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Isopaste Thermally Conductive Paste
from Acrolab Ltd.

Isopaste is a high-temperature thermal bridging compound used in Acrolab's Isoplatens and Heat Transfer Tools to act as a heat conductor in the Isobar ® Heat Pipe channels. It comes in three stock sizes: 4oz., 8oz., and 16oz. cans. Larger quantities can be arranged with your Acrolab Engineering... [See More]

  • Form / Shape: Grease, Paste
  • Cure / Technology: Thermoset; Single Component
  • Composition: Unfilled
  • Industry: Electronics; OEM or Industrial; Heat Transfer Systems
Techspray Silicone Free Heat Sink Compound 4 oz Aerosol -- 1978-DP
from Ellsworth Adhesives

Product will not harden, dry out, melt, or contaminate wave solder baths. Designed to eliminate the phenomenon of silicone migration. Product has a functional temperature range from -40C (-40F) to 200C (392F). Sold as a pack (24/pk). [See More]

  • Form / Shape: Grease, Paste
  • Cure / Technology: Does Not Harden
  • Composition: Filled
  • Industry: Electronics; OEM or Industrial; Semiconductors, IC's
Electrically and Thermally Conductive Adhesive -- EK1000
from Epoxy Technology

A single component, silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance making it ideal for the demanding requirements of high power LED die attach applications. Other benefits include low viscosity and high thixotropy making it... [See More]

  • Form / Shape: Die Bonding Adhesives; Grease, Paste
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Single Component
INSULCAST 140 FR Castable Epoxy Heat Sink
from ITW Polymer Technologies - Insulcast Division

Castable Epoxy Heat Sink, UL recognized under file E86165 & meets the flammability requirement of 94 V-0. INSULCAST 140 FR is an epoxy casting system with high thermal conductivity. This system, when cured with INSULCURE 11B, also provides Class F operating properties. [See More]

  • Form / Shape: Die Bonding Adhesives; Grease, Paste
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Flame Resistant, Two Component Epoxy -- EP21FRLVSP
from Master Bond, Inc.

Master Bond Polymer System EP21FRLVSP is a two component flame resistant compound for general purpose bonding, sealing and casting, formulated to cure at room temperature. With a one-to-one mix ratio, by weight only, it readily develops a high bonding strength of more than 2000psi at room... [See More]

  • Form / Shape: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Grease, Paste; Optional Premixed and Frozen
  • Chemical System: Epoxy
  • Type: High Dielectric
  • Composition: Filled
Thermal Compound -- TC70
from Nordson EFD

High-performance electronics contain many components - including central processing units (CPUs), microprocessors units (MPUs), graphics processing units (GPUs), LEDs, field-effect transistors (FETs) and integrated bipolar transistors (IGBT ’s), uninterrupted power supplies - that heat up... [See More]

  • Form / Shape: Grease, Paste
  • Cure / Technology: Single Component
  • Composition: Unfilled
  • Industry: Electronics; Semiconductors, IC's
High Thermally Conductive Paste -- OMEGATHERM® OT-201 Series
from OMEGA Engineering, Inc.

OMEGATHERM thermal conducting paste is a high temperature and high thermally conductive paste product. They are specially formulated for permanent and temporary bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics,... [See More]

  • Form / Shape: Grease, Paste
  • Chemical System: Silicone
  • Type: High Dielectric
  • Cure / Technology: Single Component
Heat Transfer Compound -- NH Nonhardening
from Thermon Manufacturing Co.

NH nonhardening heat transfer compound is used where thermal expansion and contraction could break the bond of a hardened compound. Thermon ’s heat transfer compounds provide an efficient thermal connection between the external heating source and the process equipment. Thermon ’s NH... [See More]

  • Form / Shape: Grease, Paste
  • Industry: Electric Power; Heating Coil Systems
  • Cure / Technology: Single Component
  • Use Temperature: -320 to 375
3M™ Thermally Conductive Grease -- TCG-2031
from 3M Electronics Design & Manufacturing

Low viscosity grease, designed for use in screen printing applications. Screen printing of this material results in a thin bond line and consequently higher thermal performance. [See More]

  • Form / Shape: Grease, Paste
  • Cure / Technology: Single Component; Non-Curing
  • Composition: Filled
  • Industry: Electronics
Grease Heat Sink Tube -- CT40-5 [CT40-5 from ITW Chemtronics]
from All-Spec Industries

The CircuitWorks CT40-5 tube dispenser is for precise application of silicone compound that facilitates heat transfer away from electronics and electrical components. [See More]

  • Form / Shape: Grease, Paste
  • Cure / Technology: Single Component
  • Chemical System: Silicone
  • Industry: Electronics; Semiconductors, IC's
Aremco-Bond™ -- 525
from Aremco Products, Inc.

Good chemical resistance and mechanical strength [See More]

  • Form / Shape: Gap Filler, Foam in Place Gasket; Grease, Paste; Encapsulant or Conformal Coating
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset
Metal Oxide Thickened Dimethyl Silicone Compound -- Bluesil™ V-740
from Bluestar Silicones USA Corp.

Metal Oxide Thickened Dimethyl Silicone Compound. Description. Bluesil V-740 is a metal oxide thickened dimethyl silicone compound. It is a white, heavy paste used for heat dissipation applications where high thermal conductivity is required. [See More]

  • Form / Shape: Grease, Paste
  • Cure / Technology: Two Component  
  • Chemical System: Silicone
  • Industry: Electronics; Electric Power; Semiconductors, IC's
55 Shore D polyurethane adhesive -- 10-2055
from Epoxies Etc...

The 10-2055 and 10-2055 HV were developed to produce a general purpose, semi flexible polyurethane adhesive for bonding a wide variety of plastic and metal substrates. The flexibility of these adhesives allows bonding to substrates with high coefficients of thermal expansion (CTE) and substrates... [See More]

  • Form / Shape: Die Bonding Adhesives; Grease, Paste
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Polyurethane
  • Industry: OEM or Industrial
Thermal Management Adhesive -- 315
from Henkel Corporation - Electronics

Ease-of-use, thermal conductivity [See More]

  • Form / Shape: Die Bonding Adhesives; Grease, Paste
  • Chemical System: Acrylic
  • Type: High Dielectric
  • Composition: Filled
Dissipator® -- 745
from Hernon Manufacturing, Inc.

Dissipator ® structural acrylics provide specific adhesion for bonding electrical heat sink components with high thermal conductivity. Heat trapped and not dissipated by the components can lead to premature component failure and costly repair and replacement. Thermal conductivity is assured and... [See More]

  • Form / Shape: Gel; Gap Filler, Foam in Place Gasket; Grease, Paste
  • Chemical System: Acrylic
  • Type: High Dielectric
  • Composition: Unfilled
Dissipator® Adhesive -- Grade 745
from Hi-Tech Seals, Inc.

HERNON ® offers a complete line of structural acrylic adhesives. These systems are two-part, no mix, and reactive adhesives. Each acrylic adhesive has two components: the adhesive base or resin, and the Activator. Structural acrylic adhesives are termed “reactive ” cure systems. The... [See More]

  • Form / Shape: Grease, Paste
  • Cure / Technology: Two Component  
  • Chemical System: Acrylic
  • Industry: Electronics
Electro-Conductive Epoxy Adhesive -- ACE-10021 (formerly CM3270-2FC)
from Protavic America, Inc.

Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture die attachand can be dispensed, printed or pin transferred. It offer fast in-line cure. This product can produce ultra fine dots via < 30 gauge needle. The product will... [See More]

  • Form / Shape: Die Bonding Adhesives; Grease, Paste
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Single Component