Monitor / Instrument Wafer and Thin Film Instrumentation
from Daitron Co., Ltd.
The chip testers pick up laser diode chips on a sheet, measure and evaluate various characteristics, and sort them based on the results. The measurement stages are equipped with the temperature control function to characterize devices in the required temperature ranges. Features. ●To bring out... [See More]
- Form Factor: Monitor or instrument
- Applications: Wafer
- Mounting / Loading: Floor
from Zygo Corporation
The APM650 ™ packaging metrology system is a new inspection tool for automated measurement of panel-based PCBs and other advanced packaging applications. It provides 2D & 3D measurements of a variety of surface features with sub-nanometer vertical precision and sub-micron lateral... [See More]
- Form Factor: Monitor or instrument
- Technology: Interferometer
- Mounting / Loading: Manual loading
- Applications: Wafer
from Cosmic Equipment SpA
Complete solution for Wide Bandgap device testing. Cosmic lab systems are built to accelerate how engineers characterize power devices-whether in research, development, or pre-production. From initial setup to high-voltage test execution and result reporting, our platform is comprehensive, precise,... [See More]
- Form Factor: Monitor or instrument
- Applications: Wafer
from JEOL USA, Inc.
DART ™ (Direct Analysis in Real Time) is a new ion source that can analyze samples with various states and shapes without any sample preparation. [See More]
- Form Factor: Monitor or instrument
- Mounting / Loading: Floor
from Daitron Co., Ltd.
The cleaving machines automatically perform parallel alignment and positioning and cleave with the blade the silicon substrates and compound semiconductor substrates, such as GaAs, InP, and GaN, from the scribed positions. It is capable for processing maximum of 4-inch wafers and wafer-to-bar... [See More]
- Form Factor: Monitor or instrument
- Applications: Wafer
- Mounting / Loading: Floor
- Wafer / Part Size: 102
from Cosmic Equipment SpA
The FTI-1000 is a purpose-built ATE system designed for high-coverage wafer-level testing of power discrete devices, wide-bandgap components, and gate-driver-integrated power ICs. Suitable for both engineering characterization and high-volume wafer sort, the system integrates independent DC and AC... [See More]
- Form Factor: Monitor or instrument
- Applications: Wafer
from JEOL USA, Inc.
The EC-52000IC Ion Cleaner is a device that holdsa specimen of an electron microscope underglow discharge, for removing hydrocarboncontaminants adhered to the specimen byutilizing physical and chemical reactions.The Ion Cleaner prevents specimen contamination,which arises from accumulations of... [See More]
- Form Factor: Monitor or instrument
- Mounting / Loading: Floor
from Daitron Co., Ltd.
The scribe machines automatically perform parallel alignment and positioning and scribe silicon substrates and compound semiconductor substrates, such as GaAs, InP, and GaN. It is capable for processing maximum of 4-inch wafers and wafer-to-bar scribing, bar-to-chip scribing, and full... [See More]
- Form Factor: Monitor or instrument
- Applications: Wafer
- Mounting / Loading: Floor
- Wafer / Part Size: 102
from Cosmic Equipment SpA
Wide bandgap SiC technology is opening up a whole new generation of high voltage power products for applications in transport, power transmission and green energy. M2 Wafer edition tests these upto 10kV on wafer before singulation, identifying defective product early and saving the expense of... [See More]
- Form Factor: Monitor or instrument
- Applications: Wafer
from Daitron Co., Ltd.
The visual inspection machines capture high-definition images of semiconductor products and transparent objects such as glass and perform the measurements for scratches, particulates and debris, chipping, color unevenness, dimensions of devices and so forth through the image processing technology. [See More]
- Form Factor: Monitor or instrument
- Technology: Optical / Imaging
- Mounting / Loading: Floor
- Applications: Wafer
from Filmetrics, Inc.
Automated Cassette-to-Cassette Thin-Film Thickness Mapping System for Production Environments. The Filmetrics F60-c family maps film thickness and index just like our F50 products, but it also includes a number of features intended specifically for production environments. These include automatic... [See More]
- Form Factor: Monitor or instrument
- Technology: Spectrometer (SIMS, XRF, FTIR, DLTS, AAS); Spectral Reflectance
- Mounting / Loading: In-process, in-situ or system mounted
- Applications: Wafer; CVD / PVD
from Phenom-World BV
The Phenom Pro desktop SEM is one of the most advanced imaging models in the Phenom series. With its long-life high-brightness CeB6 electron source, the Phenom Pro creates state-of-the-art images with a minimum of user maintenance intervention. The backscattered-electron detector (BSED) and... [See More]
- Form Factor: Monitor or instrument
- Technology: FIB
- Mounting / Loading: Manual loading
- Applications: Wafer; CVD / PVD; Packaged IC or substrate
from Park Systems, Inc.
