Encapsulating / Potting Compound Industrial Sealants
from Ellsworth Adhesives
3M Scotch-Weld Epoxy Potting Compound/Adhesive DP270 Black is a two component, epoxy resin system that is used for sealing, encapsulating, and potting electronic and heat sensitive components. It offers low viscosity, long handling times, noncorrosive to copper, good electrical properties, and... [See More]
- Features: Encapsulant, Potting Compound
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Viscosity: 6000 to 16000
from Master Bond, Inc.
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Flexible; Leveling Filling; Non-corrosive; Phase Change; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Composition: Unfilled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing; Addition Cure
from RS Components, Ltd.
Gel box line ISAAC 4 [See More]
- Features: Encapsulant, Potting Compound
- Use Temperature: 194
- Type / Form: Gel
from Ellsworth Adhesives
3M Scotch-Weld Epoxy Potting Compound/Adhesive DP270 Clear is a two component, epoxy resin system that is used for sealing, encapsulating, and potting electronic and heat sensitive components. It offers low viscosity, long handling times, noncorrosive to copper, good electrical properties, and... [See More]
- Features: Encapsulant, Potting Compound
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Viscosity: 6000 to 16000
from Master Bond, Inc.
EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Flexible; Flame Retardant; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from RS Components, Ltd.
Gel box line WATT [See More]
- Features: Encapsulant, Potting Compound
- Use Temperature: 194
- Type / Form: Gel
from Ellsworth Adhesives
Dow 3-4237 Dielectric Firm Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for potting, sealing, encapsulating, and protecting electrical components from contaminants, moisture, and stress. It is durable, flexible, self healing, and offers long working times. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound
- Cure / Technology: Two Component
- Chemical System: Silicone
- Industry: Electronics
from Master Bond, Inc.
One part, nano silica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Glob Top, Daub, Doming or Overfill; Leveling Filling; Non-corrosive; Phase Change; Thermally Conductive
- Cure / Technology: UV or Radiation Cured; Single Component; Dual Curing
- Composition: Filled
- Type / Form: Liquid
from RS Components, Ltd.
Gel box line KELVIN [See More]
- Features: Encapsulant, Potting Compound
- Use Temperature: 194
- Type / Form: Gel
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4150 Dielectric Gel Clear-Green is a two component, fast room temperature curing, silicone gel that is used for potting, sealing, encapsulating, and protecting a variety of materials in the electronics industry. It offers flexibility, stress relief, and offers excellent... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound
- Cure / Technology: Two Component
- Chemical System: Silicone
- Viscosity: 480
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Features: Electrically Conductive; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Flexible; Leveling Filling; Non-corrosive; Phase Change; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Composition: Filled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component ; Addition Cure
from RS Components, Ltd.
Gel box line ISAAC 4 MP [See More]
- Features: Encapsulant, Potting Compound
- Use Temperature: 194
- Type / Form: Gel
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4680 Silicone Gel Clear-Blue is a two component, room temperature curing, low viscosity, dielectric gel that is used for potting, sealing, encapsulating, and protecting electrical components from contaminants, moisture, and stress. It is durable, flexible, and fast curing. 1:1... [See More]
- Features: Encapsulant, Potting Compound
- Cure / Technology: Two Component
- Chemical System: Silicone
- Viscosity: 275
from Master Bond, Inc.
EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from RS Components, Ltd.
Gel box line PASCAL 6 MP [See More]
- Features: Encapsulant, Potting Compound
- Use Temperature: 194
- Type / Form: Gel
from Ellsworth Adhesives
Dow DOWSIL ™ 3-6121 Low Temperature Elastomer Clear is a two component, room to high temperature curing, silicone encapsulant that is used to protect electrical components from contaminants, moisture, and stress. It is fast curing, flowable, tear resistant, and has high tensile strength. 10:1... [See More]
- Features: Encapsulant, Potting Compound
- Cure / Technology: Two Component
- Chemical System: Silicone
- Viscosity: 19250
from Master Bond, Inc.
Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Non-corrosive; Phase Change; Thermal Insulation
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from RS Components, Ltd.
Gel box line WATT MP [See More]
- Features: Encapsulant, Potting Compound
- Use Temperature: 194
- Type / Form: Gel
from Ellsworth Adhesives
Dow DOWSIL ™ 93-500 Thixotropic Space Grade Encapsulant and 93-500 Space Grade Encapsulant Clear are two component, silicone elastomers that are used for aerospace applications such as sealing optical sensors, encapsulating/potting electronic components, and bonding solar cells to substrates,... [See More]
- Features: Encapsulant, Potting Compound
- Cure / Technology: Two Component
- Chemical System: Silicone
- Thermal Conductivity: 0.2000
from Master Bond, Inc.
EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Flame Retardant; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from RS Components, Ltd.
Gel box line KELVIN MP [See More]
- Features: Encapsulant, Potting Compound
- Use Temperature: 194
- Type / Form: Gel
from Ellsworth Adhesives
Dow DOWSIL ™ CY 52-276 Kit Clear is a two component, low volatility silicone gel that is used for protecting and sealing electronic devices from thermal shock, vibration, fuels, and solvents. with addition cure, It offers flexibility and a low temperature cure. 1:1 mix ratio. Part A, 1 kg... [See More]
- Features: Encapsulant, Potting Compound
- Cure / Technology: Two Component
- Chemical System: Silicone
- Viscosity: 900 to 1200
from Master Bond, Inc.
EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Flexible; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from RS Components, Ltd.
Silicone compound DC4 tube 100g [See More]
- Features: Encapsulant, Potting Compound
- Thermal Conductivity: 0.1460
- Use Temperature: -58 to 392
from Ellsworth Adhesives
Dow DOWSIL ™ CY 52-276 Kit Clear is a two component, low volatility silicone gel that is used for protecting and sealing electronic devices from thermal shock, vibration, fuels, and solvents. with addition cure, It offers flexibility and a low temperature cure. 1:1 mix ratio. Part B, 1 kg... [See More]
- Features: Encapsulant, Potting Compound
- Cure / Technology: Two Component
- Chemical System: Silicone
- Viscosity: 900
from Master Bond, Inc.
MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Flexible; Leveling Filling; Non-corrosive; Phase Change; Thermally Conductive
- Composition: Unfilled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from RS Components, Ltd.
MG Black flexible epoxy 832FX 450ml [See More]
- Features: Encapsulant, Potting Compound
- Use Temperature: 284
- Chemical System: Epoxy
- Thermal Conductivity: 0.2600
from Ellsworth Adhesives
Dow DOWSIL ™ EG-3810 Dielectric Gel is a one component, clear, heat curing silicone gel that is used for potting, sealing, encapsulating, and protecting a variety of materials in the electronics industry. It offers a wide range of operating temperatures ranging from -60 °C to 200 °C,... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound
- Cure / Technology: Single Component
- Chemical System: Silicone
- Industry: Electronics; Semiconductors, IC's
from Master Bond, Inc.
Master Bond EP62-1 is a two component heat cured and chemically resistant epoxy resin system featuring a long pot life at ambient temperatures and efficient cures at moderately elevated temperatures. The recommended mix ratio is 100 parts of component A to 10 parts of component B. The pot life of... [See More]
- Features: Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Porous Surfaces
from RS Components, Ltd.
MG Translucent epoxy 832C 450ml [See More]
- Features: Encapsulant, Potting Compound
- Thermal Conductivity: 0.3090
- Chemical System: Epoxy
from Ellsworth Adhesives
Dow DOWSIL ™ Q3-6575 Dielectric Gel Clear is a two component, heat curing, low temperature, silicone gel that is used for protecting and sealing electronic devices from high voltages, moisture, mechanical and thermal shock. 1:1 mix ratio by weight or volume. 0.9 kg Kit.This is a Dow product... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound
- Cure / Technology: Two Component
- Chemical System: Silicone
- Viscosity: 750
from Master Bond, Inc.
Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronicc/ structural applications. The two components are combined in a convenient noncritical mix... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Solvent Based; Thermal Insulation
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from RS Components, Ltd.
Silicone gel encapsulant 2kg kit [See More]
- Features: Encapsulant, Potting Compound
- Use Temperature: -67 to 392
from Ellsworth Adhesives
Dow DOWSIL ™ Q3-6575 Dielectric Gel Clear is a two component, heat curing, low temperature, silicone gel that is used for protecting and sealing electronic devices from high voltages, moisture, mechanical and thermal shock. 1:1 mix ratio by weight or volume. 35 kg Kit. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound
- Cure / Technology: Two Component
- Chemical System: Silicone
- Viscosity: 750
from Master Bond, Inc.
Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from RS Components, Ltd.
Thermally conductive encapsulent 2kg kit [See More]
- Features: Encapsulant, Potting Compound; Thermally Conductive
- Thermal Conductivity: 1.17
from Ellsworth Adhesives
Dow HIPEC ™ Q3-6646 Semiconductor Protective Coating Kit Clear is a two component, low modulus LED gel encapsulant that is used for protecting and sealing LEDs. It offers stress relief, low viscosity, and long working times. 210 mL Kit. [See More]
- Features: Encapsulant, Potting Compound
- Viscosity: 630 to 660
- Cure / Technology: Two Component
from Master Bond, Inc.
