosity version of ABLETHERM 12-1 adhesive. It is designed for bonding applications which require high thermal conductivity and reworkability. Thermally conductive. Reworkable. Unfilled [See More]

• Type: Thermally Conductive
• Cure / Technology: Single Component

• Chemical System: Silicone

OMEGA's THERMCOAT KIT is used for cementing fine-gage thermocouples in place on metal, plastic and ceramic surfaces and for assembling and installing thermopiles, temperature probes and thermocouple bolometers. THERMCOAT CO and THERMCOAT COL This is a fast-setting two-part cement which should be... [See More]

• Type: Thermally Conductive
• Cure / Technology: Thermoset (optional feature); Single Component

• Chemical System: Ceramic
• Form / Shape: Liquid (optional feature); Powder (optional feature)

MG Chemicals 8330S is a Silver Conductive Epoxy with a slow cure time and extreme conductivity. This electronic grade epoxy combines a long working time and high conductivity. The cured conductive adhesive bonds very well to most substrates used in electronic assemblies, resists thermal and... [See More]

• Type: Electrically Conductive; Thermally Conductive
• Cure / Technology: Thermoset

• Chemical System: Epoxy
• Industry: Electronics

Gap Pad 1500S30 is a highly compliant Gap Pad material that is ideal for fragile component leads.The material is fiberglass reinforced for improved puncture resistance and handling characteristics. Gap Pad 1500S30 maintains a conformable, yet elastic nature that provides excellent interfacing and... [See More]

• Type: Thermally Conductive

• Industry: Electronics

Indium Corporation ’s Solder Thermal Interface Materials radically improve: Heat dissipation efficiency in electronic devices. Thermal conductance for high power devices – with densities in excess of 1000 watts. End-of-life performance at the thermal interface – to avoid failures... [See More]

• Type: Thermally Conductive
• Industry: Semiconductors, IC's

• Chemical System: Metal

The high-density, ceramic-based thermal compound specifically designed for modern high-power CPUs and high-performance heatsinks or water-cooling solutions. Made with micronized aluminum oxide, boron nitride and zinc oxide. Ceramique uses a high-density layered composite of five unique shapes of... [See More]

• Type: Thermally Conductive

LiPOLY BS87 is an ultra-soft thermally conductive gel pad with a thermal conductivity of 3.0 W/m*K. BS87 offers excellent compression under minimal force with high recovery characteristics. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for... [See More]

• Type: Thermally Conductive
• Form / Shape: Sheet Form, Die-cut Parts

• Chemical System: Silicone
• Gap Fill: 0.0197 to 0.1969

LOCTITE ABLESTIK 8-2, Epoxy, Non-conductive Die Attach Adhesive LOCTITE ® ABLESTIK 8-2 non-conductive die attach adhesive is designed for MEMs package applications. Designed as an instrument adhesive, LOCTITE ABLESTIK 8-2 adhesive offers eight times the thermal conductivity of unfilled epoxies. [See More]

• Type: Thermally Conductive
• Cure / Technology: Single Component

• Chemical System: Epoxy

MG Chemicals 8330S is a Silver Conductive Epoxy with a slow cure time and extreme conductivity. This electronic grade epoxy combines a long working time and high conductivity. The cured conductive adhesive bonds very well to most substrates used in electronic assemblies, resists thermal and... [See More]

• Type: Electrically Conductive; Thermally Conductive
• Cure / Technology: Thermoset

• Chemical System: Epoxy
• Industry: Electronics

Gap Pad 2000S40 is recommended for low-stress applications that require a mid to high thermally conductive interface material. The highly conformable nature of the material allows the pad to fill in air voids and air gaps between PC boards and heat sinks or metal chassis with stepped topography,... [See More]

• Type: Thermally Conductive

• Industry: Electronics

Packaged in tape & reel bundle packs and vacuum packed in a metallized bag. [See More]

• Type: Thermally Conductive
• Industry: Semiconductors, IC's

• Chemical System: Metal

Features: Ultimate Heat Conductivity. Non-Electrical Conductive. Non-Corrosive & Non-Curring. No Bleeding & User Friendly. GELID Applicator. Net Content of 3.5g. Created for Extreme Users on highest level the GC- Extreme thermal compound (3.5g) achieves the best heat conductivity from your... [See More]

• Type: Thermally Conductive

LiPOLY ’s S282 is a thermally conductive pad designed for gap filling. The thermal conductivity is 1.7 W/m*K. It uses fiberglass cloth as the reinforcement material with great self-adhesive that can fit closely with non-flat heat sinks to increase the contact area. The low stress damped... [See More]

• Type: Thermally Conductive
• Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket

• Chemical System: Silicone
• Gap Fill: 0.0197 to 0.1969

LOCTITE ABLESTIK 813J01 BIPAX, Silicone, Non-corrosive, Encapsulant LOCTITE ® ABLESTIK 813J01 BIPAX exhibits very low stress upon cure thus preventing component cracking and other stress-related problems. This adhesive can be cured at room temperature in thick or thin sections. It is... [See More]

