Thermal Compound / Interface (Thermally Conductive) Industrial Sealants
from Master Bond, Inc.
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Flexible; Leveling Filling; Non-corrosive; Phase Change; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Composition: Unfilled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing; Addition Cure
from Quantaflex Printed Electronics Inc.
A high level of custom engineering and problem solving. Designing electrical shielding components requires a high level of custom engineering and problem solving. Nothing should be left to chance because the goal is to create a part that protects the electronic device (and your customers) from the... [See More]
- Features: EMI/RFI Shielding; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Industry: Electronics; Semiconductors, IC's
- Type / Form: Liquid; Sheet or Film
from Thermon, Inc
NH nonhardening heat transfer compound is used where thermal expansion and contraction could break the bond of a hardened compound. Typically installed between plate-type heating coils or with systems that require periodic disassembly, NH remains pliable indefinitely, allowing the compound to expand... [See More]
- Features: Gap Filler, Foam in Place Gasket; Thermally Conductive
- Type / Form: Liquid
- Cure / Technology: Single Component
- Use Temperature: 32 to 410
from RS Components, Ltd.
Thermal Putty, 3.0 W/m K, non silicone, [See More]
- Features: Leveling Filling; Thermally Conductive
- Thermal Conductivity: 3
- Use Temperature: -22 to 302
from Ellsworth Adhesives
Dow DOWSIL ™ SE 1700 W/C Thermally Conductive Adhesive Clear is a two-part non-flowing, heat cure, and high tensile strength adhesive. It is primarily used for sealing ceramic condensers, sealing PCB components, and as a bonding agent for key pad of PC. 1.1 kg Kit. [See More]
- Features: Thermally Conductive
- Substrate Compatibility: Ceramic, Glass
- Cure / Technology: Two Component
- Viscosity: 542000
from Master Bond, Inc.
EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Flexible; Flame Retardant; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Thermon, Inc
SnapTrace is a preformed flexible heat transfer compound designed for rapid, consistent installation over steam trace tubing on straight piping. SnapTrace also includes TFK channel, providing mechanical and weather protection to the installation. Thermon's heat transfer compounds provide an... [See More]
- Features: Gap Filler, Foam in Place Gasket; Thermally Conductive
- Thermal Conductivity: 34.61 to 69.23
- Use Temperature: 14 to 450
from RS Components, Ltd.
Thermal Putty with EMI, 2.0 W/m K, 55ml [See More]
- Features: Leveling Filling; Thermally Conductive
- Use Temperature: -58 to 392
- Chemical System: Silicone
- Thermal Conductivity: 2
from Master Bond, Inc.
One part, nano silica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Glob Top, Daub, Doming or Overfill; Leveling Filling; Non-corrosive; Phase Change; Thermally Conductive
- Cure / Technology: UV or Radiation Cured; Single Component; Dual Curing
- Composition: Filled
- Type / Form: Liquid
from Thermon, Inc
T-3 heat transfer compound now has higher temperature ratings than ever before while still creating an efficient thermal bond between a steam or electric heater and process pipes or equipment. A single "Thermonized ™"steam tracer utilizing Thermon's heat transfer compound is more cost... [See More]
- Features: Gap Filler, Foam in Place Gasket; Thermally Conductive
- Type / Form: Grease, Paste
- Cure / Technology: Single Component
- Use Temperature: 32 to 850
from RS Components, Ltd.
Thermal Putty, 2.0 W/m K, 55ml [See More]
- Features: Leveling Filling; Thermally Conductive
- Use Temperature: -58 to 392
- Chemical System: Silicone
- Thermal Conductivity: 2
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Features: Electrically Conductive; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Flexible; Leveling Filling; Non-corrosive; Phase Change; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Composition: Filled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component ; Addition Cure
from RS Components, Ltd.
Thermal Putty [See More]
- Features: Leveling Filling; Thermally Conductive
- Use Temperature: -40 to 392
- Chemical System: Silicone
- Thermal Conductivity: 2
from Master Bond, Inc.
EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from RS Components, Ltd.
Thermal Putty [See More]
- Features: Leveling Filling; Thermally Conductive
- Use Temperature: -40 to 392
- Chemical System: Silicone
- Thermal Conductivity: 3
from Master Bond, Inc.