Master Bond EP30NS is a nano silica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from RS Components, Ltd.
Optically clear polyurethane 250g [See More]
- Features: Encapsulant, Potting Compound
- Industry: Optical
- Chemical System: Polyurethane
- Thermal Conductivity: 0.2000
from Ellsworth Adhesives
Dow SYLGARD ™ 527 Silicone Dielectric Gel is a two component, room temperature and heat curing gel that is used for coating, encapsulating, potting, and sealing electronic devices. It provides flexibility, good flow, and low viscosity. 1:1 mix ratio. 0.9 kg Kit. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound
- Cure / Technology: Two Component
- Chemical System: Silicone
- Industry: Electronics
from Master Bond, Inc.
EP42-2LV Black is a two component, room temperature curing epoxy compound featuring low viscosity and superior chemical resistance. It meets NASA low outgassing specifications, is black in color and optically opaque. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from RS Components, Ltd.
Epoxy Black Encap Pot Comd inc 8MT450 [See More]
- Features: Encapsulant, Potting Compound
- Chemical System: Epoxy
from Ellsworth Adhesives
Dow SYLGARD ™ 527 Silicone Dielectric Gel is a two component, room temperature and heat curing gel that is used for coating, encapsulating, potting, and sealing electronic devices. It provides flexibility, good flow, and low viscosity. 1:1 mix ratio. 36.3 kg Kit. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound
- Cure / Technology: Two Component
- Chemical System: Silicone
- Industry: Electronics
from Master Bond, Inc.
Master Bond Supreme 17HT is a one component toughened epoxy for bonding and sealing. It has a moderate viscosity system with good flow properties. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Flexible; Non-corrosive; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from RS Components, Ltd.
High Temp Epoxy Pot Encapsulating Comp [See More]
- Features: Encapsulant, Potting Compound
- Chemical System: Epoxy
from Ellsworth Adhesives
Dow SYLGARD ™ 527 Silicone Dielectric Gel is a two component, room temperature and heat curing gel that is used for coating, encapsulating, potting, and sealing electronic devices. It provides flexibility, good flow, and low viscosity. 1:1 mix ratio. 7.2 kg Kit. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound
- Cure / Technology: Two Component
- Chemical System: Silicone
- Industry: Electronics
from Master Bond, Inc.
Master Bond Polymer System EP36 is a unique one component high performance toughened epoxy system for electrical potting, casting, encapsulation, baked coatings and adhesive applications. It features an outstanding combination of properties including high temperature stability up to 500 °F,... [See More]
- Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Encapsulant, Potting Compound; Flexible; Gap Filler, Foam in Place Gasket; Anti-static, ESD
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from RS Components, Ltd.
Epox Black Therm Conduct PotEncap Comp [See More]
- Features: Encapsulant, Potting Compound; Thermally Conductive
- Chemical System: Epoxy
from Ellsworth Adhesives
Dow SYLGARD ™ 527 Silicone Dielectric Gel is a two component, room temperature and heat curing gel that is used for coating, encapsulating, potting, and sealing electronic devices. It provides flexibility, good flow, and low viscosity. 1:1 mix ratio. Part B, 18.1 kg Pail. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound
- Cure / Technology: Two Component
- Chemical System: Silicone
- Industry: Electronics
from Master Bond, Inc.
Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for conventional bonding and sealing. This system features an excellent die shear strength of 24-27 kg-f and can be used in a typical die size ranging from 4-400 mm2. EP17HTDA-1 can also be... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from RS Components, Ltd.
EPOXY MASTIC XR9102 [See More]
- Features: Encapsulant, Potting Compound
- Use Temperature: 32 to 194
- Chemical System: Epoxy
from Ellsworth Adhesives
DYMAX Ultra Light-Weld 9008 UV Curable Encapsulant is used for sealing and encapsulating electronic devices such as chip-on-flex or chip-on-board applications. It is flexible, solvent free, and moisture resistant. 10 mL MR Syringe. [See More]
- Features: Encapsulant, Potting Compound
- Substrate Compatibility: Metal
- Cure / Technology: Single Component
- Viscosity: 4500
from Master Bond, Inc.
Master Bond Polymer System EP19HT is a storage stable one component liquid epoxy resin system for durable, high performance adhesive/sealants, impregnates and liners. It features remarkably long shelf life and excellent storage characteristics at ambient temperatures yet cures readily at elevated... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from RS Components, Ltd.