• Type: Thermally Conductive
• Cure / Technology: Single Component

• Chemical System: Silicone
• Viscosity: 40000

MG Chemicals 8329TCS is a slow cure electrically insulating epoxy adhesive. Combines a long working 1:1 mix ratio and a 4 hour work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to mechanical shocks and... [See More]

• Type: Thermally Conductive
• Cure / Technology: Thermoset

• Chemical System: Epoxy
• Industry: Electronics

Gap Pad 2200SF is a thermally conductive, electrically isolating, silicone-free polymer specially designed for silicone-sensitive applications. The material is ideal for applications with uneven topologies and high stackup tolerances. Gap Pad 2200SF is reinforced for easy material handling and added... [See More]

• Type: Thermally Conductive

• Industry: Electronics

Packaged in tape & reel bundle packs and vacuum packed in a metallized bag. [See More]

• Type: Thermally Conductive
• Industry: Semiconductors, IC's

• Chemical System: Metal

Why settle for silver, when you could have Diamond? The IC Diamond 7 from Innovation Cooling consists of over 92% micronized synthetic diamond, which has over five times the thermal conductivity of silver! Diamond is also a well-known insulator, so you don 't have to worry about zapping anything... [See More]

• Type: Thermally Conductive

LiPOLY S393 is a product with high ductile thermal conductivity. Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material. It won't easy to break and deformwhether stamped, punched, strip type, or custom cutting. Your best choice... [See More]

• Type: Thermally Conductive
• Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket

• Chemical System: Silicone
• Gap Fill: 0.0197 to 0.3937

LOCTITE ABLESTIK 872-7TN1, Epoxy, Non-conductive adhesive LOCTITE ® ABLESTIK 872-7TN1 is ideal for electronic applications requiring stress relief. Flexible. Thixotropic. High viscosity. Long work life. Easy handling. High thermal conductivity. Reduced stress [See More]

• Type: Thermally Conductive
• Cure / Technology: Two Component  

• Chemical System: Epoxy
• Form / Shape: Paste

MG Chemicals 8329TCM is a medium cure thermally conductive epoxy adhesive which has a convenient 1:1 mix ratio and a 45 minute work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to mechanical shocks and... [See More]

• Type: Electrically Conductive; Thermally Conductive
• Cure / Technology: Thermoset

• Chemical System: Epoxy
• Industry: Electronics

Gap Pad ® 2202SF is a high performance, 2.0 W/m-K, thermally conductive gap filling material. The Gap Pad ® 2202SF compound is silicone-free by design and offers exceptionally low interfacial resistances to adjacent surfaces. Gap Pad ® 2202SF is specifically designed for... [See More]

• Type: Thermally Conductive

• Industry: Electronics

Packaged in tape & reel bundle packs and vacuum packed in a metallized bag. [See More]

• Type: Thermally Conductive
• Industry: Semiconductors, IC's

• Chemical System: Metal

Why settle for silver, when you could have Diamond? The IC Diamond 7 from Innovation Cooling consists of over 92% micronized synthetic diamond, which has over five times the thermal conductivity of silver! Diamond is also a well-known insulator, so you don 't have to worry about zapping anything... [See More]

• Type: Thermally Conductive

LiPOLY S818 is a product with high ductile thermal conductivity.Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material.It won't easy to break and deform whether stamped, punched, strip type, or custom cutting. Your best choice... [See More]

• Type: Thermally Conductive
• Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket

• Chemical System: Silicone
• Gap Fill: 0.0197 to 0.3937

LOCTITE ABLESTIK ABP 8163F-1, Silicone, Die Attach, Non-conductive Adhesive LOCTITE ® ABLESTIK ABP 8163F-1 non-conductive die attach adhesive is designed for LED and sensor manufacturing applications. High thermal conductivity. High reflectivity. Excellent anti-yellowing properties [See More]

• Type: Thermally Conductive
• Viscosity: 21000

• Thermal Conductivity: 0.8000

TSE3281-G is a thermally conductive silicone adhesive from Momentive Performance Materials. This one component material is non-corrosive and has excellent adhesion properties to a wide variety of substrates. Potential applications for TSE3281-G include sealing and bonding for thermally conductive... [See More]

• Type: Thermally Conductive
• Industry: Electronics

• Chemical System: Silicone; Elastomeric

Gap Pad ® 3004SF is high performance, 3.0 W/m-K, thermally conductive gap filling material. Gap Pad ® 3004SF is silicone-free by design and offers exceptionally low interfacial resistances to adjacent surfaces. Gap Pad ® 3004SF is designed for applications that are silicone-sensitive. [See More]

• Type: Thermally Conductive

• Industry: Electronics

Packaged in tape & reel bundle packs and vacuum packed in a metallized bag. [See More]

• Type: Thermally Conductive
• Industry: Semiconductors, IC's

• Chemical System: Metal

Introducing Innovation Cooling 's latest offering, the IC Perihelion! This high-performance ceramic thermal compound features a ceramic base with a high bulk loading of over 91% to prevent pump out due to thermal cycling. It is completely silicone-free and non-capacitive, and will not conduct... [See More]