EP35SP is a two component epoxy system specially formulated to resist high temperatures and aggressive chemicals. It has a paste viscosity with little to no flow when curing. [See More]
- Features: High Dielectric; Encapsulant or Conformal Coating; Non-corrosive; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from RS Components, Ltd.
Thermal Putty [See More]
- Features: Leveling Filling; Thermally Conductive
- Use Temperature: -40 to 392
- Chemical System: Silicone
- Thermal Conductivity: 5
from Master Bond, Inc.
EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Flame Retardant; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from RS Components, Ltd.
Thermal Putty [See More]
- Features: Leveling Filling; Thermally Conductive
- Use Temperature: -58 to 392
- Chemical System: Silicone
- Thermal Conductivity: 7
from Master Bond, Inc.
EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Flexible; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from RS Components, Ltd.
Thermally conductive encapsulent 2kg kit [See More]
- Features: Encapsulant, Potting Compound; Thermally Conductive
- Thermal Conductivity: 1.17
from Master Bond, Inc.
MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Flexible; Leveling Filling; Non-corrosive; Phase Change; Thermally Conductive
- Composition: Unfilled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from RS Components, Ltd.
Epox Black Therm Conduct PotEncap Comp [See More]
- Features: Encapsulant, Potting Compound; Thermally Conductive
- Chemical System: Epoxy
from Master Bond, Inc.
Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from RS Components, Ltd.
UR5097 Black GP PU Resin Pack, 250g [See More]
- Features: Encapsulant, Potting Compound; Flame Retardant; Thermally Conductive
- Thermal Conductivity: 0.6500
- Chemical System: Polyurethane
from Master Bond, Inc.
Master Bond EP30NS is a nano silica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from RS Components, Ltd.
QSil 553 [See More]
- Features: Encapsulant, Potting Compound; Thermally Conductive
- Thermal Conductivity: 0.6800
- Use Temperature: 500
from Master Bond, Inc.
EP42-2LV Black is a two component, room temperature curing epoxy compound featuring low viscosity and superior chemical resistance. It meets NASA low outgassing specifications, is black in color and optically opaque. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from RS Components, Ltd.
Loctite CAT 24 LV 100CC [See More]
- Features: Encapsulant, Potting Compound; Thermally Conductive
- Chemical System: Epoxy
from Master Bond, Inc.
Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part nickel conductive systems, EP76M... [See More]
- Features: Electrically Conductive; EMI/RFI Shielding; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket; Thermally Conductive; Anti-static, ESD
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from RS Components, Ltd.
Loctite Stycast 2850 FT Bleu BE [See More]
- Features: Encapsulant, Potting Compound; Thermally Conductive
- Chemical System: Epoxy
from Master Bond, Inc.
Master Bond Polymer System FL901AO is a one component high performance, thermally conductive, electrically insulative epoxy resin based adhesive film with outstanding performance characteristics. Unlike many other such epoxy film products, it does not require refrigerated storage although this is... [See More]
- Features: High Dielectric; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from RS Components, Ltd.
Loctite Stycast 2850 FT QuartKit [See More]
- Features: Encapsulant, Potting Compound; Thermally Conductive
- Chemical System: Epoxy
from Master Bond, Inc.
Master Bond Supreme 17HT is a one component toughened epoxy for bonding and sealing. It has a moderate viscosity system with good flow properties. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Flexible; Non-corrosive; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from RS Components, Ltd.
QSil 553 Grey Silicone Potting Comp 250g [See More]
- Features: Encapsulant, Potting Compound; Thermally Conductive
- Thermal Conductivity: 0.6800
from Master Bond, Inc.
Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for conventional bonding and sealing. This system features an excellent die shear strength of 24-27 kg-f and can be used in a typical die size ranging from 4-400 mm2. EP17HTDA-1 can also be... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from RS Components, Ltd.
EPOXY RESIN 250 G [See More]
- Features: Encapsulant, Potting Compound; Flame Retardant; Thermally Conductive
- Thermal Conductivity: 1.1
- Chemical System: Epoxy
from Techsil Limited
Elecolit ® 6603 is a thermally conductive epoxy with very good metal adhesion and slight flexibility. This grade has very good flow behavior and can easily be processed using a dispenser, spreading knife or spatula. Although designed for bonding applications, 6603 can also be used as a potting... [See More]
- Features: Electrically Conductive; Thermally Conductive
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Industry: Electronics
from Aremco Products, Inc.
