Shape / Flatness Wafer and Thin Film Instrumentation
from Zygo Corporation
The APM650 ™ packaging metrology system is a new inspection tool for automated measurement of panel-based PCBs and other advanced packaging applications. It provides 2D & 3D measurements of a variety of surface features with sub-nanometer vertical precision and sub-micron lateral... [See More]
- Measurements: Critical dimensions or Trench geometry; Flatness; Roughness / Waviness; Area mapping; DepthProfiling
- Mounting / Loading: Manual loading
- Form Factor: Monitor or instrument
- Technology: Interferometer
from MTI Instruments Inc.
The Proforma 300SA is a benchtop/desktop, semi-automated wafer measurement system for semi-conducting and semi-insulating materials. Based on MTII ’s exclusive Push-Pull capacitance technology, the Proforma 300SA delivers full wafer surface scanning for thickness, thickness variation, bow,... [See More]
- Measurements: Flatness; Roughness / Waviness; WaferThickness; Area mapping
- Mounting / Loading: Manual loading
- Form Factor: ProbingSystem; Sensor or sensing element
- Technology: Capacitance or electromagnetic gage
from MicroSense, LLC
Automated Thickness measurement system. IR interferometry probe technology. Single or dual probes. Manual Loading. 0.5um accuracy. 0.1um resolution. Wafer 4" to 12" (100 to 300mm) round or square. Thickness range: 20um to 1mm. Flexible recipe generation. 2D & 3D mapping capability. SECS/GEM... [See More]
- Measurements: Flatness; WaferThickness
- Mounting / Loading: Floor
- Form Factor: Monitor or instrument
- Technology: Interferometer
from KEYENCE
SI-F Series Spectral Interference Displacement Meter. The SI-F Series Spectral Interference Displacement Meter specializes in super-high accuracy displacement measurement for thickness or position measurement or surface mapping. With resolution down to 1nm, the SI Series is able to see even the... [See More]
- Measurements: Flatness; FilmThickness
- Mounting / Loading: In-process, in-situ or system mounted; In-line; Floor
- Form Factor: Monitor or instrument; Controller; Sensor or sensing element
- Technology: Interferometer
from Polytec, Inc.
For the best yields it is necessary to optimize your process. Measuring and understanding the characteristicsof your product allows continuous improvement. The AVT-1000 enables you to measure all critical parame-ters on metal or glass such as Roughness, Waviness, and Defects. The AVT can measure... [See More]
- Measurements: Defects, dimples or film residues; Flatness; Roughness / Waviness; WaferThickness
- Mounting / Loading: Floor
- Form Factor: Monitor or instrument
- Technology: Optical / Imaging; Laser Doppler Vibrometry
from MTI Instruments Inc.
The Proforma 300i wafer thickness gage is a capacitance based, differential measurement system that performs non-contact thickness measurements of semiconducting and semi-insulating wafers. By utilizing MTI Push/Pull technology, the Proforma 300i does not require the wafers to have a consistent... [See More]
- Measurements: Flatness; Roughness / Waviness; WaferThickness; Area mapping
- Mounting / Loading: Manual loading
- Form Factor: ProbingSystem; Sensor or sensing element
- Technology: Capacitance or electromagnetic gage
from MicroSense, LLC
Automated Thickness measurement system. Cassette to cassette or manual loading. Patented sensing technology with APBP (dual automated positioning backpressure probes). Manual Loading. 20mm resolution. Wafer 2" to 12" (50 to 300mm) round or square. Thickness range: 200um to 5mm. Automated... [See More]
- Measurements: Flatness; WaferThickness
- Mounting / Loading: Floor
- Form Factor: Monitor or instrument
- Technology: Automated Positioning Backpressure Probe (APBP)
from KEYENCE
LT-9000 Surface Scanning Laser Confocal Sensor. The LT-9000 Surface Scanning Laser Confocal Displacement Meter excels in measuring micron-level defects or thicknesses without being affected by target color or angle. The confocal principle requires only that the light reflect off a surface and be... [See More]
- Measurements: Flatness; FilmThickness
- Mounting / Loading: In-process, in-situ or system mounted; In-line; Floor
- Form Factor: Monitor or instrument; Controller; Sensor or sensing element
- Technology: Confocal
from Polytec, Inc.
The MSA-500 Micro System Analyzer is the premier measurement technology for the analysis and visualization of structural vibrations and surface topography in micro structures such as MEMS (Micro-Electro-Mechanical Systems) devices. By fully integrating a microscope with Scanning Laser-Doppler... [See More]
- Measurements: Flatness; Roughness / Waviness; Structural Vibrations & Topography
- Mounting / Loading: Manual loading
- Form Factor: Sensor or sensing element
- Technology: Optical / Imaging; Laser Doppler Vibrometry
from KEYENCE
LK-G5000 High-Speed / High-Accuracy Laser Displacement Sensor. The LK-G5000 is a High-Speed 1D Laser Displacement Sensor for precision displacement measurement. With a sampling speed of 392 kHz, this sensor is able keep up with just about any inline process as well as account for vibration for... [See More]
- Measurements: Flatness; FilmThickness
- Mounting / Loading: In-process, in-situ or system mounted; In-line; Floor
- Form Factor: Monitor or instrument; Controller; Sensor or sensing element
- Technology: Laser Triangulation