Park Systems has revolutionized the AFM with the introduction of the XE-3DM, the fully automated AFM system designed for overhang and trench profiles, sidewall roughness and imaging, and critical angle measurements. The unique design of the XE-3DM, made possible by the XE-series ’ decoupled XY... [See More]
- Form Factor: Monitor or instrument
- Technology: Profilometer or AFM
- Mounting / Loading: Floor
- Applications: Wafer
from Technic, Inc.
Technic ’s EBA (Electroplating Bath Analyzer) provides an easy to implement, accurate and trouble-free analysis of your electroplating solutions. The EBA utilizes a patented combination of processing technique, software and hardware to obtain greater consistency and accuracy in analytical... [See More]
- Form Factor: Monitor or instrument
- Applications: Wafer; Electroplate
from PTB Sales, Inc.
Ask for pricing. The Dektak IIA is used for making accurate measurements on small vertical features ranging in height from 100 to 655,000 angstroms. Dektak IIA acquires data by moving the sample beneath the diamond tipped stylus. Vertical movements of the stylus are sensed by an LVDT, digitalized,... [See More]
- Form Factor: Monitor or instrument
- Applications: CVD / PVD (optional feature)
from StellarNet, Inc.
TF Systems for Non-Contact Film Thickness Measurements. We offer a complete line of film thickness measurement systems that can measure from 5 nm to 200 µm for analysis of single layer and/or multilayer films in less than a second. StellarNet thin film reflectometry systems consist of a portable USB... [See More]
- Form Factor: Monitor or instrument
- Technology: Reflectometer
- Mounting / Loading: In-process, in-situ or system mounted
- Applications: Wafer (optional feature); Memory drive disc or head (optional feature); CVD / PVD (optional feature); Flat panel display (optional feature); Optical components or lenses (optional feature); Polishing / CMP (optional feature); Polymer or photoresist films (optional feature); Thin-Film Photovoltaics
from Rigaku Corporation
Rigaku's WaferX 300 represents the culmination of 25 years of experience in the X-ray fluorescence analysis of thin films on silicon wafers. Specifically developed as an in-process metrology tool, the system incorporates "bridge tool" technology — servicing 6", 8", as well as the latest 12"... [See More]
- Form Factor: Monitor or instrument
- Technology: Spectrometer (SIMS, XRF, FTIR, DLTS, AAS); WDXRF
- Mounting / Loading: Floor
- Applications: Wafer
from Xenemetrix Ltd.
EX-6600 SDD. Secondary Target EDXRF. Xenemetrix ’s EX-6600 SDD Energy Dispersive X-ray Fluorescence (EDXRF) spectrometer offers the ultimate in sensitivity and selectivity. The Silicon Drift Detector (SDD) simultaneously delivers lower electronic noise and higher count rates which translates... [See More]
- Form Factor: Monitor or instrument
- Technology: Spectrometer (SIMS, XRF, FTIR, DLTS, AAS); EDXRF
- Mounting / Loading: Manual loading; Floor
- Applications: Wafer; CVD / PVD; Electroplate
from Nor-Cal Products, Inc. - The Vacuum Experts
Nor-Cal Products Deposition Monitors are used to measure the thin film (deposition) thicknesses, rate of deposition or frequency, in conjunction with the crystal sensor. Models are available which independently monitor 2 or 6 crystals. Included Windows software allows the user to change the monitor... [See More]
- Form Factor: Monitor or instrument
- Technology: Quartz crystal microbalance
- Mounting / Loading: Floor
- Applications: CVD / PVD
from MicroSense, LLC
The Polar Kerr System for MRAM utilizes the polar Magneto-Optical Kerr Effect (MOKE) to characterize the magnetic properties of multi-layer wafers used in the development and manufacturing of perpendicular MRAM. Utilizing a non-contact full-wafer measurement technique, the system creates a map of... [See More]
- Form Factor: Monitor or instrument
- Technology: Magnetometer
- Mounting / Loading: Floor
- Applications: Wafer
from KEYENCE
SI-F Series Spectral Interference Displacement Meter. The SI-F Series Spectral Interference Displacement Meter specializes in super-high accuracy displacement measurement for thickness or position measurement or surface mapping. With resolution down to 1nm, the SI Series is able to see even the... [See More]
- Form Factor: Monitor or instrument; Controller; Sensor or sensing element
- Technology: Interferometer
- Mounting / Loading: In-process, in-situ or system mounted; In-line; Floor
- Applications: Wafer; Memory drive disc or head; Flat panel display; Packaged IC or substrate
from WDI Wise Device Inc.
