Glob Top / Daub Industrial Sealants
from Master Bond, Inc.
One part, nano silica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Glob Top, Daub, Doming or Overfill; Leveling Filling; Non-corrosive; Phase Change; Thermally Conductive
- Cure / Technology: UV or Radiation Cured; Single Component; Dual Curing
- Composition: Filled
- Type / Form: Liquid
from Master Bond, Inc.
Formulated for potting, encapsulation, bonding and sealing applications, Master Bond EP17HT-100 is a single part epoxy system that is designed to cure in 60-90 minutes at 200-220 °F. This low heat curing schedule is useful in bonding applications involving temperature sensitive substrates. It is... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermal Insulation
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component; Reactive or Moisture Cured
from Master Bond, Inc.
Moderate viscosity EP3RR-80 is a one part epoxy that is particularly compatible for sealing, potting and encapsulation applications. It is a superior thermal conductor, while retaining first class electrical insulation properties. EP3RR-80 can cure in thicker sections up to and beyond a 1/2 inch... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component; Reactive or Moisture Cured
from Master Bond, Inc.
Master Bond Polymer System UV15X-2GT is a new, easily processable, one component, UV curable glob top, featuring exceptional durability and chemical resistance. UV15X-2GT is a thixotropic paste that handles well when encapsulating selected components and chips on circuit boards. The cured UV15X-2GT... [See More]
- Features: High Dielectric; Glob Top, Daub, Doming or Overfill; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermal Insulation
- Type / Form: Liquid
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
Supreme 3HTND-2DM is a rapid curing, toughened, one part epoxy system used for the dam-and-fill method for chip-on-board encapsulation. It passes ASTM E595 specifications for NASA low outgassing allowing it to be used in vacuum, aerospace, electro-optic and other related applications. Supreme... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Epoxy Technology
EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]
- Features: Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Epoxy
- Type / Form: Liquid
from Novagard Solutions
Non-corrosive, single component alkoxy cure silicone sealant/adhesive [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Glob Top, Daub, Doming or Overfill; Non-corrosive; Gap Filler, Foam in Place Gasket; UL Rating
- Composition: Unfilled
- Chemical System: Silicone; Elastomeric
- Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing