Depth Profiling Wafer and Thin Film Instrumentation
2 Results
Packaging Metrology System -- APM650™
from Zygo Corporation
from Zygo Corporation
The APM650 ™ packaging metrology system is a new inspection tool for automated measurement of panel-based PCBs and other advanced packaging applications. It provides 2D & 3D measurements of a variety of surface features with sub-nanometer vertical precision and sub-micron lateral... [See More]
- Form Factor: Monitor or instrument
- Technology: Interferometer
- Mounting / Loading: Manual loading
- Applications: Wafer
IG20 5 KeV Argon or Oxygen Ion Source for UHV Surface Analysis -- IG20
from Hiden Analytical
from Hiden Analytical
Static and Dynamic SIMSAuger Electron SpectroscopyIon Beam SputteringSurface Science StudiesRastering / Depth Profiling [See More]
- Form Factor: Ion Beam Gun
- Technology: FIB; Spectrometer (SIMS, XRF, FTIR, DLTS, AAS)
- Mounting / Loading: In-process, in-situ or system mounted
- Applications: Wafer; CVD / PVD