from Acrolab Ltd.
Isopaste is a high-temperature thermal bridging compound used in Acrolab's Isoplatens and Heat Transfer Tools to act as a heat conductor in the Isobar ® Heat Pipe channels. It comes in three stock sizes: 4oz., 8oz., and 16oz. cans. Larger quantities can be arranged with your Acrolab Engineering... [See More]
- Form / Shape: Grease, Paste
- Cure / Technology: Thermoset; Single Component
- Composition: Unfilled
- Industry: OEM or Industrial; Heat Transfer Systems
from Allied Electronics, Inc.
Ther-O-Link is a white thermal compound that cost effectively enhances the heat transfer between a semiconductor case and a heat sink. Silicone-based, and easy to apply, Ther-O-Link substantially reduces dry interface thermal resistance, while providing long life under a variety of conditions. [See More]
- Form / Shape: Grease, Paste
- Use Temperature: -40 to 392
from Bluestar Silicones USA Corp.
Metal Oxide Thickened Dimethyl Silicone Compound. Description. Bluesil V-740 is a metal oxide thickened dimethyl silicone compound. It is a white, heavy paste used for heat dissipation applications where high thermal conductivity is required. [See More]
- Form / Shape: Grease, Paste
- Cure / Technology: Two Component
- Chemical System: Silicone
- Industry: Electronics; Electric Power; Semiconductors, IC's
from Digi-Key Corporation
LOCTITE NSWC 100 THERMAL GREASE [See More]
- Form / Shape: Grease, Paste
from Ellsworth Adhesives
Product will not harden, dry out, melt, or contaminate wave solder baths. Designed to eliminate the phenomenon of silicone migration. Product has a functional temperature range from -40C (-40F) to 200C (392F). Sold as a pack (24/pk). [See More]
- Form / Shape: Grease, Paste
- Cure / Technology: Does Not Harden
- Composition: Filled
- Industry: Electronics; OEM or Industrial; Semiconductors, IC's
from Epoxy Technology
A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for inter-connecting, grounding and EMI RF shielding. Fast curing at relatively low temperatures may be realized. [See More]
- Form / Shape: Grease, Paste
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Hi-Tech Seals, Inc.
HERNON ® offers a complete line of structural acrylic adhesives. These systems are two-part, no mix, and reactive adhesives. Each acrylic adhesive has two components: the adhesive base or resin, and the Activator. Structural acrylic adhesives are termed “reactive ” cure systems. The... [See More]
- Form / Shape: Grease, Paste
- Cure / Technology: Two Component
- Chemical System: Acrylic
- Industry: Electronics
from ITW Polymer Technologies - Insulcast Division
Castable Epoxy Heat Sink, UL recognized under file E86165 & meets the flammability requirement of 94 V-0. INSULCAST 140 FR is an epoxy casting system with high thermal conductivity. This system, when cured with INSULCURE 11B, also provides Class F operating properties. [See More]
- Form / Shape: Die Bonding Adhesives; Grease, Paste
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System EP21FRLVSP is a two component flame resistant compound for general purpose bonding, sealing and casting, formulated to cure at room temperature. With a one-to-one mix ratio, by weight only, it readily develops a high bonding strength of more than 2000psi at room... [See More]
- Form / Shape: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Grease, Paste; Optional Premixed and Frozen
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Filled
from OMEGA Engineering, Inc.
OMEGATHERM thermal conducting paste is a high temperature and high thermally conductive paste product. They are specially formulated for permanent and temporary bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics,... [See More]
- Form / Shape: Grease, Paste
- Chemical System: Silicone
- Type: High Dielectric
- Cure / Technology: Single Component
from Sauereisen, Inc.
Sauereisen Adhesive Paste No. 19 is an inorganic, odorless, nontoxic cement used for bonding glass, porcelain, wood, felt, cork, metals and ceramic fiber. Some typical applications include protection of exposed metal surfaces during heat treating, bonding wallboard to brick or concrete and cementing... [See More]
- Form / Shape: Die Bonding Adhesives; Grease, Paste
- Chemical System: Ceramic
- Type: High Dielectric
- Composition: Unfilled
from Thermon Manufacturing Co.
NH nonhardening heat transfer compound is used where thermal expansion and contraction could break the bond of a hardened compound. Thermon ’s heat transfer compounds provide an efficient thermal connection between the external heating source and the process equipment. Thermon ’s NH... [See More]
- Form / Shape: Grease, Paste
- Industry: Electric Power; Heating Coil Systems
- Cure / Technology: Single Component
- Use Temperature: -320 to 375
from 3M Electronics Markets Materials Division
Low viscosity grease, designed for use in screen printing applications. Screen printing of this material results in a thin bond line and consequently higher thermal performance. [See More]
- Form / Shape: Grease, Paste
- Cure / Technology: Single Component; Non-Curing
- Composition: Filled
- Industry: Electronics
from Henkel Corporation - Electronics
Ease-of-use, thermal conductivity [See More]
- Form / Shape: Die Bonding Adhesives; Grease, Paste
- Chemical System: Acrylic
- Type: High Dielectric
- Composition: Filled
from Protavic America, Inc.
Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture die attachand can be dispensed, printed or pin transferred. It offer fast in-line cure. This product can produce ultra fine dots via < 30 gauge needle. The product will... [See More]
- Form / Shape: Die Bonding Adhesives; Grease, Paste
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