• Type: Thermally Conductive

LiPOLY DCTP140-s is a thermal insulator uses fiberglass cloth as a reinforcement material, combined with thermal conductive silicon, giving it high thermal conduction and great compression strength. The thermal conductivity is 4.5 W/m*K, the thickness is 0.25~0.45mm. Its high insulation and... [See More]

• Type: Thermally Conductive
• Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket

• Chemical System: Silicone
• Gap Fill: 0.0098 to 0.0177

Clear epoxy resin hardener which is one part of a two part epoxy system designed for use with a variety of LOCTITE HYSOL resins. LOCTITE ® PE 3164 is a clear epoxy resin hardener which forms a black, fast gelling, low viscosity, room temperature cure potting compound with high thermal... [See More]

• Type: Thermally Conductive

• Chemical System: Epoxy

Momentive SnapSIL TN3005 is a low volatile siloxane, silicone adhesive sealant that cures at room temperature. It offers primerless adhesion to many substrates and high elongation once cured. Ideal for use as an insulating adhesive seal and fixing for electrical and electronic parts. Can also be... [See More]

• Type: Thermally Conductive
• Industry: Electronics

• Chemical System: Silicone; Elastomeric

Gap Pad ® 3500ULM (ultra low-modulus) is an extremely soft gap filling material rated at a thermal conductivity of 3.5 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique 3.5 W/m-K filler package and ultra-low modulus resin formulation. The enhanced... [See More]

• Type: Thermally Conductive

• Industry: Electronics

The Thermal Interface Ribbon Kit includes 99.99% Indium ribbon that is 1.00" wide x thicknesses of: .002"/.006"/.010" by three feet of each. Also included is the 5RMA flux. [See More]

• Type: Thermally Conductive
• Form / Shape: Ribbon

• Cure / Technology: Solder
• Industry: Semiconductors, IC's

The NT-H1 from Noctua is a pro-grade TIM solution for those who crave the right evacuation plan for their CPU heat. The perfect compound for the serious enthusiast who demands top-notch performance from a product that 's also easy to use, the NT-H1 uses an array of different micro-particles that... [See More]

• Type: Thermally Conductive

LiPOLY PR27 is a very thin high insulator with a thickness of 0.15mm. It uses Polyimide Film as the reinforcement material, which can increase the tensile strength. It has great dielectric strength and can withstand 12K voltages. It ’s suitable for high power transistors, electrical equipment,... [See More]

• Type: Thermally Conductive
• Form / Shape: Sheet Form, Die-cut Parts

• Chemical System: Silicone
• Gap Fill: 0.0059

LOCTITE STYCAST 2762FT, Epoxy, High Temperature Resistance, High Thermal Conductivity, Potting, Encapsulant LOCTITE ® STYCAST 2762FT epoxy encapsulant is designed for potting electronic components exposed to harsh environments. This material is also ideal for large and complex castings that... [See More]

• Type: Thermally Conductive
• Cure / Technology: Two Component  

• Chemical System: Epoxy
• Viscosity: 25000

Momentive SnapSIL TN3005 is a low volatile siloxane, silicone adhesive sealant that cures at room temperature. It offers primerless adhesion to many substrates and high elongation once cured. Ideal for use as an insulating adhesive seal and fixing for electrical and electronic parts. Can also be... [See More]

• Type: Thermally Conductive
• Industry: Electronics

• Chemical System: Silicone; Elastomeric

GAP PAD ™ HC 5.0 is a soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique filler package and low-modulus resin formulation. The enhanced material is ideal for applications... [See More]

• Type: Thermally Conductive
• Industry: Electronics

• Form / Shape: Gap Filler, Foam in Place Gasket

Offering increased adhesiveness for ridiculously easy application, the Thermalright Chill Factor 2 Thermal Compound is a durable, long-lasting tool that you can apply with no fuss and little mess. The second addition of Thermalright 's Chill Factor Thermal Compound uses less silicon oil (which... [See More]

• Type: Thermally Conductive

LiPOLY ’s thermal insulator SH1500/2000/3000 uses fiberglass cloth as a reinforcement material, combined with thermal conductive silicon, giving it high thermal conduction and great compression strength. The thermal conductivity is 1.5/2.0/3.0 W/m*K, the thickness is 0.23~0.35mm. Its high... [See More]

• Type: Thermally Conductive
• Form / Shape: Sheet Form, Die-cut Parts

• Chemical System: Silicone
• Gap Fill: 0.0091 to 0.0138

LOCTITE STYCAST 2850FTJ, Epoxy, Encapsulant. LOCTITE ® STYCAST 2850FTJ epoxy encapsulant is designed for use in high voltage applications where surface arcing or tracking is a concern. LOCTITE STYCAST 2850FTJ is recommended for encapsulation of components that require heat dissipation and... [See More]

• Type: Thermally Conductive
• Cure / Technology: Two Component  

• Chemical System: Epoxy
• Viscosity: 225000