Help with Thermal Compounds and Thermal Interface Materials specifications:
Material Type
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| Material Type | |||
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| Conformal / Encapsulating Coating | Encapsulating or conformal coatings are compounds that are used to seal or cover an element or circuit from mechanical and environmental ingress. Typically, the encapsulant layers are less than 100 mils thick. | ||
| Fabric | The adhesive or thermal compound is provided in a fabric | ||
| Glob Top / Daub | Glob top or daub-type compounds are used to insulate semiconductor dies or other electronic components on a printed circuit board (PCB) or other device without encapsulating the entire assembly. | ||
| Grease / Paste | Greases and pastes have a high enough viscosity to seal joints, openings, or fittings without migration or leakage from the gap. Vacuum sealants have low vapor pressures to prevent out gassing into the system. Greases do not cure or polymerize under normal end-use conditions. Pastes may cure or set depending on the composition. | ||
| Gap Filling Compound | Gap filling or under fill compounds are used to fill gaps or spaces between two surfaces that are to be bonded or sealed. Flexible sheet materials, as well as sealants or form-in-place (FIP) compounds (liquid and viscous materials) are used to fill gaps between seams or on surfaces to contain fluids, prevent leaks, and prevent infiltration of unwanted material. | ||
| Pad | The adhesive or sealant comes in soft, conformable pads. | ||
| Specialty / Other | Other specialty, proprietary, or unlisted material forms. | ||
| Die Bonding Adhesive / Compound | Adhesive resins or compounds are used for joining electrical or electronic components such as die bonding compounds. They require clean surfaces that are compatible with the adhesive. | ||
| Search Logic: | All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches. | ||
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Industry Applications & Features
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| Industry | |||
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| Electronics | Products are designed for use in electronics applications. For example, they can be used in potting or encapsulating compounds, conductive adhesives, and dielectric sealants. | ||
| Electrical Power / HV | Products are resins, compounds, and plastic composites that are suitable for electrical power or high voltage (HV) applications such as generator or motor assemblies, coil or transformer manufacturing, and switch or circuit breaker insulation. | ||
| Optoelectronics / Photonics | Products are designed for optoelectronics or photonics applications. Examples include cements for bonding simple lenses into compound structures. | ||
| Semiconductors / IC Packaging | Products are designed or are suitable for semiconductor or semiconductor packaging applications. | ||
| Aerospace | Products are designed for aerospace applications. For example, they can be used to bond composite structures to other composite or metallic frame components. | ||
| Automotive | Products are designed for automotive applications. For example, they can be used to bond panels and seal windows. | ||
| Military / Government (MIL-SPEC / GG) | Products adhere to U.S. military specifications (MIL-SPEC). | ||
| OEM / Industrial | Products are designed for use by original equipment manufacturers (OEMs) for the assembly, sealing, or fabrication of products. | ||
| Optical Grade / Material | Polymers or elastomers are designed for optical or photonics applications. Examples include transparent polycarbonate or acrylic lens materials. | ||
| Other | Other unlisted industries. | ||
| Search Logic: | All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches. | ||
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| Features | |||
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| Electrically Conductive | Resins or compounds with a high degree of electrical conductivity (low resistivity) are used in applications such as anti-static or ESD control, EMI / RFI shielding, thick-film metallization, and device and board-level electrical interconnection. | ||
| Electrical Insulation / Dielectric | Dielectric compounds and electrical insulation materials form a barrier or isolator between electrical or electronic components. The voltage potential between the conductor and conductive components influence material selection, based on the dielectric strength to reduce shorting. Dielectric constant and loss tangent are important parameters in minimizing crosstalk between insulated circuit paths. | ||
| EMI / RFI Shielding Material | Polymers or elastomers are designed to provide shielding from electromagnetic interference (EMI) or radio frequency interference (RFI). Typically, these compounds have a high degree of electrical conductivity. | ||
| ESD Control / Anti-static | Anti-static materials have relatively high electrical conductivity or low electrical resistivity. They are used in electronic, anti-static or electrostatic discharge (ESD) applications. | ||