Aremco offers an expansive range of ceramic-based materials used for the assembly of high temperature, high power electrical devices, and high temperature fixtures, molds and tooling. These materials, based on aluminum oxide, aluminum nitride, magnesium oxide, silicon dioxide, silicon carbide,... [See More]
- Features: Encapsulant or Conformal Coating; Thermally Conductive
- Substrate Compatibility: Ceramic, Glass; Textiles or Fabrics; Dissimilar Substrates
- Type / Form: Liquid
- Industry: Electronics
from Shiu Li Technology Co., Ltd
LiPOLY DTT44 is a soft thermally conductive gel pad specifically designed for networking applications. DTT44 is designed to focus on Dk and Df to reduce interference in RF modules. DTT44 has a thermal conductivity of 3.0 W/m*K. This product can be supplied as standard sheets, custom die-cuts or... [See More]
- Features: Thermally Conductive; UL Rating
- Type / Form: Sheet or Film
- Chemical System: Silicone
- Industry: Electronics
from Henkel Corporation - Electronics
GAP PAD ™ HC 5.0 is a soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique filler package and low-modulus resin formulation. The enhanced material is ideal for applications... [See More]
- Features: Gap Filler, Foam in Place Gasket; Thermally Conductive
- Industry: Electronics
from Epoxy Technology
Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting hostile environments,... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Thermally Conductive
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Type / Form: Grease, Paste
from Sauereisen, Inc.
Sauereisen Aluseal Adhesive Cement No. 2 is a ceramic cement paste offering good bond strength and thermal shock. resistant properties for assembling, sealing and cementing porcelain, glass, metal and other materials. Its fine particle size. and excellent flow characteristics make No. 2 a good... [See More]
- Features: High Dielectric; Flexible; Thermally Conductive
- Composition: Unfilled
- Chemical System: Ceramic
- Cure / Technology: Air Setting / Film Drying; Single Component
from OMEGA Engineering, Inc.
Air Set Cements set or cure through loss of moisture by evaporation. Atmospheric conditions therefore affect the drying rate. Air Set Cements are used mainly in thin film applications (applied in thicknesses less than 1/4")*. SELECTION CRITERIA FOR CEMENTS. 1. Type of Application Potting, sealing,... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Thermally Conductive
- Cure / Technology: Air Setting / Film Drying; Two Component (optional feature); Single Component (optional feature)
- Chemical System: Ceramic
- Type / Form: Liquid (optional feature); Powder (optional feature)
from Boyd
Thermal Interface Materials - Gap Fillers and Pads, Films, Tapes, Hardware. Electronic devices continue to become faster, smaller, and more powerful every day, enabling technological advancements across all industries. The Internet of Things, powered by embedded electronics and its complex... [See More]
- Features: Gap Filler, Foam in Place Gasket; Thermally Conductive; Thermal Insulation
- Type / Form: Sheet or Film
from Epoxies Etc...
20-2162 is a unique high performance two component urethane system. The 20-2162 is engineered for demanding applications where flow control is necessary to limit mold leaking, seeping around cable entries and substrate wicking. This product offers outstanding durability and adhesion to a variety of... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Thermally Conductive
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Polyurethane
- Type / Form: Liquid
from Techsil Limited
TSE3281-G is a thermally conductive silicone adhesive from Momentive Performance Materials. This one component material is non-corrosive and has excellent adhesion properties to a wide variety of substrates. Potential applications for TSE3281-G include sealing and bonding for thermally conductive... [See More]
- Features: Thermally Conductive
- Industry: Electronics
- Chemical System: Silicone; Elastomeric
from Aremco Products, Inc.
High fired strength, dense ceramics [See More]
- Features: High Dielectric; Gap Filler, Foam in Place Gasket; Thermally Conductive; Threadlocker or Retainer
- Composition: Filled
- Chemical System: Ceramic
- Cure / Technology: Thermoset
from Shiu Li Technology Co., Ltd
LiPOLY DTT65 is a soft thermally conductive gel pad specifically designed for networking applications. DTT65 is designed to focus on Dk and Df to reduce interference in RF modules. DTT65 has a thermal conductivity of 5.0 W/m*K. This product can be supplied as standard sheets, custom die-cuts or... [See More]
- Features: Thermally Conductive; UL Rating
- Type / Form: Sheet or Film
- Chemical System: Silicone
- Industry: Electronics
from Sauereisen, Inc.
