Floor Mounted / Stand-alone Wafer and Thin Film Instrumentation
from JEOL USA, Inc.
DART ™ (Direct Analysis in Real Time) is a new ion source that can analyze samples with various states and shapes without any sample preparation. [See More]
- Mounting / Loading: Floor
- Form Factor: Monitor or instrument
from Daitron Co., Ltd.
The chip testers pick up laser diode chips on a sheet, measure and evaluate various characteristics, and sort them based on the results. The measurement stages are equipped with the temperature control function to characterize devices in the required temperature ranges. Features. ●To bring out... [See More]
- Mounting / Loading: Floor
- Applications: Wafer
- Form Factor: Monitor or instrument
from JEOL USA, Inc.
The EC-52000IC Ion Cleaner is a device that holdsa specimen of an electron microscope underglow discharge, for removing hydrocarboncontaminants adhered to the specimen byutilizing physical and chemical reactions.The Ion Cleaner prevents specimen contamination,which arises from accumulations of... [See More]
- Mounting / Loading: Floor
- Form Factor: Monitor or instrument
from Daitron Co., Ltd.
The cleaving machines automatically perform parallel alignment and positioning and cleave with the blade the silicon substrates and compound semiconductor substrates, such as GaAs, InP, and GaN, from the scribed positions. It is capable for processing maximum of 4-inch wafers and wafer-to-bar... [See More]
- Mounting / Loading: Floor
- Applications: Wafer
- Form Factor: Monitor or instrument
- Wafer / Part Size: 102
from Daitron Co., Ltd.
The scribe machines automatically perform parallel alignment and positioning and scribe silicon substrates and compound semiconductor substrates, such as GaAs, InP, and GaN. It is capable for processing maximum of 4-inch wafers and wafer-to-bar scribing, bar-to-chip scribing, and full... [See More]
- Mounting / Loading: Floor
- Applications: Wafer
- Form Factor: Monitor or instrument
- Wafer / Part Size: 102
from Daitron Co., Ltd.
The visual inspection machines capture high-definition images of semiconductor products and transparent objects such as glass and perform the measurements for scratches, particulates and debris, chipping, color unevenness, dimensions of devices and so forth through the image processing technology. [See More]
- Mounting / Loading: Floor
- Technology: Optical / Imaging
- Form Factor: Monitor or instrument
- Applications: Wafer
from MicroSense, LLC
The Polar Kerr System for MRAM utilizes the polar Magneto-Optical Kerr Effect (MOKE) to characterize the magnetic properties of multi-layer wafers used in the development and manufacturing of perpendicular MRAM. Utilizing a non-contact full-wafer measurement technique, the system creates a map of... [See More]
- Mounting / Loading: Floor
- Technology: Magnetometer
- Form Factor: Monitor or instrument
- Applications: Wafer
from Xenemetrix Ltd.
EX-6600 SDD. Secondary Target EDXRF. Xenemetrix ’s EX-6600 SDD Energy Dispersive X-ray Fluorescence (EDXRF) spectrometer offers the ultimate in sensitivity and selectivity. The Silicon Drift Detector (SDD) simultaneously delivers lower electronic noise and higher count rates which translates... [See More]
- Mounting / Loading: Manual loading; Floor
- Technology: Spectrometer (SIMS, XRF, FTIR, DLTS, AAS); EDXRF
- Form Factor: Monitor or instrument
- Applications: Wafer; CVD / PVD; Electroplate
from Rigaku Corporation
Rigaku's WaferX 300 represents the culmination of 25 years of experience in the X-ray fluorescence analysis of thin films on silicon wafers. Specifically developed as an in-process metrology tool, the system incorporates "bridge tool" technology — servicing 6", 8", as well as the latest 12"... [See More]
- Mounting / Loading: Floor
- Technology: Spectrometer (SIMS, XRF, FTIR, DLTS, AAS); WDXRF
- Form Factor: Monitor or instrument
- Applications: Wafer
from Hitachi High Technologies America, Inc.
Next generation devices at 20nm and below require double-patterning, 3D (three-dimensional) structures, and complex, high-precision processes that include protective layer formation and finishing techniques for new materials. Hitachi High-Tech developed the Conductor Etch System 9000 Series to... [See More]
- Mounting / Loading: Floor
- Applications: Etching
from Advanced Energy Industries, Inc.
