Thermally Conductive Conductive Compounds

218 Results
Addition Cured Silicone is Optically Clear with Enhanced Low Temperature Serviceability -- MasterSil 157
from Master Bond, Inc.

MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]

  • Type: Thermally Conductive
  • Composition: Unfilled
  • Chemical System: Silicone
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing; Addition Cure
BERGQUIST GAP FILLER TGF 3500LVO is a silicone, thermally conductive, liquid gap filler with industry-wide applications. -- BERGQUIST GAP FILLER TGF 3500LVO
from Henkel Adhesive Technologies - Aviation, Space and Rail

BERGQUIST ® GAP FILLER TGF 3500LVO is a silicone, two-component, high thermal conductivity, liquid gap filler. This product offers the mechanical property benefits of a silicone material with the additional feature of low outgassing. It can be used in industries ranging from automotive to... [See More]

  • Type: Thermally Conductive
  • Cure / Technology: Thermoset
  • Chemical System: Silicone
  • Form / Shape: Gap Filler, Foam in Place Gasket; Liquid
Bergquist Gap Filler 1500 Thermally Conductive Adhesive Yellow 50 cc Cartridge -- GAP FILLER 1500 50CC [GF1500-00-60-50CC from Bergquist Company (The)]
from Ellsworth Adhesives

Bergquist Gap Filler 1500 Thermally Conductive Adhesive is a two component, liquid gap filling material that is designed as a form-in-place elastomer for fragile electronic assemblies and filling difficult air voids and gaps. It offers excellent shear thinning characteristics, slump resistance,... [See More]

  • Type: Thermally Conductive
  • Form / Shape: Gap Filler, Foam in Place Gasket
  • Cure / Technology: Two Component  
  • Thermal Conductivity: 1.8
Thermal Interface Material
from Boyd Corporation

Thermal Interface Materials - Gap Fillers and Pads, Films, Tapes, Hardware. Electronic devices continue to become faster, smaller, and more powerful every day, enabling technological advancements across all industries. The Internet of Things, powered by embedded electronics and its complex... [See More]

  • Type: Thermally Conductive
  • Form / Shape: Gap Filler, Foam in Place Gasket
Pedigree® -- 40 VTC-40F
from ELANTAS PDG, Inc.

Mineral-filled VPI resin - semi-flexible for transformers with improved heat dissipation [See More]

  • Type: Thermally Conductive
  • Composition: Filled
  • Chemical System: Alkyd
  • Cure / Technology: Thermoset; Single Component
5G mmWave Thermal Conductive Gel Pad -- DTT44-s
from Shiu Li Technology Co., Ltd

LiPOLY DTT44 is a soft thermally conductive gel pad specifically designed for networking applications. DTT44 is designed to focus on Dk and Df to reduce interference in RF modules. DTT44 has a thermal conductivity of 3.0 W/m*K. This product can be supplied as standard sheets, custom die-cuts or... [See More]

  • Type: Thermally Conductive
  • Form / Shape: Sheet Form, Die-cut Parts
  • Chemical System: Silicone
  • Gap Fill: 0.0197 to 0.1969
Extremely Compressible Thermal Gap Filler -- SARCON® PG45A
from Fujipoly® America Corp.

Fujipoly ® introduces Sarcon ® PG45A its newest high-performance, putty-like thermal interface material. This extremely low modulus gap filler exhibits a thermal resistance as low as 0.02 °C •in2/W at 43.5 PSI with a thermal conductivity of 4.5 W/m °K. Sarcon ® PG45A... [See More]

  • Type: Thermally Conductive
  • Form / Shape: Putty; Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
  • Gap Fill: 0.0591 to 0.0984
1127229 [HTC10S from Electrolube]
from RS Components, Ltd.

Silicon-free heat sink compound. Easy to apply with the practical syringe. Extremely high thermal conductivity. For the thermal coupling of electronic components. Thermal Conductivity = 0.9W/m ·K. Material = Non-Silicone. Maximum Operating Temperature = +130 °C. Minimum Operating... [See More]

  • Type: Thermally Conductive
  • Form / Shape: Grease, Paste
  • Chemical System: Non-Silicone
  • Use Temperature: -58 to 266
Thermal Interface Materials for Heatsinkable Devices -- TGH-TP1
from Ohmite Manufacturing Co.

Ohmite thermal interface materials (TIMs) are designed for use in applications requiring reliable performance, low contact resistance, long life, low maintenance and high thermal conductivity. The flexible graphite materials are die-cut to ensure exact fit and reduce module-to-module variation... [See More]

  • Type: Thermally Conductive
  • Industry: Electronics; Electric Power; OEM or Industrial
  • Chemical System: Flexible Graphite Material
  • Use Temperature: -40 to 752
1-Part, Thermally Conductive, Black, RTV Silicone Adhesive, UL Listed -- AS1802-Black
from CHT USA Inc.

CHT ’s AS1802 Black is a 1-part, non-corrosive, neutral cure, thermally conductive, black RTV silicone adhesive sealant. It is one in a range of CHT ’s acetone cure products which are all solvent-free. It features a fast skin over time at 4 minutes. AS1802 Black is designed with... [See More]

  • Type: Thermally Conductive
  • Cure / Technology: Single Component; Acetone
  • Chemical System: Silicone
  • Industry: Automotive; Electronics
Thermal - Adhesives, Epoxies, Greases, Pastes -- 08946-ND [8946 from 3M]
from Digi-Key Electronics

SILICONE PASTE 8 OZ CLEAR [See More]

  • Type: Thermally Conductive
  • Use Temperature: -40 to 399
  • Chemical System: Silicone
4.0 x 5.0 Micron Foil -- NanoFoil®
from Indium Corporation

NanoFoil ® Bundle Kits are small quantities of NanoFoil ® in pre-made forms on tape & reel. The kit consists of small preforms, including 0.5", 1", and 2" squares available in thicknesses of 40 microns or 60 microns. The bundle kits are available in standard NanoFoil only; however,... [See More]

  • Type: Thermally Conductive
  • Industry: Semiconductors, IC's
  • Chemical System: Metal
B-Staged Epoxy Meets Airbus Standards for Flame Retardancy & Toxicity -- EP36FR
from Master Bond, Inc.

EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]

  • Type: Thermally Conductive
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Single Component
Thermal Adhesive/Compound/Material -- 120-320 [120-320 from Wakefield Thermal, Inc.]
from Richardson RFPD

The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal resistance of only 0.05 °C/W for a 0.001 in film with an area of one square... [See More]

  • Type: Thermally Conductive
BERGQUIST GAP PAD TGP 10000ULM, Thermal interface material, Gap pad, Thermal performance at low pressures -- BERGQUIST GAP PAD TGP 10000ULM
from Henkel Adhesive Technologies - Aviation, Space and Rail

BERGQUIST ® GAP PAD TGP 10000ULM is an extremely soft gap filling material rated at a thermal conductivity of 10.0 W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the... [See More]

  • Type: Thermally Conductive
  • Industry: OEM or Industrial
  • Chemical System: Silicone
  • Use Temperature: -76 to 392
Bergquist Gap Filler 2000 Thermally Conductive Adhesive Pink 50 cc Cartridge -- GAP FILLER 2000 50CC [GF2000-00-60-50CC from Bergquist Company (The)]
from Ellsworth Adhesives

Bergquist Gap Filler 2000 Thermally Conductive Adhesive is a two component, liquid gap filling material that is designed as a form-in-place elastomer for coupling hot electronic components. It cures at room or elevated temperatures and offers mechanical and chemical stability. 50 cc Cartridge. [See More]

  • Type: Thermally Conductive
  • Form / Shape: Gap Filler, Foam in Place Gasket
  • Cure / Technology: Two Component  
  • Thermal Conductivity: 2
5G mmWave Thermal Conductive Gel Pad -- DTT65-s
from Shiu Li Technology Co., Ltd

LiPOLY DTT65 is a soft thermally conductive gel pad specifically designed for networking applications. DTT65 is designed to focus on Dk and Df to reduce interference in RF modules. DTT65 has a thermal conductivity of 5.0 W/m*K. This product can be supplied as standard sheets, custom die-cuts or... [See More]

  • Type: Thermally Conductive
  • Form / Shape: Sheet Form, Die-cut Parts
  • Chemical System: Silicone
  • Gap Fill: 0.0197 to 0.1969
Form-In-Place Gap Filler -- SARCON® SPG-70A
from Fujipoly® America Corp.

Fujipoly ® America announces the release of its new SARCON ® SPG-70A. It is a high flow rate, high heat transferring compound that exhibits a thermal conductivity of 7.0 W/m °K and has the lowest thermal resistance among our dispensable SPG products. When applied between heat-generating... [See More]

  • Type: Thermally Conductive
  • Form / Shape: Gap Filler, Foam in Place Gasket; Grease, Paste
  • Chemical System: Silicone
  • Industry: Electronics
5595 Thermal Pad 210Mm X 300Mm 2Mm Sheet; Thickness 3M -- 78T6284 [5595 from 3M]
from Newark, An Avnet Company

5595 THERMAL PAD 210MM X 300MM 2MM SHEET; Thickness:2mm; Conductive Material:Filled Silicone Polymer; Thermal Conductivity:1.6W/m.K; Thermal Impedance:-; Volume Resistivity:10ohm-cm; External Length:300mm; External Width:210mm; RoHS Compliant: Yes [See More]

  • Type: Thermally Conductive
  • Thermal Conductivity: 1.6
1130455 [HTC35SL from Electrolube]
from RS Components, Ltd.

Silicon-free heat sink compound. Easy to apply with the practical syringe. Extremely high thermal conductivity. For the thermal coupling of electronic components. Thermal Conductivity = 0.9W/m ·K. Material = Non-Silicone. Maximum Operating Temperature = +130 °C. Minimum Operating... [See More]

  • Type: Thermally Conductive
  • Form / Shape: Grease, Paste
  • Chemical System: Non-Silicone
  • Use Temperature: -58 to 266
1-Part, Thermally Conductive, RTV Silicone Adhesive -- AS1802
from CHT USA Inc.

CHT ’s AS1802 is a 1-part, gray, non-corrosive, neutral cure, thermally conductive, RTV silicone adhesive sealant. It is one in a range of CHT ’s acetone cure products which are all solvent-free. It features a fast skin over time at 4 minutes. AS1802 is designed with excellent primerless... [See More]

  • Type: Thermally Conductive
  • Cure / Technology: Single Component; Acetone
  • Chemical System: Silicone
  • Industry: Automotive; Electronics
Bundle Kit 40 Microns x .5 Inch Squares -- NanoFoil®
from Indium Corporation

Thickness of NanoFoil ®: 40 microns. Size of NanoFoil ®: .5 inch squares. Qty Per Bundle: 100 each. NanoFoil ® Bundle Kits are small quantities of NanoFoil ® in pre-made forms on tape & reel. The kit consists of small preforms, including 0.5", 1", and 2" squares available in... [See More]

  • Type: Thermally Conductive
  • Industry: Semiconductors, IC's
  • Chemical System: Metal
Biocompatible, Non-Drip Epoxy Resists Repeated Sterilizations -- EP3HTND-2Med Black
from Master Bond, Inc.