| Flame Retardant (e.g. UL 94 Rated) | The material is flame retardant in accordance with industry standards from Underwriters Laboratories, Inc. (UL), Flame Class 94, or other ISO standards. Flame-retardant materials are designed to reduce the spread of flame or resist ignition when exposed to high temperatures. They also insulate the substrate and delay damage to it. | ||
| Flexible / Dampening | Products are designed to provide flexibility or dampening of sound, vibration, or shock in suitable applications. Flexible adhesives or sealants form a layer that can bend or flex without cracking or delaminating. | ||
| Non-corrosive Cure | Silicone or reactive systems use a non-corrosive cure system such as a metal or oxime catalyst. | ||
| Phase Change | Thermal interface materials use a phase change to enhance thermal characteristics or heat absorption from electronic devices or electrical components. | ||
| Solvent Based (Volatile Organic) | Solvent-based adhesive resins use a volatile organic solvent (VOC) to thin or alter viscosity. Typically, solvent-based adhesive resins result in greater environmental or regulatory control problems. Solvents can also present a fire hazard or a risk of explosion, depending on the plant or job site. | ||
| UL Approved | The material is approved to or recognized under one or more requirements of Underwriters Laboratories, Inc. (UL). | ||
| Water Based / Latex Dispersion | Water-based or water-borne adhesive resins are water soluble or water emulsion-based resin systems that typically do not contain any VOC solvents. Water-based adhesive resins usually present fewer environmental or regulatory control problems. | ||
| Search Logic: | All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches. | ||
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Material System
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| Chemical / Polymer System Type | |||
| Your choices are... | |||
| Phenolics / Formaldehyde Resins (Melamine, Furan, etc.) | Phenolic and formaldehyde resins are thermosetting molding compounds and adhesives that provide strong bonds and good resistance to high temperatures. Phenolic or phenol formaldehyde, urea formaldehyde, furan, and melamine resins are all part of this category. Generally, the most durable phenolic resin adhesives are made from chemicals of the phenol group and formaldehyde. Phenolic resins come in liquid, powder, and film form. Special phenolic resins are available that harden at moderate temperatures when mixed with suitable accelerators. Phenol-formaldehyde, resorcinol-formaldehyde, resol, and novalac resins are types of phenolic resins. Urea resin adhesives are made from urea, formaldehyde, and catalysts or hardeners. Urea formaldehyde resins can harden rapidly at moderate temperatures, but generally do not have the properties of phenolic resins. Melamine resins are made through a reaction of dicyandiamide with formaldehyde. Most of the resins in this group have excellent dielectric properties. Furan formaldehyde (FF) resins are made by the polymerization or poly-condensation of furfural, furfural alcohol, or other compounds containing a furan ring, or by the reaction of these furan compounds with other compounds (not over 50%). Fire-retardant furans are used in hand lay-up, spray-up, and filament winding operations. Furans are commonly used in foundry binders, grinding wheels, refractories, and other high-temperature applications. Furan resins and chemicals are also used in fiberglass composites, hybrid resins combined with epoxy or phenolics, and in corrosion-resistant cements. | ||
| Polyamide | Polyamides are used to produce strong hot-melt adhesives with higher strength than either polyethylene or other hot-melt adhesives. Nylon is a well-known example of a polyamide engineering resin that is also used to mold plastic parts. | ||
| Polyethylene (PE) | Polyethylene (PE) is used as a hot-melt adhesive. | ||
| Polyester (PET) | Polyester (PET) is used as a hot-melt adhesive. | ||
| Polyester / Vinyl Ester | Thermosetting resins or plastics are based on the polyester (alkyd) or vinyl ester system. These materials should not be confused with thermoplastic polyesters or PET resins. | ||
| Polypropylene (PP) | Polypropylene (PP) is commonly used in hot-melt adhesive systems. PP is a polymer based on polypropylene chemical bonds. | ||
| Polysulfide | Polymer resins or compounds are based on polysulfide or polyphenylene sulfide (PPS) chemical systems. | ||
| Polyurethane (PU, PUR) | Polyurethane (PUR) resins provide excellent flexibility, impact resistance, and durability. Polyurethanes are formed through the reaction of an isocyanate component with polyols or other active hydroxyl group compounds. PUR resins require a catalyst, heat, or air evaporation to initiate and complete curing. | ||
| Silicone | Plastic compounds, elastomer resins, or polymers are based on the silicone chemical system. Silicones are produced through the hydrolysis and polymerization of silanes and siloxanes. | ||
| Epoxy (EP) | Epoxy resins (EP) exhibit high strength and low shrinkage during curing. Epoxies are known for their toughness and resistance to chemical and environmental damage. Most epoxies are two-part resins cured at room temperature. Some thermally-cured or thermoset one-part epoxies are also available. Depending on the formulation, epoxy resins are used as casting resins, potting agents, resin binders or laminating resins in fiberglass or composite construction. They are also used as encapsulates, electrical conductors in microelectronic packaging, and adhesives in structural bonding applications. | ||
