Roughness / Waviness Wafer and Thin Film Instrumentation
from Park Systems, Inc.
Park Systems has revolutionized the AFM with the introduction of the XE-3DM, the fully automated AFM system designed for overhang and trench profiles, sidewall roughness and imaging, and critical angle measurements. The unique design of the XE-3DM, made possible by the XE-series ’ decoupled XY... [See More]
- Measurements: Defects, dimples or film residues; Critical dimensions or Trench geometry; Roughness / Waviness
- Mounting / Loading: Floor
- Form Factor: Monitor or instrument
- Technology: Profilometer or AFM
from Rigaku Corporation
The Rigaku MFM65 performs high-precision measurements not possible by optical or ultrasonic techniques. This sophisticated X-ray metrology tool makes it practical to perform high-throughput measurements on product and blanket wafers ranging from ultrathin single-layer films to multilayer stacks. The... [See More]
- Measurements: Composition; Particle contamination; FilmThickness; Roughness / Waviness
- Mounting / Loading: Floor
- Form Factor: Monitor or instrument
- Technology: Reflectometer; X-ray Diffractometer; XRR, XRF, XRD
from MTI Instruments Inc.
The Proforma 300SA is a benchtop/desktop, semi-automated wafer measurement system for semi-conducting and semi-insulating materials. Based on MTII ’s exclusive Push-Pull capacitance technology, the Proforma 300SA delivers full wafer surface scanning for thickness, thickness variation, bow,... [See More]
- Measurements: Flatness; Roughness / Waviness; WaferThickness; Area mapping
- Mounting / Loading: Manual loading
- Form Factor: ProbingSystem; Sensor or sensing element
- Technology: Capacitance or electromagnetic gage
from Polytec, Inc.
For the best yields it is necessary to optimize your process. Measuring and understanding the characteristicsof your product allows continuous improvement. The AVT-1000 enables you to measure all critical parame-ters on metal or glass such as Roughness, Waviness, and Defects. The AVT can measure... [See More]
- Measurements: Defects, dimples or film residues; Flatness; Roughness / Waviness; WaferThickness
- Mounting / Loading: Floor
- Form Factor: Monitor or instrument
- Technology: Optical / Imaging; Laser Doppler Vibrometry
from Phenom-World BV
The Phenom Pro desktop SEM is one of the most advanced imaging models in the Phenom series. With its long-life high-brightness CeB6 electron source, the Phenom Pro creates state-of-the-art images with a minimum of user maintenance intervention. The backscattered-electron detector (BSED) and... [See More]
- Measurements: Composition; Defects, dimples or film residues; Critical dimensions or Trench geometry; Particle contamination; Roughness / Waviness; Area mapping
- Mounting / Loading: Manual loading
- Form Factor: Monitor or instrument
- Technology: FIB
from Zygo Corporation
The APM650 ™ packaging metrology system is a new inspection tool for automated measurement of panel-based PCBs and other advanced packaging applications. It provides 2D & 3D measurements of a variety of surface features with sub-nanometer vertical precision and sub-micron lateral... [See More]
- Measurements: Critical dimensions or Trench geometry; Flatness; Roughness / Waviness; Area mapping; DepthProfiling
- Mounting / Loading: Manual loading
- Form Factor: Monitor or instrument
- Technology: Interferometer
from Park Systems, Inc.
Atomic Force Microscopy (AFM) is emerging as an essential tool in many industries. With its ability to accurately measure critical dimensions in the micrometer to nanometer regime, the AFM is becoming an essential tool choice in applications involving surface roughness, trench width, depth, sidewall... [See More]
- Measurements: Defects, dimples or film residues; Critical dimensions or Trench geometry; Roughness / Waviness
- Mounting / Loading: Floor
- Form Factor: Monitor or instrument
- Technology: Profilometer or AFM
from MTI Instruments Inc.
The Proforma 300i wafer thickness gage is a capacitance based, differential measurement system that performs non-contact thickness measurements of semiconducting and semi-insulating wafers. By utilizing MTI Push/Pull technology, the Proforma 300i does not require the wafers to have a consistent... [See More]
- Measurements: Flatness; Roughness / Waviness; WaferThickness; Area mapping
- Mounting / Loading: Manual loading
- Form Factor: ProbingSystem; Sensor or sensing element
- Technology: Capacitance or electromagnetic gage
from Polytec, Inc.
The MSA-500 Micro System Analyzer is the premier measurement technology for the analysis and visualization of structural vibrations and surface topography in micro structures such as MEMS (Micro-Electro-Mechanical Systems) devices. By fully integrating a microscope with Scanning Laser-Doppler... [See More]
- Measurements: Flatness; Roughness / Waviness; Structural Vibrations & Topography
- Mounting / Loading: Manual loading
- Form Factor: Sensor or sensing element
- Technology: Optical / Imaging; Laser Doppler Vibrometry
from Phenom-World BV
The Phenom ProX desktop scanning electron microscope is the ultimate all-in-one imaging and X-ray analysis system. With the Phenom ProX desktop SEM, sample structures can be physically examined and their elemental composition determined. Viewing three-dimensional images of microscopic structures... [See More]
- Measurements: Composition; Defects, dimples or film residues; Critical dimensions or Trench geometry; Particle contamination; Roughness / Waviness; Area mapping
- Mounting / Loading: Manual loading
- Form Factor: Monitor or instrument
- Technology: FIB