EP3HTND-2Med Black is a one part system that combines easy processing with excellent bonding properties. It cures in 20-30 minutes at 250°F or 5-10 minutes at 300°F and adheres well to a wide variety of substrates including glass, metals, ceramics and most plastics. This paste compound meets USP... [See More]

  • Type: Thermally Conductive
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Single Component
BERGQUIST GAP PAD TGP 5000 is a silicone, highly conformable, fiberglass reinforced gap pad with a thermal conductivity of 5 W/mK. -- BERGQUIST GAP PAD TGP 5000
from Henkel Adhesive Technologies - Aviation, Space and Rail

BERGQUIST ® GAP PAD TGP 5000 is a silicone based, thermally conductive, fiberglass reinforced and S-class soft gap pad. Its highly conformable nature and S-class softness ensures that it conforms to demanding contours and maintains structural integrity. Fiberglass reinforcement provides... [See More]

  • Type: Thermally Conductive
  • Industry: OEM or Industrial
  • Chemical System: Silicone
  • Use Temperature: -76 to 392
Bergquist Liqui-Bond SA 2000 Silicone Adhesive Yellow 600 cc Cartridge -- LIQUI-BOND SA2000 600CC CARTRIDGE [LBSA2000-00-00-600CC from Bergquist Company (The)]
from Ellsworth Adhesives

Bergquist Liqui-Bond SA 2000 is a one component, thermally conductive silicone adhesive that is used for structural bonding applications that are exposed to extreme environments. It cures at elevated temperatures and has excellent mechanical and chemical stability. 600 cc Cartridge. [See More]

  • Type: Thermally Conductive
  • Cure / Technology: Single Component
  • Chemical System: Silicone
  • Thermal Conductivity: 2
Complex Thermal Conductive Material -- G566A/G566AP
from Shiu Li Technology Co., Ltd

LiPOLY G566 Graphite Sheet has great thermal conductivity on the X and Y axis. The thermal conductivity is 1700W/m*K. It is flexible, which is suitable for thin products and high capability mobile devices. [See More]

  • Type: Thermally Conductive
  • Form / Shape: Sheet Form, Die-cut Parts
  • Chemical System: Graphite
  • Gap Fill: 8.27E-4
High Performance Gap Filler -- SARCON ® GR80A
from Fujipoly® America Corp.

Highly Conformable and High Heat Conducting gel materials. SARCON ® Thermal Gap Filler Pads are highly conformable and high heat conducting gel materials in a versatile sheet form. They easily fit and adhere to most all shapes and sizes of components, including protrusions and recessed areas. [See More]

  • Type: Thermally Conductive
  • Form / Shape: Gap Filler, Foam in Place Gasket; Gel
  • Chemical System: Silicone
  • Gap Fill: 0.0394 to 0.1181
1181368 [SMA10SL from Electrolube]
from RS Components, Ltd.

A heat curable, one part thixotropic adhesive for use in holding components in place during soldering operations of surface mount assemblies. High uncured green strength and fast cure cycle with medium bond strength. Thixotropic properties give high dot profile. Excellent mechanical strength. Not... [See More]

  • Type: Thermally Conductive
  • Use Temperature: -40 to 266
  • Form / Shape: Syringe
  • Thermal Conductivity: 0.2500 to 0.3000
1-Part, Thermally Conductive, Space-Grade Silicone Adhesive, UL Listed -- AS1707
from CHT USA Inc.

CHT's AS1707 is a 1-part, alkoxy cured, thermally conductive, low volatile, RTV silicone adhesive paste. AS1707 is formulated to meet the requirements for use as a space grade adhesive. AS1707 has low thermal outgassing properties and a wide operational temperature range. In addition to meeting... [See More]

  • Type: Thermally Conductive
  • Cure / Technology: Single Component; Alkoxy
  • Chemical System: Silicone
  • Industry: Automotive; Electronics
Engineered Solder Materials -- Indalloy® Alloys Liquid at Room Temperature
from Indium Corporation

Several low melting point Indalloy ® alloys are liquid at room temperature. These gallium-based alloys are non-toxic replacements for mercury. The gallium-based alloys have far lower vapor pressure than mercury, reducing both the amount and toxicity of metal vapor exposure. Excellent Thermal and... [See More]

  • Type: Thermally Conductive
  • Form / Shape: Liquid
  • Chemical System: Metal
  • Industry: Semiconductors, IC's
Chemical Resistant, Two Part Epoxy Features Glass Transition Temperature of +240°C -- EP126
from Master Bond, Inc.

Master Bond EP126 withstands very high temperatures, up to +600 °F, and has a glass transistion temperature of +240 °C. This two component product features unique handling properties as Part A is a moderate viscosity liquid and Part B is a powder. It can be easily mixed using a forgiving 100... [See More]

  • Type: Thermally Conductive
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
BERGQUIST GAP PAD TGP 7000ULM, Thermally conductive soft gap filling material, For high performance applications -- BERGQUIST GAP PAD TGP 7000ULM
from Henkel Adhesive Technologies - Aviation, Space and Rail

BERGQUIST GAP PAD TGP 7000ULM is an extremely soft gap filling material rated at a thermal conductivity of 7.0 W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique... [See More]

  • Type: Thermally Conductive
  • Form / Shape: Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
  • Industry: OEM or Industrial
Dow DOWSIL™ 1-4173 TC Thermally Conductive Adhesive Gray 1.5 kg Cartridge -- 1-4173 TC ADHESIVE 1.5KG [2852497 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™ 1-4173 Thermally Conductive Adhesive Gray is a one component, solvent free adhesive that is used for bonding electronic components, housings, lids, base plates, and dispensing equipment. It is heat curing, self-leveling, flowable, good thermal conductivity, and has high tensile... [See More]

  • Type: Thermally Conductive
  • Thermal Conductivity: 1.8
  • Cure / Technology: Single Component
  • Viscosity: 61000
Complex Thermal Conductive Material -- TR332CU
from Shiu Li Technology Co., Ltd

LiPOLY TR332CU has outstanding parallel thermal conduction and has high flexibility, which is suitable for thin products like mobile devices. [See More]

  • Type: Thermally Conductive
  • Form / Shape: Sheet Form, Die-cut Parts
  • Chemical System: Graphite, Copper, Acrylic
  • Gap Fill: 0.0039 to 0.0059
High Performance Thermal Gap Filler -- SARCON® GR130A
from Fujipoly® America Corp.

Fujipoly ® recently released Sarcon ® GR130A, its newest high-performance, thermal gap filler pad. The highly conformable, gel-like sheets exhibit a thermal resistance as low as 0.02 °C •in2/W at 43.5 PSI with a thermal conductivity of 13 W/m °K. Sarcon ® GR130A is available... [See More]

  • Type: Thermally Conductive
  • Form / Shape: Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
  • Gap Fill: 0.0118 to 0.0787
Adhesive, Thermal, Jar, 80G; Thermal Conductivity Loctite -- 12N4579 [1118188 from Henkel Corporation - Industrial]
from Newark, An Avnet Company

ADHESIVE, THERMAL, JAR, 80G; Thermal Conductivity:0.034 °C/W; Conductive Material:-; Thickness:-; Thermal Impedance:-; Dielectric Strength:-; External Length:-; External Width:-; Product Range:-; Adhesive Colour:Grey; Colour:Grey [See More]

  • Type: Thermally Conductive
1225181
from RS Components, Ltd.

TIM (Thermal Interface Material) pads from Intelligent LED Solutions intended for use with the OSLON 4 High Bay LED arrays. These thermally conductive pads provide an essential interface between the LED module arrays and their associated heatsinks - they help to ensure efficient operation and long... [See More]

  • Type: Thermally Conductive
  • Use Temperature: -400 to 572
  • Chemical System: Graphite
2-Part, Silicone Potting Compound and Encapsulant, UL Listed -- QSil-563
from CHT USA Inc.

CHT's QSil 563 is a 2-part, platinum cure, 100% silicone solids elastomer designed for electronic potting and encapsulation applications. QSil 562 offers a hard, low modulus material that is readily repairable. QSil 563 is thermally conductive to aid in efficient heat dissipation. This silicone... [See More]

  • Type: Thermally Conductive
  • Industry: Automotive; Electronics
  • Cure / Technology: Two Component  ; Addition
  • Features: Flame Retardant; UL Rating
Indium Thermal Interface Materials (TIM)
from Indium Corporation

Thermal interface materials are useful for a variety of applications, but solder thermal interface materials (sTIM) are especially suited to high-end device cooling. To improve package reliability, it is especially important to choose the right alloy. Indium, in particular, should be considered as a... [See More]

  • Type: Thermally Conductive
  • Industry: Semiconductors, IC's
  • Chemical System: Metal
  • Thermal Conductivity: 15 to 28.1
Dual Curing, Thixotropic Adhesive -- UV22DC80-10F
from Master Bond, Inc.

One part, nanosilica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]

  • Type: Thermally Conductive
  • Composition: Filled
  • Chemical System: UV Curing
  • Cure / Technology: UV or Radiation Cured; Single Component; Dual Curing
BERGQUIST LIQUI FORM TLF 6000HG, Thermally conductive gel, Pre-cured -- BERGQUIST LIQUI FORM TLF 6000HG
from Henkel Adhesive Technologies - Aviation, Space and Rail

BERGQUIST ® LIQUI FORM TLF 6000HG thermally conductive gel interface material is designed to meet the demanding requirements in certain telecom market applications. Its unique formulation assures a balanced mix of high thermal conductivity, good dispensing efficiency and high thermal... [See More]

  • Type: Thermally Conductive
  • Form / Shape: Paste; Gel
  • Chemical System: Silicone
  • Industry: OEM or Industrial
Dow DOWSIL™ 1-4173 TC Thermally Conductive Adhesive Gray 10 kg Pail -- 1-4173 TC ADHESIVE 10KG [4025029 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™ 1-4173 Thermally Conductive Adhesive Gray is a one component, heat curing silicone that is used for bonding heat sinks, housings, base plates, lids, and circuit applications. It provides flowability, chemical stability, and resistance to shock, ozone, stress, and environmental... [See More]

  • Type: Thermally Conductive
  • Thermal Conductivity: 1.9
  • Cure / Technology: Single Component
  • Tensile (Break): 900
Exceptionally Soft Thermal Conductive Gel Pad -- BS75K
from Shiu Li Technology Co., Ltd

LiPOLY BS75K is a soft thermally conductive gap filler. With a thermal conductivity of 3.0 W/m*K and a low thermal impedance, BS75K is suitable for a wide range of applications. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for a wide... [See More]

  • Type: Thermally Conductive
  • Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
  • Gap Fill: 0.0197 to 0.1969
High Thermal Conductivity Non-Silicone Greases -- SARCON® SG-50NS and SG-60NS
from Fujipoly® America Corp.

Fujipoly ® USA introduces new 5 and 6W/m-K SARCON ® thermally conductive greases to the North American market. SARCON ® SG-50NS and SG-60NS greases offer excellent stability over wide temperature ranges with low thermal resistance. They feature exceptionally low bleed and evaporation as... [See More]

  • Type: Thermally Conductive
  • Industry: Electronics
  • Form / Shape: Grease, Paste
  • Thermal Conductivity: 5 to 6
Bond-Ply 100 .008" 12" X 12" Sheet; Insulator Body Material Bergquist -- 47T1948 [BP100-0.008-00-1212 from Bergquist Company (The)]
from Newark, An Avnet Company

BOND-PLY 100 .008" 12" X 12" SHEET; Insulator Body Material:-; Thermal Conductivity:0.8W/m.K; Breakdown Voltage Vbr:6kV; Thickness:0.203mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:-; SVHC:No RoHS Compliant: Yes [See More]

  • Type: Thermally Conductive
  • Thermal Conductivity: 0.8000
1225182
from RS Components, Ltd.

TIM (Thermal Interface Material) pads from Intelligent LED Solutions intended for use with the OSLON 4 High Bay LED arrays. These thermally conductive pads provide an essential interface between the LED module arrays and their associated heatsinks - they help to ensure efficient operation and long... [See More]

  • Type: Thermally Conductive
  • Use Temperature: -4 to 311
  • Chemical System: Graphite
2-Part, Thermally Conductive Silicone Encapsulants, UL Listed -- SE3000
from CHT USA Inc.