A field-proven solution for any dual-magnetron sputtering application with additional capabilities facilitating advanced process innovation. Achieve higher deposition rates with a more stable process through advanced ARC management. Tune your process with variable frequency and duty cycle. Tailor to... [See More]
- Mounting / Loading: Floor
- Applications: Wafer; Magnetron Sputtering
- Form Factor: Controller
from Park Systems, Inc.
Park Systems has revolutionized the AFM with the introduction of the XE-3DM, the fully automated AFM system designed for overhang and trench profiles, sidewall roughness and imaging, and critical angle measurements. The unique design of the XE-3DM, made possible by the XE-series ’ decoupled XY... [See More]
- Mounting / Loading: Floor
- Technology: Profilometer or AFM
- Form Factor: Monitor or instrument
- Applications: Wafer
from TSI Incorporated
This fully automated particle deposition system deposits PSL and SiO2 spheres as small as 10 nm. Calibrate and qualify your defect inspection tools with ease, confidence, and efficiency by producing high volumes of high-quality custom 300 mm and 200 mm calibration standards. Robotic wafer handling... [See More]
- Mounting / Loading: Floor
- Applications: Wafer; CVD / PVD
- Form Factor: Wafer Inspection And Metrology
- Wafer / Part Size: 200 to 300
from Imego
MERMAID is a unique measurement instrument for analysis of liquid and thin film properties using magnetoelastic resonance (MER) sensors. Dynamic events such as viscosity change, phase transitions or bio film growth can be analyzed. The MER sensor can measure properties of either a coating on top of... [See More]
- Mounting / Loading: In-process, in-situ or system mounted; Floor
- Technology: Quartz crystal microbalance; Magnetoelastic Resonance Sensors (MER)
- Form Factor: ProbingSystem; Sensor or sensing element
- Applications: CVD / PVD; Polymer or photoresist films; BioFilms
from Nikon Metrology
The NWL200 series is the first lineup of wafer loaders for inspection microscopes capable of loading 100 micron thin wafers. Thanks to a new chuck system, the NWL200 series achieves highly reliable loading suitable for inspection of next-generation semiconductors. Improved wafer-sensing functions... [See More]
- Mounting / Loading: Floor
- Technology: Optical / Imaging
- Form Factor: ProbingSystem; Wafer Loading System
- Applications: Wafer
from Nor-Cal Products, Inc. - The Vacuum Experts
Nor-Cal Products Deposition Monitors are used to measure the thin film (deposition) thicknesses, rate of deposition or frequency, in conjunction with the crystal sensor. Models are available which independently monitor 2 or 6 crystals. Included Windows software allows the user to change the monitor... [See More]
- Mounting / Loading: Floor
- Technology: Quartz crystal microbalance
- Form Factor: Monitor or instrument
- Applications: CVD / PVD
from Polytec, Inc.
For the best yields it is necessary to optimize your process. Measuring and understanding the characteristicsof your product allows continuous improvement. The AVT-1000 enables you to measure all critical parame-ters on metal or glass such as Roughness, Waviness, and Defects. The AVT can measure... [See More]
- Mounting / Loading: Floor
- Technology: Optical / Imaging; Laser Doppler Vibrometry
- Form Factor: Monitor or instrument
- Applications: Memory drive disc or head
from KEYENCE
SI-F Series Spectral Interference Displacement Meter. The SI-F Series Spectral Interference Displacement Meter specializes in super-high accuracy displacement measurement for thickness or position measurement or surface mapping. With resolution down to 1nm, the SI Series is able to see even the... [See More]
- Mounting / Loading: In-process, in-situ or system mounted; In-line; Floor
- Technology: Interferometer
- Form Factor: Monitor or instrument; Controller; Sensor or sensing element
- Applications: Wafer; Memory drive disc or head; Flat panel display; Packaged IC or substrate
from MicroSense, LLC
Automated Wafer Thickness Measurement System. Cassette to cassette or manual loading. Exclusive sensing technology with dual White light chromatic coding probes (10nm resolution). Wafer 4 ” to 12 ” (100 to 300mm). Thickness range: 50um to 3mm. Extended warpage range up to 5mm. Throughput... [See More]
- Mounting / Loading: Floor
- Technology: Optical / Imaging
- Form Factor: Monitor or instrument
- Applications: Wafer
from Xenemetrix Ltd.
