OEM / Industrial Conductive Compounds

BERGQUIST GAP FILLER TGF 3500LVO is a silicone, thermally conductive, liquid gap filler with industry-wide applications. -- BERGQUIST GAP FILLER TGF 3500LVO
from Henkel Adhesive Technologies - Aviation, Space and Rail

BERGQUIST ® GAP FILLER TGF 3500LVO is a silicone, two-component, high thermal conductivity, liquid gap filler. This product offers the mechanical property benefits of a silicone material with the additional feature of low outgassing. It can be used in industries ranging from automotive to... [See More]

  • Industry: OEM or Industrial
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Cure / Technology: Thermoset
Isopaste Thermally Conductive Paste
from Acrolab Ltd.

Isopaste is a high-temperature thermal bridging compound used in Acrolab's Isoplatens and Heat Transfer Tools to act as a heat conductor in the Isobar ® Heat Pipe channels. It comes in three stock sizes: 4oz., 8oz., and 16oz. cans. [See More]

  • Industry: Electronics; OEM or Industrial; Heat Transfer Systems
  • Composition: Unfilled
  • Type: Thermally Conductive
  • Cure / Technology: Thermoset; Single Component
Thermal Interface Materials for Heatsinkable Devices -- TGH-TP1
from Ohmite Manufacturing Co.

Ohmite thermal interface materials (TIMs) are designed for use in applications requiring reliable performance, low contact resistance, long life, low maintenance and high thermal conductivity. The flexible graphite materials are die-cut to ensure exact fit and reduce module-to-module variation... [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial
  • Chemical System: Flexible Graphite Material
  • Type: Thermally Conductive
  • Use Temperature: -40 to 752
Pedigree® -- 40 VTC-40F
from ELANTAS PDG, Inc.

Mineral-filled VPI resin - semi-flexible for transformers with improved heat dissipation [See More]

  • Industry: Aerospace; Automotive; Electric Power; OEM or Industrial
  • Chemical System: Alkyd
  • Type: Thermally Conductive
  • Composition: Filled
Addition Cured Silicone is Optically Clear with Enhanced Low Temperature Serviceability -- MasterSil 157
from Master Bond, Inc.

MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Optical; Semiconductors, IC's
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Composition: Unfilled
BERGQUIST GAP PAD TGP 10000ULM, Thermal interface material, Gap pad, Thermal performance at low pressures -- BERGQUIST GAP PAD TGP 10000ULM
from Henkel Adhesive Technologies - Aviation, Space and Rail

BERGQUIST ® GAP PAD TGP 10000ULM is an extremely soft gap filling material rated at a thermal conductivity of 10.0 W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the... [See More]

  • Industry: OEM or Industrial
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Use Temperature: -76 to 392
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22
from Master Bond, Inc.

Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Filled
BERGQUIST GAP PAD TGP 5000 is a silicone, highly conformable, fiberglass reinforced gap pad with a thermal conductivity of 5 W/mK. -- BERGQUIST GAP PAD TGP 5000
from Henkel Adhesive Technologies - Aviation, Space and Rail

BERGQUIST ® GAP PAD TGP 5000 is a silicone based, thermally conductive, fiberglass reinforced and S-class soft gap pad. Its highly conformable nature and S-class softness ensures that it conforms to demanding contours and maintains structural integrity. Fiberglass reinforcement provides... [See More]

  • Industry: OEM or Industrial
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Use Temperature: -76 to 392
B-Staged Epoxy Meets Airbus Standards for Flame Retardancy & Toxicity -- EP36FR
from Master Bond, Inc.

EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's; Aerospace
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Unfilled
BERGQUIST GAP PAD TGP 7000ULM, Thermally conductive soft gap filling material, For high performance applications -- BERGQUIST GAP PAD TGP 7000ULM
from Henkel Adhesive Technologies - Aviation, Space and Rail

BERGQUIST GAP PAD TGP 7000ULM is an extremely soft gap filling material rated at a thermal conductivity of 7.0 W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique... [See More]

  • Industry: OEM or Industrial
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Form / Shape: Gap Filler, Foam in Place Gasket
Chemical Resistant, Two Part Epoxy Features Glass Transition Temperature of +240°C -- EP126
from Master Bond, Inc.

