Polyimide (PI) Plastic Plate, Rod, and Stock Shapes
from Duvelco Limited
Ducoya® G001 is a remarkable material with unparalleled physical strength, elongation and toughness. Ducoya G001 can also continuously operate over a wide temperature range from near absolute zero to greater than 400°C in a favorable chemical environment. Its excellent electrical and thermal... [See More]
- Chemical System: Thermoplastic; Polyimide or Bismaleimide (BMI)
- Form / Shape: Rod or Round Stock (optional feature); Hollow or Tubular Stock (optional feature); Plate (optional feature)
- Filler: Unfilled
- Industry: Aerospace; Semiconductors or IC Packaging
from RS Components, Ltd.
Tecasint 2011 rod, 13mm dia. x 250mm [See More]
- Chemical System: Thermoplastic; Polyimide; Polyimide or Bismaleimide (BMI)
- Width / O.D.: 0.5118
- Form / Shape: Rod or Round Stock
- Length: 9.84
from Duvelco Limited
Ducoya® G001 UP is an ultra-pure polyimide for semiconductors. The material is intended for use in the latest semiconductor manufacturing operations where feature sizes can be found in the low nanometer range. [See More]
- Chemical System: Thermoplastic; Polyimide or Bismaleimide (BMI)
- Form / Shape: Rod or Round Stock (optional feature); Hollow or Tubular Stock (optional feature); Plate (optional feature)
- Filler: Unfilled
- Industry: Semiconductors or IC Packaging
from Duvelco Limited
G021: High-performance polyimide with 15% graphite encapsulated into the polymer, combining low wear with balanced physical properties. [See More]
- Chemical System: Thermoplastic; Polyimide or Bismaleimide (BMI)
- Form / Shape: Rod or Round Stock (optional feature); Hollow or Tubular Stock (optional feature); Plate (optional feature)
- Filler: Carbon or Graphite
- Industry: Aerospace; Automotive
from Duvelco Limited
G022: Polyimide with 40% graphite encapsulated into the polymer, providing unparalleled dimensional stability for design flexibility. [See More]
- Chemical System: Thermoplastic; Polyimide or Bismaleimide (BMI)
- Form / Shape: Rod or Round Stock (optional feature); Hollow or Tubular Stock (optional feature); Plate (optional feature)
- Filler: Carbon or Graphite
from TriStar Plastics Corp.
High-temperature resistance. Chemical resistance. FDA compliance [See More]
- Chemical System: Thermally cured; Meldin; Polyimide or Bismaleimide (BMI)
- Thickness: 0.0625 to 2
- Form / Shape: Bar Stock or Rod Stock; Rod or Round Stock; Sheet or Film
- Industry: OEM or Industrial
from Ensinger, Inc.
TECASINT 1011 is an unfilled polyimide natural grade. This material particularly stands out in the TECASINT 1000 product family for very high strength and elongation. It is characterised by properties such as a very high modulus of elasticity, high rigidity, high degree of hardness and low thermal... [See More]
- Chemical System: PI (Polyimide); Polyimide or Bismaleimide (BMI)
- Thermal Conductivity: 0.2200
- Filler: Unfilled
- Tensile (Break): 16824
from MCA - Advanced Materials Division
Duratron ® D7000 PI Polyimide shapes possess superior electrical and thermal insulation properties, and outstanding mechanical performance qualities for applications that demand higher temperature resistance. In addition to these characteristics, Duratron ® D7000 PI offers great chemical... [See More]
- Chemical System: Thermoplastic; Polyimide or Bismaleimide (BMI)
- Features: Thermal Insulation
- Industry: Structural
- Use Temperature: 580
from Port Plastics, Inc.
Duratron ® 7000 PI is an exceptional value for applications where thermal requirements exclude Duratron PAI and do not require the extraordinary thermal resistance of Duratron PBI. Duratron PI is available in several grades for structural and wear applications and in the broadest range of... [See More]
- Chemical System: Thermoplastic; Polyimide or Bismaleimide (BMI)
- Industry: Structural and wear applications
- Form / Shape: Hollow or Tubular Stock; Sheet or Film
from Interstate Plastics, Inc.
Dupont ™ VESPEL ® polyimide is an extremely high temperature, creep resistant material that is often used in high heat environments where thermoplastic materials would lose their mechanical properties. [See More]
- Chemical System: Thermoplastic; Polyimide or Bismaleimide (BMI)
- Width / O.D.: 0.2500 to 0.6250
- Form / Shape: Rod or Round Stock
- Industry: OEM or Industrial
from Ensinger, Inc.
TECASINT 2011 is one of the unfilled natural grades. It has a very high modulus of elasticity, high rigidity and hardness. Compared with TECASINT 1011 it has significantly reduced moisture absorption, higher toughness and better machining properties. Within the TECASINT 2000 series the material has... [See More]
- Chemical System: PI (Polyimide); Polyimide or Bismaleimide (BMI)
- Use Temperature: 536 to 626
- Filler: Unfilled
- Deflection Temperature: 600
from MCA - Advanced Materials Division
Duratron ® D7015G PI Polyimide is a bearing grade PI that exhibits superior temperature and wear resistance qualities, while offering a low coefficient of friction. Not only does Duratron ® D7015G PI maintain its performance abilities with or without lubrication, but with 15% graphite... [See More]
- Chemical System: Thermoplastic; Polyimide or Bismaleimide (BMI)
- Use Temperature: 580
- Industry: Bearing & Structural
- Tensile (Break): 11000
from Ensinger, Inc.
TECASINT 2021 is a plastic reinforced with 15% graphite and based on the base polymer TECASINT 2011. It is particularly suitable for tribological applications owing to its improved friction and wear behavior. Thanks to its self lubricating property, TECASINT 2021 is well suited to lubricated and dry... [See More]
- Chemical System: PI (Polyimide); Polyimide or Bismaleimide (BMI)
- Tensile (Break): 14649
- Use Temperature: 500
- Tensile Modulus: 580 to 638
from Ensinger, Inc.
TECASINT 2391 has been developed with 15 % MoS2 from the base polymer TECASINT 2011. It has optimum friction and wear properties in a vacuum, which means it can be used in space travel applications, in a vacuum or in inert gases (techn. dry). The plastic displays low outgassing in accordance with... [See More]
- Chemical System: PI (Polyimide); Polyimide or Bismaleimide (BMI)
- Tensile (Break): 13778
- Use Temperature: 500
- Tensile Modulus: 566 to 595