CHT's SE3000 is a 2-part, platinum cure silicone elastomer designed for electronic potting and encapsulation applications. It offers good prtection against chemicals, environmental contamination, mechanical shock, vibration and impact damage. SE3000 can be used in applications where low flammability... [See More]

  • Type: Thermally Conductive
  • Industry: Electronics
  • Cure / Technology: Two Component  ; Addition
  • Features: Flame Retardant; UL Rating
Thermal - Adhesives, Epoxies, Greases, Pastes -- 1000-116-ND [1704238 from Henkel Corporation - Industrial]
from Digi-Key Electronics

LOCTITE NSWC 100 THERMAL GREASE [See More]

  • Type: Thermally Conductive
  • Use Temperature: -40 to 302
  • Form / Shape: Grease, Paste
  • Thermal Conductivity: 1.4
Liquid Metal Thermal Interface Material
from Indium Corporation

Several very low melting point Indalloy ® alloys are liquid at room temperature. These gallium-based alloys are finding increased use in various applications as a replacement for toxic mercury, which has a high vapor pressure at room temperature. These alloys have reduced toxicity and lower... [See More]

  • Type: Thermally Conductive
  • Form / Shape: Liquid
  • Chemical System: Metal
  • Industry: Semiconductors, IC's
Electrically and Thermally Conductive, Two Part Silicone Meets NASA Low Outgassing Specifications -- MasterSil 973S-LO
from Master Bond, Inc.

MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]

  • Type: Electrically Conductive; Thermally Conductive
  • Composition: Filled
  • Chemical System: Silicone
  • Cure / Technology: Thermoset; Two Component  ; Addition Cure
Thermal Adhesive/Compound/Material -- 120-SA [120-SA from Wakefield Thermal, Inc.]
from Richardson RFPD

The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal resistance of only 0.05 °C/W for a 0.001 in film with an area of one square... [See More]

  • Type: Thermally Conductive
Dow DOWSIL™ 1-4174 TC Thermally Conductive Adhesive Gray 1.5 kg Cartridge -- 1-4174 TC ADHESIVE 1.5KG [3135641 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™ 1-4174 Thermally Conductive Adhesive Gray is a one component, solvent free, silicone polymer that is used for bonding electronic components, housings, lids, base plates, and heat sinks. It is heat curing, self-leveling, flowable, high tensile strength, and allows controlled bond... [See More]

  • Type: Thermally Conductive
  • Thermal Conductivity: 1.9
  • Cure / Technology: Single Component
  • Tensile (Break): 900
Exceptionally Soft Thermal Conductive Gel Pad -- BS87
from Shiu Li Technology Co., Ltd

LiPOLY BS87 is an ultra-soft thermally conductive gel pad with a thermal conductivity of 3.0 W/m*K. BS87 offers excellent compression under minimal force with high recovery characteristics. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for... [See More]

  • Type: Thermally Conductive
  • Form / Shape: Sheet Form, Die-cut Parts
  • Chemical System: Silicone
  • Gap Fill: 0.0197 to 0.1969
Highly Conformable and Non-Flammable, Higher Thermal interface material -- SARCON® PG80B
from Fujipoly® America Corp.

SARCON® Extremely Compressible Gap Filler Type (Putty Type) is a highly conformable, thermally conductive, non-flammable interface materials. The surface consistency is excellent for filling small air gaps and uneven mating surface, making reliable contact with various shapes and sizes of... [See More]

  • Type: Thermally Conductive
  • Industry: Electronics; Semiconductors, IC's
  • Form / Shape: Putty; Gap Filler, Foam in Place Gasket
  • Use Temperature: -40 to 302
Bond-Ply 100, .005", 6"x6" Sheet; Insulator Body Material Bergquist -- 18K5358 [BP100-0.005-00-6/6 from Bergquist Company (The)]
from Newark, An Avnet Company

BOND-PLY 100, .005", 6"X6" SHEET; Insulator Body Material:Carbon; Thermal Conductivity:0.8W/m.K; Breakdown Voltage Vbr:3kV; Thickness:0.127mm; Volume Resistivity:100000000000ohm-m; Thermal Impedance:-; Dielectric Strength:-; Product RoHS Compliant: Yes [See More]

  • Type: Thermally Conductive
  • Thermal Conductivity: 0.8000
1225183
from RS Components, Ltd.

A range of TIM (Thermal Interface Material) pads from Intelligent LED Solutions intended for use with the Duris S8 & S10 series of SCOB LEDs. Thermally conductive pads provide an essential interface between the LED modules and their associated heatsinks - they help to ensure efficient operation and... [See More]

  • Type: Thermally Conductive
  • Chemical System: Graphite
2-Part, Thermally Conductive Silicone Potting Compound and Encapsulant, UL Listed -- QSil-553
from CHT USA Inc.

CHT's QSil 553 is a 2-part, platinum cure, silicone potting compound and encapsulant designed to protect electronic components from harsh environmental conditions and shock and vibration. It features a low viscosity for convenient dispensing and will easily flow throughout components. Because of its... [See More]

  • Type: Thermally Conductive
  • Industry: Automotive; Electronics; OEM or Industrial
  • Cure / Technology: Two Component  ; Addition
  • Features: Flame Retardant; UL Rating
Solder Thermal Interface Materials
from Indium Corporation

Indium Corporation ’s Solder Thermal Interface Materials radically improve: Heat dissipation efficiency in electronic devices. Thermal conductance for high power devices – with densities in excess of 1000 watts. End-of-life performance at the thermal interface – to avoid failures... [See More]

  • Type: Thermally Conductive
  • Industry: Semiconductors, IC's
  • Chemical System: Metal
Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity -- EP3HTSDA-1
from Master Bond, Inc.

EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]

  • Type: Thermally Conductive
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Single Component
Thermal Adhesive/Compound/Material -- 126-2 [126-2 from Wakefield Thermal, Inc.]
from Richardson RFPD

The 126 Series is a nontoxic, synthetic, ester-based (nonsilicone) Thermal Joint Compound with metal oxide fillers designed to enhance thermal performance characteristics of plastic and metal package devices exceeding that of silicone-based compounds. Solved are problems associated with... [See More]

  • Type: Thermally Conductive
Dow DOWSIL™ 3-1818 TC Adhesive Gray 1.5 kg Cartridge -- 3-1818 TC ADHESIVE 1.5KG [4014893 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™ 3-1818 Thermally Conductive Adhesive Gray is a one component, thixotropic adhesive that is used for bonding with common materials in the electronics industry. It has a fast heat cure, glass beads for controlling bond line thickness, self priming, good dielectric properties, and... [See More]

  • Type: Thermally Conductive
  • Industry: Electronics
  • Cure / Technology: Single Component
  • Thermal Conductivity: 1.8
Exceptionally Soft Thermal Conductive Gel Pad -- S282-s
from Shiu Li Technology Co., Ltd

LiPOLY ’s S282 is a thermally conductive pad designed for gap filling. The thermal conductivity is 1.7 W/m*K. It uses fiberglass cloth as the reinforcement material with great self-adhesive that can fit closely with non-flat heat sinks to increase the contact area. The low stress damped... [See More]

  • Type: Thermally Conductive
  • Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
  • Gap Fill: 0.0197 to 0.1969
Silicone Free Form-in-Place Thermal Gap Filler -- SARCON® SPG-25B-NS
from Fujipoly® America Corp.

SARCON ® SPG-25B-NS from Fujipoly ® is an easy to dispense, low- viscosity, silicone free compound that exhibits a thermal conductivity of 2.5 W/m °K and a thermal resistance of only 2.1 °K •cm2/W. When applied between heat-generating components and a nearby heat sink or... [See More]

  • Type: Thermally Conductive
  • Industry: Electronics
  • Form / Shape: Gap Filler, Foam in Place Gasket; Grease, Paste
  • Use Temperature: -40 to 248
Bush, To-220, Pk10; Insulator Body Material Multicomp -- 23WX3104 [31-35-25GFN from multicomp PRO]
from Newark, An Avnet Company

BUSH, TO-220, PK10; Insulator Body Material:-; Thermal Conductivity:-; Breakdown Voltage Vbr:-; Thickness:-; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:-; Length:3.8mm; Mounting Hole Dia:3.08mm RoHS Compliant: Yes [See More]

  • Type: Thermally Conductive
1225184
from RS Components, Ltd.

A range of TIM (Thermal Interface Material) pads from Intelligent LED Solutions intended for use with the Duris S8 & S10 series of SCOB LEDs. Thermally conductive pads provide an essential interface between the LED modules and their associated heatsinks - they help to ensure efficient operation and... [See More]

  • Type: Thermally Conductive
  • Chemical System: Graphite
Thermal - Adhesives, Epoxies, Greases, Pastes -- 1000-140-ND [1586134 from Henkel Corporation - Industrial]
from Digi-Key Electronics

ECCOBOND 56C-CAT 9 KIT, 140.5GM [See More]

  • Type: Thermally Conductive
  • Use Temperature: -76 to 248
  • Chemical System: Epoxy
  • Thermal Conductivity: 3
Thermal Interface Materials -- Heat-Spring® Bundle Pack: Squares: .5 Inch Squares - Qty 100 Pieces
from Indium Corporation

Packaged in tape & reel bundle packs and vacuum packed in a metallized bag. [See More]

  • Type: Thermally Conductive
  • Industry: Semiconductors, IC's
  • Chemical System: Metal
Electrically Conductive Die Attach Epoxy With High Glass Transition Temperature -- EP17HTS-DA
from Master Bond, Inc.

Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]

  • Type: Electrically Conductive; Thermally Conductive
  • Composition: Filled
  • Chemical System: Polyphenylene Sulfide; Epoxy
  • Cure / Technology: Thermoset; Single Component
Dow DOWSIL™ 3-6752 Thermally Conductive Adhesive Gray 30 cc Syringe -- 3-6752 TC ADHESIVE 75G [4121539 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™ 3-6752 Thermally Conductive Adhesive Gray is a one component, heat curing silicone that is used to cool electronic applications and bond with metals, ceramics, filled plastics, epoxy laminates, and organic substrates. It is flame resistant, self leveling, flowable, thixotropic,... [See More]

  • Type: Thermally Conductive
  • Industry: Semiconductors, IC's
  • Cure / Technology: Single Component
  • Thermal Conductivity: 1.8
High Insulating Thermal Conductive Film -- PR27
from Shiu Li Technology Co., Ltd

LiPOLY PR27 is a very thin high insulator with a thickness of 0.15mm. It uses Polyimide Film as the reinforcement material, which can increase the tensile strength. It has great dielectric strength and can withstand 12K voltages. It ’s suitable for high power transistors, electrical equipment,... [See More]

  • Type: Thermally Conductive
  • Form / Shape: Sheet Form, Die-cut Parts
  • Chemical System: Silicone
  • Gap Fill: 0.0059
Thermal Interface Material Sample Kit -- SARCON®
from Fujipoly® America Corp.

Fujipoly ® recently introduced a comprehensive engineering kit that includes free samples of (20) different Sarcon ® Thermal Interface Materials. The sample kit gives engineers the flexibility to test the performance properties of multiple Sarcon ® materials in order to find the perfect... [See More]

  • Type: Thermally Conductive
  • Industry: Electronics; Semiconductors, IC's
Bush, To-3, Pk10; Insulator Body Material Multicomp -- 23WX3103 [3-38-32GFN from multicomp PRO]
from Newark, An Avnet Company

BUSH, TO-3, PK10; Insulator Body Material:-; Thermal Conductivity:-; Breakdown Voltage Vbr:-; Thickness:-; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:-; Length:4.37mm; Overall Width:6.1mm RoHS Compliant: Yes [See More]

  • Type: Thermally Conductive
1225185
from RS Components, Ltd.