High performance polyurethane compound [See More]
- Features: Encapsulant, Potting Compound
- Chemical System: Polyurethane
from Ellsworth Adhesives
DYMAX Ultra Light-Weld 9008 UV Curable Encapsulant is used for sealing and encapsulating electronic devices such as chip-on-flex or chip-on-board applications. It is flexible, solvent free, and moisture resistant. 170 mL Cartridge. [See More]
- Features: Encapsulant, Potting Compound
- Substrate Compatibility: Metal
- Cure / Technology: Single Component
- Viscosity: 4500
from Master Bond, Inc.
Master Bond UV10 and UV10TK are one component UV curable modified epoxy compounds, ready for use as supplied, for high performance casting, coatings, sealing and bonding applications. UV10 is a low viscosity amber liquid at room temperature and UV10TK is a medium viscosity amber liquid at room... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermal Insulation
- Type / Form: Liquid
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from RS Components, Ltd.
Blk low viscosity polyurethane compound [See More]
- Features: Encapsulant, Potting Compound
- Thermal Conductivity: 0.2450
- Chemical System: Polyurethane
from Ellsworth Adhesives
Henkel Loctite Nuva-Sil 5091 is a one component, low viscosity, UV light and moisture curable silicone sealant. It is self leveling, has medium strength and is highly flexible. 300 mL Cartridge. [See More]
- Features: Encapsulant, Potting Compound
- Cure / Technology: Single Component
- Chemical System: Silicone
- Industry: Automotive; Military
from Master Bond, Inc.
Supreme 3HTND-2DM is a rapid curing, toughened, one part epoxy system used for the dam-and-fill method for chip-on-board encapsulation. It passes ASTM E595 specifications for NASA low outgassing allowing it to be used in vacuum, aerospace, electro-optic and other related applications. Supreme... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from RS Components, Ltd.
UR5044 Blue Soft PU Resin Pack, 250g [See More]
- Features: Encapsulant, Potting Compound
- Thermal Conductivity: 0.2500
- Chemical System: Polyurethane
from Ellsworth Adhesives
Henkel Loctite SI 5031 Nuva-Sil is a medium viscosity, UV/Visible light curing silicone sealant with a secondary moisture cure mechanism for shadow curing. 300 mL Cartridge. [See More]
- Features: Encapsulant, Potting Compound
- Cure / Technology: Single Component
- Chemical System: Silicone
- Industry: Automotive; Military
from Master Bond, Inc.
Master Bond Polymer System EP30 is a low viscosity, two component epoxy adhesive for general purpose bonding, coating, sealing and casting formulated to cure at room temperature or more rapidly at elevated temperatures with a four (4) to one (1) mix ratio by weight. This adhesive is 100% reactive... [See More]
- Features: Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Flexible; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermal Insulation
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Type / Form: Liquid
from RS Components, Ltd.
ER1450 White RF Epoxy Resin Pack, 250g [See More]
- Features: Encapsulant, Potting Compound
- Chemical System: Epoxy
from Ellsworth Adhesives
Henkel Loctite SI 5083 is a one component, high strength, UV cured silicone. It is used for potting, coating and sealing of various electronic, automotive, military, and industrial components. 300 mL Cartridge. [See More]
- Features: Encapsulant, Potting Compound
- Cure / Technology: Single Component
- Chemical System: Silicone
- Substrate Compatibility: Metal; Plastic; Rubber or Elastomer; Wood
from Master Bond, Inc.
Formulated to have special optical transmission properties, EP30-2LB is an optically clear epoxy that does not permit UV light transmission, but transmits well from 450-900 nm and above. It is a user friendly compound that has a non-critical ten to one mix ratio by weight. This system cures readily... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from RS Components, Ltd.
ER1448 Black RF Epoxy Resin Pack, 250g [See More]
- Features: Encapsulant, Potting Compound
- Chemical System: Epoxy
from Protavic America, Inc.
PNE-47207 ™ is an adhesive/sealant and potting compound. PNE-47207 ™ is designed to provide air free potting and casting of electronic devices. PNE-47207 ™ will bond difficult substrates such as glass, ceramics, and metals. It passes UL 94V0 for fire retardant properties,and has a... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Flame Retardant; Gap Filler, Foam in Place Gasket
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from OMEGA Engineering, Inc.
Air Set Cements set or cure through loss of moisture by evaporation. Atmospheric conditions therefore affect the drying rate. Air Set Cements are used mainly in thin film applications (applied in thicknesses less than 1/4")*. SELECTION CRITERIA FOR CEMENTS. 1. Type of Application Potting, sealing,... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Thermally Conductive
- Cure / Technology: Air Setting / Film Drying; Two Component (optional feature); Single Component (optional feature)
- Chemical System: Ceramic
- Type / Form: Liquid (optional feature); Powder (optional feature)
from Hapco, Inc.