This is the only commercially available microscope guaranteeing transmission of more then 80% for all four YAG laser harmonics: 266, 355, 532, and 1064nm - without compromising the review channel fidelity. The MIC4 microscope is instrumental in laser repair of TFT arrays over the wavelength ranging... [See More]
- Form Factor: Monitor or instrument
- Technology: Optical / Imaging
- Mounting / Loading: In-process, in-situ or system mounted (optional feature); Floor (optional feature)
- Applications: CVD / PVD; Electroplate; Flat panel display; Packaged IC or substrate; Optical components or lenses; Photolithography; PV Cell, Laser Micromachining, Photomask
from Polytec, Inc.
For the best yields it is necessary to optimize your process. Measuring and understanding the characteristicsof your product allows continuous improvement. The AVT-1000 enables you to measure all critical parame-ters on metal or glass such as Roughness, Waviness, and Defects. The AVT can measure... [See More]
- Form Factor: Monitor or instrument
- Technology: Optical / Imaging; Laser Doppler Vibrometry
- Mounting / Loading: Floor
- Applications: Memory drive disc or head
from Hiden Analytical
The Hiden Plasma Workstation, an integrated RF-ICP reactor / plasma analyser system for all you plasma process studies. [See More]
- Form Factor: Monitor or instrument; Controller
- Technology: Spectrometer (SIMS, XRF, FTIR, DLTS, AAS)
- Mounting / Loading: In-process, in-situ or system mounted
- Applications: Optical components or lenses; Etching
from Filmetrics, Inc.
Automated Film Thickness Mapping. The Filmetrics F50 family of products can map film thickness as quickly as two points per second. A motorized R-Theta stage accepts standard and custom chucks for samples up to 450mm in diameter. Map patterns can be polar, rectangular, or linear, or you can create... [See More]
- Form Factor: Monitor or instrument
- Technology: Spectrometer (SIMS, XRF, FTIR, DLTS, AAS); Spectral Reflectance
- Mounting / Loading: In-process, in-situ or system mounted
- Applications: Wafer; CVD / PVD
from Phenom-World BV
The Phenom ProX desktop scanning electron microscope is the ultimate all-in-one imaging and X-ray analysis system. With the Phenom ProX desktop SEM, sample structures can be physically examined and their elemental composition determined. Viewing three-dimensional images of microscopic structures... [See More]
- Form Factor: Monitor or instrument
- Technology: FIB
- Mounting / Loading: Manual loading
- Applications: Wafer; CVD / PVD; Packaged IC or substrate
from Park Systems, Inc.
XE-HDM is an automatic defect review AFM which revolutionizes the way defects in HDD substrates and media are searched, scanned, and analyzed. The new XE-HDM significantly increases throughput for the defect review process; test runs with real defects demonstrate over 500 - 800% gain in throughput... [See More]
- Form Factor: Monitor or instrument
- Technology: Profilometer or AFM
- Mounting / Loading: Floor
- Applications: Wafer; Memory drive disc or head
from Technic, Inc.
The RTA is an automated, on-line, real-time, and in-tank system for monitoring and controlling the levels of chemical constituents of plating baths. The RTA technology is a unique modern approach to metrology combining the advanced, purpose-selected electroanalytical techniques with state-of-the-art... [See More]
- Form Factor: Monitor or instrument
- Applications: Wafer; Electroplate
from PTB Sales, Inc.
PTB Sales toll free: 866-332-0500 [See More]
- Form Factor: Monitor or instrument
- Applications: CVD / PVD (optional feature)
from Rigaku Corporation
The Rigaku MFM65 performs high-precision measurements not possible by optical or ultrasonic techniques. This sophisticated X-ray metrology tool makes it practical to perform high-throughput measurements on product and blanket wafers ranging from ultrathin single-layer films to multilayer stacks. The... [See More]
- Form Factor: Monitor or instrument
- Technology: Reflectometer; X-ray Diffractometer; XRR, XRF, XRD
- Mounting / Loading: Floor
- Applications: Wafer
from Xenemetrix Ltd.
