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Electrical -- 430
from Epoxy Technology

A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for inter-connecting, grounding and EMI RF shielding. Fast curing at relatively low temperatures may be realized. [See More]

  • Features: Electrically Conductive; EMI/RFI Shielding
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Flame Resistant, Two Component Epoxy -- EP21FRLVSP
from Master Bond, Inc.

Master Bond Polymer System EP21FRLVSP is a two component flame resistant compound for general purpose bonding, sealing and casting, formulated to cure at room temperature. With a one-to-one mix ratio, by weight only, it readily develops a high bonding strength of more than 2000psi at room... [See More]

  • Features: Anti-static, ESD; Electrically Conductive; EMI/RFI Shielding; Flexible; Dissimilar Substrates
  • Chemical System: Epoxy
  • Type: High Dielectric
  • Composition: Filled
T-3 Heat Transfer Compound -- TFK-4
from Thermon Manufacturing Co.

T-3 heat transfer compound creates an efficient thermal bond between a steam or electric heater and process pipes or equipment. A single “Thermonized ™ ”steam tracer utilizing Thermon ’s heat transfer compound is more cost effective than a contoured clamp-on jacket and has... [See More]

  • Features: Electrically Conductive
  • Form / Shape: Grease, Paste
  • Cure / Technology: Single Component
  • Industry: Electric Power
Aremco-Bond™ -- 525
from Aremco Products, Inc.

Good chemical resistance and mechanical strength [See More]

  • Features: Electrically Conductive
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset
Thermal Management Phase Change Material -- POWERSTRATE® 51
from Henkel Corporation - Electronics

Exceptionally low thermal impedance, unmatched thermal performance [See More]

  • Features: Electrically Conductive; Phase Change
  • Cure / Technology: Single Component
  • Composition: Filled
  • Form / Shape: Encapsulant or Conformal Coating
Clear Non-Yellowing Silicone Encapsulant -- PNS-56225
from Protavic America, Inc.

PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]

  • Features: Electrically Conductive; Flexible
  • Composition: Unfilled
  • Chemical System: Silicone
  • Cure / Technology: Thermoset; Two Component