Filter-bond ™ is a series of casting and potting compounds ideally suited for potting, sealing, and bonding filtration and ultrafiltration products. The Filter-bond ™ E-Series is manufactured to ultra-high quality standards and has been used by customers to pass FDA approval. Filter-bond... [See More]
- Features: Encapsulant, Potting Compound; Flexible
- Cure / Technology: Two Component
- Chemical System: Elastomeric; Polyurethane
- Type / Form: Liquid
from Sauereisen, Inc.
Sauereisen Cement No. 31 is a white, porcelain-like cement that is widely used throughout industry in a variety of applications. including assembling, sealing, insulating and cementing of ceramics, porcelain, metal, and glass. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Flame Retardant; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Composition: Unfilled
- Chemical System: Ceramic
- Cure / Technology: Two Component ; Chemically Set
from Shiu Li Technology Co., Ltd
LiPOLY's TPS series is a low-density, potting material. Its low density and lightweight properties enhance product performance, reduce production costs. The product has a thermal conductivity of 0.55-1.50 W/m*K and can cure at room temperature or high temperatures. [See More]
- Features: Encapsulant, Potting Compound; Leveling Filling; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Chemical System: Silicone
- Type / Form: Grease, Paste; Liquid
from Aremco Products, Inc.
Hi-temp, prevents dusting of fibrous insulation materials [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Composition: Filled
- Chemical System: Silicone
- Cure / Technology: Thermoset
from Epoxies Etc...
UV 60-7016 is a high performance Ultraviolet Curable Adhesive, Sealant, and Potting Compound. This new one component urethane acrylate system was specifically designed for the difficult bonding of glass to metal. UV 60-7016 has outstanding thermal shock and impact resistance, and is an excellent... [See More]
- Features: Encapsulant, Potting Compound; Flexible; Gap Filler, Foam in Place Gasket
- Composition: Unfilled
- Chemical System: Elastomeric; Polyurethane
- Cure / Technology: UV or Radiation Cured; Single Component
from ACCRAbond, Inc.
CONATHANE ® FP-1303 White or Amber is a two-component, unfilled, fast setting polyurethane sealant designed for use in HEPA and other air filtration devices. CONATHANE ® FP-1303 is also used for potting, casting, embedding, and encapsulating of electronic circuits, components, and power... [See More]
- Features: Encapsulant, Potting Compound
- Cure / Technology: Two Component
- Chemical System: Polyurethane
from Epoxy Technology
EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]
- Features: Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Epoxy
- Type / Form: Liquid
from Wacker Chemical Corp.
SEMICOSIL ® 925 is a high purity, one-component addition curing RTV-2 silicone gel. Special features. Low ion content. Low volatile content. Low viscosity. Good mechanical damping properties. Application. SEMICOSIL ® 925 is a dielectric gel especially designed to seal, protect and preserve... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Flexible
- Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
- Chemical System: Silicone
- Type / Form: Liquid
from OMEGA Engineering, Inc.
Chemical Set Cements set or cure by an internal chemical action which does not require exposure to air. Chemical Set Cements can be used in thick applications (applied in thicknesses greater than 1/4")*. SELECTION CRITERIA FOR CEMENTS. 1. Type of Application Potting, sealing, encapsulating,... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Thermally Conductive
- Cure / Technology: Air Setting / Film Drying; Two Component (optional feature); Single Component (optional feature)
- Chemical System: Ceramic
- Type / Form: Liquid (optional feature); Powder (optional feature)
from Epoxies Etc...
20-2100 FR is a two component, room temperature curing, low viscosity polyurethane system for potting, casting, encapsulating and sealing electronic components and assemblies. 20-2100 FR is a flame retardant self extinguishing system. It meets the stringent requirements of UL 94-VO. Designed for... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Flexible; Flame Retardant; Gap Filler, Foam in Place Gasket; UL Rating
- Composition: Unfilled
- Chemical System: Elastomeric; Polyurethane
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Wacker Chemical Corp.
GENIOSIL® WP1 is a polyether-based silane-terminated polymer suitable asbinder in moisture curing formulations. It is a clear liquid with a slight but characteristic odor and differs to conventional silylated polymers due to its high reactivity. This is a direct consequence of the structural... [See More]
- Features: Encapsulant, Potting Compound
- Cure / Technology: Two Component
- Chemical System: Silicone
- Type / Form: Liquid