A range of TIM (Thermal Interface Material) pads from Intelligent LED Solutions intended for use with the Duris S8 & S10 series of SCOB LEDs. Thermally conductive pads provide an essential interface between the LED modules and their associated heatsinks - they help to ensure efficient operation and... [See More]

  • Type: Thermally Conductive
  • Chemical System: Graphite
Thermal - Adhesives, Epoxies, Greases, Pastes -- 1000-142-ND [1188119 from Henkel Corporation - Industrial]
from Digi-Key Electronics

STYCAST 2850FT BLK18# 8.16KG [See More]

  • Type: Thermally Conductive
  • Use Temperature: -85 to ?
  • Chemical System: Epoxy
Thermal Interface Materials -- Heat-Spring® Bundle Pack: Squares: 1 Inch Squares: Qty 50 Pieces
from Indium Corporation

Packaged in tape & reel bundle packs and vacuum packed in a metallized bag. [See More]

  • Type: Thermally Conductive
  • Industry: Semiconductors, IC's
  • Chemical System: Metal
Epoxy Features Exceptional Chemical and Heat Resistance -- EP35SP
from Master Bond, Inc.

EP35SP is a two component epoxy system specially formulated to resist high temperatures and aggressive chemicals. It has a paste viscosity with little to no flow when curing. [See More]

  • Type: Thermally Conductive
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Thermal Adhesive/Compound/Material -- 126-4S [126-4S from Wakefield Thermal, Inc.]
from Richardson RFPD

The 126 Series is a nontoxic, synthetic, ester-based (nonsilicone) Thermal Joint Compound with metal oxide fillers designed to enhance thermal performance characteristics of plastic and metal package devices exceeding that of silicone-based compounds. Solved are problems associated with... [See More]

  • Type: Thermally Conductive
Dow DOWSIL™ 340 Heat Sink Compound Lubricant/Grease White 142 g Tube -- 340 CMPD 142G TUBE [1446622 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™ 340 Heat Sink Compound White is a one component, grease like silicone that is used for thermal coupling of electrical components to heat sinks. It is non-flowing, non-curing, thermally conductive, low bleed, and has high temperature stability. 142 g Tube. [See More]

  • Type: Thermally Conductive
  • Thermal Conductivity: 0.6700
  • Cure / Technology: Single Component
  • Dielectric Strength: 210
High Insulating Thermal Conductive Film -- SH1500/2000/3000
from Shiu Li Technology Co., Ltd

LiPOLY ’s thermal insulator SH1500/2000/3000 uses fiberglass cloth as a reinforcement material, combined with thermal conductive silicon, giving it high thermal conduction and great compression strength. The thermal conductivity is 1.5/2.0/3.0 W/m*K, the thickness is 0.23~0.35mm. Its high... [See More]

  • Type: Thermally Conductive
  • Form / Shape: Sheet Form, Die-cut Parts
  • Chemical System: Silicone
  • Gap Fill: 0.0091 to 0.0138
Two-Part Thermal Gap Filler -- SARCON® LG23A and LG30A
from Fujipoly® America Corp.

The SARCON® LG Series is the perfect solution for filling large, complex and uneven gaps between heat generating components that depend on reliable contact with a heat spreader to maintain optimal performance. SARCON® LG23A and LG30A easily dispense in a liquid form that will cure at room... [See More]

  • Type: Thermally Conductive
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Silicone
  • Form / Shape: Gap Filler, Foam in Place Gasket; Gel
Cover, Iec, To-220, Pk50; Insulator Body Material Tr Fastenings -- 43Y4130 [TRIEC-TO-220-18 from TR Fastenings]
from Newark, An Avnet Company

COVER, IEC, TO-220, PK50; Insulator Body Material:Nylon (Polyamide), Glass Filled; Thermal Conductivity:-; Breakdown Voltage Vbr:-; Thickness:3.7mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:- RoHS Compliant: Yes [See More]

  • Type: Thermally Conductive
1225186
from RS Components, Ltd.

A range of TIM (Thermal Interface Material) pads from Intelligent LED Solutions intended for use with the Duris S8 & S10 series of SCOB LEDs. Thermally conductive pads provide an essential interface between the LED modules and their associated heatsinks - they help to ensure efficient operation and... [See More]

  • Type: Thermally Conductive
  • Chemical System: Graphite
Thermal - Adhesives, Epoxies, Greases, Pastes -- 1000-143-ND [1188125 from Henkel Corporation - Industrial]
from Digi-Key Electronics

STYCAST 2850FT BLU18# [See More]

  • Type: Thermally Conductive
  • Use Temperature: -85 to ?
  • Chemical System: Epoxy
Thermal Interface Materials -- Heat-Spring® Bundle Pack: Squares: 1.5 Inch Squares - Qty 20 Pieces
from Indium Corporation

Packaged in tape & reel bundle packs and vacuum packed in a metallized bag. [See More]

  • Type: Thermally Conductive
  • Industry: Semiconductors, IC's
  • Chemical System: Metal
Epoxy Meets Airbus Standards for Flame Retardancy, Smoke and Gas Emissions -- EP93FRHT
from Master Bond, Inc.

EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]

  • Type: Thermally Conductive
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Dow DOWSIL™ 340 Heat Sink Compound Lubricant/Grease White 382 g Cartridge -- 340 CMPD 382G CART [2653338 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™ 340 Heat Sink Compound White is a one component, non-curing, grease like silicone that is used for thermal coupling of electrical components to heat sinks. It is non-flowing, low bleed, thermally conductive, and has high temperature stability. 382 g Cartridge. [See More]

  • Type: Thermally Conductive
  • Thermal Conductivity: 0.6700
  • Cure / Technology: Single Component
  • Viscosity: 542000
High Thermal Conductive Gap Filler -- T-top81
from Shiu Li Technology Co., Ltd

LiPOLY T-top81 is an ultra-soft, highly conformable, non-flammable interface material. T-top81 is a high deflection material, designed to allow minimal stress on components while offering excellent thermal conductivity and low thermal resistance. With a thermal conductivity of 8.0 W/m*K, T-top81... [See More]

  • Type: Thermally Conductive
  • Form / Shape: Sheet Form, Die-cut Parts
  • Chemical System: Silicone
  • Gap Fill: 0.0197 to 0.1969
Crystal Insulator, Rectangular, 0.1Mm; Insulator Body Material Bivar -- 39C6302 [CI-192-050 from Bivar, Inc.]
from Newark, An Avnet Company

CRYSTAL INSULATOR, RECTANGULAR, 0.1MM; Insulator Body Material:PET (Polyester); Thermal Conductivity:-; Breakdown Voltage Vbr:-; Thickness:0.1mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:- RoHS Compliant: Yes [See More]

  • Type: Thermally Conductive
1225187
from RS Components, Ltd.

A range of TIM (Thermal Interface Material) pads from Intelligent LED Solutions intended for use with the Duris S8 & S10 series of SCOB LEDs. Thermally conductive pads provide an essential interface between the LED modules and their associated heatsinks - they help to ensure efficient operation and... [See More]

  • Type: Thermally Conductive
  • Chemical System: Graphite
Thermal - Adhesives, Epoxies, Greases, Pastes -- 1000-167-ND [1188118 from Henkel Corporation - Industrial]
from Digi-Key Electronics

STYCAST 2850FT BLK 3# 1.36KG [See More]

  • Type: Thermally Conductive
  • Use Temperature: -85 to ?
  • Chemical System: Epoxy
Thermal Interface Materials -- Heat-Spring® Bundle Pack: Squares: 2 Inch Squares: Qty 20 Pieces
from Indium Corporation

Packaged in tape & reel bundle packs and vacuum packed in a metallized bag. [See More]

  • Type: Thermally Conductive
  • Industry: Semiconductors, IC's
  • Chemical System: Metal
Epoxy with High Elongation Passes ISO 10993-5 Certification for Cytotoxicity -- EP40Med
from Master Bond, Inc.

EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]

  • Type: Thermally Conductive
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Thermal Adhesive/Compound/Material -- 152-1B [152-1B-NC from Wakefield Thermal, Inc.]
from Richardson RFPD

DeltaBond ™ 152 adhesive is ideal for general cementing; thermally bonding semiconductors and components to chassis or heat sinks, while electrically isolating one from the other; fabricating heat sinks or thermal links; and for all permanent bonding of assemblies which require high thermally... [See More]

  • Type: Thermally Conductive
Dow DOWSIL™ 340 Heat Sink Compound Lubricant/Grease White 9 kg Pail -- 340 CMPD 9KG PAIL [1608410 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™ 340 Heat Sink Compound White is a one component, grease like silicone that is used for thermal coupling of electrical components to heat sinks. It is non-flowing, non-curing, thermally conductive, low bleed, and has high temperature stability. 9 kg Pail. [See More]

  • Type: Thermally Conductive
  • Thermal Conductivity: 0.6700
  • Cure / Technology: Single Component
  • Dielectric Strength: 210
High Thermal Conductive Gap Filler -- T-Work7000
from Shiu Li Technology Co., Ltd

Our high thermally conductive gap filler T-work7000 provides excellent compression and extremely low thermal resistance in form shape with high thermal conductivity for gap filling between electrical component and heatsink. [See More]

  • Type: Thermally Conductive
  • Form / Shape: Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
  • Gap Fill: 0.0197 to 0.1969
Crystal Insulator, Rectangular, 0.1Mm; Insulator Body Material Bivar -- 78K7298 [CI-192028 from Bivar, Inc.]
from Newark, An Avnet Company

CRYSTAL INSULATOR, RECTANGULAR, 0.1MM; Insulator Body Material:PET (Polyester); Thermal Conductivity:-; Breakdown Voltage Vbr:-; Thickness:0.1mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:- RoHS Compliant: Yes [See More]

  • Type: Thermally Conductive
1225188
from RS Components, Ltd.

A range of TIM (Thermal Interface Material) pads from Intelligent LED Solutions intended for use with the Duris S8 & S10 series of SCOB LEDs. Thermally conductive pads provide an essential interface between the LED modules and their associated heatsinks - they help to ensure efficient operation and... [See More]

  • Type: Thermally Conductive
  • Chemical System: Graphite
Thermal - Adhesives, Epoxies, Greases, Pastes -- 1000-168-ND [1188124 from Henkel Corporation - Industrial]
from Digi-Key Electronics

STYCAST 2850FT BLU 3# INDIVIDUAL [See More]

  • Type: Thermally Conductive
  • Use Temperature: -85 to ?
  • Chemical System: Epoxy
Thermal Interface Materials -- Thermal Interface Ribbon Kit
from Indium Corporation

The Thermal Interface Ribbon Kit includes 99.99% Indium ribbon that is 1.00" wide x thicknesses of: .002"/.006"/.010" by three feet of each. Also included is the 5RMA flux. [See More]

  • Type: Thermally Conductive
  • Form / Shape: Ribbon
  • Cure / Technology: Solder
  • Industry: Semiconductors, IC's
Extremely Soft MasterSil 170 Gel Encapsulant Offers Removability and Optical Clarity -- MasterSil 170 Gel
from Master Bond, Inc.

MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]

  • Type: Thermally Conductive
  • Composition: Unfilled
  • Chemical System: Silicone
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Thermal Adhesive/Compound/Material -- 152-G [152-G-NC from Wakefield Thermal, Inc.]
from Richardson RFPD

Richardson RFPD, an Arrow Company, is a specialized electronic component distributor providing design engineers with deep technical expertise and localized global design support for the latest new products from the world's leading suppliers of RF, Wireless, Energy and Power Technologies. [See More]

  • Type: Thermally Conductive
Dow DOWSIL™ Q1-9226 Conductive Adhesive Gray 2 kg Kit -- Q1-9226 A/B 2KG KIT [4001835 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™ Q1-9226 Thermally Conductive Adhesive Gray is a two component, heat curing, silicone adhesive that is used for bonding with a variety of substrates such as filled plastics, metals, epoxies, laminate boards, and ceramics. It is typically used for bonding substrates to heat sinks... [See More]

  • Type: Thermally Conductive
  • Thermal Conductivity: 0.7400
  • Cure / Technology: Two Component  
  • Tensile (Break): 508
High Thermal Conductive Gap Filler -- T-work8000
from Shiu Li Technology Co., Ltd

LiPOLY T-work8000 is a high performance thermally conductive interface pad. T-work8000 offers outstanding thermal conductivity at 15.0 W/m*K and extremely low thermal resistance under minimal force. T-work8000 offers excellent compression, filling small air gaps and uneven surfaces, ensuring an... [See More]

  • Type: Thermally Conductive
  • Form / Shape: Sheet Form, Die-cut Parts
  • Chemical System: Silicone
  • Gap Fill: 0.0197 to 0.1969
Dispensable Gel, Syringe, 10Cc, Pink; Dispensing Method Wakefield Solutions -- 85AC0730 [GL-20-10 from Wakefield-Vette, Inc.]
from Newark, An Avnet Company

DISPENSABLE GEL, SYRINGE, 10CC, PINK; Dispensing Method:Syringe; Volume:10cc; Weight:-; Product Range:ulTIMiFlux Series RoHS Compliant: Yes [See More]

  • Type: Thermally Conductive
1225189
from RS Components, Ltd.

A range of TIM (Thermal Interface Material) pads from Intelligent LED Solutions intended for use with the Duris S8 & S10 series of SCOB LEDs. Thermally conductive pads provide an essential interface between the LED modules and their associated heatsinks - they help to ensure efficient operation and... [See More]

  • Type: Thermally Conductive
  • Chemical System: Graphite
Thermal - Adhesives, Epoxies, Greases, Pastes -- 1000-169-ND [1188134 from Henkel Corporation - Industrial]
from Digi-Key Electronics

STYCAST 2850KT BLU 3LB [See More]

  • Type: Thermally Conductive
  • Use Temperature: -67 to 311
  • Chemical System: Epoxy
  • Thermal Conductivity: 2.78
Highly Flexible Addition Cured Silicone Offers Low Thermal Resistance -- MasterSil 151TC
from Master Bond, Inc.

MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]

  • Type: Thermally Conductive
  • Composition: Filled
  • Chemical System: Silicone
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Thermal Adhesive/Compound/Material -- 152-KA [152-KA-NC from Wakefield Thermal, Inc.]
from Richardson RFPD

DeltaBond ™ 152 adhesive is ideal for general cementing; thermally bonding semiconductors and components to chassis or heat sinks, while electrically isolating one from the other; fabricating heat sinks or thermal links; and for all permanent bonding of assemblies which require high thermally... [See More]

  • Type: Thermally Conductive
Dow DOWSIL™ SE 4486 CV Thermally Conductive Adhesive White 330 mL Cartridge -- SE 4486-USA 330ML CART [4014354 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™ SE 4486 Thermally Conductive Adhesive is a one component, moisture and heat curing, silicone elastomer that is used for potting power supplies, attaching base plates and heat sinks. It offers good dielectric properties, stress relief, wide temperature range, and resistance to... [See More]

  • Type: Thermally Conductive
  • Thermal Conductivity: 1.53
  • Cure / Technology: Single Component
  • Tensile (Break): 551
High Thermal Conductive Gap Filler -- T-work9000
from Shiu Li Technology Co., Ltd

LiPOLY T-work9000 offers outstanding thermal conductivity at 20.0 W/m*K and extremely low thermal resistance under minimal force. T-work9000 offers excellent compression, filling small air gaps on uneven surfaces, ensuring an efficient and consistent transfer of heat. [See More]

  • Type: Thermally Conductive
  • Form / Shape: Sheet Form, Die-cut Parts
  • Chemical System: Silicone
  • Gap Fill: 0.0197 to 0.1969
Electric Joint Compound, Circuit Breaker; Dispensing Method Square D By Schneider Electric -- 16B1734 [PJC7201 from Schneider Electric]
from Newark, An Avnet Company

ELECTRIC JOINT COMPOUND, CIRCUIT BREAKER; Dispensing Method:Tube; Volume:59.15ml; Weight:2oz; Product Range:-; Accessory Type:Electric Joint Compound; For Use With:I-Line Circuit Breakers, QMB Plug-On Units or Model-V MCC Units RoHS Compliant: NA [See More]

  • Type: Thermally Conductive
1225190
from RS Components, Ltd.

A range of TIM (Thermal Interface Material) pads from Intelligent LED Solutions intended for use with the Duris S8 & S10 series of SCOB LEDs. Thermally conductive pads provide an essential interface between the LED modules and their associated heatsinks - they help to ensure efficient operation and... [See More]

  • Type: Thermally Conductive
  • Chemical System: Graphite
Thermal - Adhesives, Epoxies, Greases, Pastes -- 1000-173-ND [2055134 from Henkel Corporation - Industrial]
from Digi-Key Electronics

STYCAST 2850FT BK, 5 GAL PA [See More]

  • Type: Thermally Conductive
  • Use Temperature: -85 to ?
  • Chemical System: Epoxy
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4501
from Hapco, Inc.

Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame... [See More]

  • Type: Thermally Conductive
  • Form / Shape: Liquid
  • Cure / Technology: Thermoset; Two Component  
  • Industry: Electronics
BERGQUIST GAP PAD TGP 1350
from Henkel Corporation - Industrial

BERGQUIST GAP PAD TGP 1350, Highly Conformable, Thermally Conductive, Reworkable Gap Filling Material. BERGQUIST ® GAP PAD TGP 1350 is a highly compliant Gap Pad material that is ideal for fragile component leads. The material includes a PEN film, which facilitates rework and improves puncture... [See More]

  • Type: Thermally Conductive
  • Form / Shape: Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
Dissipator® Adhesive -- Grade 745
from Hi-Tech Seals, Inc.

HERNON ® offers a complete line of structural acrylic adhesives. These systems are two-part, no mix, and reactive adhesives. Each acrylic adhesive has two components: the adhesive base or resin, and the Activator. Structural acrylic adhesives are termed “reactive ” cure systems. The... [See More]

  • Type: Thermally Conductive
  • Cure / Technology: Two Component  ; Reactive or Moisture Cured
  • Chemical System: Acrylic
  • Form / Shape: Grease, Paste
Adhesive Paste -- No. 19
from Sauereisen, Inc.

Sauereisen Adhesive Paste No. 19 is an inorganic, odorless, nontoxic cement used for bonding glass, porcelain, wood, felt, cork, metals and ceramic fiber. Some typical applications include protection of exposed metal surfaces during heat treating, bonding wallboard to brick or concrete and cementing... [See More]

  • Type: Thermally Conductive
  • Composition: Unfilled
  • Chemical System: Ceramic
  • Cure / Technology: Single Component
Elecolit® 6603 Thermally Conductive Epoxy 30gm -- PNEL00008
from Techsil Limited

Elecolit ® 6603 is a thermally conductive epoxy with very good metal adhesion and slight flexibility. This grade has very good flow behavior and can easily be processed using a dispenser, spreading knife or spatula. Although designed for bonding applications, 6603 can also be used as a potting... [See More]

  • Type: Electrically Conductive; Thermally Conductive
  • Cure / Technology: Thermoset
  • Chemical System: Epoxy
  • Industry: Electronics
Biocompatible, Thermally Conductive Epoxy -- EPO-TEK® MED-T905BN-3
from Epoxy Technology

EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries.  Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]

  • Type: Thermally Conductive
  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Form / Shape: Grease, Paste
2 oz. Thermally Conductive Compound, RoHS compliant -- 70115161 [100200F00000G from Boyd Corporation]
from Allied Electronics, Inc.

Ther-O-Link is a white thermal compound that cost effectively enhances the heat transfer between a semiconductor case and a heat sink. Silicone-based, and easy to apply, Ther-O-Link substantially reduces dry interface thermal resistance, while providing long life under a variety of conditions. [See More]

  • Type: Thermally Conductive
  • Use Temperature: -40 to 392
  • Form / Shape: Grease, Paste
Thermal Compound -- TC70
from Nordson EFD

Our innovative, non-silicone thermal compounds provide an ideal thermal solution by ensuring reliable heat transfer over a longer time than most industrial thermal interface materials. Conventional, silicone-based heat sink compounds and thermal greases tend to spread after a number of heating and... [See More]

  • Type: Thermally Conductive
  • Composition: Unfilled
  • Chemical System: Synthetic Based
  • Cure / Technology: Single Component
Gap Pad 1000HD -- 8806383648769
from Henkel Corporation - Electronics

Gap Pad ® 1000HD was designed to with-stand applications requiring high durability. The coated polyimide carrier on one side of the material allows easy rework, excellent handling characteristics and puncture resistance. The conformable and elastic nature of Gap Pad ® 1000HD allows excellent... [See More]

  • Type: Thermally Conductive
  • Industry: Electronics
Thermal Interface Materials
from ArKco Sales, Inc.

About Us. ArKco Sales, Inc was founded in 1977 as an electro-mechanical manufacturer ’s representative, with heavy emphasis on the engineering community, serving customers, distributors, and principals. ArKco Sales facilitates synergistic, innovative, global product solutions for current and... [See More]

  • Type: Thermally Conductive
High Temperature Cement -- OMEGABOND® Air Set Series
from OMEGA Engineering, Inc.

Air Set Cements set or cure through loss of moisture by evaporation. Atmospheric conditions therefore affect the drying rate. Air Set Cements are used mainly in thin film applications (applied in thicknesses less than 1/4")*. SELECTION CRITERIA FOR CEMENTS. 1. Type of Application Potting, sealing,... [See More]

  • Type: Thermally Conductive
  • Cure / Technology: Two Component   (optional feature); Single Component (optional feature)
  • Chemical System: Ceramic
  • Form / Shape: Liquid (optional feature); Powder (optional feature); Encapsulant or Conformal Coating
Clear Non-Yellowing Silicone Encapsulant -- PNS-56225
from Protavic America, Inc.

PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]

  • Type: Electrically Conductive; Thermally Conductive
  • Composition: Unfilled
  • Chemical System: Silicone
  • Cure / Technology: Thermoset; Two Component  
Aremco-Seal -- 613
from Aremco Products, Inc.

Aremco offers an expansive range of ceramic-based materials used for the assembly of high temperature, high power electrical devices, and high temperature fixtures, molds and tooling. These materials, based on aluminum oxide, aluminum nitride, magnesium oxide, silicon dioxide, silicon carbide,... [See More]

  • Type: Thermally Conductive
  • Industry: Electronics
  • Form / Shape: Liquid; Encapsulant or Conformal Coating
  • Features: Dissimilar Substrates
Arctic Alumina Thermal Compound (1.75 gram) -- 407
from Xoxide

Introducing Arctic Alumina Thermal Compound, the first ceramic-based, polysynthetic thermal compound for use between modern high-power CPUs and high performance heatsinks or water-cooling solutions. Features: Made with micronized aluminum oxide and boron nitride: Arctic Alumina uses a layered... [See More]

  • Type: Thermally Conductive
Flowable, One-component Silicone Sealant -- CENUSIL® RT 760 CN A/B
from Wacker Chemical Corp.

WACKER ’s silicone adhesives and sealants are based on many years of experience, innovative research and comprehensive technological expertise. In a wide variety of industries, especially in lighting technology, flowable or non-sag silicone products offer decisive advantages in performance and... [See More]

  • Type: Thermally Conductive
  • Industry: Electronics
  • Chemical System: Silicone; Elastomeric
Potting/Encapsulation Compound -- INSTAbond® 809FR
from ACCRAbond, Inc.