Sauereisen Cement No. 31 is a white, porcelain-like cement that is widely used throughout industry in a variety of applications. including assembling, sealing, insulating and cementing of ceramics, porcelain, metal, and glass. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Flame Retardant; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Composition: Unfilled
- Chemical System: Ceramic
- Cure / Technology: Two Component ; Chemically Set
from OMEGA Engineering, Inc.
Chemical Set Cements set or cure by an internal chemical action which does not require exposure to air. Chemical Set Cements can be used in thick applications (applied in thicknesses greater than 1/4")*. SELECTION CRITERIA FOR CEMENTS. 1. Type of Application Potting, sealing, encapsulating,... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Thermally Conductive
- Cure / Technology: Air Setting / Film Drying; Two Component (optional feature); Single Component (optional feature)
- Chemical System: Ceramic
- Type / Form: Liquid (optional feature); Powder (optional feature)
from Techsil Limited
Techsil ® TIM11021G is a silicone compound that provides high thermal conductivity. It exhibits virtually no oil separation and minimal weight loss at elevated temperatures, which contributes to stability of TIM interface under broad operational temperature ranges. Techsil ® TIM- 11021G is... [See More]
- Features: Thermally Conductive
- Chemical System: Silicone; Elastomeric
from Aremco Products, Inc.
Used for repairing metal components, pinholes, cracks, and filling seams. [See More]
- Features: Leveling Filling; Gap Filler, Foam in Place Gasket; Thermally Conductive; Water Based
- Composition: Filled
- Chemical System: Ceramic
- Cure / Technology: Air Setting / Film Drying; Thermoset
from Shiu Li Technology Co., Ltd
LiPOLY G566 Graphite Sheet has great thermal conductivity on the X and Y axis. The thermal conductivity is 1700W/m*K. It is flexible, which is suitable for thin products and high capability mobile devices. [See More]
- Features: Thermally Conductive
- Industry: Electronics
- Type / Form: Sheet or Film
- Gap Fill: 8.27E-4
from Techsil Limited
Techsil ® TIM11123 (GB) Grey is a 200 micron, self-gapping, non-corrosive, 1-part room temperature vulcanizing (RTV) silicone rubber. It is one of a new family of products called acetone cure sealants. These products are cured rapidly in contact with atmospheric moisture to a tough rubber that... [See More]
- Features: Electrically Conductive; Gap Filler, Foam in Place Gasket; Thermally Conductive
from Shiu Li Technology Co., Ltd
LiPOLY TR332CU has outstanding parallel thermal conduction and has high flexibility, which is suitable for thin products like mobile devices. [See More]
- Features: Thermally Conductive
- Industry: Electronics
- Type / Form: Sheet or Film
- Gap Fill: 0.0039 to 0.0059
from Shiu Li Technology Co., Ltd
LiPOLY BS75K is a soft thermally conductive gap filler. With a thermal conductivity of 3.0 W/m*K and a low thermal impedance, BS75K is suitable for a wide range of applications. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for a wide... [See More]
- Features: Gap Filler, Foam in Place Gasket; Thermally Conductive; UL Rating
- Type / Form: Sheet or Film
- Chemical System: Silicone
- Industry: Electronics
from Shiu Li Technology Co., Ltd
LiPOLY BS87 is an ultra-soft thermally conductive gel pad with a thermal conductivity of 3.0 W/m*K. BS87 offers excellent compression under minimal force with high recovery characteristics. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for... [See More]
- Features: Thermally Conductive; UL Rating
- Type / Form: Sheet or Film
- Chemical System: Silicone
- Industry: Electronics
from Shiu Li Technology Co., Ltd
LiPOLY ’s S282 is a thermally conductive pad designed for gap filling. The thermal conductivity is 1.7 W/m*K. It uses fiberglass cloth as the reinforcement material with great self-adhesive that can fit closely with non-flat heat sinks to increase the contact area. The low stress damped... [See More]
- Features: Gap Filler, Foam in Place Gasket; Thermally Conductive; UL Rating
- Type / Form: Sheet or Film
- Chemical System: Silicone
- Industry: Electronics
from Shiu Li Technology Co., Ltd