RoHS Vision. The Fast and Easy Method for Ensuring Compliance. with Regulations for Hazardous Substances. The Restriction of Hazardous Substances Directive (RoHS) restricts toxic metals in electrical and electronic equipment. Xenemetrix ’s new RoHS Vision uses a high resolution detector, a... [See More]
- Mounting / Loading: Manual loading; Floor
- Technology: Spectrometer (SIMS, XRF, FTIR, DLTS, AAS); EDXRF
- Form Factor: Monitor or instrument
- Applications: Wafer; CVD / PVD; Electroplate
from Rigaku Corporation
The Rigaku MFM65 performs high-precision measurements not possible by optical or ultrasonic techniques. This sophisticated X-ray metrology tool makes it practical to perform high-throughput measurements on product and blanket wafers ranging from ultrathin single-layer films to multilayer stacks. The... [See More]
- Mounting / Loading: Floor
- Technology: Reflectometer; X-ray Diffractometer; XRR, XRF, XRD
- Form Factor: Monitor or instrument
- Applications: Wafer
from Hitachi High Technologies America, Inc.
Conductor Etch System M-600/6000 Series is targeted for deep silicon trench etch of power devices used in mobile systems, home electrical appliances, automobiles, trains, etc. Low temperature etch technology and TM (Time Modulation) bias technology together with the ECR (Electron Cyclotron... [See More]
- Mounting / Loading: Floor
- Applications: Etching
from Advanced Energy Industries, Inc.
Litmas is an all-in-one remote plasma source combining the power supply, LitmasMatch ™ matching network, and plasma chamber into one compact chassis. Small-footprint point-of-use abatement solution. Highly reliable, effective abatement with minimum utilities usage. Lower cost of ownership than... [See More]
- Mounting / Loading: Floor
- Applications: Wafer; Photolithography; Etching
- Form Factor: Controller
from Park Systems, Inc.
XE-HDM is an automatic defect review AFM which revolutionizes the way defects in HDD substrates and media are searched, scanned, and analyzed. The new XE-HDM significantly increases throughput for the defect review process; test runs with real defects demonstrate over 500 - 800% gain in throughput... [See More]
- Mounting / Loading: Floor
- Technology: Profilometer or AFM
- Form Factor: Monitor or instrument
- Applications: Wafer; Memory drive disc or head
from KEYENCE
LT-9000 Surface Scanning Laser Confocal Sensor. The LT-9000 Surface Scanning Laser Confocal Displacement Meter excels in measuring micron-level defects or thicknesses without being affected by target color or angle. The confocal principle requires only that the light reflect off a surface and be... [See More]
- Mounting / Loading: In-process, in-situ or system mounted; In-line; Floor
- Technology: Confocal
- Form Factor: Monitor or instrument; Controller; Sensor or sensing element
- Applications: Wafer; Flat panel display; Packaged IC or substrate
from MicroSense, LLC
Automated Thickness measurement system. IR interferometry probe technology. Single or dual probes. Manual Loading. 0.5um accuracy. 0.1um resolution. Wafer 4" to 12" (100 to 300mm) round or square. Thickness range: 20um to 1mm. Flexible recipe generation. 2D & 3D mapping capability. SECS/GEM... [See More]
- Mounting / Loading: Floor
- Technology: Interferometer
- Form Factor: Monitor or instrument
- Applications: Wafer
from Xenemetrix Ltd.
S-Mobile SDD. Brings the power of laboratory spectrometer to the field. A small compact analyzer that can be taken to the job site. When the task calls for fast real time high quality results the S-Mobile meets the job description perfectly. This instrument features Silicon Drift Detector which... [See More]
- Mounting / Loading: Manual loading; Floor
- Technology: Spectrometer (SIMS, XRF, FTIR, DLTS, AAS); EDXRF
- Form Factor: Monitor or instrument
- Applications: CVD / PVD; Electroplate
from Rigaku Corporation
The WDA-3650 X-ray fluorescence spectrometer for thin film evaluation continues Rigaku's 30-year history of XRF wafer analyzers that has mirrored the history of thin film device development. This latest XRF metrology tool contributes significantly to the process control of metal film thickness, film... [See More]
- Mounting / Loading: Floor
- Technology: Spectrometer (SIMS, XRF, FTIR, DLTS, AAS); WDXRF
- Form Factor: Monitor or instrument
- Applications: Wafer
from Hitachi High Technologies America, Inc.