Master Bond EP126 withstands very high temperatures, up to +600 °F, and has a glass transistion temperature of +240 °C. This two component product features unique handling properties as Part A is a moderate viscosity liquid and Part B is a powder. It can be easily mixed using a forgiving 100... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Unfilled
BERGQUIST LIQUI FORM TLF 6000HG, Thermally conductive gel, Pre-cured -- BERGQUIST LIQUI FORM TLF 6000HG
from Henkel Adhesive Technologies - Aviation, Space and Rail

BERGQUIST ® LIQUI FORM TLF 6000HG thermally conductive gel interface material is designed to meet the demanding requirements in certain telecom market applications. Its unique formulation assures a balanced mix of high thermal conductivity, good dispensing efficiency and high thermal... [See More]

  • Industry: OEM or Industrial
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Form / Shape: Paste; Gel
Dual Curing, Thixotropic Adhesive -- UV22DC80-10F
from Master Bond, Inc.

One part, nanosilica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
  • Chemical System: UV Curing
  • Type: Thermally Conductive
  • Composition: Filled
LOCTITE ABLESTIK QMI529HT-LV, BMI Hybrid, Die Attach, Conductive Adhesive -- LOCTITE ABLESTIK QMI529HT-LV
from Henkel Adhesive Technologies - Aviation, Space and Rail

LOCTITE ® ABLESTIK QMI529HT-LV conductive die attach adhesive has been formulated for use in high throughput die attach applications. Electrically conductive. Thermally conductive. Good dispensing characteristics. Hydrophobic [See More]

  • Industry: Electronics; OEM or Industrial
  • Cure / Technology: Thermoset
  • Type: Electrically Conductive
  • CTE: 34
Electrically and Thermally Conductive, Two Part Silicone Meets NASA Low Outgassing Specifications -- MasterSil 973S-LO
from Master Bond, Inc.

MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Silicone
  • Type: Electrically Conductive; Thermally Conductive
  • Composition: Filled
Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity -- EP3HTSDA-1
from Master Bond, Inc.

EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Unfilled
Electrically Conductive Die Attach Epoxy With High Glass Transition Temperature -- EP17HTS-DA
from Master Bond, Inc.

Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Polyphenylene Sulfide; Epoxy
  • Type: Electrically Conductive; Thermally Conductive
  • Composition: Filled
Epoxy Features Exceptional Chemical and Heat Resistance -- EP35SP
from Master Bond, Inc.

EP35SP is a two component epoxy system specially formulated to resist high temperatures and aggressive chemicals. It has a paste viscosity with little to no flow when curing. [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's; Downhole
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Unfilled
Epoxy Meets Airbus Standards for Flame Retardancy, Smoke and Gas Emissions -- EP93FRHT
from Master Bond, Inc.

EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Unfilled
Epoxy with High Elongation Passes ISO 10993-5 Certification for Cytotoxicity -- EP40Med
from Master Bond, Inc.

EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]

  • Industry: Electronics; OEM or Industrial
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Unfilled
Extremely Soft MasterSil 170 Gel Encapsulant Offers Removability and Optical Clarity -- MasterSil 170 Gel
from Master Bond, Inc.

MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]

  • Industry: Aerospace; Electronics; Photonics; OEM or Industrial; Optical; Semiconductors, IC's
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Composition: Unfilled
Fast Curing, High Bond Strength Epoxy Adhesive -- EP51
from Master Bond, Inc.

Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature. The... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Unfilled
High Shear/Peel Strength, Room Temperature Curing Epoxy -- EP31
from Master Bond, Inc.

Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel strength exceeding 40 pli. The service... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Cure / Technology: Thermoset; Two Component  
High Tempreature and Thermal Cycling Resistant Epoxy -- EP33
from Master Bond, Inc.

Master Bond Polymer Adhesive EP33 is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond Polymer Adhesive EP33 produces high strength bonds whose... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Unfilled
Highly Flexible Addition Cured Silicone Offers Low Thermal Resistance -- MasterSil 151TC
from Master Bond, Inc.

MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Composition: Filled
Low Exotherm, Two Component Epoxy -- EP29LP
from Master Bond, Inc.

Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will form bond strengths in excess of 2,500 psi (aluminum to aluminum). It bonds well to a variety of substrates... [See More]

  • Industry: Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Unfilled
Low Outgassing, Optically Clear Two Component Epoxy -- EP29LPSP
from Master Bond, Inc.

Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]

  • Industry: Aerospace; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Unfilled
Ceramabond -- 503
from Aremco Products, Inc.

High fired strength, dense ceramics [See More]

  • Industry: Electronics; OEM or Industrial; Gas Ignitors, Sagger Plates, Temp Probes
  • Chemical System: Ceramic
  • Type: Thermally Conductive
  • Composition: Filled
55 Shore D polyurethane adhesive -- 10-2055
from Epoxies Etc...

The 10-2055 and 10-2055 HV were developed to produce a general purpose, semi flexible polyurethane adhesive for bonding a wide variety of plastic and metal substrates. The flexibility of these adhesives allows bonding to substrates with high coefficients of thermal expansion (CTE) and substrates... [See More]

  • Industry: OEM or Industrial
  • Chemical System: Polyurethane
  • Type: Thermally Conductive
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
Adhesive Paste -- No. 19
from Sauereisen, Inc.

Sauereisen Adhesive Paste No. 19 is an inorganic, odorless, nontoxic cement used for bonding glass, porcelain, wood, felt, cork, metals and ceramic fiber. Some typical applications include protection of exposed metal surfaces during heat treating, bonding wallboard to brick or concrete and cementing... [See More]

  • Industry: OEM or Industrial
  • Chemical System: Ceramic
  • Type: Thermally Conductive
  • Composition: Unfilled
Thermally Conductive Silicone Rubber Compound -- ELASTOSIL® RT 743 LV-K A/B
from Wacker Chemical Corp.

WACKER ’s silicone adhesives and sealants are based on many years of experience, innovative research and comprehensive technological expertise. In a wide variety of industries, especially in lighting technology, flowable or non-sag silicone products offer decisive advantages in performance and... [See More]

  • Industry: Electronics; OEM or Industrial
  • Chemical System: Silicone; Elastomeric
  • Type: Electrically Conductive
  • Cure / Technology: Thermoset
Clear Non-Yellowing Silicone Encapsulant -- PNS-56225
from Protavic America, Inc.

PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]

  • Industry: Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Silicone
  • Type: Electrically Conductive; Thermally Conductive
  • Composition: Unfilled
Pyro-Putty® -- 657
from Aremco Products, Inc.

Used for repairing metal components, pinholes, cracks, and filling seams. [See More]

  • Industry: Aerospace; Automotive; OEM or Industrial; Chemical, Oil Refining, Mining
  • Chemical System: Ceramic
  • Type: Thermally Conductive
  • Composition: Filled
Elastomeric potting & encapsulating compound -- 20-2121
from Epoxies Etc...

20-2121 is formulated for electronic potting, encapsulating and casting applications. The 20-2121 is a two-component, low viscosity, room temperature curing system. This is an easy to use product that does not contain TDI, MbOCA or Mercury. 20-2121 will cushion and protect sensitive electronic... [See More]

  • Industry: OEM or Industrial
  • Chemical System: Polyurethane
  • Type: Thermally Conductive
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Clear UV Adhesive -- ANA-97773
from Protavic America, Inc.

ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued shrinkage and movement. Bond lines are clear, colorless and exhibit low shrinkage during the curing process. [See More]

  • Industry: Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Composition: Unfilled
  • Type: Electrically Conductive
  • Cure / Technology: Thermoset; Two Component  ; UV or Radiation Cured
Nickel Filled Electrically Conductive -- 40-3914
from Epoxies Etc...

40-3914 is a one component electrically conductive ink. This Polymer system was developed to provide a good balance of low cost and high conductivity. This thick film ink provides conductivity for many electronic and industrial applications. 40-3914 exhibits outstanding adhesion to a variety of... [See More]

  • Industry: Electronics; OEM or Industrial
  • Chemical System: Epoxy
  • Type: Electrically Conductive
  • Composition: Filled
Electro-Conductive Epoxy Adhesive -- ACE-10131
from Protavic America, Inc.

Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for production needs. One... [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Epoxy
  • Type: Electrically Conductive; Thermally Conductive
  • Composition: Filled
Epoxy Adhesive -- ANE-20904
from Protavic America, Inc.

Epoxy system designed for underfill applications. This material is fast flowing and provides excellent properties for common device packaging. [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Cure / Technology: Thermoset; Single Component
Epoxy Cast -- PTE-36977
from Protavic America, Inc.

PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ is heat stable up to 150 °C. [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Composition: Filled