| Vinyl (PVC) | Polymers are based on the vinyl chemical system. Examples include polyvinyl chloride (PVC), polyvinylidene chloride (PVDF), polyvinyl vinyl acetate (PVA), and polyvinyl alcohol (PVOH). | ||
| Specialty / Other | Other specialty, proprietary or unlisted resins, chemical systems or compound or polymer types. | ||
| Acrylic / Polyacrylate | Acrylics feature excellent environmental resistance and fast-setting times. Acrylic polymers are produced from acrylic acids via a catalytic reaction. | ||
| Search Logic: | All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches. | ||
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| Rubber Based / Elastomeric? | Elastomers and rubber materials are characterized by their high degree of flexibility and elasticity (high reversible elongation). Natural rubber, synthetic rubber, or elastomer sealants and adhesives can be based on a variety of systems such silicone, polyurethane, chloroprene, butyl, polybutadiene, isoprene, or neoprene. | ||
| Search Logic: | "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice. | ||
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| Composition | |||
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| Unfilled | Raw materials or unfilled resins do not contain any additional modifiers such as fillers, colorants, dispersants, plasticizers, wetting agents, levelers, or defoamers. These products are used as starting components or raw materials for the production of finished plastic resins, elastomers, adhesives, sealants, coatings, or other polymer-based products. | ||
| Filled | Filled compounds consist of adhesives with additional modifiers such as pigments or chopped fiber reinforcements. Typically, filled compounds are ready-to-use. | ||
| Search Logic: | All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches. | ||
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Cure Type / Technology
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| Cure Type / Technology | |||
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| Thermoplastic / Hot Melt | Thermoplastics can be repeatedly softened by heat and then hardened, or set by cooling, which allows parts to be injection-molded or thermoformed and scrap to be reprocessed. Thermoplastic or hot melt adhesives can be repeatedly softened by heat and then hardened, or set by cooling, which allows parts to be removed or repositioned during assembly. Most hot melt adhesives are solvent-free thermoplastics that melt or drop in viscosity above 180°F, and then rapidly set upon cooling. They are used in a variety of manufacturing processes, including bookbinding, woodworking, construction, product assembly, and box and carton heat sealing. Hot melt adhesive technology stemmed from the previous use of molten wax for bonding. Thermoplastic systems were introduced to satisfy performance needs. Typically, a pure hot melt system will not have the heat resistance of two-part, catalyst or thermoset adhesives. Hybrid hot melt systems are available that exhibit a degree of reactive curing. Polyethylenes, polyamides and ethylene-vinyl acetates are common types of hot melt adhesives. Heat activated adhesives become sticky or tacky when warmed, and are used in contact or PSA-type applications. | ||
| Thermosetting / Crosslinking | Thermoset plastics and thermoset resins are crosslinked polymeric resins that are cured using heat or heat and pressure. Cured thermoset resins generally have higher resistance to heat than thermoplastics, but cannot be melted down and reprocessed. Thermoset adhesives are crosslinked polymeric resins cured using heat or heat and pressure. Cured thermoset resins do not melt and flow when heated, but they may soften. Phenolic, melamine and urea formaldehyde resins are thermosetting adhesives that offer strong bonds and good resistance to high temperatures. Vulcanization is a thermosetting reaction involving the use of heat and/or pressure in conjunction with a vulcanizing agent, resulting in greatly increased strength, stability and elasticity in rubber-like materials. RTV silicone rubbers are room temperature vulcanizing materials. The vulcanizing agent is a crosslinking compound or catalyst. Sulfur is the traditional vulcanizing agent used with natural rubber. Silicones use moisture, acetic acid and other compounds as curing agents. | ||
| Room Temp. Cure / Vulcanizing | Room temperature curing or vulcanizing products are polymer resins or compounds that either cure or vulcanize at room temperature. Vulcanization is a thermosetting reaction involving the use of heat and/or pressure in conjunction with a vulcanizing agent. It results in greatly increased strength, stability, and elasticity in rubber-like materials. The vulcanizing agent is a crosslinking compound or catalyst. Silicones use moisture, acetic acid, and other compounds as curing or vulcanizing agents. | ||