RoHS Vision. The Fast and Easy Method for Ensuring Compliance. with Regulations for Hazardous Substances. The Restriction of Hazardous Substances Directive (RoHS) restricts toxic metals in electrical and electronic equipment. Xenemetrix ’s new RoHS Vision uses a high resolution detector, a... [See More]
- Form Factor: Monitor or instrument
- Technology: Spectrometer (SIMS, XRF, FTIR, DLTS, AAS); EDXRF
- Mounting / Loading: Manual loading; Floor
- Applications: Wafer; CVD / PVD; Electroplate
from MicroSense, LLC
Benchtop, automated Thickness measurement systems. Cassette to cassette or manual loading. Exclusive sensing technology with dual White light chromatic coding probes (10nm resolution). Wafer 2 ” to 4 ” (50 to 100mm). Thickness range: 50um to 3mm. Throughput up to 100W/hours. 2D & 3D... [See More]
- Form Factor: Monitor or instrument
- Technology: Optical / Imaging
- Mounting / Loading: Manual loading
- Applications: Wafer
from KEYENCE
LT-9000 Surface Scanning Laser Confocal Sensor. The LT-9000 Surface Scanning Laser Confocal Displacement Meter excels in measuring micron-level defects or thicknesses without being affected by target color or angle. The confocal principle requires only that the light reflect off a surface and be... [See More]
- Form Factor: Monitor or instrument; Controller; Sensor or sensing element
- Technology: Confocal
- Mounting / Loading: In-process, in-situ or system mounted; In-line; Floor
- Applications: Wafer; Flat panel display; Packaged IC or substrate
from WDI Wise Device Inc.
The LSCM has the advantages of a confocal laser scanning microscope with the size and price of an IR camera. The combination of high contrast imaging, infrared capabilities, extremely small size and low cost enables many new applications. [See More]
- Form Factor: Monitor or instrument
- Technology: Optical / Imaging
- Mounting / Loading: In-process, in-situ or system mounted
- Applications: Wafer; CVD / PVD; Flat panel display; Packaged IC or substrate; Optical components or lenses; Photolithography
from Hiden Analytical
The Hiden EQP is a combined Mass / Energy analyser for the analysis of positive AND negative ions, neutrals, and radicals from plasma processes. [See More]
- Form Factor: Monitor or instrument; Controller
- Technology: Spectrometer (SIMS, XRF, FTIR, DLTS, AAS)
- Mounting / Loading: In-process, in-situ or system mounted
- Applications: Optical components or lenses; Etching
from Filmetrics, Inc.
Automated Thickess Mapping for Production Environments. The Filmetrics F60-t family maps film thickness and index just like our F50 products, but it also includes a number of features intended specifically for production environments. These include automatic notch finding, automatic on-board... [See More]
- Form Factor: Monitor or instrument
- Technology: Spectrometer (SIMS, XRF, FTIR, DLTS, AAS); Spectral Reflectance
- Mounting / Loading: In-process, in-situ or system mounted
- Applications: Wafer; CVD / PVD
from Phenom-World BV
The Phenom Pure desktop SEM (scanning electron microscope) is an ideal tool for making the transition from working with a light microscope to operating an electron microscope. The Phenom Pure is equipped with the basic fundamentals for meeting imaging needs. The Phenom Pure provides high-quality... [See More]
- Form Factor: Monitor or instrument
- Technology: FIB
- Mounting / Loading: Manual loading
- Applications: Wafer; CVD / PVD; Packaged IC or substrate
from Park Systems, Inc.
Atomic Force Microscopy (AFM) is emerging as an essential tool in many industries. With its ability to accurately measure critical dimensions in the micrometer to nanometer regime, the AFM is becoming an essential tool choice in applications involving surface roughness, trench width, depth, sidewall... [See More]
- Form Factor: Monitor or instrument
- Technology: Profilometer or AFM
- Mounting / Loading: Floor
- Applications: Wafer
from PTB Sales, Inc.
PTB Sales toll free: 866-332-0500 [See More]
- Form Factor: Monitor or instrument
- Applications: CVD / PVD (optional feature)
from Rigaku Corporation
The WDA-3650 X-ray fluorescence spectrometer for thin film evaluation continues Rigaku's 30-year history of XRF wafer analyzers that has mirrored the history of thin film device development. This latest XRF metrology tool contributes significantly to the process control of metal film thickness, film... [See More]
- Form Factor: Monitor or instrument
- Technology: Spectrometer (SIMS, XRF, FTIR, DLTS, AAS); WDXRF
- Mounting / Loading: Floor
- Applications: Wafer
from Xenemetrix Ltd.