INSTAbond ® 809FR. INSTAbond ® 809 FR exhibits good thermal conductivity, excellent flow properties, and low exotherm characteristics in large masses. INSTAbond ® 809 FR meets the requirements for UL-94 V-0 rating for flame retardancy. [See More]

  • Type: Thermally Conductive
  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Features: Flame Retardant; UL Rating
Metal Oxide Thickened Dimethyl Silicone Compound -- Bluesil™ V-740
from Bluestar Silicones USA Corp.

Metal Oxide Thickened Dimethyl Silicone Compound. Description. Bluesil V-740 is a metal oxide thickened dimethyl silicone compound. It is a white, heavy paste used for heat dissipation applications where high thermal conductivity is required. [See More]

  • Type: Thermally Conductive
  • Cure / Technology: Two Component  
  • Chemical System: Silicone
  • Form / Shape: Grease, Paste
55 Shore D polyurethane adhesive -- 10-2055
from Epoxies Etc...

The 10-2055 and 10-2055 HV were developed to produce a general purpose, semi flexible polyurethane adhesive for bonding a wide variety of plastic and metal substrates. The flexibility of these adhesives allows bonding to substrates with high coefficients of thermal expansion (CTE) and substrates... [See More]

  • Type: Thermally Conductive
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Polyurethane
  • Form / Shape: Die Bonding Adhesives; Grease, Paste
Di-Pak™ Rigid Eletrical Insulating Compound -- R-4528/7
from Hapco, Inc.

DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity). Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI-COAT R-4721 is easy to... [See More]

  • Type: Thermally Conductive
  • Form / Shape: Liquid
  • Cure / Technology: Thermoset; Two Component  
  • Industry: Electronics
Die Attach Adhesives -- LOCTITE ABLESTIK 2000T
from Henkel Corporation - Industrial

LOCTITE ABLESTIK 2000T, Proprietary Hybrid Chemistry, Die Attach, Electrically Conductive Adhesive LOCTITE ® ABLESTIK 2000T electrically conductive adhesive is designed for die attach applications. It features high thermal conductivity and high adhesion to a variety of substrates. High thermal... [See More]

  • Type: Thermally Conductive
  • CTE: 27
Cement -- No. 31
from Sauereisen, Inc.

Sauereisen Cement No. 31 is a white, porcelain-like cement that is widely used throughout industry in a variety of applications. including assembling, sealing, insulating and cementing of ceramics, porcelain, metal, and glass. [See More]

  • Type: Thermally Conductive
  • Composition: Unfilled
  • Chemical System: Ceramic
  • Cure / Technology: Two Component  ; Chemically Set
MG Chemicals 8331 Silver Conductive Epoxy 115gm -- MGEP00007
from Techsil Limited

MG Chemicals 8331 is a Silver Conductive Epoxy with a moderate cure time and high conductivity. This is an economical electronic epoxy with good electrical and thermal conductivities. The adhesive bonds very well to a variety of surfaces, it resists thermal and mechanical shocks and provides the low... [See More]

  • Type: Electrically Conductive; Thermally Conductive
  • Cure / Technology: Thermoset
  • Chemical System: Epoxy
  • Industry: Electronics
Chemical,Heat Sink Comp,1 lb,Silicone Free,Jar -- 70207177 [1978-1 from Techspray, an ITW Company]
from Allied Electronics, Inc.

Features exceptionally low bleed and evaporation characteristics. Will not harden, dry out or melt; will not contaminate wave and solder baths. Meets or exceeds KS 21343 and MIL-C-47113. Use with both metal and plastic. Ideal for Electronic Applications. Avoids Silicone Contamination for Soldering [See More]

  • Type: Thermally Conductive
  • Form / Shape: Grease, Paste
  • Chemical System: Silicone
  • Use Temperature: -40 to 392
Gap Pad 1000SF -- 8806383747073
from Henkel Corporation - Electronics

The new Gap Pad 1000SF is a thermally conductive, electrically insulating, silicone-free polymer specially designed for silicone-sensative applications. The material is ideal for applications with high standoff and flatness tolerances. Gap Pad 1000SF is reinforced for easy material handling and... [See More]

  • Type: Thermally Conductive
  • Industry: Electronics
High Temperature Cement -- OMEGABOND® Chemical Set Series
from OMEGA Engineering, Inc.

Chemical Set Cements set or cure by an internal chemical action which does not require exposure to air. Chemical Set Cements can be used in thick applications (applied in thicknesses greater than 1/4")*. SELECTION CRITERIA FOR CEMENTS. 1. Type of Application Potting, sealing, encapsulating,... [See More]

  • Type: Thermally Conductive
  • Cure / Technology: Two Component   (optional feature); Single Component (optional feature)
  • Chemical System: Ceramic
  • Form / Shape: Liquid (optional feature); Powder (optional feature); Encapsulant or Conformal Coating
Electro-Conductive Epoxy Adhesive -- ACE-10131
from Protavic America, Inc.

Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for production needs. One... [See More]

  • Type: Electrically Conductive; Thermally Conductive
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Single Component
Ceramabond -- 503
from Aremco Products, Inc.

High fired strength, dense ceramics [See More]

  • Type: Thermally Conductive
  • Composition: Filled
  • Chemical System: Ceramic
  • Cure / Technology: Thermoset
Arctic Alumina Thermal Compound (14 gram) -- 408
from Xoxide

Introducing Arctic Alumina Thermal Compound, the first ceramic-based, polysynthetic thermal compound for use between modern high-power CPUs and high performance heatsinks or water-cooling solutions. Features: Made with micronized aluminum oxide and boron nitride: Arctic Alumina uses a layered... [See More]

  • Type: Thermally Conductive
Pourable, Addition-Curing RTV-2 Silicone Rubber -- ELASTOSIL® RT675 A/B
from Wacker Chemical Corp.

ELASTOSIL ® RT 675 A/B is a pourable, addition-curing RTV-2 silicone rubber. [See More]

  • Type: Thermally Conductive
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Silicone; Elastomeric
  • Form / Shape: Liquid
Flame Retardant Thermally Conductive -- 50-3150 FR
from Epoxies Etc...

50-3150 FR has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-3150 FR Black Epoxy with Catalyst 190 and Catalyst 105 are listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low shrinkage, and outstanding insulation... [See More]

  • Type: Thermally Conductive
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Die Attach Adhesives -- LOCTITE ABLESTIK 84-1LMIT
from Henkel Corporation - Industrial

LOCTITE ABLESTIK 84-1LMIT, Epoxy, Component assembly, Electrically Conductive Adhesive. LOCTITE ® ABLESTIK 84-1LMIT adhesive is designed for medium die attach applications. This adhesive is ideal for application by syringe dispensing or screen printing. Electrically conductive. High thermal... [See More]

  • Type: Thermally Conductive
  • Cure / Technology: Single Component
  • Chemical System: Epoxy
  • Form / Shape: Paste
MG Chemicals Med Cure Thermal Epoxy Adhesive 6ml -- MGEP00014
from Techsil Limited

MG Chemicals 8329TCM is a medium cure thermally conductive epoxy adhesive which has a convenient 1:1 mix ratio and a 45 minute work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to mechanical shocks and... [See More]

  • Type: Thermally Conductive
  • Cure / Technology: Thermoset
  • Chemical System: Epoxy
  • Industry: Electronics
Chemical; Boron Nitride; Heat Sink Grease; Tube, 3.4 g syringe -- 70219352
from Allied Electronics, Inc.

The tube dispenser for precise application of silicone compound that facilitates heat transfer away from electronics and electrical components. Excellent Thermal Conductivity and Dielectric Properties. Will Not Dry Out, Harden or Melt. Noncorrosive and Nonflammable. Thermally Stable from –40... [See More]

  • Type: Thermally Conductive
  • Form / Shape: Grease, Paste
Gap Pad 1450 -- 8806384107521
from Henkel Corporation - Electronics

Gap Pad ® 1450 is a highly compliant Gap Pad material that is ideal for fragile component leads. The material includes a permanent liner, which facilitates rework and improves puncture resistance and handling characteristics. The un-lined side of Gap Pad ® 1450 maintains a conformable, yet... [See More]

  • Type: Thermally Conductive
  • Industry: Electronics
High Thermally Conductive Paste -- OMEGATHERM® OT-201 Series
from OMEGA Engineering, Inc.

OMEGATHERM thermal conducting paste is a high temperature and high thermally conductive paste product. They are specially formulated for permanent and temporary bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics,... [See More]

  • Type: Thermally Conductive
  • Cure / Technology: Single Component
  • Chemical System: Silicone
  • Form / Shape: Grease, Paste
Epoxy Adhesive -- ANE-20904
from Protavic America, Inc.

Epoxy system designed for underfill applications. This material is fast flowing and provides excellent properties for common device packaging. [See More]

  • Type: Thermally Conductive
  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Epoxy
  • Form / Shape: Die Bonding Adhesives; Liquid
Ceramabond -- 890
from Aremco Products, Inc.

Aremco ’s high temperature ceramic adhesives are unique inorganic formulations for bonding and sealing ceramics, metals, quartz, graphites, textiles, and composite materials used in design, process and maintenance applications to 3200 °F. These advanced materials, which exhibit high... [See More]

  • Type: Electrically Conductive; Thermally Conductive
  • Form / Shape: Grease, Paste
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Industry: Electronics
Arctic Silver 5 Thermal Compound (12 gram) -- 405
from Xoxide

Introducing Arctic Silver 5 With its unique high-density filling of micronized silver and enhanced thermally conductive ceramic particles, Arctic Silver 5 provides a new level of performance and stability. Arctic Silver 5 is optimized for use between modern high-power CPUs and high performance... [See More]

  • Type: Thermally Conductive
Thermally Conductive PU Potting Compound -- 20-2366FR
from Epoxies Etc...

20-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 20-2366 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical... [See More]

  • Type: Thermally Conductive
  • Composition: Unfilled
  • Chemical System: Polyurethane; Elastomeric
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Electrically Conductive Adhesives -- LOCTITE ABLESTIK ABP 8065T
from Henkel Corporation - Industrial

LOCTITE ABLESTIK ABP 8065T, BMI Acrylate, Die Attach, Highly filled, Conductive Adhesive LOCTITE ® ABLESTIK ABP 8065T highly filled, conductive die-attach adhesive is designed for bonding mini dies in high reliability package applications. It is formulated to provide high heat transfer... [See More]

  • Type: Thermally Conductive
  • CTE: 22
  • Thermal Conductivity: 10
  • Viscosity: 9000
MG Chemicals Silver Conductive Epoxy (10 Min) 14gm -- MGEP00006
from Techsil Limited

MG Chemicals 8331 is a Silver Conductive Epoxy with a moderate cure time and high conductivity. This is an economical electronic epoxy with good electrical and thermal conductivities. The adhesive bonds very well to a variety of surfaces, it resists thermal and mechanical shocks and provides the low... [See More]

  • Type: Electrically Conductive; Thermally Conductive
  • Cure / Technology: Thermoset
  • Chemical System: Epoxy
  • Industry: Electronics
Chemical; Heat Sink; 44 Non-Silicone; 1x 10^15; 420 @ 0.050 in. gap volt/mil -- 70159784 [10/26/2022 from GC Electronics]
from Allied Electronics, Inc.