| UV / Radiation Cured (also EB, Light) | UV or radiation cured adhesives use ultraviolet light, visible light, or electron beam (EB) irradiation to initiate curing, which forms a permanent bond without heating or excessive heat generation. One disadvantage of UV curing adhesives is the requirement that one substrate is UV transparent. Some UV resin systems employ a secondary curing mechanism to complete curing of adhesive regions shielded from the UV light. EB curable adhesives use electron beam radiation to cure or initiate curing. The electron beam can penetrate through material that is opaque to UV light. | ||
| Single Component System | Single component adhesives or sealant systems consist of one resin that hardens by reaction with surface moisture, a surface applied activator-primer, or through the application of heat. | ||
| Two Component System | Two or multi-component adhesive or sealant systems consist of two or more resins or a resin and a hardener, crosslinker, activator or catalyst that, when combined, react and cure into a polymerized compound or bond. Two component systems are mixed and then applied. | ||
| Specialty / Other | Other unlisted, specialty, proprietary technologies or cure types. | ||
| Search Logic: | All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches. | ||
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Thermal Properties
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| Use Temperature | Use temperature is the range of temperatures a product can be exposed to without the degradation of structural or other required end-use properties. | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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| Thermal Conductivity | Thermal conductivity is the linear heat transfer per unit area through a material for a given applied temperature gradient. Heat flux (h) = [thermal conductivity (k) ] x [temperature gradient (Δ T)] | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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| Coeff. of Thermal Expansion (CTE) | Coefficient of linear expansion (CFE) is the amount of linear expansion or shrinkage that occurs in a material with a change in temperature. | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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Mechanical Properties
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| Tensile Strength (Break) | Tensile strength at break is the maximum amount of stress required to break the material under tension-loading test conditions, or to cause failure. Typically, tensile tests are performed according to test procedure standards such as ASTM D-638 or ISO 527-1, ASTM D-1708, ASTM D-2289 (plastics at high strain rates), and ASTM D-882 (thin plastic sheets), as well as other OEM proprietary standards. | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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| Elongation | Elongation is the amount of deformation as a percentage that occurs during a tensile test or other mechanical test. | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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Electrical & Optical Properties
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| Dielectric Strength | Dielectric strength is the maximum voltage field that the material can withstand before electrical breakdown occurs. | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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| Dielectric Constant (Relative Permittivity) | The dielectric constant is the relative permittivity of a material compared to a vacuum or free space. As an equation, it is expressed as k = εr = ε / εo= where ε is the absolute permittivity of the material and εo is the absolute permittivity of a vacuum 8.85 x 10-12 F/m. | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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| Index of Refraction | The index of refraction is a measure of the speed of light in a material. | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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| Transmission | This is the amount of light transmitted through a material. | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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Processing & Physical Properties
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| Applied Thickness / Gap Fill | Products are applied at a particular functional surface thickness or between two surfaces (the 'gap fill' thickness) to ensure performance criteria, such as strength, electrical resistance, etc., are met. | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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| Viscosity | Viscosity is a measurement of a fluid's resistance to flow. Water is lower in viscosity than motor oil or honey. Oil is lower in viscosity than tar or molasses. Depending on the application method, viscosity determines how well a resin fills the cavities or voids in a mold. | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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| Water Absorption | The amount of water absorbed by the material. | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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