LiPOLY S393 is a product with high ductile thermal conductivity. Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material. It won't easy to break and deformwhether stamped, punched, strip type, or custom cutting. Your best choice... [See More]
- Features: High Dielectric; Gap Filler, Foam in Place Gasket; Thermally Conductive; UL Rating
- Type / Form: Sheet or Film
- Chemical System: Silicone
- Industry: Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
from Shiu Li Technology Co., Ltd
LiPOLY S818 is a product with high ductile thermal conductivity.Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material.It won't easy to break and deform whether stamped, punched, strip type, or custom cutting. Your best choice... [See More]
- Features: High Dielectric; Gap Filler, Foam in Place Gasket; Thermally Conductive; UL Rating
- Type / Form: Sheet or Film
- Chemical System: Silicone
- Industry: Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
from Shiu Li Technology Co., Ltd
LiPOLY DCTP140-s is a thermal insulator uses fiberglass cloth as a reinforcement material, combined with thermal conductive silicon, giving it high thermal conduction and great compression strength. The thermal conductivity is 4.5 W/m*K, the thickness is 0.25~0.45mm. Its high insulation and... [See More]
- Features: High Dielectric; Gap Filler, Foam in Place Gasket; Thermally Conductive; UL Rating
- Type / Form: Sheet or Film
- Chemical System: Silicone
- Industry: Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
from Shiu Li Technology Co., Ltd
LiPOLY PR27 is a very thin high insulator with a thickness of 0.15mm. It uses Polyimide Film as the reinforcement material, which can increase the tensile strength. It has great dielectric strength and can withstand 12K voltages. It ’s suitable for high power transistors, electrical equipment,... [See More]
- Features: Thermally Conductive; UL Rating
- Type / Form: Sheet or Film
- Chemical System: Silicone
- Industry: Electronics
from Shiu Li Technology Co., Ltd
LiPOLY ’s thermal insulator SH1500/2000/3000 uses fiberglass cloth as a reinforcement material, combined with thermal conductive silicon, giving it high thermal conduction and great compression strength. The thermal conductivity is 1.5/2.0/3.0 W/m*K, the thickness is 0.23~0.35mm. Its high... [See More]
- Features: Thermally Conductive; UL Rating
- Type / Form: Sheet or Film
- Chemical System: Silicone
- Industry: Electronics
from Shiu Li Technology Co., Ltd
LiPOLY T-top81 is an ultra-soft, highly conformable, non-flammable interface material. T-top81 is a high deflection material, designed to allow minimal stress on components while offering excellent thermal conductivity and low thermal resistance. With a thermal conductivity of 8.0 W/m*K, T-top81... [See More]
- Features: Thermally Conductive; UL Rating
- Type / Form: Sheet or Film
- Chemical System: Silicone
- Industry: Electronics
from Shiu Li Technology Co., Ltd
Our high thermally conductive gap filler T-work 7000 provides excellent compression and extremely low thermal resistance in form shape with high thermal conductivity for gap filling between electrical component and heatsink. [See More]
- Features: Gap Filler, Foam in Place Gasket; Thermally Conductive; UL Rating
- Type / Form: Sheet or Film
- Chemical System: Silicone
- Industry: Electronics
from Shiu Li Technology Co., Ltd
LiPOLY T-work 8000 is a high performance thermally conductive interface pad. T-work 8000 offers outstanding thermal conductivity at 15.0 W/m*K and extremely low thermal resistance under minimal force. T-work 8000 offers excellent compression, filling small air gaps and uneven surfaces, ensuring an... [See More]
- Features: Thermally Conductive; UL Rating
- Type / Form: Sheet or Film
- Chemical System: Silicone
- Industry: Electronics
from Shiu Li Technology Co., Ltd
LiPOLY T-work 9000 offers outstanding thermal conductivity at 20.0 W/m*K and extremely low thermal resistance under minimal force. T-work 9000 offers excellent compression, filling small air gaps on uneven surfaces, ensuring an efficient and consistent transfer of heat. [See More]
- Features: Thermally Conductive; UL Rating
- Type / Form: Sheet or Film
- Chemical System: Silicone
- Industry: Electronics