Wrist Strap Ground Cords, Ground Cord. Non-contaminating Synthetic-Ester based, capable of moving 46% more heat than other compounds. Meets Belcore spec. K521334 and Mil spec. C-47113. All GC Aerosols, Except as noted contain no Ecology-Damaging Fluorocarbons [See More]

  • Type: Thermally Conductive
  • Use Temperature: -22 to 390
  • Form / Shape: Grease, Paste
Gap Pad 1500 -- 8806384238593
from Henkel Corporation - Electronics

Gap Pad 1500 has an ideal filler blend that gives it a low modulus characteristic that maintains optimal thermal performance yet still allows for easy handling. The natural tack on both sides of the material allows for good compliance to adjacent surfaces of components, minimizing interfacial... [See More]

  • Type: Thermally Conductive
  • Industry: Electronics
Thermally Conductive Epoxy -- OB-100 / OB-200 Series
from OMEGA Engineering, Inc.

OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper products. [See More]

  • Type: Thermally Conductive
  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Form / Shape: Liquid
Epoxy Cast -- PTE-36977
from Protavic America, Inc.

PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ is heat stable up to 150 °C. [See More]

  • Type: Thermally Conductive
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Pyro-Putty® -- 657
from Aremco Products, Inc.

Used for repairing metal components, pinholes, cracks, and filling seams. [See More]

  • Type: Thermally Conductive
  • Composition: Filled
  • Chemical System: Ceramic
  • Cure / Technology: Thermoset
Arctic Silver 5 Thermal Compound (3.5 gram) -- 402
from Xoxide

Introducing Arctic Silver 5 - With its unique high-density filling of micronized silver and enhanced thermally conductive ceramic particles, Arctic Silver 5 provides a new level of performance and stability. Arctic Silver 5 is optimized for use between modern high-power CPUs and high performance... [See More]

  • Type: Thermally Conductive
Electrically Non-Conductive Adhesives -- LOCTITE ABLESTIK 12-2
from Henkel Corporation - Industrial

LOCTITE ABLESTIK 12-2, Silicone, General Assembly LOCTITE ® ABLESTIK 12-2 adhesive is the lower viscosity version of ABLETHERM 12-1 adhesive. It is designed for bonding applications which require high thermal conductivity and reworkability. Thermally conductive. Reworkable. Unfilled [See More]

  • Type: Thermally Conductive
  • Cure / Technology: Single Component
  • Chemical System: Silicone
MG Chemicals Silver Conductive Epoxy (10 Min) 19gm -- MGEP00004
from Techsil Limited

MG Chemicals 8330 Silver Conductive Epoxy is a higher conductivity version of the 8331 Silver Conductive Epoxy. It is an electronic grade epoxy which combines a moderate curing rate and a high conductivity. It bonds very well to most substrates used in electronic assemblies; resists thermal and... [See More]

  • Type: Electrically Conductive; Thermally Conductive
  • Cure / Technology: Thermoset
  • Chemical System: Epoxy
  • Industry: Electronics
Chemical; Silicone Free; Heat Sink Grease; Tube, 8 g syringe -- 70219353
from Allied Electronics, Inc.

The tube dispenser for precise application of silicone compound that facilitates heat transfer away from electronics and electrical components. Excellent Thermal Conductivity and Dielectric Properties. Will Not Dry Out, Harden or Melt. Noncorrosive and Nonflammable. Thermally Stable from –40... [See More]

  • Type: Thermally Conductive
  • Form / Shape: Grease, Paste
  • Chemical System: Silicone
Gap Pad 1500R -- 8806384435201
from Henkel Corporation - Electronics

Gap Pad 1500R has the same highly conformable, low modulus polymer as the standard Gap Pad 1500. The fiberglass reinforcement allows for easy material handling and enhances puncture, shear and tear resistance. The natural tack on both sides of the material allows for good compliance to mating... [See More]

  • Type: Thermally Conductive
  • Industry: Electronics
Thermcoat Cement & Lacquer Kit -- THERMCOAT Series
from OMEGA Engineering, Inc.

OMEGA's THERMCOAT KIT is used for cementing fine-gage thermocouples in place on metal, plastic and ceramic surfaces and for assembling and installing thermopiles, temperature probes and thermocouple bolometers. THERMCOAT CO and THERMCOAT COL This is a fast-setting two-part cement which should be... [See More]

  • Type: Thermally Conductive
  • Cure / Technology: Thermoset (optional feature); Single Component
  • Chemical System: Ceramic
  • Form / Shape: Liquid (optional feature); Powder (optional feature)
Arctic Silver Ceramique 2 Thermal Compound (2.7 gram) -- 70953
from Xoxide

The high-density, ceramic-based thermal compound specifically designed for modern high-power CPUs and high-performance heatsinks or water-cooling solutions. Features: Tri-Linear Ceramic Content: Like the original C éramique, C éramique 2 uses only ceramic fillers so it is neither... [See More]

  • Type: Thermally Conductive
Electrically Non-Conductive Adhesives -- LOCTITE ABLESTIK 8-2
from Henkel Corporation - Industrial

LOCTITE ABLESTIK 8-2, Epoxy, Non-conductive Die Attach Adhesive LOCTITE ® ABLESTIK 8-2 non-conductive die attach adhesive is designed for MEMs package applications. Designed as an instrument adhesive, LOCTITE ABLESTIK 8-2 adhesive offers eight times the thermal conductivity of unfilled epoxies. [See More]

  • Type: Thermally Conductive
  • Cure / Technology: Single Component
  • Chemical System: Epoxy
MG Chemicals Silver Conductive Epoxy (4 Hour) 21gm -- MGEP00005
from Techsil Limited

MG Chemicals 8330S is a Silver Conductive Epoxy with a slow cure time and extreme conductivity. This electronic grade epoxy combines a long working time and high conductivity. The cured conductive adhesive bonds very well to most substrates used in electronic assemblies, resists thermal and... [See More]

  • Type: Electrically Conductive; Thermally Conductive
  • Cure / Technology: Thermoset
  • Chemical System: Epoxy
  • Industry: Electronics
Chemical; Silicone; Heat Sink Grease; Tube; -- 70219367
from Allied Electronics, Inc.

The tube dispenser for precise application of silicone compound that facilitates heat transfer away from electronics and electrical components. Excellent Thermal Conductivity and Dielectric Properties. Will Not Dry Out, Harden or Melt. Noncorrosive and Nonflammable. Thermally Stable from –40... [See More]

  • Type: Thermally Conductive
  • Form / Shape: Grease, Paste
  • Chemical System: Silicone
  • Use Temperature: -40 to 342
Gap Pad 1500S30 -- 8806384533505
from Henkel Corporation - Electronics

Gap Pad 1500S30 is a highly compliant Gap Pad material that is ideal for fragile component leads.The material is fiberglass reinforced for improved puncture resistance and handling characteristics. Gap Pad 1500S30 maintains a conformable, yet elastic nature that provides excellent interfacing and... [See More]

  • Type: Thermally Conductive
  • Industry: Electronics
Arctic Silver Ceramique Thermal Compound (2.5 gram) -- 400
from Xoxide

The high-density, ceramic-based thermal compound specifically designed for modern high-power CPUs and high-performance heatsinks or water-cooling solutions. Made with micronized aluminum oxide, boron nitride and zinc oxide. Ceramique uses a high-density layered composite of five unique shapes of... [See More]

  • Type: Thermally Conductive
Electrically Non-Conductive Adhesives -- LOCTITE ABLESTIK 813J01 BIPAX
from Henkel Corporation - Industrial

LOCTITE ABLESTIK 813J01 BIPAX, Silicone, Non-corrosive, Encapsulant LOCTITE ® ABLESTIK 813J01 BIPAX exhibits very low stress upon cure thus preventing component cracking and other stress-related problems. This adhesive can be cured at room temperature in thick or thin sections. It is... [See More]

  • Type: Thermally Conductive
  • Cure / Technology: Single Component
  • Chemical System: Silicone
  • Viscosity: 40000
MG Chemicals Silver Conductive Epoxy (4 Hour)125gm -- MGEP00008
from Techsil Limited

MG Chemicals 8330S is a Silver Conductive Epoxy with a slow cure time and extreme conductivity. This electronic grade epoxy combines a long working time and high conductivity. The cured conductive adhesive bonds very well to most substrates used in electronic assemblies, resists thermal and... [See More]

  • Type: Electrically Conductive; Thermally Conductive
  • Cure / Technology: Thermoset
  • Chemical System: Epoxy
  • Industry: Electronics
HEAT SINK 1 LB. JAR (Z9) -- 70159755 [10/6/2022 from GC Electronics]
from Allied Electronics, Inc.

Heat Sink, 2.350 Specific Gravity. Zinc oxide filled silicone grease with heat transfer properties. Does not soften under elevated temperatures. Will not dry and harden. All GC Aerosols, Except as noted contain no Ecology-Damaging Fluorocarbons [See More]

  • Type: Thermally Conductive
  • Form / Shape: Grease, Paste
Gap Pad 2000S40 -- 8806384697345
from Henkel Corporation - Electronics

Gap Pad 2000S40 is recommended for low-stress applications that require a mid to high thermally conductive interface material. The highly conformable nature of the material allows the pad to fill in air voids and air gaps between PC boards and heat sinks or metal chassis with stepped topography,... [See More]

  • Type: Thermally Conductive
  • Industry: Electronics
Gelid GC Extreme Thermal Compound -- 70711
from Xoxide

Features: Ultimate Heat Conductivity. Non-Electrical Conductive. Non-Corrosive & Non-Curring. No Bleeding & User Friendly. GELID Applicator. Net Content of 3.5g. Created for Extreme Users on highest level the GC- Extreme thermal compound (3.5g) achieves the best heat conductivity from your... [See More]

  • Type: Thermally Conductive
Electrically Non-Conductive Adhesives -- LOCTITE ABLESTIK 872-7TN1
from Henkel Corporation - Industrial

LOCTITE ABLESTIK 872-7TN1, Epoxy, Non-conductive adhesive LOCTITE ® ABLESTIK 872-7TN1 is ideal for electronic applications requiring stress relief. Flexible. Thixotropic. High viscosity. Long work life. Easy handling. High thermal conductivity. Reduced stress [See More]

  • Type: Thermally Conductive
  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Form / Shape: Paste
MG Chemicals Slow Cure Thermal Epoxy Adhesive 6ml -- MGEP00003
from Techsil Limited

MG Chemicals 8329TCS is a slow cure electrically insulating epoxy adhesive. Combines a long working 1:1 mix ratio and a 4 hour work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to mechanical shocks and... [See More]

  • Type: Thermally Conductive
  • Cure / Technology: Thermoset
  • Chemical System: Epoxy
  • Industry: Electronics
HEAT SINK COMPOUND, TUBE, 6.5 GR. -- 70159754 [10/8/2022 from GC Electronics]
from Allied Electronics, Inc.