S-Mobile SDD. Brings the power of laboratory spectrometer to the field. A small compact analyzer that can be taken to the job site. When the task calls for fast real time high quality results the S-Mobile meets the job description perfectly. This instrument features Silicon Drift Detector which... [See More]
- Form Factor: Monitor or instrument
- Technology: Spectrometer (SIMS, XRF, FTIR, DLTS, AAS); EDXRF
- Mounting / Loading: Manual loading; Floor
- Applications: CVD / PVD; Electroplate
from MicroSense, LLC
Benchtop automated thickness measurement system with X-Y stage on air bearing for wafers up to 8 ” round and for square wafers up to 156mmx156mm. Dual white light chromatic coding probe technology with 10nm resolution. Thickness range from 50um to 1mm. Automated calibration. Hiscan option for... [See More]
- Form Factor: Monitor or instrument
- Technology: Optical / Imaging
- Mounting / Loading: Manual loading
- Applications: Wafer
from KEYENCE
LK-G5000 High-Speed / High-Accuracy Laser Displacement Sensor. The LK-G5000 is a High-Speed 1D Laser Displacement Sensor for precision displacement measurement. With a sampling speed of 392 kHz, this sensor is able keep up with just about any inline process as well as account for vibration for... [See More]
- Form Factor: Monitor or instrument; Controller; Sensor or sensing element
- Technology: Laser Triangulation
- Mounting / Loading: In-process, in-situ or system mounted; In-line; Floor
- Applications: Wafer; Memory drive disc or head; Flat panel display; Packaged IC or substrate
from Hiden Analytical
The PSM is a differentially pumped mass spectrometer for the analysis of secondary ions and neutrals from plasma process. [See More]
- Form Factor: Monitor or instrument; Controller
- Technology: Spectrometer (SIMS, XRF, FTIR, DLTS, AAS)
- Mounting / Loading: In-process, in-situ or system mounted
- Applications: Ion Beam Etching, Plasma Deposition
from Filmetrics, Inc.
Turn Your Microscope into a Film Thickness Measurement Tool. The F40 product family is for applications that require a spot size as small as 1 micron. For most microscopes the F40 simply attaches to the c-mount adapter, which is the industry standard for video camera mounting. The F40 comes complete... [See More]
- Form Factor: Monitor or instrument
- Technology: Spectrometer (SIMS, XRF, FTIR, DLTS, AAS); Spectral Reflectance
- Mounting / Loading: In-process, in-situ or system mounted
- Applications: Wafer; CVD / PVD
from Park Systems, Inc.
Hard Disk Drive (HDD) manufacturers can now reliably depend on Park Systems ’ XE-PTR, a fully automated industrial in-line AFM for automatic Pole Tip Recession measurements on rowbar-level sliders. As most HDD manufacturers are turning to PMR (Perpendicular Magnetic Recording), sub-nano scale... [See More]
- Form Factor: Monitor or instrument
- Technology: Profilometer or AFM
- Mounting / Loading: Floor
- Applications: Wafer; Memory drive disc or head
from PTB Sales, Inc.
The Sycon STM-100 Thickness/Rate Monitor/MF a precision mass and film thickness measurement instrument for use in thin film deposition processes and other quartz crystal microbalance applications. [See More]
- Form Factor: Monitor or instrument
- Applications: CVD / PVD (optional feature)
from Rigaku Corporation
TXRF analysis can gauge contamination in all fab processes, including cleaning, litho, etch, ashing, films, etc. The TXRF 3760 can measure elements from Na through U with a single-target, 3-beam X-ray system and a solid-state detector system. The TXRF 3760 includes Rigaku's patented XY θ... [See More]
- Form Factor: Monitor or instrument
- Technology: Reflectometer; TXRF
- Mounting / Loading: Floor
- Applications: Wafer
from Xenemetrix Ltd.
S-Mobile ULS. Brings the power of laboratory spectrometer to the field. This portable analyzer is specially adapted for Ultra Low Sulfur applications. Complies with the latest and most severe international standard methods for low sulfur concentration levels analysis: ASTM D7212, D4294 and ISO... [See More]
- Form Factor: Monitor or instrument
- Technology: Spectrometer (SIMS, XRF, FTIR, DLTS, AAS); EDXRF
- Mounting / Loading: Manual loading; Floor
- Applications: CVD / PVD; Electroplate
from MicroSense, LLC
Automated Wafer Thickness Measurement System. Cassette to cassette or manual loading. Exclusive sensing technology with dual White light chromatic coding probes (10nm resolution). Wafer 4 ” to 12 ” (100 to 300mm). Thickness range: 50um to 3mm. Extended warpage range up to 5mm. Throughput... [See More]
- Form Factor: Monitor or instrument
- Technology: Optical / Imaging
- Mounting / Loading: Floor
- Applications: Wafer