Electrically Conductive Thermal Compounds and Thermal Interface Materials Datasheets

Electrical -- 430
from Epoxy Technology

A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for inter-connecting, grounding and EMI RF shielding. Fast curing at relatively low temperatures may be realized. [See More]

  • Features: Electrically Conductive; EMI/RFI Shielding
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Liqui Bond SA 2000 (One-Part) -- 8806384795649
from Henkel Corporation - Electronics

Liqui-Bond SA 2000 is a high performance, thermally conductive silicone adhesive that cures to a solid bonding elastomer. Liqui-Bond SA 2000 is supplied as a one-part liquid component, in either tube or mid-sized container form. Liqui-Bond SA 2000 features excellent low and high-temperature... [See More]

  • Features: Electrically Conductive
  • Industry: Electronics
Flexible, Two Component Silver Conductive Epoxy -- EP21TDCSFL
from Master Bond, Inc.

Master Bond Polymer System EP21TDCSFL is a two component, silver filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. Its most salient features are its high flexibility and elongation. This... [See More]

  • Features: Anti-static, ESD; Electrically Conductive; EMI/RFI Shielding; Flexible; Dissimilar Substrates
  • Chemical System: Epoxy; Polyurethane
  • Type: High Dielectric
  • Composition: Filled
T-3 Heat Transfer Compound -- TFK-4
from Thermon Manufacturing Co.

T-3 heat transfer compound creates an efficient thermal bond between a steam or electric heater and process pipes or equipment. A single “Thermonized ™ ”steam tracer utilizing Thermon ’s heat transfer compound is more cost effective than a contoured clamp-on jacket and has... [See More]

  • Features: Electrically Conductive
  • Form / Shape: Grease, Paste
  • Cure / Technology: Single Component
  • Industry: Electric Power
Aremco-Bond™ -- 525
from Aremco Products, Inc.

Good chemical resistance and mechanical strength [See More]

  • Features: Electrically Conductive
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset
Clear Non-Yellowing Silicone Encapsulant -- PNS-56225
from Protavic America, Inc.

PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]

  • Features: Electrically Conductive; Flexible
  • Composition: Unfilled
  • Chemical System: Silicone
  • Cure / Technology: Thermoset; Two Component  

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