Conductor Etch System M-8000 Series is utilized for hard mask and silicon etching for 32nm and beyond. Hitachi High-Tech developed new process flows, such as double patterning and new material etch processes such as high-k dielectric/metal gate through JDP (Joint Development Program) with device... [See More]
- Mounting / Loading: Floor
- Applications: Etching
from Park Systems, Inc.
Atomic Force Microscopy (AFM) is emerging as an essential tool in many industries. With its ability to accurately measure critical dimensions in the micrometer to nanometer regime, the AFM is becoming an essential tool choice in applications involving surface roughness, trench width, depth, sidewall... [See More]
- Mounting / Loading: Floor
- Technology: Profilometer or AFM
- Form Factor: Monitor or instrument
- Applications: Wafer
from KEYENCE
LK-G5000 High-Speed / High-Accuracy Laser Displacement Sensor. The LK-G5000 is a High-Speed 1D Laser Displacement Sensor for precision displacement measurement. With a sampling speed of 392 kHz, this sensor is able keep up with just about any inline process as well as account for vibration for... [See More]
- Mounting / Loading: In-process, in-situ or system mounted; In-line; Floor
- Technology: Laser Triangulation
- Form Factor: Monitor or instrument; Controller; Sensor or sensing element
- Applications: Wafer; Memory drive disc or head; Flat panel display; Packaged IC or substrate
from MicroSense, LLC
Automated Thickness measurement system. Cassette to cassette or manual loading. Patented sensing technology with APBP (dual automated positioning backpressure probes). Manual Loading. 20mm resolution. Wafer 2" to 12" (50 to 300mm) round or square. Thickness range: 200um to 5mm. Automated... [See More]
- Mounting / Loading: Floor
- Technology: Automated Positioning Backpressure Probe (APBP)
- Form Factor: Monitor or instrument
- Applications: Wafer
from Xenemetrix Ltd.
S-Mobile ULS. Brings the power of laboratory spectrometer to the field. This portable analyzer is specially adapted for Ultra Low Sulfur applications. Complies with the latest and most severe international standard methods for low sulfur concentration levels analysis: ASTM D7212, D4294 and ISO... [See More]
- Mounting / Loading: Manual loading; Floor
- Technology: Spectrometer (SIMS, XRF, FTIR, DLTS, AAS); EDXRF
- Form Factor: Monitor or instrument
- Applications: CVD / PVD; Electroplate
from Rigaku Corporation
TXRF analysis can gauge contamination in all fab processes, including cleaning, litho, etch, ashing, films, etc. The TXRF 3760 can measure elements from Na through U with a single-target, 3-beam X-ray system and a solid-state detector system. The TXRF 3760 includes Rigaku's patented XY θ... [See More]
- Mounting / Loading: Floor
- Technology: Reflectometer; TXRF
- Form Factor: Monitor or instrument
- Applications: Wafer
from Hitachi High Technologies America, Inc.
Rapid increases in aerial densities of HDD (Hard Disk Drive) requires advanced patterning solutions for thin film head production. This brings leading-edge semiconductor processes into the HDD industry as a breakthrough. Magnetic Head Etch System E-6000 Series: the EMCP (Electro Magnetically Coupled... [See More]
- Mounting / Loading: Floor
- Applications: Etching
from Park Systems, Inc.
Hard Disk Drive (HDD) manufacturers can now reliably depend on Park Systems ’ XE-PTR, a fully automated industrial in-line AFM for automatic Pole Tip Recession measurements on rowbar-level sliders. As most HDD manufacturers are turning to PMR (Perpendicular Magnetic Recording), sub-nano scale... [See More]
- Mounting / Loading: Floor
- Technology: Profilometer or AFM
- Form Factor: Monitor or instrument
- Applications: Wafer; Memory drive disc or head