Wrist Strap Ground Cords, Ground Cord. Zinc oxide filled silicone grease with heat transfer properties. Does not soften under elevated temperatures. Will not dry and harden. All GC Aerosols, Except as noted contain no Ecology-Damaging Fluorocarbons [See More]

  • Type: Thermally Conductive
  • Use Temperature: -40 to 400
  • Form / Shape: Grease, Paste
Gap Pad 2200SF -- 8806383845377
from Henkel Corporation - Electronics

Gap Pad 2200SF is a thermally conductive, electrically isolating, silicone-free polymer specially designed for silicone-sensitive applications. The material is ideal for applications with uneven topologies and high stackup tolerances. Gap Pad 2200SF is reinforced for easy material handling and added... [See More]

  • Type: Thermally Conductive
  • Industry: Electronics
IC Diamond 24 High- Performance Thermal Compound 4.8g -- 70258
from Xoxide

Why settle for silver, when you could have Diamond? The IC Diamond 7 from Innovation Cooling consists of over 92% micronized synthetic diamond, which has over five times the thermal conductivity of silver! Diamond is also a well-known insulator, so you don 't have to worry about zapping anything... [See More]

  • Type: Thermally Conductive
Electrically Non-Conductive Adhesives -- LOCTITE ABLESTIK ABP 8163F-1
from Henkel Corporation - Industrial

LOCTITE ABLESTIK ABP 8163F-1, Silicone, Die Attach, Non-conductive Adhesive LOCTITE ® ABLESTIK ABP 8163F-1 non-conductive die attach adhesive is designed for LED and sensor manufacturing applications. High thermal conductivity. High reflectivity. Excellent anti-yellowing properties [See More]

  • Type: Thermally Conductive
  • Viscosity: 21000
  • Thermal Conductivity: 0.8000
MG Chemicals Thermal Conductive Epoxy 50ml -- MGEP00002
from Techsil Limited

MG Chemicals 8329TCM is a medium cure thermally conductive epoxy adhesive which has a convenient 1:1 mix ratio and a 45 minute work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to mechanical shocks and... [See More]

  • Type: Electrically Conductive; Thermally Conductive
  • Cure / Technology: Thermoset
  • Chemical System: Epoxy
  • Industry: Electronics
HEAT SINK HTC SILICONE 1 OZ. -- 70159753 [10/1/1935 from GC Electronics]
from Allied Electronics, Inc.

Wrist Strap Ground Cords, Ground Cord. Higher thermal conductivity formula has all the same benefits of conventional heat sink greases, plus is exceptionally stable in high humidity applications. All GC Aerosols, Except as noted contain no Ecology-Damaging Fluorocarbons [See More]

  • Type: Thermally Conductive
  • Form / Shape: Grease, Paste
  • Chemical System: Silicone
  • Use Temperature: -40 to 400
Gap Pad 2202SF -- 8806383878145
from Henkel Corporation - Electronics

Gap Pad ® 2202SF is a high performance, 2.0 W/m-K, thermally conductive gap filling material. The Gap Pad ® 2202SF compound is silicone-free by design and offers exceptionally low interfacial resistances to adjacent surfaces. Gap Pad ® 2202SF is specifically designed for... [See More]

  • Type: Thermally Conductive
  • Industry: Electronics
IC Diamond 7 High-Performance Thermal Compound 1.5g -- 70257
from Xoxide

Why settle for silver, when you could have Diamond? The IC Diamond 7 from Innovation Cooling consists of over 92% micronized synthetic diamond, which has over five times the thermal conductivity of silver! Diamond is also a well-known insulator, so you don 't have to worry about zapping anything... [See More]

  • Type: Thermally Conductive
Encapsulants -- LOCTITE PE 3164
from Henkel Corporation - Industrial

Clear epoxy resin hardener which is one part of a two part epoxy system designed for use with a variety of LOCTITE HYSOL resins. LOCTITE ® PE 3164 is a clear epoxy resin hardener which forms a black, fast gelling, low viscosity, room temperature cure potting compound with high thermal... [See More]

  • Type: Thermally Conductive
  • Chemical System: Epoxy
Momentive SilCool TSE3281 G Thermal Silicone 1kg -- MOSI01220
from Techsil Limited

TSE3281-G is a thermally conductive silicone adhesive from Momentive Performance Materials. This one component material is non-corrosive and has excellent adhesion properties to a wide variety of substrates. Potential applications for TSE3281-G include sealing and bonding for thermally conductive... [See More]

  • Type: Thermally Conductive
  • Industry: Electronics
  • Chemical System: Silicone; Elastomeric
Heat Sink; Zinc Oxide; TubeWeight == 4 oz.; 2.3 x 10^12 OHMS/CM Ohms-cm; -- 70207176 [1978-DP from Techspray, an ITW Company]
from Allied Electronics, Inc.

Ionization Test Kit, 1000 V Voltage Rating. Silicone Free Heat Sink Compound, 4 ounce Tube. Ideal for Electronic Applications. Avoids Silicone Contamination for Soldering [See More]

  • Type: Thermally Conductive
  • Use Temperature: -40 to 392
  • Form / Shape: Grease, Paste
  • Dielectric Strength: 200
Gap Pad 3004SF -- 8806384861185
from Henkel Corporation - Electronics

Gap Pad ® 3004SF is high performance, 3.0 W/m-K, thermally conductive gap filling material. Gap Pad ® 3004SF is silicone-free by design and offers exceptionally low interfacial resistances to adjacent surfaces. Gap Pad ® 3004SF is designed for applications that are silicone-sensitive. [See More]

  • Type: Thermally Conductive
  • Industry: Electronics
IC Perihelion High-Performance Ceramic Thermal Compound -- 70256
from Xoxide

Introducing Innovation Cooling 's latest offering, the IC Perihelion! This high-performance ceramic thermal compound features a ceramic base with a high bulk loading of over 91% to prevent pump out due to thermal cycling. It is completely silicone-free and non-capacitive, and will not conduct... [See More]

  • Type: Thermally Conductive
Encapsulants -- LOCTITE STYCAST 2762FT
from Henkel Corporation - Industrial

LOCTITE STYCAST 2762FT, Epoxy, High Temperature Resistance, High Thermal Conductivity, Potting, Encapsulant LOCTITE ® STYCAST 2762FT epoxy encapsulant is designed for potting electronic components exposed to harsh environments. This material is also ideal for large and complex castings that... [See More]

  • Type: Thermally Conductive
  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Viscosity: 25000
Momentive SnapSIL TN3005 Clear Silicone 310ml -- MOSI01370
from Techsil Limited

Momentive SnapSIL TN3005 is a low volatile siloxane, silicone adhesive sealant that cures at room temperature. It offers primerless adhesion to many substrates and high elongation once cured. Ideal for use as an insulating adhesive seal and fixing for electrical and electronic parts. Can also be... [See More]

  • Type: Thermally Conductive
  • Industry: Electronics
  • Chemical System: Silicone; Elastomeric
Heat Transfer Compound; non-silicone; high thermal conductivity; 1 pt tub -- 70125530 [8610-1P from MG Chemicals]
from Allied Electronics, Inc.

AC Outlet Analyzer and Wrist Strap Tester. Designed for use in transferring heat away from electrical and electronic devices such as; transistors, power diodes, semi-conductors, ballasts and thermocouple wells. High thermal conductivity, high dielectric constant, high dissipation factor, use with... [See More]

  • Type: Thermally Conductive
  • Use Temperature: 392
  • Form / Shape: Grease, Paste
Gap Pad 3500ULM -- 8806384893953
from Henkel Corporation - Electronics

Gap Pad ® 3500ULM (ultra low-modulus) is an extremely soft gap filling material rated at a thermal conductivity of 3.5 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique 3.5 W/m-K filler package and ultra-low modulus resin formulation. The enhanced... [See More]

  • Type: Thermally Conductive
  • Industry: Electronics
Noctua NT-H1 Thermal Compound -- 80315
from Xoxide

The NT-H1 from Noctua is a pro-grade TIM solution for those who crave the right evacuation plan for their CPU heat. The perfect compound for the serious enthusiast who demands top-notch performance from a product that 's also easy to use, the NT-H1 uses an array of different micro-particles that... [See More]

  • Type: Thermally Conductive
Encapsulants -- LOCTITE STYCAST 2850FTJ
from Henkel Corporation - Industrial

LOCTITE STYCAST 2850FTJ, Epoxy, Encapsulant. LOCTITE ® STYCAST 2850FTJ epoxy encapsulant is designed for use in high voltage applications where surface arcing or tracking is a concern. LOCTITE STYCAST 2850FTJ is recommended for encapsulation of components that require heat dissipation and... [See More]

  • Type: Thermally Conductive
  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Viscosity: 225000
Momentive SnapSIL TN3005 White Silicone 310ml -- MOSI01371
from Techsil Limited

Momentive SnapSIL TN3005 is a low volatile siloxane, silicone adhesive sealant that cures at room temperature. It offers primerless adhesion to many substrates and high elongation once cured. Ideal for use as an insulating adhesive seal and fixing for electrical and electronic parts. Can also be... [See More]

  • Type: Thermally Conductive
  • Industry: Electronics
  • Chemical System: Silicone; Elastomeric
Heat Transfer Compound; non-silicone; high thermal conductivity; 2 oz tub -- 70125528 [8610-60G from MG Chemicals]
from Allied Electronics, Inc.

Heat Transfer Compound, 350 V ⁄MIL Dielectric Strength, 2.5 Specific Gravity. Designed for use in transferring heat away from electrical and electronic devices such as; transistors, power diodes, semi-conductors, ballasts and thermocouple wells. High thermal conductivity, high dielectric... [See More]

  • Type: Thermally Conductive
  • Use Temperature: 392
  • Form / Shape: Grease, Paste
  • Thermal Conductivity: 0.6570
Gap Pad 5000S35 -- 8806384959489
from Henkel Corporation - Electronics

Gap Pad 5000S35 is a fiberglass-reinforced filler and polymer featuring a high thermal conductivity. The material yields extremely soft characteristics while maintaining elasticity and conformability.The fiberglass reinforcement provides easy handling and converting, added electrical isolation and... [See More]

  • Type: Thermally Conductive
  • Industry: Electronics
Thermalright Chill Factor 2 Thermal Compound -- 130981
from Xoxide

Offering increased adhesiveness for ridiculously easy application, the Thermalright Chill Factor 2 Thermal Compound is a durable, long-lasting tool that you can apply with no fuss and little mess. The second addition of Thermalright 's Chill Factor Thermal Compound uses less silicon oil (which... [See More]

  • Type: Thermally Conductive
Encapsulants -- LOCTITE STYCAST 2850KT CAT 24LV
from Henkel Corporation - Industrial

LOCTITE STYCAST 2850KT CAT 24LV, Epoxy, Encapsulant LOCTITE ® STYCAST 2850KT CAT 24LV epoxy encapsulant is designed for heat sink replacement in non-integrated electrical components and assemblies. It is also recommended for use in high voltage applications where surface arching or tracking is a... [See More]

  • Type: Thermally Conductive
  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Use Temperature: 85 to 221
Momentive SnapSIL TN3085 Grey Silicone 310ml -- MOSI01362
from Techsil Limited

Momentive SnapSIL TN3085 is a thermally conductive, low volatile siloxane, silicone adhesive that cures at room temperature to form an elastic, flame retardant silicone rubber. It offers primerless adhesion to many substrates. Designed for bonding applications in power supplies, securing PCB's to... [See More]

  • Type: Thermally Conductive
  • Industry: Electronics
  • Chemical System: Silicone; Elastomeric
SILICONE HEAT SINK COMPOUND, TUBE, 1 FL. OZ. -- 70159792 [10/9/2022 from GC Electronics]
from Allied Electronics, Inc.

Heat Sink, 2.350 Specific Gravity. Silicone Heat Sink Compound, Odorless, 1 Fl. Oz Tube. All GC Aerosols, Except as noted contain no Ecology-Damaging Fluorocarbons [See More]

  • Type: Thermally Conductive
  • Form / Shape: Grease, Paste
  • Chemical System: Silicone
  • Use Temperature: -40 to 400
Thermal Interface Material -- GAP PAD HC 5.0
from Henkel Corporation - Electronics

GAP PAD ™ HC 5.0 is a soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique filler package and low-modulus resin formulation. The enhanced material is ideal for applications... [See More]

  • Type: Thermally Conductive
  • Industry: Electronics
  • Form / Shape: Gap Filler, Foam in Place Gasket
Tuniq TX-2 High Performance Thermal Compound -- 24103
from Xoxide

Tuniq TX-2 High Performance Thermal Compound achieves the best interface between your CPU and the heatsinks by its unique designed molecular size and shape. Without any metal or electric conductive, Tuniq TX-2 High Performance Thermal Compound is safe, reliable and the most effective thermal... [See More]

  • Type: Thermally Conductive